HP (Hewlett-Packard) ML370 manual
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Buen manual de instrucciones
Las leyes obligan al vendedor a entregarle al comprador, junto con el producto, el manual de instrucciones HP (Hewlett-Packard) ML370. La falta del manual o facilitar información incorrecta al consumidor constituyen una base de reclamación por no estar de acuerdo el producto con el contrato. Según la ley, está permitido adjuntar un manual de otra forma que no sea en papel, lo cual últimamente es bastante común y los fabricantes nos facilitan un manual gráfico, su versión electrónica HP (Hewlett-Packard) ML370 o vídeos de instrucciones para usuarios. La condición es que tenga una forma legible y entendible.
¿Qué es un manual de instrucciones?
El nombre proviene de la palabra latina “instructio”, es decir, ordenar. Por lo tanto, en un manual HP (Hewlett-Packard) ML370 se puede encontrar la descripción de las etapas de actuación. El propósito de un manual es enseñar, facilitar el encendido o el uso de un dispositivo o la realización de acciones concretas. Un manual de instrucciones también es una fuente de información acerca de un objeto o un servicio, es una pista.
Desafortunadamente pocos usuarios destinan su tiempo a leer manuales HP (Hewlett-Packard) ML370, sin embargo, un buen manual nos permite, no solo conocer una cantidad de funcionalidades adicionales del dispositivo comprado, sino también evitar la mayoría de fallos.
Entonces, ¿qué debe contener el manual de instrucciones perfecto?
Sobre todo, un manual de instrucciones HP (Hewlett-Packard) ML370 debe contener:
- información acerca de las especificaciones técnicas del dispositivo HP (Hewlett-Packard) ML370
- nombre de fabricante y año de fabricación del dispositivo HP (Hewlett-Packard) ML370
- condiciones de uso, configuración y mantenimiento del dispositivo HP (Hewlett-Packard) ML370
- marcas de seguridad y certificados que confirmen su concordancia con determinadas normativas
¿Por qué no leemos los manuales de instrucciones?
Normalmente es por la falta de tiempo y seguridad acerca de las funcionalidades determinadas de los dispositivos comprados. Desafortunadamente la conexión y el encendido de HP (Hewlett-Packard) ML370 no es suficiente. El manual de instrucciones siempre contiene una serie de indicaciones acerca de determinadas funcionalidades, normas de seguridad, consejos de mantenimiento (incluso qué productos usar), fallos eventuales de HP (Hewlett-Packard) ML370 y maneras de solucionar los problemas que puedan ocurrir durante su uso. Al final, en un manual se pueden encontrar los detalles de servicio técnico HP (Hewlett-Packard) en caso de que las soluciones propuestas no hayan funcionado. Actualmente gozan de éxito manuales de instrucciones en forma de animaciones interesantes o vídeo manuales que llegan al usuario mucho mejor que en forma de un folleto. Este tipo de manual ayuda a que el usuario vea el vídeo entero sin saltarse las especificaciones y las descripciones técnicas complicadas de HP (Hewlett-Packard) ML370, como se suele hacer teniendo una versión en papel.
¿Por qué vale la pena leer los manuales de instrucciones?
Sobre todo es en ellos donde encontraremos las respuestas acerca de la construcción, las posibilidades del dispositivo HP (Hewlett-Packard) ML370, el uso de determinados accesorios y una serie de informaciones que permiten aprovechar completamente sus funciones y comodidades.
Tras una compra exitosa de un equipo o un dispositivo, vale la pena dedicar un momento para familiarizarse con cada parte del manual HP (Hewlett-Packard) ML370. Actualmente se preparan y traducen con dedicación, para que no solo sean comprensibles para los usuarios, sino que también cumplan su función básica de información y ayuda.
Índice de manuales de instrucciones
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HP Pr oL iant ML3 7 0 Gener ation 5 S er v er Maint enance and Se r v i ce Gui de J une 2006 (First Edition) Part Number 404682-001[...]
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© Copyright 2006 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in t he express limited warranty statements accompanying such products and s ervic es. Nothing herein should be co nstrued as constituting an addi tional war[...]
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Contents 3 C on ten ts Customer se lf re pair ........................................................................................................... ........... 5 Parts only warr anty service .................................................................................................... ..................... 5 Illustrated pa rts cata log [...]
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Contents 4 Diskette driv e cabl ing ......................................................................................................... ..................... 66 SAS cabling .................................................................................................................... ....................... 67 CD-ROM driv e cabling .....[...]
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Customer self repair 5 C ust omer s elf r epair HP products are designed with many Customer Self Re pair (CSR) parts to minimi ze repair time and allow for greater flexibility in perf orming defective parts re placement. If during the di agnosis period HP (or HP service providers or service partners) identifies that the r epair can be accomplished [...]
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Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous s eront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont é[...]
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Customer self repair 7 In base alla disponibilità e alla località geografica, le parti CSR vengono sp edite con consegna entro il giorno lavorativo seguente. La consegna nel gior no stesso o entro quattro ore è off erta con un supplemento di costo solo in alc une zone. In caso di neces sità si può richiedere l'assisten za telefonica di un[...]
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Customer self repair 8 stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Cu stomer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in No rdamerika finden Sie au[...]
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Customer self repair 9 Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente ( http://www.hp.com/go/selfrepair ). Se r v ic i o de gar antía e x clu si v o de [...]
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Customer self repair 10 G arant ieser v ic e " P ar ts On ly" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos ver vangende onderdelen ter beschikking stellen. Voor de Parts Only garantieservice is vervanging door CSR-onderde[...]
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Customer self repair 11[...]
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Customer self repair 12[...]
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Customer self repair 13[...]
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Customer self repair 14[...]
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Illustrated parts catalog 15 Illus tr ated par ts catalog In this section Mechanical components .......................................................................................................... ............... 16 System co mponents .............................................................................................................[...]
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Illustrated parts catalog 16 Mec hanical co mponents Item Description Assembly part number Spare part number Customer self repair (on page 5 ) 1 Access panel (top cover) 389 059-001 409410-001 Mandatory 1 2 Front bezel (tower model only ) 389070-001 409411 -001 Optional 2 3 Rack bezel (rack model only ) 389064-001 409412 -001 Optional 2 4 Tower con[...]
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Illustrated parts catalog 17 Item Description Assembly part number Spare part number Customer self repair (on page 5 ) a) Wrap-around panel 389077-001 — M andatory 1 b) Top cover 389078-001 — Mandatory 1 5 Center wall 384886-001 409433 -001 Optional 2 6 Removable media bl ank 394777-001 409414-001 Mandatory 1 7 Media bay sp acer 389079-001 4094[...]
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Illustrated parts catalog 18 1 Mandatory: Obligatorio—componentes para los que la reparación por parte del us uario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que ha cerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. 2 Optional: Opcional— componentes para los que la [...]
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Illustrated parts catalog 19[...]
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Illustrated parts catalog 20 S y stem c omponent s Item Description Assembly part number Spare part number Customer self repair (on page 5 ) System components 14 Hot-plug power supply, 1000 W 380622-001 403781-001 Optional 2 15 Hot-plug fan, 120 mm 384881-001 409421-001 Optional 2 16 3.3-V lithium ba ttery* 166899-001 153099-001 Optional 2 17 Proce[...]
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Illustrated parts catalog 21 Item Description Assembly part number Spare part number Customer self repair (on page 5 ) a) Dual-core, Intel® Xeon™ Processor 5050 (3.00-GHz, 66 7-MHz FSB, 2x2- MB L2 cache)† 405176-004 409423 -001 Optional 2 b) Dual-Core, Intel® Xeon™ Processor 5060 (3.20-GHz, 1066- MHz FSB, 2x2-MB L2 cache)*† 398571-002 409[...]
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Illustrated parts catalog 22 Item Description Assembly part number Spare part number Customer self repair (on page 5 ) b) Receptacle, door snap, stone* 148525-004 — Optional 2 c) PCI retainer, card guide* 250967-004 — Optional 2 d) Clip, cable, adhesive, 1.77-in* 241347-007 — Optional 2 e) Clip, retainer, 0.125-in d iameter* 379046-002 — Op[...]
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Illustrated parts catalog 23 Item Description Assembly part number Spare part number Customer self repair (on page 5 ) c) 60-GB SATA, 5,000- rpm* 379306-B21 382264-001 Optional 2 40 Keyboard* 382641-001 382 925-001 Mandatory 1 41 Mouse* 334684 -003 390937-001 Manda tory 1 42 AC power cord* 163719-00 2 187335-001 Mandatory 1 43 x4/x8 PCI bus expande[...]
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Illustrated parts catalog 24 1 Mandatory: Obbligatorie—Parti che de vono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di sp edizione e di manodopera per il servizio. 2 Optional: Opzionali—Parti la cui riparazione da parte del clie nte è facoltativa. Si tratta comunque di com[...]
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Illustrated parts catalog 25[...]
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Removal and replacement procedures 26 R emo v al and r eplacemen t pr ocedur es In this section Required tools ................................................................................................................. ....................... 26 Safety consid erations ...........................................................................[...]
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Removal and replacement procedures 27 Safet y c ons id er at ion s Before performing service procedur es, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you n eed to follow when setting up the system or handling parts. A discharge of static elec tricity from a finger[...]
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Removal and replacement procedures 28 These symbols, on power supplie s or systems, indicate that the equipment is supplied by multiple sources of power. WARNING: To reduce the risk of injury from electric shock, remove all power cords to completely disconnect power fr om the system. Rack warnings WARNING: To reduce the risk of person al injury or [...]
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Removal and replacement procedures 29 Power down the server WARNING: To reduce the risk of person al injury, electric shock, or damage to the equipment, remove the power cord to remove power f rom the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry r[...]
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Removal and replacement procedures 30 3. Extend the server from the rack. Reverse t he server installation steps in the documentation that ships with the rack-mounting option. 4. Press the server rail-rel ease latches and remove the server from the rack. 5. Place the server on a sturdy, level surface. Fro n t b e ze l Tower servers have a removable[...]
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Removal and replacement procedures 31 A cces s panel WARNING: To reduce the risk of person al in jury from ho t surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel op en or removed. Operating the server in this manner result s in improp[...]
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Removal and replacement procedures 32 4. Remove the rack bezel. To replace the component, reverse the removal procedure. Fe e t NOTE: This procedure applies to towe r servers only. To remove the component: 1. Power down the server (on page 29 ). 2. Place the server on its side. 3. Remove the feet. To replace the component, slide it back into the lo[...]
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Removal and replacement procedures 33 T o w er conf igur atio n panels To remove the component: 1. Power down the server (on page 29 ). 2. Remove the tower feet (" Feet " on page 32 ). 3. Remove the tower configuration panels: a. Use the T-10/T-15 Torx screwdriver to remove the two front panel sc rews. b. Remove the tower configuration pa[...]
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Removal and replacement procedures 34 5. Remove the rail. 6. Repeat the steps to remove the other rail. To replace the component, reverse the removal procedure. P o w er suppl y blank CAUTION: Do not attempt to remove and replace a powe r supply as a hot-plug procedure unless both bays are populated with power supplies. Remove the component as indi[...]
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Removal and replacement procedures 35 Hot-plug po w er suppl y WARNING: To reduce the risk of electri c sh ock, do not disassemble the power supply or attempt to repair it. Replace it on ly with t he specified spare part. CAUTION: Do not attempt to remove and replace a powe r supply as a hot-plug procedure unless both bays are populated with power [...]
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Removal and replacement procedures 36 2. Remove the blank. To replace the component, reverse the removal procedure. Har d dr i v e To remove the component: CAUTION: To prevent improper cooling and thermal damag e, do not operate the server unless all bays are populated with either a component or a blank. 1. Determine the status of the hard drive fr[...]
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Removal and replacement procedures 37 Har d dr i v e cage and backplane To remove the component: 1. Power down the server (on page 29 ). 2. Do one of the following: • Open or remove the tower bezel, as need ed (" Front bezel " on page 30 ). • Extend the server from the rack (on page 29 ). 3. Remove the access panel (" Access pane[...]
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Removal and replacement procedures 38 8. Remove the four screws that secure the drive cage to the chassis. 9. Remove the SAS cage. To replace the component, reverse the removal procedure. Sy s t e m f a n s The server supports redundant hot-plug fans to provide proper airflow to the system if a primary fan fails. In the standard configuration, fans[...]
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Removal and replacement procedures 39 3. Remove the fan. To replace the component, reverse the removal procedure. Expansi on slo t co v er To remove the component: 1. Power down the server (on page 29 ). 2. Extend the server from the rack, if applicable (" Extend the server from the rack " on page 29 ). 3. Remove the access panel (" [...]
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Removal and replacement procedures 40 To replace the component, reverse the removal procedure. Expansi on boar d CAUTION: To prevent damage to the server or expansio n boards, power down the server and remove all AC power cords before removing or installing the exp ansion boards. To remove the component: 1. Power down the server (on page 29 ). 2. E[...]
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Removal and replacement procedures 41 CAUTION: Make a note of board locations. Be sure to install replacements in the same slots. To replace the component, reverse the removal procedure. Sl ot r ele ase l e v er To remove the component: 1. Power down the server (on page 29 ). 2. Extend the server from the rack, if applicable (" Extend the serv[...]
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Removal and replacement procedures 42 4. Remove the processor air b affle. To replace the component, reverse the removal procedure. Center w al l To remove the component: 1. Power down the server (on page 29 ). 2. Extend or remove the server from the rack (" Extend the server from th e rack " on page 29 , " Re move the server from th[...]
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Removal and replacement procedures 43 To replace the component, reverse the removal procedure. Media blanks To remove the component: 1. Power down the server (on page 29 ). 2. Open or remove the tower bezel (" Front bezel " on page 30 ). CAUTION: To prevent improper cooling and thermal damag e, do not operate the server unless all bays ar[...]
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Removal and replacement procedures 44 4. Slide the media latch to release the drive and exte nd the drive from the bay to access the cabling. CAUTION: To prevent improper cooling and thermal damag e, do not operate the server unless all bays are populated with either a component or a blank. 5. Disconnect the data and powe r cables from the device. [...]
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Removal and replacement procedures 45 4. Press the HP Systems Insig ht Display ejector butto n to extend the HP Systems Insight Display. 5. Disconnect the Systems Insight Display ca ble from the system board (" System board components " on page 80 ). 6. Remove two T-10 scr ews on the side of the Systems Insight Display. 7. Remove the Syst[...]
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Removal and replacement procedures 46 WARNING: Always comply with all electrostati c and thermal guidelines to prevent bodily injury and ensure a properly functioning sy stem when performing hot-plug operati ons. WARNING: To preven t personal injury from hazardous energy: • Remove watches, rings, or other metal objects. • Use tools with insulat[...]
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Removal and replacement procedures 47 6. Remove the FBDIMM. To replace the component, reverse the removal procedure. Pr oc essor CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or cache sizes. Refer to the label on the processor heatsink for a description of the processor. CAUTION: Be sure that you have th[...]
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Removal and replacement procedures 48 6. Remove the heatsink. 7. Open the processor retaini ng latch and the processor socket retaining bracket.[...]
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Removal and replacement procedures 49 8. Using your fingers, remove the failed processor. To replace the component: IMPORTANT: Be sure the processor remains in side the processor installation tool. 1. If the processor has separated from the installation tool, carefully re-insert the proc essor in the tool. 2. Align the processor installation tool w[...]
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Removal and replacement procedures 50 CAUTION: The processor is designed to fit one way in to the socket. Use the al ignment guides on the processor and socket to properly alig n the processor with the socket. Re fer to the server hood l abel for specific instructions. 3. Press down firmly until the proces sor in stallation tool clicks and separate[...]
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Removal and replacement procedures 51 4. Close the processor retaini ng latch and the processor socket retaining bracket. 5. Clean the old thermal grease from the heatsink with the alcohol swa b. Allow the alcohol to evaporate before continuing. 6. Apply all the grease to the top of the processor in one of the follow ing patterns to ensure even dis[...]
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Removal and replacement procedures 52 8. Close the heatsink retaining latches. 9. Install the processor air baffle. 10. Install the access panel. 11. Do one of the following: • Install and lock the bezel. • Slide the server back into the rack. 12. Power up the server. Hea tsin k To remove the component: 1. Power down the server (on page 29 ). 2[...]
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Removal and replacement procedures 53 6. Remove the heatsink. To replace the heatsink: 1. Clean the old thermal grease fr om the heatsink and processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Apply all the grease to the top of the processor in one of the follow ing patterns to ensure even distribution. 3. Install[...]
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Removal and replacement procedures 54 4. Close the heatsink retaining latches. 5. Install the processor air baffle. 6. Install the access panel. 7. Do one of the following: • Install and lock the bezel. • Slide the server back into the rack. 8. Power up the server. PP M To remove the component: 1. Power down the server (on page 29 ). 2. Do one [...]
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Removal and replacement procedures 55 5. Remove the PPM. NOTE: The appearance of compatible PPMs may vary. To replace the component, reverse the removal procedure. CAUTION: Only install a PPM if the processor is inst alled. Both the PPM and the processor must be installed together, otherwise the system d oes not boot. IMPORTANT: PPMs do not seat if[...]
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Removal and replacement procedures 56 8. Disconnect the signal cable from the power supply backplane. 9. Disconnect all cables from the system board, as necessary, to access the power su pply backplane. 10. Remove the power supply backplane. To replace the component, reverse the removal procedure. IMPORTANT: Be sure to align the two retaining guide[...]
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Removal and replacement procedures 57 3. Remove the access panel (" Access panel " on page 31 ). 4. Remove all expansion boards (" Expansion board " on page 40 ). 5. Remove the processor air b affle (" Processor air baffle " on page 41 ). 6. Remove the center wall (" Center wall " on page 42 ). 7. Remove the [...]
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Removal and replacement procedures 58 BB W C bat te r y pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migr ation, or stripe size migration is in progress. CAUTION: After the server is powered down, wait 15 seconds and then check the amber[...]
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Removal and replacement procedures 59 5. Remove the battery pack. To replace the component, reverse the removal procedure. S y st em boar d IMPORTANT: If replacing the system board or clearing NVRAM, you must r e-enter the server serial number through RBSU. To remove the component: 1. Power down the server (on page 29 ). 2. Do one of the following:[...]
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Removal and replacement procedures 60 11. Open the processor retaini ng latch and the processor socket retaining bracket. 12. Using your fingers, remove the processor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the socket contacts. • Always install the processor socket cover afte r removing the pro[...]
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Removal and replacement procedures 61 15. Lift the system board out of the chassis and tilt it to one side to clear t he cable guide. To replace the system board: 1. Install the spare system boa rd in the server before installing the proc essor. 2. Prepare the processor socket on the spare syst em board: a. Open the processor retaining latch and th[...]
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Removal and replacement procedures 62 b. Remove the processor socket protective c over. 3. Install the processor socket cover onto the processo r socket of the f ailed system board. The cover protects the socket during shipping when the failed board is returned. 4. Install the processor onto the spare sy stem board. CAUTION: The processor is design[...]
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Removal and replacement procedures 63 5. Close the processor retaining latch and the processor socket retaining bracket. 6. Clean the old thermal grease fr om the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuin g. 7. Apply all the grease to the top of the processor in one of the follow i[...]
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Removal and replacement procedures 64 2. Select the System Options menu. 3. Select Serial Number . The following warning is displayed: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should a[...]
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Removal and replacement procedures 65 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its defau lt configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or prop er disposal,[...]
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Cabling 66 C abling In this section Cabling ov erview ............................................................................................................... .................... 66 Diskette driv e cabl ing ......................................................................................................... .................... 66 SAS c[...]
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Cabling 67 S A S cabling NOTE: The center wall is removed for illustration purposes only. • SAS data cabling • SAS power cabling[...]
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Cabling 68 CD-R OM dr i v e cabling V i deo cabling[...]
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Cabling 69 P ar allel/ser ial po r t cabling BB W C opti on cabling[...]
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Cabling 70 Int er nal U SB connec tor S tor age de v i ce cabling gui delines CAUTION: To prevent damage to the equipment, be sure that the server is powe red down, all cables are disconnected from the back of the server, and the powe r cord is disc onnected from the grounded (earthed) AC outlet before installing devic es. CAUTION: To prevent damag[...]
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Diagnostic tools 71 Diagno sti c tools In this section Automatic Serv er Reco very ...................................................................................................... ................ 71 HP Systems Insi ght Mana ger ..................................................................................................... .............[...]
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Diagnostic tools 72 • From within Survey Utility • From within operating syste m-specific IML viewers • For NetWare: IML Viewer • For Windows®: IML Viewer • For Linux: IML Viewer Application • From within the iLO 2 user interface • From within HP Insight Diagnostics (on page 74 ) For more information, refer to the Management CD in th[...]
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Diagnostic tools 73 HP R OM-Ba sed S etu p Utilit y RBSU, an embedded configuration util ity, performs a wide range of co nfiguration activities that may include: • Configuring system devices and installed options • Displaying system information • Selecting the primary boot controller • Configuring memory options • Language selection For [...]
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Diagnostic tools 74 • Preparing the system for inst alling "off-the-shelf" versions of leading o perating system software • Installing optimized server drivers, management agents, and utilities automatically with every assisted installation • Testing server hardware us ing the Insight Diagnostics Utility (" HP Insight Diagnosti[...]
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Component identification 75 C ompone nt i dentif i cati on In this section Front panel components ......................................................................................................... ................. 75 Front panel LEDs and buttons ................................................................................................[...]
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Component identification 76 Item Description 6 DVD/CD-ROM drive 7 Removable media bays 8 Hard drive bays 1-8 • Tower model Item Description 1 Media bay spacer 2 DVD/CD-ROM drive 3 Removable media bays 4 Hard drive bays 1-8 5 Hard drive bays 9-16 (optional drive cage) 6 USB connectors 7 HP Systems Insight Display 8 HP Systems Insight Display eject[...]
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Component identification 77 F r ont pane l LEDs and buttons Item Description Status 1 UID button — 2 UID LED Blue = Activated Flashing blue = System is being managed remotely Off = Deactivated 3 Internal system health LED Green = Normal (system on) Amber = System health is degraded Red = System health is critical Off = Normal (system off) 4 Exter[...]
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Component identification 78 R ear panel componen ts Item Description 1 Keyboard connector 2 Mouse connector 3 USB connectors 4 iLO 2 management connector 5 Video connector 6 Serial connector 7 NIC 2 connector 8 PCI expansion slots 9 Hot-plug power supply (primary bay) 10 Hot-plug power supply blank (redundant bay) 11 NIC 1 connector 12 T-10 /T-15 T[...]
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Component identification 79 R ear panel LEDs Item Description Status 1 UID LED Blue = Activated Flashing blue = system is being remotely managed Off = Deactivated 2 iLO 2 activity LED Green or flashing green = Network activity Off = No network activity 3 iLO 2 link LED Green = Linked to network Off = No network conne ction 4 NIC 2 activity LED Gree[...]
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Component identification 80 S y st em boar d componen ts Item Description 1 PCI Express slot 1, x4 2 PCI-X slot 2, 64-bit/133-MHz 3 PCI-X slot 3, 64-bit/133-MHz 4 PCI Express slot 4, x4 5 PCI Express slot 5, x4 (optional x8 when PCIe Bus Expander is installed in slot 4) 6 PCI Express slot 6, x4 7 PCI Express slot 7, x4 (optional x8 when PCIe Bus Ex[...]
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Component identification 81 Item Description 24 Internal USB connector 25 Serial 2 connector 26 Parallel connector 27 Diskette drive connector System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled. On = iLO 2 security is disabled. S2 Off Off = System configuration can be modified. On = System configuration is lo[...]
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Página 82
Component identification 82 HP Systems Insight Display LED color Internal system health LED color Status PPM failure, slot X (amber) Red One or more of the following conditions may exist: • PPM in slot X has failed. • PPM is not installed in slot X , but the corresponding processor is installed. DIMM failure, slot X (amber) Red One or more of t[...]
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Página 83
Component identification 83 S A S and S A T A har d dr i v e LEDs Item Description Status 1 Fault/UID LED Amber = Drive failure Flashing amber = Fault-process activity Blue = Unit identification is active Off = No fault-process activity 2 Online/activity LED Green = Drive activity Flashing green = High activity on the drive or drive is being config[...]
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Página 84
Component identification 84 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing regularly (1 Hz) Off Do not remove the dri ve. Removing a drive may terminate the current operation and cause dat a loss. The drive is rebuilding, or it is part of an array that is undergoing capacity expansion or stripe migration. Flashing ir[...]
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Página 85
Component identification 85 Item Description 8 FBDIMM slot 8, bank D P o w er suppl y backplane LED If the power supply backplane LED is illumina ted, the power supply backplane has failed. Fa n l o c a t i o n s Item Description Configuration 1 Fan 1 Primary 2 Fan 2 Primary 3 Fan 3 Primary 4 Fan 4 Redundant[...]
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Página 86
Component identification 86 Item Description Configuration 5 Fan 5 Redundant 6 Fan 6 Redundant S y st ems Insigh t Displa y LEDs To view a quick reference for co mponent identification and status, access the Systems Insight Display. Item Description Status 1 Primary power supply LED Amber = Failure Off = Normal 2 Redundant power supply LED Amber = [...]
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Página 87
Component identification 87 Item Description Status 9 Processor 2 LED Amber = Failure Off = Normal 10 PPM 2 LED Amber = Failure Off = Normal 11 Hot-plug fan LE Ds Amber = Failure or fan is not installed Off = Normal 12 Internal system health LED Green = Normal (system on) Amber = System health is degraded Red = System health is critical Off = Norma[...]
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Página 88
Specifications 88 S pec if i cati ons In this section Environmental specificat ions ................................................................................................... ................. 88 Server spec ificat ions .......................................................................................................... ..............[...]
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Página 89
Specifications 89 Specification Value Weight (maximum) 40.8 kg (110 l b) Weight (when lightly loaded) 24.9 kg (55 lb) Input requirements Rated input voltage 100 VAC to 240 VAC * Rated input frequency 47 Hz to 63 Hz Rated input current 10 A (100 V) to 6.7 A (200 V) Rated input power 1500 W BTUs per hour 2730 Power supply output Rated steady-state po[...]
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Página 90
Specifications 90 Specification Value Drives supported 1 Drive height One-third heig ht Drive rotation 300 rpm Transfer rate High 500 Kb/s Low 250 Kb/s Bytes/sector 512 Sectors per track (high/low) 18/9 Tracks per side (high/low) 80/80 Access times Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency averag[...]
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Página 91
Specifications 91 Specification Value Track pitch 1.6 µm (6.3 × 10 -7 in) Cache/buffer 128 KB Startup time < 10 s Stop time < 5 s (single); < 30 s (multisession) Laser parameters Type Semiconductor laser GaAs Wave length 700 ± 25 nm Divergence angle 53.5° ± 1.5° Output power 0.14 mW Operating conditions Temperature 5°C to 55°C (41?[...]
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Página 92
Acronyms and abbreviations 92 A c r on y ms and abbr e v iati ons ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache BIOS Basic Input/Output System DDR double data rate DIMM dual inline memory module FBDIMM fully buffered DIMM IDE integrated device electronics iLO 2 Integrated Lights-Out 2 IML Integrated Management Log[...]
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Página 93
Acronyms and abbreviations 93 NMI non-maskable interrupt NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCI Express peripheral component interconnect express PCI-X peripheral component interconnect extended POST Power-On Self Test PPM processor power module RAID redundant array of inexpensive (or independent) disks RBSU ROM-Base[...]
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Página 94
Acronyms and abbreviations 94 SIM Systems Insight Manager SNMP Simple Network Management Protocol UID unit identification USB universal serial bus VHDCI very high density cable interconnect[...]
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Página 95
Index 95 A AC power supply 79 access panel 31 air baffle 28, 41 ASR (Automatic Server Recovery) 71, 92 Automatic Server Recovery (ASR) 71, 92 Autorun menu 73 B battery 80 battery-backed write cache (BBWC) 69 battery-backed write cache cabling 69 BIOS upgrade 73 buttons 75 C cables 66 cabling 66, 70 cabling, storage system 70 CD-ROM drive 68, 90 CD-[...]
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Página 96
Index 96 LEDs, SATA hard drive 83 LEDs, Systems Insight Display 86 M management tools 71 media drive 43 media drive blank 43 memory boards 46 memory slots 80, 84 N network connector LEDs 79 NIC (network interface controller) 92 NIC LEDs 77, 86 O Online ROM Flash Component Utility 73 ORCA (Option ROM Configu ration for Arrays) 72 overtemperature LED[...]
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Página 97
Index 97 V video connector 75[...]