HP (Hewlett-Packard) 335167-003 Bedienungsanleitung

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- Grundsätze der Bedienung, Regulierung und Wartung des Geräts HP (Hewlett-Packard) 335167-003
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Der Grund dafür ist die fehlende Zeit und die Sicherheit, was die bestimmten Funktionen der gekauften Geräte angeht. Leider ist das Anschließen und Starten von HP (Hewlett-Packard) 335167-003 zu wenig. Eine Anleitung beinhaltet eine Reihe von Hinweisen bezüglich bestimmter Funktionen, Sicherheitsgrundsätze, Wartungsarten (sogar das, welche Mittel man benutzen sollte), eventueller Fehler von HP (Hewlett-Packard) 335167-003 und Lösungsarten für Probleme, die während der Nutzung auftreten könnten. Immerhin kann man in der Gebrauchsanleitung die Kontaktnummer zum Service HP (Hewlett-Packard) finden, wenn die vorgeschlagenen Lösungen nicht wirksam sind. Aktuell erfreuen sich Anleitungen in Form von interessanten Animationen oder Videoanleitungen an Popularität, die den Nutzer besser ansprechen als eine Broschüre. Diese Art von Anleitung gibt garantiert, dass der Nutzer sich das ganze Video anschaut, ohne die spezifizierten und komplizierten technischen Beschreibungen von HP (Hewlett-Packard) 335167-003 zu überspringen, wie es bei der Papierform passiert.

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Inhaltsverzeichnis der Gebrauchsanleitungen

  • Seite 1

    Main tenan ce and Ser vice Gui de HP C ompaq nc6 000 Busine ss Not ebook Doc ument P art Number : 3 3 516 7 -003 F ebruary 2005 This guide is a troubleshooting reference used for maintaining and servicing the notebook. It provides comprehensi ve information on identifying notebook features, components, and spare parts; troubleshooting notebook prob[...]

  • Seite 2

    © Copyright 2003, 2005 He wlett-Packard De velopment Company , L.P . Microsoft and W indows are U.S. re gistered trademarks of Microsoft Corporation. Intel and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. SD Logo is a trademark of its proprietor . Bluetooth is a [...]

  • Seite 3

    Maintenance and S ervice Gui de iii Cont ent s 1 Product Description 1.1 Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–11 1.3 Clearing a Password . . . . . . . . . . . . . . . . . . . . . . . . 1–13 1.4 Power Management . . [...]

  • Seite 4

    i v Maintenance and S ervice Gui de Cont ent s 3.5 Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–10 3.6 Sequential Part Number Listing . . . . . . . . . . . . . . . 3–11 4 Removal and Replacement Preliminaries 4.1 Tools Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Service Consideration[...]

  • Seite 5

    Cont ent s Maintenance and Se rvice Guide v 5.20 RTC Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–46 5.21 LED Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–48 5.22 Button Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–50 5.23 System Board . . . . . . . . . . . . . . . . . . . . .[...]

  • Seite 6

    Maintenance and Se rvice Guide 1–1 1 Product Des c ription The HP Compaq nc6000 Business Notebook of fers advanced modularity , a Mobile Intel® Pentium® 4 Processor-M with 64-bit architecture, an A TI MOBILITY RADEON 9600 graphics controller with 64 or 32 MB of discrete video memory , and extensi ve multimedia support. HP Compaq nc6 000 Busines[...]

  • Seite 7

    1–2 Maintenance and S ervice Gui de Product Description 1.1 M o d e l s Notebook models are sho wn in T ables 1-1 and 1-2. Ta b l e 1 - 1 HP Compaq nc6000 Model Naming Con ventions Key C P 180 S4 60 Y Ci 10 P XXXXXX-XXX 12 3 4 5 6 7 8 9 1 0 Ke y Description Options 1 Brand/Series designator C = HP nc6000 2 Processor type P = Mobile In tel P entiu[...]

  • Seite 8

    Product Description Maintenance and Se rvice Guide 1–3 Ta b l e 1 - 2 HP Compaq nc6000 Models All HP Compaq nc6000 models f eature: ■ Dual Stick (T ouchP ad and poin ting stick) pointing de vice ■ 8- or 6-cell lithium ion (Li-Ion) batter y pack ■ 3-year w arranty on par ts and labor Cnc6000 P 170 S4 60 Y Gm 51 P United States DQ882A ABA Cnc[...]

  • Seite 9

    1–4 Maintenance and S ervice Gui de Product Description Cnc6000 P 160 X4 40 W Gj 51 P Belgium Denmark Europe Fr a n c e Germany Greece Iceland Italy DJ256A UUG DJ256A ABY DJ256A ABB DJ256A ABF DJ256A ABD DJ256A AB7 DJ256A A2M DJ256A ABZ The Netherlands Norwa y P or tugal Spain Sweden Switzerland United Kingdom DJ256A ABH DJ256A ABN DJ256A AB9 DJ2[...]

  • Seite 10

    Product Description Maintenance and Se rvice Guide 1–5 Cnc6000 P 160 X4 40 W Gn 51 P Asia P acific A ustralia Belgium Brazil Czech Repub lic Denmark Europe International Fr a n c e F rench Canada Germany Greece Hong K ong Hungar y Iceland India Israel Italy Jap an Japan - English DP894A UUF DP894A ABG and DS860P ABG DP894A UUG DP894A AC4 DP894A A[...]

  • Seite 11

    1–6 Maintenance and S ervice Gui de Product Description Cnc6000 P 160 X4 40 W Gn 51 2 Asia P acific A ustralia Belgium Brazil Czech Repub lic Denmark Europe International Fr a n c e F rench Canada Germany Greece Hong K ong Hungar y Iceland India Israel Italy Jap an Japan - English DP895A UUF DP895A ABG and DS859P ABG DP895A UUG DP895A AC4 DP895A [...]

  • Seite 12

    Product Description Maintenance and Se rvice Guide 1–7 Cnc6000 P 150 X4 40 W Gn 25 P Hong K ong DS807P AB5 Cnc6000 P 150 X4 30 W Gg 10 H Ger many DJ324S ABD Cnc6000 P 150 X4 30 D Gm 25 P Europe International DQ881A ABB United States DQ881A ABA Cnc6000 P 140 X4 40 W Gm 25 P Japan DT641P ABJ Japan/English DT641P ACF Cnc6000 P 140 X4 40 W Gp 25 P A [...]

  • Seite 13

    1–8 Maintenance and S ervice Gui de Product Description Cnc6000 P 140 X4 40 D Gn 25 H P eople’ s Republic of China DS794P AB2 Cnc6000 P 140 X4 40 D Mn 51 P United States DT868A ABA Cnc6000 P 140 X4 40 C Gn 51 P Asia P acific DS652C UUF Cnc6000 P 140 X4 30 Y Gn 25 P United States DS825C ABA Cnc6000 P 140 X4 30 W Gi 25 P Belgium Denmark Fr a n c [...]

  • Seite 14

    Product Description Maintenance and Se rvice Guide 1–9 Cnc6000 P 140 X4 30 D Gp 25 P Asia P acific Belgium Czech Repub lic Denmark Europe Fr a n c e F rench Canada Germany Greece Hungar y Iceland Israel Italy Jap an Japan/English Ko r e a DT412C UUF DJ254A UUG DJ254A AKB DJ254A ABY DJ254A ABB DJ254A ABF and DT412C ABF DT412C ABC DJ254A ABD, DT412[...]

  • Seite 15

    1–10 Maintenance and Serv ice Guide Product Description Cnc6000 P 140 X4 30 D Gn 25 P A ustralia F rench Canada Hong K ong DS798P ABG DH913U ABC DS806P AB5 United States DH913U ABA and DS847C ABA Cnc6000 P 140 X4 30 D Gn 25 2 A ustralia DS797P ABG Ta b l e 1 - 2 HP Compaq nc6000 Models (Continued)[...]

  • Seite 16

    Product Description Maintenance and S ervice Gui de 1–11 1. 2 F e a t u r e s ■ Mobile Intel Pentium 4 1.8-GH z Processor-M, with 2.0-MB L2 cache, v arying by notebook model ■ Mobile Intel Pentium M 1.7-, 1.6-, 1.5-, and 1.4-GHz processors, all with 1.0-MB L2 cache, v arying by notebook model ■ 14.1-inch SXGA+ (1400 × 1050) or XGA (1024 ×[...]

  • Seite 17

    1–12 Maintenance and Serv ice Guide Product Description ■ Stereo speakers ■ Support for the follo wing devices in the MultiBay: ❏ 24X Max CD-R OM dri ve ❏ 24X Max D VD/CD-R W combo driv e ❏ 8X Max D VD-R OM dri ve ❏ D VD+R W/R and CD-R W combo dri ve ❏ 8-cell Prismatic battery pack ■ Connectors for: ❏ SD Card ❏ Infrared ❏ On[...]

  • Seite 18

    Product Description Maintenance and S ervice Gui de 1–13 1. 3 C l e a r i n g a P a s s w o r d If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear CMOS: 1. Prepare the notebook for disassembly (refer to Section “5.3 Preparing the Notebook for Disassembly” for more info[...]

  • Seite 19

    1–14 Maintenance and Serv ice Guide Product Description 1 .5 External Com ponen ts The external components on the front and left side of the notebook are sho wn below and described in T able 1-3. F r ont and Left-Si de Compone nts[...]

  • Seite 20

    Product Description Maintenance and S ervice Gui de 1–15 Ta b l e 1 - 3 Front and Left-Side Components Item Component Function 1 A udio line-out jack Produces system sound when connected to optional powered stereo speak ers, headphones, headset, or tele vision audio . 2 Microphone jack Connects an optional monaural microphone. 3 Hard drive ba y H[...]

  • Seite 21

    1–16 Maintenance and Serv ice Guide Product Description The notebook rear panel and right-side components are sho wn belo w and described in T able 1-4. Rear P anel and Righ t Side Compo nents Ta b l e 1 - 4 Rear P anel and Right-Side Components Item Component Function 1 Batter y slot Holds the primar y batter y . 2 PC Card eject buttons Release [...]

  • Seite 22

    Product Description Maintenance and S ervice Gui de 1–17 6 V ents (3) Allow airflo w to cool inter nal components. Ä T o pre vent o verheating, do not obstruct vents. Using the notebook on a soft surf ace, such as a pillow , blank et, rug, or thick clothing, ma y blo ck a i rf l ow . 7 Bluetooth compar tment Holds a Bluetooth wireless de vice. 8[...]

  • Seite 23

    1–18 Maintenance and Serv ice Guide Product Description The notebook ke yboard components are shown belo w and described in T able 1-5. K e yboar d Com ponents[...]

  • Seite 24

    Product Description Maintenance and S ervice Gui de 1–19 Ta b l e 1 - 5 Ke yboard Components Item Component Function 1 fn ke y Ex ecutes frequently used system functions when pressed in comb ination with another key . 2 caps lock ke y Enab les caps lock and turns on the caps lock light. 3 f1 through f12 function keys P erf or m system and applica[...]

  • Seite 25

    1–20 Maintenance and Serv ice Guide Product Description The notebook top components are sho wn below and described in T able 1-6. T op Components Ta b l e 1 - 6 T op Components Item Component Function 1 Num lock light On: Num lock is on or the embedded numeric ke ypad is enabled. 2 Caps lock light On: Caps lock is on. 3 Scroll lock light On: Scro[...]

  • Seite 26

    Product Description Maintenance and S ervice Gui de 1–21 4 Displa y lid switch* ■ If the notebook is cl osed while on, turns off the displa y . ■ If the notebook is opened while on, turns on the display . 5 P ow er button* When the notebook is: ■ Off , press and release to tur n on the notebook. ■ In Standby , press and release to exit St[...]

  • Seite 27

    1–2 2 Maintenance and Serv ice Guide Product Description T op Components (C ontinued)[...]

  • Seite 28

    Product Description Maintenance and Se rvice Guide 1–2 3 Ta b l e 1 - 6 T op Components (Continued) Item Component Function 8 Presentation Mode but t o n Alternates between presentation modes. 9 P ointing stick Mov es the poin ter and selects or activates items on the screen. 10 Left and right pointing stick b uttons Function like the left and ri[...]

  • Seite 29

    1–2 4 Maintenance and Serv ice Guide Product Description The external components on the bottom of the notebook are sho wn below and described in T able 1-7. Bott om Components Ta b l e 1 - 7 Bottom Components Item Component Function 1 Batter y bay Holds the primar y batter y pack. 2 Batter y release latch Releases a batter y pack from the batter [...]

  • Seite 30

    Product Description Maintenance and Se r v ice Guide 1–2 5 3 Mini PCI compar tment Holds an optional wireless LAN or ISDN de vice. ✎ The FCC does not allow unauthorized Mini PCI devices to be used in the notebook. Installing an unauthorized Mini PCI device can prevent the notebook from operating properly and might result in a warning message. T[...]

  • Seite 31

    1–2 6 Maintenance and Serv ice Guide Product Description 1. 6 D e s i g n O v e r v i e w This section presents a design ov erview of k ey parts and features of the notebook. Refer to Chapter 3, “Illustrated Parts Catalog, ” to identify replacement parts, and Chapter 5, “Remov al and Replacement Procedures, ” for disassembly steps. The sy[...]

  • Seite 32

    Maintenance and Se rvice Guide 2–1 2 T roubl eshooting Å W ARNIN G: Only au thori z ed techni ci ans trained b y HP should re pair t his equipment . All tr oubleshooting and r epair pr ocedures ar e detailed to allo w only su bassembl y/module -lev el repair . Because of the comple xity of the indi vi dual boards and suba ssemblies , do not atte[...]

  • Seite 33

    2–2 Maintenance and S ervice Gui de T roublesh ooting 2. 1 Compu ter Setup and Di a gnostic s Utilities The notebook features two system management utilities: ■ Computer Setup —A system information and customization utility that can be used e ven when your operating system is not working or will not load. This utility includes settings that a[...]

  • Seite 34

    T roubleshooting Maintenance and Se rvice Guide 2–3 3. T o close Computer Setup and restart the notebook: ❏ Select File > Sa ve Changes and Exit and press enter . – or – ❏ Select File > Ignore Changes and Exit and press enter . 4. When you are prompted to confirm your action, press F10. Selecting fro m the Fi le Menu Ta b l e 2 - 1 [...]

  • Seite 35

    2–4 Maintenance and S ervice Gui de T roublesh ooting Selectin g from the Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Setup P ass word Enter , change, or delete a Setup password. The Setup pass word is called an administrator pass word in Computer Security , a program accessed from the Windows Control P anel. P ow er-on P assw [...]

  • Seite 36

    T roubleshooting Maintenance and Se rvice Guide 2–5 Selec ting from the Adv anced Menu Ta b l e 2 - 3 Adv anced Menu Select T o Do This Language Change the Comp uter Setup language. Boot Options Enable/disable: ■ QuickBoot, which starts the notebook more quickly b y eliminating some star tup tests. (If you suspect a memory failure and w ant to [...]

  • Seite 37

    2–6 Maintenance and S ervice Gui de T roublesh ooting De vice Options (continued) ■ Change the parallel por t mode from Enhanced P arallel P o r t (EPP , the def ault setting) to standard, bi-directional EPP , or Enhanced Capabilities P or t (ECP). ■ Set video-out mode to NTSC (def ault), P AL, NTSC-J , or P AL-M.* ■ Enable/disab le all set[...]

  • Seite 38

    T roubleshooting Maintenance and Se rvice Guide 2–7 2.2 Using Di agn osti c s for W in do w s When you access Diagnostics for W indo ws, a scan of all system components is displayed on the screen before the diagnostics windo w opens. Y ou can display more or less information from anywhere within Diagnostics for W indo ws by selecting Le vel on th[...]

  • Seite 39

    2–8 Maintenance and S ervice Gui de T roublesh ooting Obtainin g , Saving, or Printin g Dia gnosti c Te s t I n f o r m a t i o n 1. Access Diagnostics for W indo ws by selecting Start > Settings > Control P anel > Diagnostics for W indows. 2. Select the Te s t tab. 3. In the scroll box, select the category or de vice you want to test. 4[...]

  • Seite 40

    T roubleshooting Maintenance and Se rvice Guide 2–9 6. Select the Begin T esting button. 7. Select a tab to vie w a test report: ❏ Status tab —Summarizes the tests run, passed, and failed during the current testing session. ❏ Log tab —Lists tests run on the system, the number of times each test has run, th e number of errors found on each[...]

  • Seite 41

    2–10 Maintenance and Serv ice Guide T roublesh ooting 2.3 T roubl eshooting Flo wc har ts T able 2-4 T roubleshooting Flo wcharts Over view Flowch ar t Description 2.1 “Flowchart 2.1—Initial T roubleshooting” 2.2 “Flowchart 2.2—No P ower , Part 1” 2.3 “Flowchart 2.3—No P ower , Part 2” 2.4 “Flowchart 2.4—No P ower , Part 3?[...]

  • Seite 42

    T roubleshooting Maintenance and S ervice Gui de 2–11 Flo wch art 2. 1—Initi al T roubleshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device working? Go to “Flowchart 2.17—Nonfunction ing Device?[...]

  • Seite 43

    2–12 Maintenance and Serv ice Guide T roublesh ooting Flo wch art 2.2—N o P ow er , P art 1 1. Reseat the power cables in the Port Replicator and at the AC outlet. 2. Ensure that the AC power source is active. 3. Ensure that the power strip is working. Done Remove from Port Replicator (if applicable). Power up on battery power? Power up on AC p[...]

  • Seite 44

    T roubleshooting Maintenance and S ervice Gui de 2–13 Flo wc har t 2.3—No P o w er , P ar t 2 Continued from “Flowchart 2.2—No Power , Part 1” Visually check for debris in battery socket and clean if necessary . Done N Y Power on? Check battery by recharging it, moving it to another notebook, or replacing it. Power on? Done Y Replace powe[...]

  • Seite 45

    2–14 Maintenance and Serv ice Guide T roublesh ooting Flo wch art 2.4—N o P ow er , P art 3 Continued from “Flowchart 2.3—No Power , Part 2” Reseat AC adapter in notebook and at power source. Internal or external AC adapter? Done Done Done Done Power on? Power on? Power on? Plug directly into AC outlet. Power LED on? Power outlet active? [...]

  • Seite 46

    T roubleshooting Maintenance and S ervice Gui de 2–15 Flo wc har t 2.5—No P o wer , P art 4 Y N Continued from “Flowchart 2.4—No Power , Part 3” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest. Power on? Done N Replace the following item s (if applicable) in [...]

  • Seite 47

    2–16 Maintenance and Serv ice Guide T roublesh ooting Flo wch art 2.6—N o Video, P ar t 1 A N Stand-alone or Port Replicator? No video. Replace the following one at a ti me. T est after each replacement. 1. Cable between notebook and no tebook display (if applicable) 2. Inverter board (if applicable) 3. Display 4. System board Internal or exter[...]

  • Seite 48

    T roubleshooting Maintenance and S ervice Gui de 2–17 Flo wch art 2.7—N o Video, P ar t 2 Y N Continued from “Flowchart 2.6—No Video, Part 1” Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done Verify that notebook is properly seated in Port Rep licator , and check for bent pins on cab[...]

  • Seite 49

    2–18 Maintenance and Serv ice Guide T roublesh ooting Flo wch art 2.8—N onfunc tioning P ort Replica tor (if applicable) Y N Reseat power cord in Port Replicator and power outlet. N Replace the following Port Replicator components one at a time. Check notebook operation after each replacement. 1. Power supply 2. I/O board 3. Backplane board 4. [...]

  • Seite 50

    T roubleshooting Maintenance and S ervice Gui de 2–19 Flo wch art 2.9—N o Operatin g S ystem (OS) Loading No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive, Part 1” Reseat power cord in Port Replicator and power outlet. No OS loading.* * NOTE: Before beginning to troubleshoot, always check cable connections, c[...]

  • Seite 51

    2–20 Maintenance and Serv ice Guide T roublesh ooting Flo wc har t 2. 1 0—No OS Loa ding , H ard Driv e, Part 1 Go to “Flowchart 2.17—Nonfunction ing Device” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchart 2.11—No OS Loading, Hard Drive, Part 2” Reseat external hard drive. OS loading? Done Boot from[...]

  • Seite 52

    T roubleshooting Maintenance and S ervice Gui de 2–21 Flo wch art 2. 1 1—No OS Loading , Ha rd Driv e, Part 2 Continued from “Flowchart 2.10—No OS Loading, Hard Drive, Part 1” Reseat hard drive. Done CD or diskette in drive? 1. Replace hard drive. 2. Replace system board. Go to “Flowchart 2.13—No OS Loading, Diskette Drive” Load OS [...]

  • Seite 53

    2–2 2 Maintenance and Serv ice Guide T roublesh ooting Flo wc har t 2. 1 2—No OS Loa ding , H ard Driv e, P art 3 Y System files on hard drive? Continued from “Flowchart 2.11—No OS Loading, Hard Drive, Part 2” Clean virus. Done N Install OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on diskette? R[...]

  • Seite 54

    T roubleshooting Maintenance and Se rvice Guide 2–2 3 Flo wch art 2. 1 3—N o OS Loading , Disk et te Driv e Done Y N Reseat diskette drive. OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message? Bootable diskette in drive? Install bootable diskette and reboot notebook. Check diskette for system [...]

  • Seite 55

    2–2 4 Maintenance and Serv ice Guide T roublesh ooting Flo wc har t 2. 1 4—N o OS Loadin g, CD- or D VD-ROM Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD- or DVD-ROM Drive. Install bootable disc and reboot notebook. Go to “Flowchart 2.17—Nonfunction ing Device” Go to “Flowchart 2.17—Nonfunction ing Devic[...]

  • Seite 56

    T roubleshooting Maintenance and Se r v ice Guide 2–2 5 Flo wch art 2. 1 5—No Au dio, P art 1 No audio. N Notebook in Port Replicator (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchart 2.16—No Audio, Part 2” Go to “Flowchart 2.16—No Audio, Part 2” Go to “Flowc[...]

  • Seite 57

    2–2 6 Maintenance and Serv ice Guide T roublesh ooting Flo wch art 2. 1 6—No Au dio, P art 2 YN Continued from “Flowchart 2.15—No Audio, Part 1” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker . Load drivers and set configuration in OS. Audio? Done Replac[...]

  • Seite 58

    T roubleshooting Maintenance and Se rvice Guide 2–2 7 Flo wch art 2. 1 7—N onfunc tioning De vice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook, and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix or replace broken item. Nonfunctioning device. Reat[...]

  • Seite 59

    2–2 8 Maintenance and Serv ice Guide T roublesh ooting Flo wch art 2. 1 8—N onfunc tioning K e yboard Y N OK? Keyboard not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external keyboard. Reseat internal keyboard connector (if applicable). Replace internal keyboard or cable. OK?[...]

  • Seite 60

    T roubleshooting Maintenance and Se rvice Guide 2–2 9 Flo wch art 2. 1 9—Nonfunc tioning P ointing Dev ice Y N OK? Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device. Reseat internal pointing device connector (if applicable). Replace inter[...]

  • Seite 61

    2–30 Maintenance and Serv ice Guide T roublesh ooting Flo wc har t 2.20—No Net work/Modem Connec tion Y Disconnect all power from the notebook and open. No network or modem connection. N Done Digital line? Network or modem jack active? Replace jack or have jack activated. Connect to nondigital line. NIC/modem configured in OS? Reload drivers an[...]

  • Seite 62

    Maintenance and Se rvice Guide 3–1 3 I llustra ted P ar ts C a talog This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers and option part numbers. 3. 1 Seri al Number Loca tion When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the not[...]

  • Seite 63

    3–2 Maintenance and S ervice Gui de Illustr ated P arts Catalog 3.2 Notebook Major C omponen ts Notebook Maj or Components[...]

  • Seite 64

    Illustr ated P arts Catalog Maintenance and Se rvice Guide 3–3 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components Item Description Spare P ar t Number 1 Display assemb lies 14.1-inch, TFT , SXGA+ 14.1-inch, TFT , XGA 344397-001 344396-001 Miscellaneous Plastics Kit (includes the f ollowing components) 344411-001 2a 2b 2c 2d 2e 2f 2g Left and[...]

  • Seite 65

    3–4 Maintenance and S ervice Gui de Illustr ated P arts Catalog Notebook Maj or Components[...]

  • Seite 66

    Illustr ated P arts Catalog Maintenance and Se rvice Guide 3–5 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components (Continued) Item Description Spare P ar t Number 5 T op cover (includes T ouchP ad) 344398-001 6 Fan assemb ly 345065-001 7 Heat sink 344410-001 8 Hard drives 80-GB (5400-r pm) 60-GB (7200-r pm) 60-GB (5400-r pm) 40-GB (5400-r pm[...]

  • Seite 67

    3–6 Maintenance and S ervice Gui de Illustr ated P arts Catalog Notebook Maj or Components[...]

  • Seite 68

    Illustr ated P arts Catalog Maintenance and Se rvice Guide 3–7 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components (Continued) Item Description Spare P ar t Number 13 MultiBay de vices 24X Max CD-ROM driv e 24X Max D VD/CD-RW combo driv e 4X Max D VD+RW/R and CD-R W combo drive 8X Max D VD-ROM drive Diskette drive MultiBa y batter y pack 1000[...]

  • Seite 69

    3–8 Maintenance and S ervice Gui de Illustr ated P arts Catalog 3. 3 M iscellan eous P l as tic s Kit Miscell aneous Plastics Kit Components Ta b l e 3 - 2 Miscellaneous Plastics Kit Components Spare P ar t Number 344411-001 Item Description 1 Left and right display hinge co vers 2 R TC batter y 3 Mini PCI compar tment cov er 4 Bluetooth cov er 5[...]

  • Seite 70

    Illustr ated P arts Catalog Maintenance and Se rvice Guide 3–9 3.4 M a s s S to ra g e D e vi ce s T able 3-3 Mass Storage Devices Spare P ar t Number Information Item Description Spare P ar t Number 1 Hard drives (include hard driv e bezel and frame) 80-GB (5400-r pm) 60-GB (7200-r pm) 60-GB (5400-r pm) 40-GB (5400-r pm) 30-GB (4200-r pm) 344407[...]

  • Seite 71

    3–10 Maintenance and Serv ice Guide Illustr ated P arts Catalog 3.5 Miscell aneous Ta b l e 3 - 4 Misc Carrying cases Leather , top load, Samsung Leather , top load, SG Nylon, top load, Samsung Nylon, top load, SG Nylon, entry lev el 325817-001 325817-002 325815-001 325815-002 325814-001 P ort Replicators Advanced P or t Replicator Simple P or t [...]

  • Seite 72

    Illustr ated P arts Catalog Maintenance and S ervice Gui de 3–11 3.6 Sequential P ar t N umber Listin g Ta b l e 3 - 5 Spare P ar ts: Sequential P ar t Number Listing Spare P ar t Number Description 100044-001 24X Max CD-ROM drive 164999-001 USB mouse, carbon 173949-001 8X Max D VD-ROM Drive 239704-001 65-watt A C adapter 241995-001 Diskette driv[...]

  • Seite 73

    3–12 Maintenance and Serv ice Guide Illustr ated P arts Catalog 325526-001 802.11b/g LAN board mi ni PCI communications board 325526-291 802.11b/g, W4 00 modem board (for use in J apan) mini PCI communications board 325814-001 Nylon, entr y lev el 325815-001 Nylon, top load, Samsung 325815-002 Nylon, top load, SG 325817-001 Leather , top load, Sa[...]

  • Seite 74

    Illustr ated P arts Catalog Maintenance and S ervice Gui de 3–13 344391-061 K eyboard (including pointing stick) - Italy 344391-071 K eyboard (including pointing stick) - Spain 344391-081 K eyboard (including pointing stic k) - Denmar k 344391-091 K eyboard (including pointing stick) - Norw ay 344391-121 K eyboard (including po inting stick) - F [...]

  • Seite 75

    3–14 Maintenance and Serv ice Guide Illustr ated P arts Catalog 344391-D61 K eyboard (including pointing stic k) - India 344391-DD1 K eyboard (including pointing stic k) - Iceland 344396-001 Display assemb ly - 14.1-inch, TFT , XGA 344397-001 Display assemb ly - 14.1-inch, TFT , SXGA+ 344398-001 T op cov er (includes T ouchP ad) 344399-001 Base e[...]

  • Seite 76

    Illustr ated P arts Catalog Maintenance and S ervice Gui de 3–15 346885-001 System board (include s 32-MB discrete video memor y) 346886-001 Batter y pack, 6-cell 347253-001 Intel P entium M (Banias) processor , 1.5-GHz 348276-001 Bluetooth wirele ss communications board 353395-001 Intel P entium M (D othan) processor , 2.0 GHz 356596-001 Intel P[...]

  • Seite 77

    Maintenance and Se rvice Guide 4–1 4 Remo v al and Rep la cemen t Preliminaries This chapter provides essential information for proper and safe remov al and replacement service. 4. 1 T oo ls Required Y ou will need the following tools to complete the remo val and replacement procedures: ■ Magnetic scre wdriv er ■ Phillips P0 scre wdriv er ■[...]

  • Seite 78

    4–2 Maintenance and S ervice Gui de Remo v al and Replacement Pr eliminar ies 4.2 Ser vice C onsidera tions The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures. ✎ As you remov e each subassem bly from the notebook, place the subassembly (and all accompanying scre ws)[...]

  • Seite 79

    Remo v al and Replacement Pr eliminaries Maintenance and Se rvice Guide 4–3 4. 3 P re v ent ing Da mage to Re mo v able Dri v es Remov able dri ves are fragile components that must be handled with care. T o prev ent damage to the notebook, damage to a remov able dri ve, or loss of information, observe the follo wing precautions: ■ Before removi[...]

  • Seite 80

    4–4 Maintenance and S ervice Gui de Remo v al and Replacement Pr eliminar ies 4.4 Pre v enting El ec trostatic D ama g e Many electronic components are sensiti ve to electrostatic discharge (ESD). Circuitry design and structure determine the degree of sensiti vity . Networks built into man y integrated circuits provide some protection, b ut in ma[...]

  • Seite 81

    Remo v al and Replacement Pr eliminaries Maintenance and Se rvice Guide 4–5 ■ Store reusable electrostatic-sensiti ve parts from assemblies in protecti ve packaging or nonconducti ve foam. ■ Use transporters and con ve yors made of antistatic belts and roller bushings. Ensure that mechanized equipment used for moving materials is wired to gro[...]

  • Seite 82

    4–6 Maintenance and S ervice Gui de Remo v al and Replacement Pr eliminar ies 4.7 Groundin g Eq uipm ent an d Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible straps with a minimum of one megohm ±1[...]

  • Seite 83

    Remo v al and Replacement Pr eliminaries Maintenance and Se rvice Guide 4–7 ■ Metal tote boxes ■ Electrostatic voltage le v els and protectiv e materials T able 4-1 shows ho w humidity af fects the electrostatic voltage le vels generated by dif ferent acti vities. T able 4-2 lists the shielding protection provided by antistatic bags and floor[...]

  • Seite 84

    Maintenance and Se rvice Guide 5–1 5 Remo v al and Rep la cemen t Procedur es This chapter provides remo val and replacement procedures. There are fifty-se ven screws and standof fs, in f ifteen different sizes, that must be remov ed, replaced, and/or loosened when servicing the notebook. Make special note of each scre w size and location during [...]

  • Seite 85

    5–2 Maintenance and S ervice Gui de Remo v al and Replacement Pr ocedur es 5. 1 S e r i a l N u m b e r Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook. Ser ial Number L ocation[...]

  • Seite 86

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–3 5 .2 Disassem bly Sequence C hart Use the chart belo w to determine the section number to be referenced when removing notebook components. Disassembl y Sequence Char t Section Description # of Screws Removed 5.3 Preparing the notebook for disassemb ly Batter y pack Hard dri[...]

  • Seite 87

    5–4 Maintenance and S ervice Gui de Remo v al and Replacement Pr ocedur es Section Description # of Screws Removed 5.21 LED board 0 5.22 Button board 2 5.23 System board 5 screws , 2 standoffs Disassembl y Sequence Char t (Continued)[...]

  • Seite 88

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–5 5 .3 Preparing th e Notebook for Disasse mbl y Before you begin an y remov al or installation procedures: 1. Sav e your work, exit all applications, and shut do wn the notebook. If you are not sure whet her the notebook is of f or in Hibernation, briefly press the po wer bu[...]

  • Seite 89

    5–6 Maintenance and S ervice Gui de Remo v al and Replacement Pr ocedur es b . Slide and hold the battery release latch 1 tow ard the back of the notebook. c. Use the notch in the battery pack to slide the battery pack to the left 2 . d. Remov e the battery pack. Re mov ing the Battery P ack[...]

  • Seite 90

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–7 5. Remov e the battery bezel by sliding it do wn and off of the battery pack. ✎ The battery bezel is included in the Miscellaneous Plastics Kit, spare part number 344411-001. Re mov ing the Battery Bez el Re verse the abov e procedure to install the battery pack and batte[...]

  • Seite 91

    5–8 Maintenance and S ervice Gui de Remo v al and Replacement Pr ocedur es 6. Remov e the hard driv e by follo wing these steps: a. T urn the notebook upside down, with the rear panel facing you. b . Remov e the T8M2.5×5.0 screw 1 that secures the hard dri ve door to the notebook. c. Remov e the PM3.0×4.0 hard driv e security screw 2 that secur[...]

  • Seite 92

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–9 d. Lift the hard dri ve cov er up and swing it back 1 . e. Use the Mylar tab 2 to slide the hard driv e to the left 3 to disconnect it from the system board. f. Remov e the hard driv e. Re mov ing the Har d Dri ve[...]

  • Seite 93

    5–10 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es Ä CAUT ION: The hard dr i ve should be dis assembled onl y if it is damaged and must be r e pair ed. Unneces sary disassembly o f the hard dri v e can result in damage t o the hard dr iv e and loss o f infor mation . g. Remov e the two T5M3.0×4.0 scre ws 1 and the two PM[...]

  • Seite 94

    Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–11 5 .4 Notebook Feet The notebook feet are adhesi ve-backed rubber pads. The notebook feet are included in the Miscellaneous Plastics Kit, spare part number 344411-001. The not ebook feet attach to the base enclosure as illustrated belo w . Replac ing the Notebook Feet[...]

  • Seite 95

    5–12 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5 .5 Mini PCI Comm unica tions Board Spare P ar t Number Information Mini PCI communications boar ds 802.11a/b/g LAN board 802.11b/g LAN board 802.11b/g, W400 modem bo ard (f or use in Japan) 802.11b W500 modem boar d (f or use in Japan) 802.11b/g modem board (MOW ) 802.11[...]

  • Seite 96

    Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–13 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside down, with the front facing you. 3. Remov e the PM2.5×3.5 screw 1 that secures the Mini PCI compartment cov er to the notebook. 4. Lift the right side of the cov er up and swing[...]

  • Seite 97

    5–14 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 6. If a wireless communications de vice is installed in this compartment, disconnect the two antenna cables from the Mini PCI communications board. Note that the longer cable 1 connects to the rear antenna terminal and the shorter antenna cable 2 connects to the front ante[...]

  • Seite 98

    Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–15 8. Spread the retaining tabs 1 that secure the Mini PCI communications board to the socket. The board rises up. 9. Pull the board aw ay from the socket at a 45-degree angle 2 . Re mov ing the Mini P CI Comm unicatio ns Board Re verse the abov e procedure to install a Mini[...]

  • Seite 99

    5–16 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5. 6 M u l t i B ay D ev i c e 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside down, with the right side facing you. 3. Slide and hold the MultiBay release latch to the right 1 . 4. Remov e the MultiBay device 2 . Re m ovi n g [...]

  • Seite 100

    Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–17 5 .7 Bluetooth Wireless Comm unic atio ns Bo ar d 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside down, with the right side facing you. 3. Loosen the PM2.0×5.0 scre w 1 that secures the Bluetooth cov er to the notebook. 4. Re[...]

  • Seite 101

    5–18 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 6. Remov e the two PM1.5×3.0 scre ws 1 that secure the Bluetooth board to the Bluetooth cov er 2 . 7. Remov e the cov er from the board. ✎ The Bluetooth cov er is included in the Miscellaneous Plastics Kit, spare part number 344411-001. Re mov ing the Bluetooth Boar d R[...]

  • Seite 102

    Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–19 5 .8 Integrated Smar t C ard ✎ The integrated smart card is located in the bottom PC Card slot. 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e any PC Card or spacer from the top PC Card slot. 3. Using a flat-bladed tool, pry the smart card b[...]

  • Seite 103

    5–20 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5. Eject the smart card from the notebook using a flat-bladed tool to press the small metal eject tab 1 to the left of the smart card. 6. Remov e the card from the slot 2 . Re mov ing the Smart Car d Re verse the abov e procedure to install the integrated smart card.[...]

  • Seite 104

    Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–21 5. 9 Keyb o a r d 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside down, with the front facing you. 3. Remov e the two T8M2.5×11.0 scre ws that secure the ke yboard to the notebook. Re mov ing the K ey board Sc r ew s Spare P [...]

  • Seite 105

    5–2 2 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 4. T urn the notebook right-side up, with the front facing you. 5. Open the notebook. 6. Slide the four tabs on the top edge of the ke yboard tow ard you 1 . 7. Lift the rear edge of the ke yboard up and swing it forward 2 until it rests on the palm rest. Re leasing the K[...]

  • Seite 106

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–2 3 8. Release the zero insertion force (ZIF) connector 1 to which the pointing stick cable is attached and disconnect the cable 2 . 9. Release the ZIF connector 3 to which the ke yboard cable is attached and disconnect the cable 4 . Disconnecting the T ouchP ad and K e yboar[...]

  • Seite 107

    5–2 4 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5. 1 0 M o d e m B o a r d 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Release the ke yboard (refer to Section 5.9 ). 3. Disconnect the modem cable 1 from the modem board. 4. Remov e the two PM2.5×3.5 scre ws 2 that secure the modem board to the n[...]

  • Seite 108

    Re mov al and Replacemen t Procedur es Maintenance and Se r v ice Guide 5–2 5 5 . 1 1 Memor y Expansion Board 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the keyboard (refer to Section 5.9 ). 3. Lift the left side of the memory shield and swing it up and to the right 1 until it rests at a 45-degree angle. 4. Slide [...]

  • Seite 109

    5–2 6 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5. Spread the retaining tabs 1 that secure the memory expansion board to the sock et. The board rises up. 6. Pull the board aw ay from the socket at a 45-degree angle 2 . Re mov ing a Memory Expansion Boar d Re verse the abov e procedure to install a memory expansion boar[...]

  • Seite 110

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–2 7 5. 1 2 Sw i t c h C ove r 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the keyboard (refer to Section 5.9 ). 3. Close the notebook. 4. T urn the notebook upside down, with the rear panel facing you. 5. Remov e the two TM2.5×9.0 scre ws that[...]

  • Seite 111

    5–2 8 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 6. T urn the notebook right-side up, with the front facing you. 7. Open the notebook. 8. Lift up on the middle of the switch cov er 1 to disengage it from the notebook. 9. Swing the rear edge of the switch cov er up and forward 2 . 10. Remov e the switch cov er . Re mov i[...]

  • Seite 112

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–2 9 5. 1 3 Ke yb o a r d Pl a t e ✎ The ke yboard plate is included in the Miscellaneous Plastics Kit, spare part number 344411-001. 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the keyboard (refer to Section 5.9 ). 3. Remov e the switch cov e[...]

  • Seite 113

    5–30 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5. 1 4 S e c u r i t y M o d u l e ( T PM ) 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the keyboard (refer to Section 5.9 ). 3. Remov e the switch cov er (refer to Section 5.12 ). 4. Remov e the keyboard plate (refer to Section 5.13 ). 5. R[...]

  • Seite 114

    Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–31 5 . 1 5 Fa n Assem bly 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the keyboard (refer to Section 5.9 ). 3. Remov e the switch cov er (refer to Section 5.12 ). 4. Remov e the keyboard plate (refer to Section 5.13 ). 5. Disconnect the fan ca[...]

  • Seite 115

    5–3 2 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 7. Lift the left side of the fan assembly 1 until it rests at an angle. 8. Slide the fan assembly up and to the left 2 to remov e it from the notebook. Re mov ing the F an Assembl y[...]

  • Seite 116

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–3 3 9. Remov e the three PM2.0×3.0 screws 1 that secure the f an to the fan housing. 10. Remov e the fan 2 . Re mov ing the F an fr om the F an Ass embly Re verse the abov e procedure to install the fan assembly .[...]

  • Seite 117

    5–34 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5. 1 6 H e a t S i n k 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K eyboard (refer to Section 5.9 ) ❏ Switch cov er (refer to Section 5.12 ) ❏ K eyboard plate (refer to Section 5.13 ) ❏ Fan assembly (refe[...]

  • Seite 118

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–3 5 3. Lift the left side of the heat sink up 1 until the thermal grease bond between the heat sink and the processor disengages. 4. Slide the heat sink forward 2 until the cooling f ins 3 clear the top cov er . 5. Lift the heat sink straight up to remov e it. Re mov ing the [...]

  • Seite 119

    5–3 6 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es ✎ Carefully clean any thermal grease residue from the underside of the heat sink 1 and processor surfaces 2 each time you remo ve the heat sink. Then apply ne w thermal grease to both surfaces. Re mov ing the Ther mal Gr ease F r om the Heat Sink and Proce ssor Re verse[...]

  • Seite 120

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–3 7 5. 1 7 P r o c e s s o r 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K eyboard (refer to Section 5.9 ) ❏ Switch cov er (refer to Section 5.12 ) ❏ K eyboard plate (refer to Section 5.13 ) ❏ Fan assembly (r[...]

  • Seite 121

    5–38 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 2. Use a flat-bladed scre wdriv er to turn the processor lock screw one-quarter turn counterclockwise 1 to release the processor from the socket. 3. Lift the processor straight up 2 to remov e it. ✎ Note that the gold triangle 3 on the processor should be aligned in the [...]

  • Seite 122

    Re mov al and Replacemen t Procedur es Maintenance and Se r v ice Guide 5–3 9 5 . 1 8 Displa y Assembl y 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Disconnect the wireless antenna cables from the Mini PCI communications board (refer to Section 5.5 ). 3. Remov e the following components: ❏ K eyboard (refer to Section 5.9[...]

  • Seite 123

    5–40 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 4. Disconnect the display cable 1 and microphone cable 2 from the system board. 5. Remov e the left and right wireless antenna cables 3 from the three clips in the top cov er . 6. Remov e the left and right wireless antenna cables from the hole 4 in the system board. Disco[...]

  • Seite 124

    Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–41 7. Close the notebook. 8. T urn the notebook upside down, with the rear panel facing you. 9. Remov e the following scre ws: 1 T wo T8M2.5×9.0 scre ws from the rear panel 2 T wo T8M2.5×9.0 scre ws from the bottom of the notebook Re mov ing the Displa y Sc re w s[...]

  • Seite 125

    5–4 2 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 10. T urn the notebook right-side up, with the front facing you. 11. Open the notebook until the display assembly is in an upright position. 12. Lift the display assembly straight up 1 to remov e it. 13. If necessary , remov e the left 2 and right 2 display hinge cov ers [...]

  • Seite 126

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–4 3 5. 1 9 T o p C ove r 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K eyboard (refer to Section 5.9 ) ❏ Memory shield (refer to Section 5.11 ) ❏ Switch cov er (refer to Section 5.12 ) ❏ K eyboard plate (refe[...]

  • Seite 127

    5–44 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 3. Remov e the following scre ws: 1 Nine T8M2.5×9.0 scre ws from the bottom of the notebook 2 Three PM2.5×3.5 scre ws from the MultiBay 3 T wo PM2.5×3.5 scre ws from the hard driv e bay 4 T wo T8M2.5×5.5 scre ws from the rear panel Re mov ing the T op Co ver S cr e ws[...]

  • Seite 128

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–4 5 4. T urn the notebook right-side up, with the front facing you. 5. Disconnect the R TC battery cable 1 from the system board. 6. Release the ZIF connector 2 to which the T ouchPad cable is attached and disconnect the T ouchPad cable 3 . 7. Lift the right side of the top c[...]

  • Seite 129

    5–46 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5. 2 0 R TC B a t t e r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 344411-001. 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K eyboard (refer to Section 5.9 ) ❏ Memor[...]

  • Seite 130

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–4 7 3. Lift the R TC battery out of the top cover clip. Re mov ing the R T C Battery Re verse the abov e procedure to install the R TC battery .[...]

  • Seite 131

    5–48 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5 .2 1 LED Board 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K eyboard (refer to Section 5.9 ) ❏ Memory shield (refer to Section 5.11 ) ❏ Switch cov er (refer to Section 5.12 ) ❏ K eyboard plate (refer to [...]

  • Seite 132

    Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–4 9 3. Release the ZIF connector 1 on the system board to which the LED board cable is attached, and then disconnect the cable 2 . 4. Lift the board straight up to remov e it 3 . 5. Release the ZIF connector 4 on the LED board to which the LED board cable is attached and disc[...]

  • Seite 133

    5–50 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5 .2 2 But to n Boa rd 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K eyboard (refer to Section 5.9 ) ❏ Memory shield (refer to Section 5.11 ) ❏ Switch cov er (refer to Section 5.12 ) ❏ K eyboard plate (ref[...]

  • Seite 134

    Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–51 3. Remov e the two PM2.5×5.0 scre ws 1 that secure the button board to the notebook. 4. Lift the front and rear edges of the button board to disconnect it from the system board 2 . 5. Remov e the button board. Re mov ing the Button Boar d Re verse the abov e procedure to[...]

  • Seite 135

    5–5 2 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5. 23 Sys t e m B o a r d ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defectiv e system board and installed on the replacement system board: ■ Mini PCI communications board (refer to Section 5.5 ) ■ Bluetooth wirele[...]

  • Seite 136

    Re mov al and Replacemen t Procedur es Maintenance and Se r v ice Guide 5–5 3 ❏ LED board (refer to Section 5.21 ) ❏ Button board (refer to Section 5.22 ) 2. Disconnect the speaker cable 1 . 3. Remov e the fi ve T8M2.5×5.0 scre ws 2 that secure the system board to the notebook. 4. Use a 5.0-mm socket to remo ve the two HM2.5×9.0 standof fs [...]

  • Seite 137

    5–54 Maintenance and Serv ice Guide Remo v al and Replacement Pr ocedur es 5. Lift the front edge of the system board 1 until it rests at an angle. 6. Slide the system board forward at an angle, and then lift it straight up to remov e it 2 . Re mov ing the S y stem Boar d Re verse the abov e procedure to install the system board.[...]

  • Seite 138

    Maintenance and Se rvice Guide 6–1 6 Spec ifica tions This chapter provides physical and performance specif ications. Ta b l e 6 - 1 Notebook Dimensions Height Width Depth 3.40 cm 31.78 cm 26.19 cm 1.34 in 12.51 in 10.31 in W eight With 6-cell battery pack and MultiBa y weight sa ver With 6-cell battery pack and MultiBa y DV D - R O M d r i v e 2[...]

  • Seite 139

    6–2 Maintenance and S ervice Gui de Spe cificat ion s Relative humidity (noncondensing) Operating Nonoperating 10% to 90% 5% to 95%, 38.7°C (101 .6°F) maximum we t bulb temperature Altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) -15 to 3,048 m -15 to 12,192 m -50 to 10,000 ft -50 to 40,000 ft Shock Operati[...]

  • Seite 140

    Spe cificat ion s Maintenance and Se rvice Guide 6–3 Ta b l e 6 - 2 14.1-inch, SXGA+, TFT Displa y Dimensions Height Width Diagonal 28.6 cm 21.4 cm 35.7 cm 11.2 in 8.4 in 14.1 in Number of colors up to 16.8 million Contrast ratio 250:1 Refresh rate 60 Hz Brightness 180 nits typical Pixel resolution Pitch Fo r ma t Configuration 0.204 × 0.204 mm [...]

  • Seite 141

    6–4 Maintenance and S ervice Gui de Spe cificat ion s Ta b l e 6 - 3 14.1-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 28.6 cm 21.4 cm 35.7 cm 11.2 in 8.4 in 14.1 in Number of colors up to 16.8 million Contrast ratio 250:1 Refresh rate 60 Hz Brightness 180 nits typical Pixel resolution Pitch Fo r ma t Configuration 0.279 × 0.279 mm 1[...]

  • Seite 142

    Spe cificat ion s Maintenance and Se rvice Guide 6–5 T able 6-4 Hard Drives 60-GB 40-GB 30-GB User capacity per drive 1 60 GB 40 GB 30 GB Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99g Interface type ATA - 5 ATA - 5 ATA - 5 T ransfer rate Synchronous (maximum) Security 100 MB/ sec A T A secur ity 100 MB/ s[...]

  • Seite 143

    6–6 Maintenance and S ervice Gui de Spe cificat ion s Ta b l e 6 - 5 External A C Adapter W eight 0.29 kg 0.65 lb P ower supply Operating v oltage Operating current Operating frequency range Maximum transient 90 to 264 V A C RMS 1.6 A RMS 47 to 63 Hz A C 4/50 kV Ta b l e 6 - 6 Primary 6-Cell, Li-Ion Battery Pac k Dimensions Height Width Depth We [...]

  • Seite 144

    Spe cificat ion s Maintenance and Se rvice Guide 6–7 Ta b l e 6 - 7 Optional High-Capacity 8-Cell, Li-Ion Battery Pac k Dimensions Height Width Depth We i g h t 1.90 cm 7.60 cm 14.70 cm 0.43 kg 0.75 in 3.00 in 5.80 in 0.94 lb Energ y Vo l t a g e Amp-hour capacity W att-hour capacity 14.1 V 4.4 Ah 63 Wh Te m p e r a t u r e Operating Nonoperating[...]

  • Seite 145

    6–8 Maintenance and S ervice Gui de Spe cificat ion s Ta b l e 6 - 8 Optional MultiBay 8-Cell, Li-Ion Battery P ac k Dimensions Height Width Depth We i g h t 1.30 cm 13.20 cm 13.90 cm 0.39 kg 0.50 in 5.20 in 5.45 in 0.86 lb Energ y Vo l t a g e Amp-hour capacity W att-hour capacity 14.8 V 3.6 Ah 52 Wh Te m p e r a t u r e Operating Nonoperating 5[...]

  • Seite 146

    Spe cificat ion s Maintenance and Se rvice Guide 6–9 T able 6-9 24X D VD/CD-R W Combo Drive and 24X CD-ROM Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center [...]

  • Seite 147

    6–10 Maintenance and Serv ice Guide Spe cificat ion s T able 6-10 8X D VD-R OM Drive and D VD+R W /R and CD-R W Combo Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bri[...]

  • Seite 148

    Spe cificat ion s Maintenance and S ervice Gui de 6–11 T able 6-11 System DMA Hard ware DMA System Function DMA0 A vailab le f or audio DMA1* Entertainment audio (default; alternate = DMA0, DMA3, none) DMA2* Disk ette dr ive DMA3 ECP parallel port LPT1 (default; alternate = DMA0, none) DMA4 DMA controller cascading (not av ailable) DMA5* A vailab[...]

  • Seite 149

    6–12 Maintenance and Serv ice Guide Spe cificat ion s T able 6-12 System Interrupts Hard ware IRQ System Function IRQ0 System timer IRQ1 K eyboard controller IRQ2 Cascaded IRQ3 COM2 IRQ4 COM1 IRQ5 Audio (def ault)* IRQ6 Disk ette dr ive IRQ7 P arallel port IRQ8 Real time cloc k (RTC) IRQ9 Infrared IRQ10 System use IRQ11 System use IRQ12 Inter nal[...]

  • Seite 150

    Spe cificat ion s Maintenance and S ervice Gui de 6–13 T able 6-13 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller no . 1 010 - 01F Unused 020 - 021 Interrupt controller no. 1 022 - 024 Opti chipset configuration registers 025 - 03F Unused 02E - 02F 8 7334 “Super I/O” configuration for[...]

  • Seite 151

    6–14 Maintenance and Serv ice Guide Spe cificat ion s I/O Address (he x) System Function (shipping configuration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller no . 2 0E0 - 0EF Unused 0F0 - 0F1 Coprocessor busy clear/reset 0F2 - 0FF U nused 100 - 16F Unused 170 - 177 Secondar y fixed disk controller 178 - 1EF U nused 1F0 - 1F7 Primar y fixed disk con[...]

  • Seite 152

    Spe cificat ion s Maintenance and S ervice Gui de 6–15 I/O Address (he x) System Function (shipping configuration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared port 300 - 31F Unused 320 - 36F Unused 370 - 377 Secondar y diskette drive controller 378 - 37F Par allel por t (LPT1/default) 380 - 387 Unused 388 - 38B FM synthesizer—OPL3 38C - 3AF Unused 3B0 [...]

  • Seite 153

    Maintenance and Se rvice Guide A–1 A Conn ec tor P in As signm en ts Ta b l e A - 1 RJ-45 Network Interface Pin Signal Pin Signal 1 T ransmit + 5 Unused 2 T ransmit – 6 Receive – 3 Receiv e + 7 Unused 4U n u s e d 8U n u s e d[...]

  • Seite 154

    A–2 Maintenance and S ervice Gui de Connec tor P in Assignments Ta b l e A - 2 RJ-11 Modem Pin Signal Pin Signal 1U n u s e d 4U n u s e d 2 Tip 5 Unused 3R i n g 6U n u s e d Ta b l e A - 3 Universal Serial Bus Pin Signal Pin Signal 1 +5 VDC 3 Data + 2 Data – 4 Ground[...]

  • Seite 155

    Connec tor P in Assignments Maintenance and Se rvice Guide A–3 Ta b l e A - 4 S-Video Pin Signal Pin Signal 1 Ground (Y) 3 Y -Luminance (Intensity) 2 Ground (C) 4 C-Chrominance (Color) Ta b l e A - 5 External Monitor Pin Signal Pin Signal 1 Red analog 9 +5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data[...]

  • Seite 156

    A–4 Maintenance and S ervice Gui de Connec tor P in Assignments Ta b l e A - 6 A udio Line-Out Pin Signal Pin Signal 1 A udio out 2 Ground Ta b l e A - 7 Microphone Pin Signal Pin Signal 1 A udio in 2 Ground[...]

  • Seite 157

    Connec tor P in Assignments Maintenance and Se rvice Guide A–5 Ta b l e A - 8 P arallel Pin Signal Pin Signal 1 Strobe 14 Auto linef eed 2 Data bit 0 15 Error 3 Data bit 1 16 Initialize paper 4 Data bit 2 17 Select in 5 Data bit 3 18 Ground 6 Data bit 4 19 Ground 7 Data bit 5 20 Ground 8 Data bit 6 21 +5VS 9 Data bit 7 22 PTF 10 Ackno wledge 23 E[...]

  • Seite 158

    A–6 Maintenance and S ervice Gui de Connec tor P in Assignments Ta b l e A - 9 Serial Pin Signal Pin Signal 1 Carrier detect 6 Data set ready 2 Receiv e data 7 Ready to send 3 T ransmit data 8 Clear to send 4 Data terminal ready 9 Ring indicator 5G r o u n d[...]

  • Seite 159

    Maintenance and Se rvice Guide B–1 B P o w e r Cord Requiremen ts 3-Con duc tor P o w er Cord The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 volts A C. The po wer cord included with the notebook meets the requirements for use in the country where the equipment is purchased. [...]

  • Seite 160

    B–2 Maintenance and S ervice Gui de P ow er Cord R equirements Countr y- Spec ifi c Requirements 3-Conductor P ower Cor d Requirements Country Accredited Ag ency Applicable Note Number A ustralia EANSW 1 A ustr ia O VE 1 Belgium CEBC 1 Canada CSA 2 Denmark DEMK O 1 Finland FIMK O 1 Fr a n c e U T E 1 Ger many VDE 1 Italy IMQ 1 Jap an M E TI 3 The[...]

  • Seite 161

    P ow er Cor d Requirements Maintenance and Se rvice Guide B–3 United Kingdom BSI 1 United States UL 2 Notes 1. The fle xible cord must be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm 2 conductor size . P ower cord fittings (a ppliance coupler and w all plug) must bear the cer tification mark of the ag ency responsible fo r ev aluation in the[...]

  • Seite 162

    Maintenance and Se rvice Guide C–1 C Scre w List ing This appendix provides specif ication and reference information for the scre ws used in the notebook. All screws listed in this appendix are av ailable in the Miscellaneous Scre w Kit, spare part number 344412-001.[...]

  • Seite 163

    C–2 Maintenance and Serv ice Guide Scr ew Listing Ta b l e C - 1 T orx T5M3.0×4.0 Screw Color Qty . Length Thread Head Width Silver 2 4 .0 mm 3.0 mm 5.0 mm Where used: 1 T wo screws that secure the ha rd drive frame to the hard driv e (documented in Section 5.3 ) mm Ta b l e C - 2 Phillips PM3.0×3.5 Screw Color Qty . Length Thread Head Width Si[...]

  • Seite 164

    Scr ew Listing Maintenance and Se rvice Guide C–3 T orx T5M3. 0×4. 0 Sc re w , Phillips P M3 . 0×3. 5 Sc re w , and Hex M2 .0×10. 0 Alignmen t P in Locati ons[...]

  • Seite 165

    C–4 Maintenance and Serv ice Guide Scr ew Listing Phillips P M3 . 0×4.0 S cr e w Location Ta b l e C - 4 Phillips PM3.0×4.0 Screw Color Qty . Length Thread Head Width Black 1 4.0 mm 3.0 mm 4.0 mm Where used: One screw that secures the hard driv e to the notebook (documented in Section 5.3 ) mm[...]

  • Seite 166

    Scr ew Listing Maintenance and Se rvice Guide C–5 T o r x T 8 M 2 .5 × 5.0 S crew L o c a t i o n Ta b l e C - 5 T orx T8M2.5×5.0 Screw Color Qty . Length Thread Head Width Black 13 5.0 mm 2.5 mm 4.0 mm Where used: One screw that secures the hard driv e cov er to the notebook (documented in Section 5.3 ) mm[...]

  • Seite 167

    C–6 Maintenance and Serv ice Guide Scr ew Listing T o r x T 8 M 2 .5 × 5.0 S crew L o c a t i o n Ta b l e C - 5 T orx T8M2.5×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 13 5.0 mm 2.5 mm 4.0 mm Where used: One screw that secures the f an assemb ly to the notebook (documented in Section 5.15 ) mm[...]

  • Seite 168

    Scr ew Listing Maintenance and Se rvice Guide C–7 T o r x T 8 M 2 .5 × 5.0 S crew L o c a t i o n s Ta b l e C - 5 T orx T8M2.5×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 13 5.0 mm 2.5 mm 4.0 mm Where used: F our screws that secure th e heat sink to the notebook (documented in Section 5.16 ) mm[...]

  • Seite 169

    C–8 Maintenance and Serv ice Guide Scr ew Listing T o r x T 8 M 2 .5 × 5.0 S crew L o c a t i o n s Ta b l e C - 5 T orx T8M2.5×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 13 5.0 mm 2.5 mm 4.0 mm Where used: 1 T wo screws that secure the button board to the notebook (documented in Section 5.22 ) 2 Five scre ws that secure t[...]

  • Seite 170

    Scr ew Listing Maintenance and Se rvice Guide C–9 Phillips M2 .5×3 . 5 Scr e w Location Ta b l e C - 6 Phillips PM2.5×3.5 Screw Color Qty . Length Thread Head Width Black 3 3.5 mm 2.5 mm 4.0 mm Where used: One screw that secures the Mini PC I compartment cover to the notebook (documented in Section 5.5 ) mm[...]

  • Seite 171

    C–10 Maintenance and S ervice Gui de Scr ew Listing Phillips P M2 .5×3. 5 Scr ew L ocations Ta b l e C - 6 Phillips PM2.5×3.5 Screw (Continued) Color Qty . Length Thread Head Width Black 3 3.5 mm 2.5 mm 4.0 mm Where used: T wo screws that secure the modem board to the notebook (documented in Section 5.10 ) mm[...]

  • Seite 172

    Scr ew Listing Maintenance and S ervice Gui de C–11 Philli ps P M2 .0×5 . 0 Scre w Locations Ta b l e C - 7 Phillips PM2.0×5.0 Screw Color Qty . Length Thread Head Width Black 1 5.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the Bl uetooth co ver to the notebook (documented in Section 5.7 ) mm[...]

  • Seite 173

    C–12 Maintenance and S ervice Gui de Scr ew Listing Phillips P M1. 5×3 .0 S cr ew L ocations Ta b l e C - 8 Phillips PM1.5×3.0 Screw Color Qty . Length Thread Head Width Black 5 3.0 mm 1.5 mm 3.5 mm Where used: T wo screws that secure the Bluetooth board to the Bluetooth cov er (documented in Section 5.7 ) mm[...]

  • Seite 174

    Scr ew Listing Maintenance and S ervice Gui de C–13 Phillips P M1. 5×3 .0 S cr ew L ocations Ta b l e C - 8 Phillips PM1.5×3.0 Screw (Continued) Color Qty . Length Thread Head Width Black 5 3.0 mm 1.5 mm 3.5 mm Where used: Three screws that secure the f an to the f an housing (documented in Section 5.15 ) mm[...]

  • Seite 175

    C–14 Maintenance and S ervice Gui de Scr ew Listing T orx T8M2 . 5×11.0 Sc r ew L ocations Ta b l e C - 9 T orx T8M2.5×11.0 Screw Color Qty . Length Thread Head Width Silver 2 1 1.0 mm 2.5 mm 5.0 mm Where used: T wo screws that secure the k eyboard to the notebook (documented in Section 5.9 ) mm[...]

  • Seite 176

    Scr ew Listing Maintenance and S ervice Gui de C–15 T o r x T 8 M 2.5× 9 .0 S c rew Lo c a t io n s T able C-10 T orx T8M2.5×9.0 Screw Color Qty . Length Thread Head Width Black 15 9.0 mm 2.5 mm 5.0 mm Where used: 1 T wo screws that secure the s witch cov er to the notebook (documented in Section 5.12 ) 2 Fo ur screws that secure the displa y a[...]

  • Seite 177

    C–16 Maintenance and S ervice Gui de Scr ew Listing T o r x T 8 M 2.5× 9 .0 S c rew Lo c a t io n s T able C-10 T orx T8M2.5×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 15 9.0 mm 2.5 mm 5.0 mm Where used: Nine screws that secure the top co ver to the notebook (documented in Section 5.19 ) mm[...]

  • Seite 178

    Scr ew Listing Maintenance and S ervice Gui de C–17 T o r x T 8 M 2 .5 × 7 .0 S cre w Lo c a t i o n s T able C-11 T orx T8M2.5×7.0 Screw Color Qty . Length Thread Head Width Black 1 7.0 mm 2.5 mm 5.0 mm Where used: One screw that secures the f an assemb ly to the notebook (documented in Section 5.15 ) mm[...]

  • Seite 179

    C–18 Maintenance and S ervice Gui de Scr ew Listing Phillips M2 .0×3 .5 Scr e w Locations T able C-12 Phillips M2.0×3.5 Screw Color Qty . Length Thread Head Width Black 5 3.5 mm 2.5 mm 4.0 mm Where used: Five scre ws that secure the top cov er to the notebook (three in the MultiBa y , two in the hard drive ba y; documented in Section 5.6 ) mm[...]

  • Seite 180

    Scr ew Listing Maintenance and S ervice Gui de C–19 T o r x T 8 M 2.5× 5.5 S crew Lo c a t i o n s T able C-13 T orx T8M2.5×5.5 Screw Color Qty . Length Thread Head Width Black 2 5.5 mm 2.5 mm 5.0 mm Where used: T wo screws that secure the top cov er to the notebook (documented in Section 5.19 ) mm[...]

  • Seite 181

    C–20 Maintenance and S ervice Gui de Scr ew Listing Hex M2 .5×9 . 0 Standoff L ocations T able C-14 Hex M2.5×9.0 Standoffs Color Qty . Length Thread Head Width Silver 2 9.0 mm 2.5 mm Where used: T wo standoffs that secure th e system board to the notebook (documented in Section 5.23 ) mm[...]

  • Seite 182

    Scr ew Listing Maintenance and S ervice Gui de C–21 Phillips M3 .5×3 .0 Sc re w Location T able C-15 Phillips M3.5×3.0 Screw Color Qty . Length Thread Head Width Black 1 3.0 mm 2.0 mm 3.5 mm Where used: One screw that secures the secu rity card to the system board (documented in Section 5.14 ) mm[...]

  • Seite 183

    Maintenance and Se rvice Guide Index–1 Ind e x A AC adapter spare part number 3–11 specifications 6–6 AC power connector, location 1–17 applications key, location 1–19 audio line-out jack location 1–15 pin assignments A–4 audio troubleshooting 2–25 B base enclosure illustrated 3–6 spare part number 3–7 battery bay, location 1–[...]

  • Seite 184

    Index–2 Maintenance and Se r vi ce Guide Index C cables, service considerations 4–2 caps lock key, location 1–19 caps lock light, location 1–20 carrying case, spare part numbers 3–10 CD-ROM drive spare part number 3–7 , 3–9 specifications 6–9 components bottom 1–24 front 1–14 keyboard 1–18 left-side 1–14 rear panel 1–16 ri[...]

  • Seite 185

    Index Maintenance and Se rvice Guide Index–3 docking connector, location 1–25 drives, preventing damage 4–3 DVD+RW/R and CD-RW Combo Drive spare part number 3–7 , 3–9 specifications 6–10 DVD/CD-RW combo drive spare part number 3–7 , 3–9 specifications 6–9 DVD-ROM drive, specifications 6–10 E electrostatic discharge 4–4 , 4–7[...]

  • Seite 186

    Index–4 Maintenance and Se r vi ce Guide Index K keyboard components 1–18 illustrated 3–2 removal 5–21 spare part numbers 3–3 , 5–21 troubleshooting 2–28 keyboard plate illustrated 3–2 , 3–8 removal 5–29 L LED board illustrated 3–6 removal 5–48 spare part number 3–7 , 3–14 , 5–48 left-side components 1–14 M mass stor[...]

  • Seite 187

    Index Maintenance and Se rvice Guide Index–5 N network jack, pin assignments A–1 network, troubleshooting 2–30 nonfunctioning device, troubleshooting 2–18 , 2–27 notebook feet illustrated 3–8 locations 5–11 notebook specifications 6–1 num lock key, location 1–19 num lock light, location 1–20 numeric keypad, location 1–19 O ope[...]

  • Seite 188

    Index–6 Maintenance and Se r vi ce Guide Index RJ-45 network jack location 1–17 pin assignments A–1 RTC battery illustrated 3–2 , 3–8 removal 5–46 S Screw Kit, spare part number 3–10 , 3–14 scroll lock light, location 1–20 Secure Digital (SD) Card slot, location 1–16 security cable slot, location 1–17 security module removal 5[...]

  • Seite 189

    Index Maintenance and Se rvice Guide Index–7 TPM removal 5–30 spare part number 3–10 , 3–14 , 5–30 transporting precautions 4–4 troubleshooting audio 2–25 Computer Setup 2–2 Diagnostics for Windows 2–7 flowcharts 2–10 keyboard 2–28 modem 2–30 network 2–30 nonfunctioning device 2–18 , 2–27 operating system loading 2–1[...]