HP (Hewlett-Packard) 721546-001 Bedienungsanleitung

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Die Vorschriften verpflichten den Verkäufer zur Übertragung der Gebrauchsanleitung HP (Hewlett-Packard) 721546-001 an den Erwerber, zusammen mit der Ware. Eine fehlende Anleitung oder falsche Informationen, die dem Verbraucher übertragen werden, bilden eine Grundlage für eine Reklamation aufgrund Unstimmigkeit des Geräts mit dem Vertrag. Rechtsmäßig lässt man das Anfügen einer Gebrauchsanleitung in anderer Form als Papierform zu, was letztens sehr oft genutzt wird, indem man eine grafische oder elektronische Anleitung von HP (Hewlett-Packard) 721546-001, sowie Anleitungsvideos für Nutzer beifügt. Die Bedingung ist, dass ihre Form leserlich und verständlich ist.

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Das Wort kommt vom lateinischen „instructio”, d.h. ordnen. Demnach kann man in der Anleitung HP (Hewlett-Packard) 721546-001 die Beschreibung der Etappen der Vorgehensweisen finden. Das Ziel der Anleitung ist die Belehrung, Vereinfachung des Starts, der Nutzung des Geräts oder auch der Ausführung bestimmter Tätigkeiten. Die Anleitung ist eine Sammlung von Informationen über ein Gegenstand/eine Dienstleistung, ein Hinweis.

Leider widmen nicht viele Nutzer ihre Zeit der Gebrauchsanleitung HP (Hewlett-Packard) 721546-001. Eine gute Gebrauchsanleitung erlaubt nicht nur eine Reihe zusätzlicher Funktionen des gekauften Geräts kennenzulernen, sondern hilft dabei viele Fehler zu vermeiden.

Was sollte also eine ideale Gebrauchsanleitung beinhalten?

Die Gebrauchsanleitung HP (Hewlett-Packard) 721546-001 sollte vor allem folgendes enthalten:
- Informationen über technische Daten des Geräts HP (Hewlett-Packard) 721546-001
- Den Namen des Produzenten und das Produktionsjahr des Geräts HP (Hewlett-Packard) 721546-001
- Grundsätze der Bedienung, Regulierung und Wartung des Geräts HP (Hewlett-Packard) 721546-001
- Sicherheitszeichen und Zertifikate, die die Übereinstimmung mit entsprechenden Normen bestätigen

Warum lesen wir keine Gebrauchsanleitungen?

Der Grund dafür ist die fehlende Zeit und die Sicherheit, was die bestimmten Funktionen der gekauften Geräte angeht. Leider ist das Anschließen und Starten von HP (Hewlett-Packard) 721546-001 zu wenig. Eine Anleitung beinhaltet eine Reihe von Hinweisen bezüglich bestimmter Funktionen, Sicherheitsgrundsätze, Wartungsarten (sogar das, welche Mittel man benutzen sollte), eventueller Fehler von HP (Hewlett-Packard) 721546-001 und Lösungsarten für Probleme, die während der Nutzung auftreten könnten. Immerhin kann man in der Gebrauchsanleitung die Kontaktnummer zum Service HP (Hewlett-Packard) finden, wenn die vorgeschlagenen Lösungen nicht wirksam sind. Aktuell erfreuen sich Anleitungen in Form von interessanten Animationen oder Videoanleitungen an Popularität, die den Nutzer besser ansprechen als eine Broschüre. Diese Art von Anleitung gibt garantiert, dass der Nutzer sich das ganze Video anschaut, ohne die spezifizierten und komplizierten technischen Beschreibungen von HP (Hewlett-Packard) 721546-001 zu überspringen, wie es bei der Papierform passiert.

Warum sollte man Gebrauchsanleitungen lesen?

In der Gebrauchsanleitung finden wir vor allem die Antwort über den Bau sowie die Möglichkeiten des Geräts HP (Hewlett-Packard) 721546-001, über die Nutzung bestimmter Accessoires und eine Reihe von Informationen, die erlauben, jegliche Funktionen und Bequemlichkeiten zu nutzen.

Nach dem gelungenen Kauf des Geräts, sollte man einige Zeit für das Kennenlernen jedes Teils der Anleitung von HP (Hewlett-Packard) 721546-001 widmen. Aktuell sind sie genau vorbereitet oder übersetzt, damit sie nicht nur verständlich für die Nutzer sind, aber auch ihre grundliegende Hilfs-Informations-Funktion erfüllen.

Inhaltsverzeichnis der Gebrauchsanleitungen

  • Seite 1

    HP Pr oL ian t ML3 1 0e Gen8 S er v er Maint enance and S er v i ce Guide Abstract This document is for an experience d service technician. It is helpful if you are q ualified in the servicing of computer equip ment and trai ned in recognizing hazar ds in products with hazardous energy levels and are familiar with weight and stability precautions f[...]

  • Seite 2

    © Copyright 2012, 2013 He wlett- Packard Development Company, L.P. The information c ontained herein is su bject to change without notice. The only warranties for HP products and services are set forth in the expr ess warranty statements accompanyin g such products and services. Nothing herein should be construed as constituting an ad ditional war[...]

  • Seite 3

    Contents 3 Con tents Customer self repair ...................................................................................................................... 6 Parts only warranty service ......................................................................................................................... 6 Illustrated parts catalog .........[...]

  • Seite 4

    Contents 4 Troubleshooting .......................................................................................................................... 61 Troubleshooting resources ........................................................................................................................ 61 Diagnostic tools ..............................[...]

  • Seite 5

    Contents 5 Acronyms and abbrevia tions ........................................................................................................ 86 Documentation feedbac k ............................................................................................................. 89 Index ............................................................[...]

  • Seite 6

    Customer self repair 6 C u st omer s elf r epair HP products are desig ned with many Customer Self Re pair (CSR) parts to mini mize repair time and allow for greater flex ibility in per forming def ective parts rep lacement. If during the diagno sis period HP (or HP service providers or service partners) identifies that the repair can be accomplish[...]

  • Seite 7

    Customer self repair 7 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer c es pièces, les c oûts de déplacemen t et main d'œuv re du service vo us seront facturé s. Facultati f - Pièces pour lesq uelles la répa ration par le clien t est facultat ive. Ces pièces s[...]

  • Seite 8

    Customer self repair 8 In base alla disponibi lità e alla località geograf ica, le parti CSR vengono sp edite con consegna entro il giorno lavorat ivo seguente. La conse gna nel giorno stesso o entro quattro ore è o fferta con un sup plemento di costo solo in a lcune zone. In caso di necessità si può richiedere l' assistenza telefonica d [...]

  • Seite 9

    Customer self repair 9 defekte Teil nicht zurückschicken, kann HP Ihnen das Er satzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Li eferung und Rüc ksendung auf und bestimmt den Kurier- /Frachtdienst. Weitere Informatione n über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepa[...]

  • Seite 10

    Customer self repair 10 enviara el componente defectuoso requerido, HP podr á cobrarle por el de s ustitución. En el caso de to das sustitucion es que lleve a ca bo el cliente, H P se hará cargo de todos l os gastos de env ío y devolución d e componentes y esco gerá la empresa de transporte que se utilice para dicho servicio. Para obtener má[...]

  • Seite 11

    Customer self repair 11 Neem contact op met e en Service Partner voor me er informatie over he t Customer Self Repair pr ogramma van HP. Informatie o ver Service Partners vindt u op de HP website ( http:// www.hp.com/go/selfrepa ir ). Gar antie s erv ice "P arts Onl y" Het is mogelijk dat de HP garantie all een de garantie service "P[...]

  • Seite 12

    Customer self repair 12 No caso desse se rviço, a substituição de peç as CSR é obrigatória. Se desejar que a HP subs titua essas peças, serão cobradas as despesas de transporte e mão - de - obra do serviço.[...]

  • Seite 13

    Customer self repair 13[...]

  • Seite 14

    Customer self repair 14[...]

  • Seite 15

    Customer self repair 15[...]

  • Seite 16

    Illustrated parts catalog 16 I llus tr ated parts catalog M echanic al components Item Description Spare part number Customer self repair (on page 6 ) 1 Access panel 686751 - 001 Mandatory 1 2 RPS cage 686 665 - 001 Mandatory 1 3 Four - bay LFF drive c age 686745 - 0 01 Mandatory 1 4 SFF drive blan k 670033 - 001 Mandatory 1 5 LFF drive blan k 6750[...]

  • Seite 17

    Illustrated parts catalog 17 2 Optional: Facultatif— Pièces pour lesquelles la réparation p ar le client est facultative. Ces pièces sont également conçues pour permettre au cl ient d'effectuer lui - même la réparation. Toutefo is, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non v ous être facturée, [...]

  • Seite 18

    Illustrated parts catalog 18[...]

  • Seite 19

    Illustrated parts catalog 19 S ystem components Item Description Spare part number Customer self re pair (on page 6 ) 7 Optical drives — — a) SATA DVD - ROM drive 624591 - 0 01 Mandatory 1 b) SATA DVD - RW drive* 624592 - 0 01 Mandatory 1 8 Front I/O module 691939 - 001 Mandatory 1 9 Eight - bay SFF hot - plug drive cage assembly 686753 - 001 M[...]

  • Seite 20

    Illustrated parts catalog 20 Item Description Spare part number Customer self re pair (on page 6 ) d) 3 TB, 6G h ard drive* 628183 - 001 Mandatory 1 Non - hot - plug drives, SAS — — a) 450 GB, 6G hard drive* 517353 - 001 Mandatory 1 b) 600 GB, 6G hard drive* 517355 - 001 Mandatory 1 Hot - plug drives, SATA — — a) 100 GB, 3G MLC solid sta te[...]

  • Seite 21

    Illustrated parts catalog 21 Item Description Spare part number Customer self re pair (on page 6 ) j) 900 GB, 6G hard drive* 653971 - 001 Mandatory 1 k) 1 TB, 6G h ard drive* 653954 - 001 Mandatory 1 14 Front system fan (80 x 38 mm) 68674 9 - 001 Mandatory 1 15 System board assembly (includes alcohol pad and thermal compound ) 686757 - 001 Option a[...]

  • Seite 22

    Illustrated parts catalog 22 Item Description Spare part number Customer self re pair (on page 6 ) 22 HP 460 W CS Gold Hot Plug Power Supply Kit (92% efficie ncy) 511777 - 001 Mandatory 1 23 RPS backplane modul e 686744 - 0 01 Mandatory 1 Cables — — 24 8- pin to 4 - pin power adapter cable* 686755 - 0 01 Mandatory 1 25 500 - mm Mini - SAS cable[...]

  • Seite 23

    Illustrated parts catalog 23 sustitución, pue de o no conllev ar costes adiciona les, dependiend o del tipo de s ervicio de garantía correspondiente al producto. 3 No: No — Algunos componentes no están dise ñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pon e como condici ón que un prov ee[...]

  • Seite 24

    Removal an d replacement procedures 24 R emo v al and r eplacemen t pr ocedur es R equired tools You need the following it ems for some procedur es: • T- 10/T - 15 Torx screwdriver (on page 75 ) • Flathead scre wdrive r • HP Insight Diagnostics (on page 62 ) S afety consider ations Before performin g service procedures, r eview all the safety[...]

  • Seite 25

    Removal an d replacement procedures 25 This symbol on an RJ - 45 receptacle indicates a network inte rface connection. WARNING: To reduce the ri sk of electric shock, fire, or dama ge to the equipment, do not plug telephone or telecommunicatio ns connectors into this receptacle. This symbol in dicates the pr esence of a hot surfa ce or hot compon e[...]

  • Seite 26

    Removal an d replacement procedures 26 Preparation procedures To access som e components and perf orm certain serv ice procedures, p erform one or more of the f ollowing procedures: • Unlock the tower bezel. • Remove the to wer bezel (on page 26 ). • Power down the serv er (on page 26 ). Before removing the server from a rack or a non - hot -[...]

  • Seite 27

    Removal an d replacement procedures 27 To power do wn the server, use one of the follo wing methods: • Press and release the Power On/Standby button. This method initiates a controlled shutdown of applications and the OS before the server enters st andby mode. • Press and hold the Power On/Standby button fo r more than 4 seconds to force the se[...]

  • Seite 28

    Removal an d replacement procedures 28 o In a hot - plug drive configuratio n, remove the drive blank . To replace the LFF driv e blank, slide the component into the bay until it clicks. To replace th e SFF drive bla nk, while pressin g the release lat c h, slide the component into the bay until it is fully seated. Storage drive N on - hot - plug d[...]

  • Seite 29

    Removal an d replacement procedures 29 5. Remove the d rive. 6. Remove the d rive from the carrier. To replace th e component, rev erse the remova l procedure. H ot - plug drive CAUTION: To preve nt improper cooling and thermal damage, do not o perate the server unless all bays are popul ated with either a componen t or a blank. To remove the compo[...]

  • Seite 30

    Removal an d r eplacement p rocedures 30 4. Remove the d rive. To replace th e component, rev erse the remova l procedure. H ot - plug power supply CAUTION: To preve nt improper cooling and thermal damage, do not o perate the server unless all bays are popul ated with either a componen t or a blank. To remove the component: 1. Power down the serv e[...]

  • Seite 31

    Removal an d replacement procedures 31 CAUTION: The defau lt and redundant power suppli es in the server must have the same output power capacity. Verif y that all power supplies have the same part number and lab el color. The system becomes unstable and might shut down wh en it detects mismatched po wer supplies. To replace th e component, rev ers[...]

  • Seite 32

    Removal an d replacement procedures 32 A ir baffle To remove the component: CAUTION: For proper cooling, do not op erate the server witho ut the access pa nel, baffles, expansion s lot covers, or bla nks installed. If the server suppor ts hot - plug componen ts, minimize the amount of time the access panel is o pen. 1. Power down the serv er (on pa[...]

  • Seite 33

    Removal an d replacement procedures 33 5. Disconnect th e SATA and power cables from the op tical drive. 6. Remove the optical dri ve. To replace th e component, rev erse the remova l procedure. Drive cage To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b.[...]

  • Seite 34

    Removal an d replacement procedures 34 o Four - bay LFF drive cage o Eight - bay SFF drive cage To replace th e component, rev erse the remova l procedure. To convert the four - bay non - hot - plug drive cage to a hot - plug model, remove the cage bracket, and then install the hot - plug backplane option before in stalling the cage back t o the se[...]

  • Seite 35

    Removal an d replacement procedures 35 b. Disconne ct each power cor d from the server. 3. Remove the t ower bezel (on page 26 ). 4. Remove the a ccess panel (" Acce ss panel " on page 31 ). 5. Remove all insta lled drives (" Storage drive " on page 28 ). 6. Disconnect the drive c age ca bles: a. Disconnect the Mini - SAS cable [...]

  • Seite 36

    Removal an d replacement procedures 36 o For a hot - plug drive cage, loosen the back plane thumbscrew, and then r emove the backplane assembly from the drive cage. To replace th e component, rev erse the remova l procedure. F ront I/O module To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch [...]

  • Seite 37

    Removal an d repla cement procedures 37 7. Remove the front I/O module. To replace th e component, rev erse the remova l procedure. Front system fan To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 3. Unlock [...]

  • Seite 38

    Removal an d replacement procedures 38 7. Press the release latch, and then remove the fan module. To replace th e component, rev erse the remova l procedure. D IMMs G eneral DIMM slot popul ation guidelines • The server h as four memory slo ts. • The server support s two channels with two DIM M slo ts per channel. o Memory chan nel 1 consists [...]

  • Seite 39

    Removal an d replacement procedures 39 R emoving a DIMM 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 3. Unlock the tower bezel. 4. Remove the a ccess panel (" Acce ss panel " on page 31 ). 5. Remove the a ir baffle (&qu[...]

  • Seite 40

    Removal an d replacement procedures 40 c. Remove the h eatsink from t he processor ba ckplate. To replace the compon ent: 1. Clean the old thermal grea se from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Remove the t hermal inter face protective cover from the h eatsink. CAUTION: Do not overtighten the [...]

  • Seite 41

    Removal an d replacement procedures 41 c. Finish the installation by completely tightening the screws in the same sequence. 4. Install the air b affle (" Air baffle " o n page 32 ). 5. Install the access panel. 6. Lock the tow er bezel. 7. Connect ea ch power cord to the server. 8. Connect each power cord to the power source. 9. Press the[...]

  • Seite 42

    Removal an d replacement procedures 42 5. Remove the a ir baffle (" Air baffle " on page 32 ). 6. Remove the h eatsink (" Heatsink " on page 39 ). CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area. CAUTION: The pins on the processor socket are very fragile. Any dama[...]

  • Seite 43

    Removal an d replacement procedures 43 1. Install the processor. Use the notches on both sides of the processor to properly align it into the socket . CAUTION: Be sure to clos e the processor so cket retaining b racket before closi ng the processor locking lever. The l ever should close witho ut resistance. Forcing t he lever closed can da mage the[...]

  • Seite 44

    Removal an d replaceme nt procedures 44 CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warrant y of the board. 5. Install the heatsink: a. Position the h eatsink using the guide pin on the processor backplate. b. Tighten one pa ir of diagonally opposite scr ews halfway, and then tighten th[...]

  • Seite 45

    Removal an d replacement procedures 45 7. Remove the expansion slot cover retainer. 8. If removing a full - length expansion boar d, remove the board retaine r securing it. 9. Remove the expansion bo ard. To replace th e component, rev erse the remova l procedure. F lash - backed writ e cache proce dures The followin g types of proc edures are prov[...]

  • Seite 46

    Removal an d replacement procedures 46 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 3. Unlock and open the tower bezel. 4. Remove the a ccess panel (" Acce ss panel " on page 31 ). 5. Remove the a ir baffle (" Air baffle " on page 32 ). CAUTION: When[...]

  • Seite 47

    Removal an d replacement procedures 47 CAUTION: In systems that u se external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the sys tem does not erro neously mark t he drives as failed w hen the server is p owered up. To remove the component: 1. Pow[...]

  • Seite 48

    Removal an d replacement procedures 48 8. Remove the capacitor pack. To replace th e component, rev erse the remova l procedure. R ecovering d ata from the flash - backed write cache If the server f ails, use the follow ing procedure to reco ver data temporarily stored in the FBWC. CAUTION: Before starting this procedure, read the information about[...]

  • Seite 49

    Removal an d replacement procedures 49 System battery If the server no longer automatically displays the correct date and time, then replace the battery that provide s power to the real - time clock. Under norm al use, battery life is 5 to 10 year s. WARNING: The compu ter contains an internal lit hium manganese dioxide, a vanadi um pentoxide, or a[...]

  • Seite 50

    Removal an d replacement procedures 50 R ear system fan To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 3. Unlock the tower bezel. 4. Remove the a ccess panel (" Acce ss panel " on page 31 ). 5. Re[...]

  • Seite 51

    Removal an d replacement procedures 51 7. Remove the iLO mod ule from t he chassis. To replace th e component, rev erse the remova l procedure. E nabling the dedicated iLO management po rt The onboard NIC 1/shared iLO connector is set as the default syst em iLO port. To enable the insta lled dedicated iLO modul e: 1. During the ser ver startup se q[...]

  • Seite 52

    Removal an d replacement procedures 52 WARNING: To reduce the risk of perso nal injury from hot surface s, allow the power supply or power supply b lank to cool before touching it. 5. Disconnect the power su pply cables from the drive c age and the system board. 6. Remove the p ower supply. To replace th e component, rev erse the remova l procedure[...]

  • Seite 53

    Removal an d replacement procedures 53 8. Remove the RPS backpl ane module. To replace the component, reverse the removal procedure. RPS cage To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 3. Unlock the tow[...]

  • Seite 54

    Removal an d replacement procedures 54 11. Remove the p ower supply cage. To replace th e component, rev erse the remova l procedure. System board CAUTION: To avoid ESD da mage, when removing electros tati c- sensitiv e components from the failed system board, plac e the components on a stat ic - dissipating w ork surface or in side separate antist[...]

  • Seite 55

    Removal an d replacement procedures 55 c. Remove the h eatsink from t he processor ba ckplate. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area. 9. Open the process or locking lever, and then open the processor retaining bracket. 10. Grasp the processor by the edges, and then lift it [...]

  • Seite 56

    Removal an d replacement procedures 56 b. Lift the syst em board out of th e chassis. To replace th e system board: 1. Install the system board. 2. Connect all cables di sconnected from the faile d system board. 3. Install the DIMMs. 4. If removed, install the dedicated iLO manageme nt port. 5. Install the expansion boards. CAUTION: Failure to comp[...]

  • Seite 57

    Removal an d replacement procedures 57 6. Open the processor locking lever, and then open the processo r retaining bracket. 7. Remove the p rocessor sock et cover. CAUTION: THE PINS ON THE SYSTE M BOARD ARE VERY FRAG ILE AND EASILY DAMAGE D. To avoid damage to the s ystem board: • Do not touch the processor socket contacts. • Do not tilt or sli[...]

  • Seite 58

    Remo val and replacemen t procedures 58 8. Install the processor. Use the notches on both sides of the processor to properly align it into the socket . CAUTION: Be sure to close th e processor so cket retaining br acket before closin g the processor locking lever. The l ever should close witho ut resistance. Forcing t he lever closed can da mage th[...]

  • Seite 59

    Removal an d replacement procedures 59 CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warrant y of the board. 12. Install the heatsink: a. Position the h eatsink using the guide pin on t he processor backplate . b. Tighten one pa ir of diagonally opposite screws halfway, and then tighte n [...]

  • Seite 60

    Removal an d replacement procedures 60 19. Lock the tow er bezel. 20. Connect ea ch power cord to the server. 21. Connect each power cord to the power source. 22. Press the Power On/Standby button. The server exits s tandby mode and applies fu ll power to the system. The system p ower LED changes from amber to gree n. After you repl ace the system [...]

  • Seite 61

    Troubleshootin g 61 T r ouble shootin g T roubleshooting resources The H P ProLiant Gen8 Tr oubleshooting Guide, V olume I: Trouble shooting pr ovides procedur es for resolving common problems and c omprehensive courses of a ction for fault isolation a nd identification, iss ue resolution, and software maintenance o n ProLiant serv ers and server b[...]

  • Seite 62

    Diagnostic tool s 62 D i agno sti c tools H P Insight D iagnostics HP Insight Diagnostic s is a proactive server management tool, available in both offline and online version s, that provides diag nostics and troubleshootin g capabilities to assist IT administrators who verify server installations, tro ubleshoot problems, and per form repair valida[...]

  • Seite 63

    Diagnostic tool s 63 Support 7.x provides anytime, anywhere personalized acce ss to your IT environment through HP Insight Online, and is also the re commended version for H P Proactive Care Service. • HP Insight Remote Support A dvanced supports medium - sized to la rge environments with up t o 3,500 devices. It can b e installed on a Windows Pr[...]

  • Seite 64

    Diagnostic tool s 64 U SB support and functionality U SB support HP provides both stan dard USB 2.0 support and legacy USB 2.0 support. Standard su pport is provided by the OS through the appr opriate USB device drivers. Before the OS loads , HP provides support for USB devices thro ugh legacy USB support, which is enabled by def ault in the system[...]

  • Seite 65

    Component ident ification 65 C om ponen t i dentif i cati on F ront panel comp onents Item Description 1 Optical drive ( optional) 2 Media driv e bay 3 USB connectors 4 Power On/Standby button and system power LED 5 Drive bays (ins ide)[...]

  • Seite 66

    Component ident ification 66 Front panel LEDs and b uttons Item Description Status 1 UID button/LED Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = Remo te management or firmware upgrad e in progress Off = Deacti vated 2 Health LED Solid green = Norma l Flashing amber = System degraded Flashing red (1 Hz/cycle per sec) = System critical[...]

  • Seite 67

    Component ident ification 67 R ear panel comp onents Item Description 1 Non - hot - plug power supply 2 Slot 4 PCIe x16 (8, 4, 1)* 3 Slot 3 PCIe x8 (8, 4, 1)* 4 Slot 2 PCIe x8 (4, 1)* 5 Slot 1 PCIe x4 (1)* 6 Expansion slot cove r retainer 7 Serial connecto r 8 Video connecto r 9 Dedicated iLO ma nagement port (optio nal) 10 NIC 1/shared iLO manage [...]

  • Seite 68

    Com ponent ident ification 68 R ear panel LEDs and b uttons Item Description Status 1 NIC link LED Green = Link exists Off = No link ex ists 2 NIC status LED Green = Activi ty exists Flashing green = Activity exists Off = No acti vity exist s 3 UID LED button Blue = Identi fication is activated Flashing blue = System is being managed remotely Off =[...]

  • Seite 69

    Component ident ification 69 S ystem board c omponents Item Description 1 RPS connecto r 2 Processor socket 3 System battery 4 24 - pin power su pply connector 5 Mini - SAS connector 6 SATA connectors 7 Internal USB cable connector 8 Internal USB conne ctor 9 SD card slot 10 Front USB co nnector 2 11 Front USB co nnector 1 12 Front pane l LED conne[...]

  • Seite 70

    Component ident ification 70 * For more informa tion on the expansion slot sp ecification s, see " PCIe expansion slot d efinitions (on page 70 )." DIMM slot locations DIMM slots a re numbered sequen tially (1 th rough 4) for the pr ocessor. The supp orted AMP mod es use the letter assignment s for population guidelin es. P CIe expansion [...]

  • Seite 71

    Component ident ification 71 Position Def ault Function S2 Off Off = System configu ration can be changed. On = System configuration is lock ed. S3 Off Reserved S4 Off Reserved S5 Off Off = Power - on password is enabled. On = Power - on password is disable d. S6 Off Off = No function On = ROM rea ds system configu ration as invalid. S7 — Reserve[...]

  • Seite 72

    Component ident ification 72 Drive numbering • Four - bay LFF drive model • Eight - bay SFF drive mode l[...]

  • Seite 73

    Component ident ification 73 H ot - plug drive LED definitio ns Item LED Status Definition 1 Locate Solid blu e The drive i s being identifi ed by a host applicatio n. Flashing blue The drive carrie r firmware is bein g updated or req uires an update . 2 Activity ring Rotating green D rive activity Off No drive activit y 3 Do not remove S olid whit[...]

  • Seite 74

    Component ident ification 74 F BWC module LED definitions The FBWC module ha s three single - color LEDs (one amber and two green). Th e LEDs are duplicated on the reverse sid e of the cache module t o facilitat e status viewing. 1 - Amber 2 - Green 3 - G reen Interpre tation Off Off Off The cache module is not powered. Off Flashing 0.5 Hz Flashing[...]

  • Seite 75

    Component ident ification 75 F an locations Item De scription 1 Rear system fa n (fan 1, for proces sor cooling) 2 Front system fan (fan 2, for ex pansion board cooling) T-10/T-15 Torx screwdriver The ser ver includes a T - 10/T - 15 Torx scre wdriver locat ed on the side of th e media drive cage. Use the screwdriver to loose n screws during hardwa[...]

  • Seite 76

    Cabling 76 C abling C abling overview This section provides guidelines that help you make i nformed decisions about c abling the server and hardware options to optimize performance. For information on cabling peripheral comp onents, refer to the white pa per on high - density deployment at the HP website ( http://www.hp.com/products/servers/platfor[...]

  • Seite 77

    Cabling 77 S ystem fan cablin g Item Description 1 Rear system fan cable 2 Front system fan cable S torage cabling F our - bay LFF drive cabling Non-hot- plug, SATA drive support only[...]

  • Seite 78

    Cabling 78 Item Description 1 Power cable 2 Data cable Non-hot- plug, SATA and SAS drive support Item Description 1 Power cable 2 Data cable Hot- plug, SATA drive support Item Description 1 Power cable[...]

  • Seite 79

    Cabling 79 Item Description 2 Mini - SAS cable Hot- plug, SATA and SAS drive support Item Description 1 Power cable 2 Mini - SAS cable E ight - bay SFF drive cabling This drive configura tion supports hot - plug SATA and SAS drives. Item Description 1 Power cable[...]

  • Seite 80

    Cabling 80 Item Description 2 Mini - SAS cable 3 Mini - SAS cable M edia drive cabl ing • Media drives in a nonre dundant power configuration Item Description 1 Upper media dr ive power cable 2 Lower media drive S ATA cable 3 Upper media dri ve SATA cable 4 Lower media drive p ower cable[...]

  • Seite 81

    Cablin g 81 • Media drive in a redu ndant power configurat ion Item Description 1 Upper media dr ive SATA cable 2 Upper media dr ive power cable P ower su pply cabling N onredundant power supply cabling Item Description 1 24 - pin power supply c able 2 4- pin power supply cable[...]

  • Seite 82

    Cabling 82 R edundant power supply cabling Item Description 1 24 - pin power supply cable 2 26 - pin RPS c able 3 4- pin power supply cable (with the 8 - pin to 4 - pin adapter cable conne cted) C apacitor pack cabl ing[...]

  • Seite 83

    Specifications 83 S pec if icati ons E nvironmental spec ifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Nonoperating - 30 ° C to 60 ° C ( - 22 ° F to 140 ° F) Relative humidity (noncondensing) Operating, maximum wet bul b temperature of 28°C (82.4°F) 10% to 90% Nonoperating, maximum wet bul[...]

  • Seite 84

    Specifications 84 H P 350 W 4U Integrated Power Supply Specification Value Input requirements — Rated input voltage 100 V AC to 2 40 V AC Rated input frequency 47 Hz to 63 Hz Rated input cu rrent 6 A Rated input po wer 440 W at 100 V AC input 440 W at 200 V AC input Efficiency No less than 82% at 1 00% load No less than 85% at 50% load No less th[...]

  • Seite 85

    Support and other resources 85 S uppo r t and othe r re s o u rc e s Before you contac t HP Be sure to have the follo wing information available before you call HP : • Active Health S ystem log (HP ProLiant Ge n8 or later products) Download and have av ailable an Active He alth System log for 3 days before the fai lure was detected. For more info[...]

  • Seite 86

    Acronyms and ab breviations 86 A c r on y ms and abbr e v iati on s ABEND abnormal end AMP Advanced Memory Protec tion ASR Automatic Server R ecovery CSR Customer Self Re pair DDR double data rate FBWC flash - backed write cache HP CS HP Common Slot (p ower supply) HP SIM HP Systems Insight Manager iLO Integrated Lights - Out IML Integrated Managem[...]

  • Seite 87

    Acronyms and ab breviations 87 NMI nonmaskable inte rrupt NVRAM nonvolatile memory PCIe peripheral component interconnect express POST Power - On Self Test RBSU ROM - Based Setup Utility RDIMM registered dual in - line memory mod ule RPS redundant power supply SAS serial attached SCSI SATA serial ATA SD Secure Digital SFF small form fact or SLC sin[...]

  • Seite 88

    Acronyms and ab breviations 88 UDIMM unregistered dua l in - line memory mo dule UID unit identification USB universal serial bus[...]

  • Seite 89

    Documentation feedback 89 Doc ument ati on f eedbac k HP is committed t o providing documentati on that meets your n eeds. To help us improve the documentation, send any erro rs, suggestion s, or comments to Documentation Feedback ( mailto:docsf eedback@hp.com ). Include the document title and part number, version number, or the URL when submitting[...]

  • Seite 90

    Index 90 A access panel 31 air baffle 32 ASR (Automatic Se rver Recovery) 64 authorized r eseller 85 Automatic Server R ecovery (ASR) 64 B bezel, tower 26 blanks 27 board components 69 C cables 76 cabling 76, 77, 78, 79, 80, 81, 82 cache module 45, 74 cache module, removing 45 capacitor pack 45, 46, 82 components 16, 65 components, identification 1[...]

  • Seite 91

    Index 91 M management tools 62 mechanical compone nts 16 media drive bay cabli ng 80 N NMI f unctionality 71 O optical drive 32, 65 P part numbers 16 PCI expansion slots 70 phone numbers 85 power down procedure 26 power supply 30, 51, 53 power supply cabling 81, 82 power supply specific ations 83, 84 powering down 26 problem dia gnos is 61 processo[...]