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HP (Hewlett-Packard) BL685C G6 Bedienungsanleitung

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Inhaltsverzeichnis der Gebrauchsanleitungen

  • Seite 1

    HP Pr oL iant BL6 8 5c G6 Ser v er Blade Maintenance and S erv ice Gui de Part Number 508504-001 April 2009 (First Edition)[...]

  • Seite 2

    © Copyright 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice . The only warranties for HP products and services are set forth in the express warranty statements accompanying such produc ts and services. Noth ing herein should be construed as constituting an additional w arranty. HP[...]

  • Seite 3

    Contents 3 Con t en t s Customer self repair ........................................................................................................... ........... 5 Parts only warr anty service .................................................................................................... ..................... 5 Illustrated pa rts cata log .[...]

  • Seite 4

    Contents 4 HP Insight Remote Support so ftware ............................................................................................. .............. 54 USB support and functionality .................................................................................................. ................. 55 USB support .............................[...]

  • Seite 5

    Customer self repair 5 C ustome r sel f r e pa ir HP products are designed with many Customer Self Repair (CSR) parts to minimi ze repair time and allow for greater flexibility in performing defe ctive parts re placement. If during the di agnosis period HP (or HP service providers or service partners) iden tifies that the repair can be accomplished[...]

  • Seite 6

    Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplac ement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont é[...]

  • Seite 7

    Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostitui te da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla[...]

  • Seite 8

    Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materiali en, die mit einem CSR- Ersatzteil geliefert werden, könn en Sie entnehmen, ob das defekte Teil an HP zurückgesch ickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzusch icken, müssen Sie dies innerhalb eines vorgegebenen[...]

  • Seite 9

    Customer self repair 9 Centro de asistencia técnica de HP y reci birá ayu da telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componente s CSR, HP especificará si los comp onentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hace[...]

  • Seite 10

    Customer self repair 10 periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegel everde verpakkingsmateriaal. Als u het defecte onderdeel niet t erugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant [...]

  • Seite 11

    Customer self repair 11 Se r v iço de gar anti a ape nas par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para pe ças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rnece as peças de reposição sem cobrar nenhuma taxa. No caso desse serviço, a substituição de peças CSR é obrigatóri[...]

  • Seite 12

    Customer self repair 12[...]

  • Seite 13

    Customer self repair 13[...]

  • Seite 14

    Customer self repair 14[...]

  • Seite 15

    Customer self repair 15[...]

  • Seite 16

    Illustrated parts catalog 16 Illus tr ated par ts catalog Server blade components Item Description Spare part number Customer self repair (on page 5 ) 1 Access panel 532159-001 Ma ndatory 1 2 Heatsink — — a) Processor 1 and 2 511658-001 Optional 2 b) Processor 3 and 4* 511659-001 Optional 2 3 Processor — — a) 2.9-GHz AMD Opteron™ Mode l 8[...]

  • Seite 17

    Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 5 ) c) 4-GB, PC2-6400, RoHS* 501158-001 Mandatory 1 d) 4-GB, PC2-6400, LP* 504589-001 Mandatory 1 e) 8-GB, PC2-5300* 432671-001 Mandatory 1 7 Hard drives — — a) 300-GB, 6G, SAS, SFF, 10, 000-rpm, dual-port* 507284-001 Mandatory 1 b) 300-GB, 3G, SAS, SF[...]

  • Seite 18

    Illustrated parts catalog 18 Item Description Spare part number Customer self repair (on page 5 ) d) HP NC364m Quad Port 1GbE BL-c Adapter 448066-001 Mandatory 1 e) HP NC382m Dual Port 1GbE Multifunction BL-c Adapter 462748-001 Mandatory 1 f) HP NC512m Dual Port 10GbE Multifun ction BL-c Adapter 448515-001 Mandatory 1 g) HP NC532m Dual Port Fle x-1[...]

  • Seite 19

    Illustrated parts catalog 19 3 No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider re place the part. These parts are identified as "No" in the Illustrated Parts Catalog. 1 Mandatory: Obligatoire—Pièces pour lesquelles la réparation pa[...]

  • Seite 20

    Illustrated parts catalog 20 2 Optional: Opcional—Peças cujo reparo feito pelo cl ient e é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. 3 No: Nenhuma[...]

  • Seite 21

    Removal and replacement procedures 21 R emo v al and r eplacement pr ocedur es Required tools You need the following item s for some procedures: • T-15 Torx screwdriver (provided inside the access panel) • HP Insight Diagnostics soft ware (" HP Insight Diagnostics " on page 53 ) Safety considerations Before performing service proced u[...]

  • Seite 22

    Removal and replacement procedures 22 CAUTION: When performing non-hot-plug operatio ns, you must power down the serv er blade and/or the system. However, it may be necessar y to leave the server blade powered up when performing other operations, such as hot- plug installations or troubleshooting. Symbols on equipment The following symbols may be p[...]

  • Seite 23

    Removal and replacement procedures 23 Power down the server blade Before powering down the server blade for any up grade or maintenance procedures, perform a backup of critical server data and programs. Depending on the Onboard Administrator configuration, use one of the followin g methods to power down the server blade: • Use a virtual power but[...]

  • Seite 24

    Removal and replacement procedures 24 3. Remove the server blade. 4. Place the server blade on a flat, level work surface. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical componen ts, properly ground the serve[...]

  • Seite 25

    Removal and replacement procedures 25 CAUTION: To prevent damage to electrical componen ts, properly ground the server blade before beginning any installation procedure. Improper ground ing can cause ESD. To replace the component: 1. Place the access panel on top of the server blade. Allow the panel to extend past the rear of the server blade appro[...]

  • Seite 26

    Removal and replacement procedures 26 3. Remove the hard drive. To replace the component, reverse the r emoval procedure. Solid state drive WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. To remove the component: 1. Power down the server blade (on pa[...]

  • Seite 27

    Removal and replacement procedures 27 To replace the component, reverse the r emoval procedure. DIMM baffle CAUTION: To avoid damage to the server blade and the enclosure, install all DIMM baffles in the proper location after adding or replacin g DIMMs. DIMM baffles that are missing or installed incorrectly can compromise server blade and enclosure[...]

  • Seite 28

    Removal and replacement procedures 28 6. Remove the DIMM. When replacing DIMMs for processors 3 and 4, it may be helpful to remove the following items: • Hard drives (" Hard drive " on page 25 ) • SAS controller (on page 29 ) • Front panel/hard drive cage assembly (on page 33 ) To replace the component, reverse the r emoval procedur[...]

  • Seite 29

    Removal and replacement procedures 29 o Mezzanine 1 and 2 o Mezzanine 3 CAUTION: To prevent damage to the server bl ade, apply pressure over the mezzanine connector when installing the mezzanine card. Do not apply pressure to the edges of the c ard. To replace the component, reverse the r emoval procedure. SAS controller To remove the component: 1.[...]

  • Seite 30

    Removal and replacement procedures 30 4. Remove the controller. To replace the component, reverse the r emoval procedure. Battery-backed write cache procedures Two types of procedures ar e provided for the BBWC option: • Removal and replacement of failed components: o Removing the cach e module (" Cache module " on page 30 ) o Removing [...]

  • Seite 31

    Removal and replacement procedures 31 4. Remove the cache module. To replace the component, reverse the r emoval procedure. Cache module battery pack To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ). 4. Remove the batt[...]

  • Seite 32

    Removal and replacement procedures 32 o Mezzanine card controller option 5. Disconnect the battery pack. To replace the component, reverse the r emoval procedure. Recovering data from the battery-backed write cache If the server fails, use the follow ing procedure to recover data temporarily stored in the BBWC. CAUTION: Before starting this pr oced[...]

  • Seite 33

    Removal and replacement procedures 33 o Find a server that has enough empty drive bays to accommodate all the drives from the failed server and that meets all the other requ irements for drive and array migration. 2. Power down the failed server (" Power down the server blade " on page 23 ). If any data is stored in the cache module, a gr[...]

  • Seite 34

    Removal and replacement procedures 34 Server blade release lever and button To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ). 4. Remove all hard drives (" Hard drive " on page 25 ). 5. Remove all hard drive b[...]

  • Seite 35

    Removal and replacement procedures 35 To replace the component, reverse the r emoval procedure. Heatsink To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ). 4. To replace heatsink 3 or 4, perform these additional steps: [...]

  • Seite 36

    Removal and replacement procedures 36 2. Remove the thermal interface prot ective cover from the heatsink. CAUTION: Heatsink retaining screws sho uld be tigh tened in diagonally o pposite pairs (in an "X" pattern). IMPORTANT: When installing the heatsink, align the guide pins on the processor retention bracket with the alignment holes in [...]

  • Seite 37

    Removal and replacement procedures 37 Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible serv er malfunction, do not mix processors of different speeds or cache sizes. Refer to the label on the proces so r heatsink[...]

  • Seite 38

    Removal and replacement procedures 38 6. Using your fingers, remove the failed pro cessor. To replace the component: CAUTION: The pins on the proces sor socket are very fragile. Any damage to them may require replacing the system board. CAUTION: Failure to completely open t he processor locking lever prevents the processor fr om seating during inst[...]

  • Seite 39

    Removal and replacement procedures 39 1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 2. Align the processor installation tool with the socket and install the processor. CAUTION: The processor is design ed to fit one way into the socket. Use the alignment guides on the processor and socke[...]

  • Seite 40

    Removal and replacement procedures 40 3. Press down firmly until the proces sor installation tool clicks and separates from the processor, and then remove the processor installation tool. 4. Close the processor retaining bracket and the processor retaining latch. 5. Clean the old thermal grease from the he atsink with the alcohol swab. Allow the al[...]

  • Seite 41

    Removal and replacement procedures 41 7. Remove the thermal interface prot ective cover from the heatsink. CAUTION: Heatsink retaining screws sho uld be tigh tened in diagonally o pposite pairs (in an "X" pattern). IMPORTANT: When installing the heatsink, align the guide pins on the processor retention bracket with the alignment holes in [...]

  • Seite 42

    Removal and replacement procedures 42 8. Install the heatsink. 9. Install the front panel/hard drive cage assembly (" Front panel/hard drive cage assembly " on page 33 ), if removed. 10. Install the SAS controller (" SAS controller " on page 29 ), if removed. 11. Install the hard drives (" Hard drive " on page 25 ), if[...]

  • Seite 43

    Removal and replacement procedures 43 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery , reconfigure t he system through RBSU. To replace the component, reverse the r emoval procedure. System board To remove the component: 1. Power down the server bl[...]

  • Seite 44

    Removal and replacement procedures 44 13. Open the processor retaining latch and the processor socket retaining bracket. 14. Using your fingers, remove the proces sor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removin[...]

  • Seite 45

    Removal and replacement procedures 45 o Near mezzanine card connector o Near SD card slot[...]

  • Seite 46

    Removal and replacement procedures 46 16. Remove the failed system board. To replace the system board: 1. Install the spare system board. 2. Prepare the processor socket on the spare syst em board:[...]

  • Seite 47

    Removal and replacement procedures 47 a. Remove the processor socket protective cover. b. Open the processor retaining latch and the processor socket retaining bracket. 3. Install the processor socket cove r onto the processor socket of the failed system board. 4. Install the processor on the spare system board. CAUTION: The processor is design ed [...]

  • Seite 48

    Removal and replacement procedures 48 5. Close the processor retaining latch and th e processor socket retaini ng bracket. 6. Clean the old thermal grease from the he atsink an d the top of the proc essor with the alcohol swab. Allow the alcohol to evapo rate before continuing. 7. Apply all the grease to the top of the processor in one of the foll [...]

  • Seite 49

    Removal and replacement procedures 49 IMPORTANT: Heatsinks for processors 1 and 2 are no t interchangeable with the heatsinks for processors 3 and 4. 8. Install the heatsink. IMPORTANT: Install all components with the same co nfiguration that was used on the failed system board. 9. Install the BBWC battery holders. 10. Install all components remove[...]

  • Seite 50

    Cabling 50 Cabl i n g SSD cable routing Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform server blade adminis tration, configuration, and diagnostic procedures by connecting video and USB devices directly to the server blade. For SUV cable connectors, see "HP c-Class Blade SUV Cable (on page 64 ).[...]

  • Seite 51

    Cabling 51 Accessing a server blade with local KVM CAUTION: Before disconnecting the SUV cable from t he connector, always squeeze the release buttons on the sides of the connector. Failure to do so can result in damage to the equipment. NOTE: For this configuration, a USB hub is not nec essary. To connect additional devices, use a USB hub. 1. Conn[...]

  • Seite 52

    Cabling 52 4. Connect the following to the USB hub: o USB CD/DVD-ROM drive o USB keyboard o USB mouse o USB diskette drive NOTE: Use a USB hub when connecting a USB di skette drive and/or USB CD-ROM drive to the server blade. The USB hub pr ovides additional connections. Item Description 1 Monitor 2 USB mouse 3 HP c-Class Blade SUV Cable 4 Server b[...]

  • Seite 53

    Diagnostic tools 53 Di agnosti c tools Troubleshooting resources The HP ProLiant Servers Troubleshoot ing Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation an d identification, error message interpretation, issue resolution, and software maintenance on ProLiant ser v ers and server blade[...]

  • Seite 54

    Diagnostic tools 54 You can view recorded events in the IML in several ways, including t he following: • From within HP SIM • From within operating system-specific IML viewer s: o For NetWare: IML Viewer o For Windows®: IML Viewer o For Linux: IML Viewer Application • From within the iLO 2 user interface • From within HP Insight Diagnostic[...]

  • Seite 55

    Diagnostic tools 55 agreements. Download from the HP website ( http://h20392.www2.hp.com/portal/swdepot/di sp layProductInfo.do? productNumber=ISDVD ). Both HP Insight Remote Support solutions are availabl e at no additional cost to customers with a valid warranty on HP technology, an HP Care Pack Se rvice or HP contractual support agreement. For m[...]

  • Seite 56

    Component identification 56 C omponen t identif icati on Front panel components Item Description 1 Serial label pull tab 2 HP c-Class Blade SUV Cable connec tor* 3 Power On/Standby button and LED 4 Server blade release button 5 Server blade release lever 6 Hard drive ba y 2 7 Hard drive ba y 1 * The SUV connector and the HP c-Class Blade SUV Cable [...]

  • Seite 57

    Component identification 57 Item Description Status 2 Health LED Green = Normal operation Amber flashing = Degraded condition Red flashing = Critica l condition 3 Flex 1 LED Green = Network linked Green flashing = Network activity Off = No link or activity 4 Flex 2 LED Green = Network linked Green flashing = Network activity Off = No link or activi[...]

  • Seite 58

    Component identification 58 Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) SAS and SATA hard drive LED combinations NOTE: Predictive failure alerts can occur only when the hard drive is connected to a Smart Array controller. Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating am[...]

  • Seite 59

    Component identification 59 System board components Item Description 1 Processor 4 DIMM slots 2 Processor socket 4 3 Processor socket 2 (populated) 4 System maintenance switch 5 Processor 2 DIMM slots 6 Mezzanine connector 1 (Type I mezzanine only) 7 Mezzanine connector 2 (Type I or Type II mezzanine) 8 System board thumbscrews (3) 9 Enclosure conn[...]

  • Seite 60

    Component identification 60 The symbols correspond to the symbols located on the inte rconnect bays. For more information, see the HP ProLiant BL685c G6 Serve r Blade Installation Instructions that ship with the server blade. Mezzanine connector definitions PCIe x8 mezzanine connec tors support x16 cards at up to x8 speeds. Item Connector Card supp[...]

  • Seite 61

    Component identification 61 • Processor 2 DIMM slots • Processor 3 DIMM slots[...]

  • Seite 62

    Component identification 62 • Processor 4 DIMM slots System maintenance switch Position Function Default 1* iLO 2 security override Off 2 Configuration lock Off 3 Reserved Off 4 Reserved Off 5* Password disabled Off 6* Reset configuration Off 7 Reserved Off 8 Reserved Off *To access redundant ROM, set S1, S5, and S6 to ON. System maintenance swit[...]

  • Seite 63

    Component identification 63 3. Remove the access panel (" Access panel " on page 24 ). 4. Change position 6 of the system maintena nce switch to on. 5. Install the access panel (" Access panel " on page 24 ). 6. Install the server blade in the enclosure and power up the server blade. 7. Wait for the POST message that prompt s yo[...]

  • Seite 64

    Component identification 64 HP c-Class Blade SUV Cable Item Connector Description 1 Server blade For connecting to the SUV connector on the server blade front panel 2 Video For connecting a video monitor 3 USB For connecting up to two USB devices 4 Serial For trained personnel to connect a null modem serial cable and perform advanced diagnostic pro[...]

  • Seite 65

    Specifications 65 Sp e c i fic a t io n s Environmental specifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 60 ° C (-40 ° F to 140 ° F) Storage -20°C to 60°C (-4°F to 140°F) Maximum wet bulb temperature 30 ° C (86 ° F) Relative humidity (noncondensing)** Operating 10%[...]

  • Seite 66

    Acronyms and abbreviations 66 A c r on y ms and abbr e v iati ons ADU Array Diagnostics Utility CSR Customer Self Repair ESD electrostatic discharge FC Fibre Channel HBA host bus adapter iLO 2 Integrated Lights-Out 2 IML Integrated Management Log PCI peripheral component interface PCIe peripheral component interconnect express RBSU ROM-Based Setup [...]

  • Seite 67

    Acronyms and abbreviations 67 SFF small form-factor SIM Systems Insight Manager TPM trusted platform module UID unit identification USB universal serial bus[...]

  • Seite 68

    Index 68 A  access panel 24 ADU (Array Diagnostic Utility) 54 air baffle 27 B  baffles 27 battery 42 battery pack, removing 31 battery-backed write cache battery pack 31 BBWC (battery-backed write cache) 30, 31 buttons 56 C  cables 50 cabling 50 cache battery 31 cache module 30 cache module battery pack 31 cache module, removing 30 caution[...]

  • Seite 69

    Index 69 S  safety considerations 21 safety information 21 SAS backplane 29 SAS controller 29 SAS drives 25, 58 SAS hard drive LEDs 57, 58 SAS/SATA LED combinations 58 SATA hard drive 58 SATA hard drive LEDs 57, 58 server blade release lever 34 solid state drive 26 spare part numbers 16 specifications 65 specifications, environmental 65 static e[...]