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HP (Hewlett-Packard) BL685c Bedienungsanleitung

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Inhaltsverzeichnis der Gebrauchsanleitungen

  • Seite 1

    HP Pr oL iant BL6 8 5c Se r v er Blade Maintenance and S erv i ce Guid e Part Number 418533- 007 May 2008 (Sev enth Edition)[...]

  • Seite 2

    © Copyright 2006, 2008 Hewlett-Pa ckard Development Company, L.P. The in formati on con taine d here in is subject to chan ge with out n otice. The on ly war ranti es for H P produ cts and serv ices ar e set forth in th e ex press warrant y stat ements accom panyin g such produ cts and serv ices. N othin g herein shoul d be con strue d as constitu[...]

  • Seite 3

    Contents 3 Con t e nt s Custom er self repair ........................................................................................................... ........... 5 Parts only warran ty servi ce .................................................................................................... ........................ 5 Illustrated par ts cata [...]

  • Seite 4

    Contents 4 External U SB func tionalit y ..................................................................................................... ............ 55 Componen t identification ....................................................................................................... ...... 56 Front pan el compon ents ..........................[...]

  • Seite 5

    Customer self repair 5 C ust omer self r epair HP products are designed with many Customer Self Repair (CSR) parts to minimize r epair time and allow for greater flexibility in performing defective parts re placement. If during the di agnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by t[...]

  • Seite 6

    Customer self repair 6 • Obligatoire - Pièces pour l esquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d' œuv re du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont [...]

  • Seite 7

    Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste par ti siano sostituit e da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e all[...]

  • Seite 8

    Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR- Ersatzteil geliefert werden, k önnen Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschi cken, müssen Sie dies innerhalb eines vorgegebenen Z[...]

  • Seite 9

    Customer self repair 9 Centro de asistencia técnica de HP y recibirá ay uda telefónica por parte de un técni co. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectu osos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacer[...]

  • Seite 10

    Customer self repair 10 periode, gewoonlijk vijf (5) we rkdagen, retourneren aan HP. Het defecte on derdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant [...]

  • Seite 11

    Customer self repair 11 Se r v iço de gar anti a ape nas par a peças A garantia limitada da HP pode incluir um serviço de garantia apenas para pe ças. Segundo os termos do serviço de garantia apenas para peças, a HP fo rne ce as peças de reposição sem cobrar nenhuma taxa. No caso desse serviço, a substituiç ão de peças CSR é obrigató[...]

  • Seite 12

    Customer self repair 12[...]

  • Seite 13

    Customer self repair 13[...]

  • Seite 14

    Customer self repair 14[...]

  • Seite 15

    Customer self repair 15[...]

  • Seite 16

    Illustrated parts catalog 16 Illus tr ated par ts cata log Server blade components Item Description Spare part number Customer self repair (on page 5 ) 1 Heatsink 436380-001 Optional 2 2 Processor — — a) 3.0-GHz AMD O pteron™ Model 8222** 455279-001 Optional 2 b) 2.8-GHz AMD O pteron TM Model 8220* ** 438872-001 Optional 2 c) 2.6-GH z AMD Opt[...]

  • Seite 17

    Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 5 ) h) 2.2-GH z AMD Opteron™ Model 8354* * * 448404-001 Optional 2 i) 1.9-GH z AMD Opteron™ Model 8347 H E* ** 457127-001 Optional 2 3 DIMMs — — a) 512-MB, P C2-5300 DIMM 416355-001 Mandatory 1 b) 1-GB, P C2-5300 DIMM* 416356-001 Mandatory 1 c) 2-G[...]

  • Seite 18

    Illustrated parts catalog 18 Item Description Spare part number Customer self repair (on page 5 ) b) QLogi c QMH2462 4Gb FC HB A for HP c-Class BladeSystem 405920-001 Man datory 1 c) HP NC325m PCI Express Quad Port Gigabit Serv er Adapter for c-Class B ladeSystem 436011-001 Man datory 1 d) HP N C326m PCI Express Dual Port 1Gb Server Adapter f or c-[...]

  • Seite 19

    Illustrated parts catalog 19 2 Optional: Facultatif —Pièces pour lesquelles la réparation par le client est facultative. Ces pièces son t également conçues pour permettre au client d'ef fectuer lui-même la réparation . Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, sel[...]

  • Seite 20

    Illustrated parts catalog 20[...]

  • Seite 21

    Removal and replac ement procedures 21 R emo val and r eplacement pr ocedur es Required tools You need the following items for some pro cedures: • T-15 Torx screwdriver • Diagnostics Utility Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the s[...]

  • Seite 22

    Removal and replac ement procedures 22 CAUTION: When performing non-hot-plug operatio ns, you must power down the serv er blade and/or the system. However, it may be necessary to leave the server blade powered up when performing other operations , such as hot-plug installatio ns or troubleshooting. Symbols on equipment The following symbols may be [...]

  • Seite 23

    Removal and replac ement procedures 23 Power down the server blade Before powering down the server blade for any up grade or maintenance procedure s, perform a backup of critical server data and programs. Depending on the Onboard Administrator configuration, use one of the following m ethods to power down the server blade: • Use a virtual power b[...]

  • Seite 24

    Removal and replac ement procedures 24 WARNING: To reduce the r isk of personal injury from h ot surfaces, allow the drives and the internal system components to cool before touch ing them. CAUTION: To prevent damage to electrical compon ents, properly ground the server blade before beginning any installation procedur e. Improper grounding can caus[...]

  • Seite 25

    Removal and replac ement procedures 25 To replace the component, reve rse the removal procedure. Hard drive 1. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations (" SAS and SATA hard drive LED combinations " on page 58 ). 2. Back up all server data. 3. Remove the hard drive. To replace the component, [...]

  • Seite 26

    Removal and replac ement procedures 26 4. Remove the DIMM baffle. CAUTION: To avoid damage to the server blade and the enclosure, install all DIMM baffles in the proper location after adding or replacin g DIMMs. DIMM baffles that are missing or installed incorrectly can co mpromise server blade and enclosure cooling. DIMM baffles for processor 1 an[...]

  • Seite 27

    Removal and replac ement procedures 27 5. Remove the DIMM. To replace the component: 1. Install the DIMM. 2. Install the DIMM baffle. 3. Install the access panel (" Access panel " on page 24 ). 4. Install the server blade. 5. Use RBSU to verify the configuration. Mezzanine card Optional mezzanine cards enable network connectivity and prov[...]

  • Seite 28

    Removal and replac ement procedures 28 4. Remove the mezzanine card. CAUTION: To prevent damage to the server blade, apply pressure over the mezzan ine connector when installing the mezzanine card. Do not apply pressure to the edges of the card. To replace the component, reve rse the removal procedure. HP Smart Array E200i Controller cache module T[...]

  • Seite 29

    Removal and replac ement procedures 29 HP Smart Array E200i Controller cache module battery pack To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ). 4. Remove the cache module (" HP Smart Array E200i Co ntroller cac[...]

  • Seite 30

    Removal and replac ement procedures 30 4. Remove the SAS cable. To replace the component, reve rse the removal procedure. Hard drive backplane To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). CAUTION: Remove all hard drives and hard driv e blanks before remov ing the hard drive backpla[...]

  • Seite 31

    Removal and replac ement procedures 31 7. Remove the hard drive backplane. To replace the component, reve rse the removal procedure. Front panel/hard drive cage assembly To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 )[...]

  • Seite 32

    Removal and replac ement procedures 32 Server blade handle To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access panel (" Access panel " on page 24 ). 4. Remove all hard drives (" Hard drive " on page 25 ). 5. Remove all hard drive blanks (" Har[...]

  • Seite 33

    Removal and replac ement procedures 33 7. Remove the release button. To replace the component, reve rse the removal procedure. Heatsink IMPORTA NT: Do not install the air baffles on heatsinks f or processors 3 and 4. To remove the component: 1. Power down the server blade (on page 23 ). 2. Remove the server blade (on page 23 ). 3. Remove the access[...]

  • Seite 34

    Removal and replac ement procedures 34 o Processor 3 or 4 o Processor 1 or 2 To replace the component: 1. Clean the old thermal grease from the proc esso r with the alcohol swab. Allow the a lcohol to evaporate before continuing.[...]

  • Seite 35

    Removal and replac ement procedures 35 2. Remove the thermal interface protective cover from the heatsink. IMPORTA NT: Do not install the air baffles on heatsinks f or processors 3 and 4. 3. If the heatsink will be installed on processor 1 or 2, expose the adhesive and apply the air baffles to the side of the heatsink that will face the center of t[...]

  • Seite 36

    Removal and replac ement procedures 36 o Processor 3 or 4 o Processor 1 or 2 CAUTION: Heatsink retaining screws should be tigh tened in diagonally opposite pairs (in an "X" pattern). 5. Install the heatsink:[...]

  • Seite 37

    Removal and replac ement procedures 37 o Processor 3 or 4 o Processor 1 or 2 6. Install the SAS cable, if remove d (" SAS cable " on page 29 ). 7. Install the access panel (" Access panel " on page 24 ). Processor WARNING: To reduce the r isk of personal injury from h ot surfaces, allow the drives and the internal system compone[...]

  • Seite 38

    Removal and replac ement procedures 38 CAUTION: The server blade supports only two- or four-processor configurations . Always populate processor socket s 1 and 2 with processors and heat sinks. To prevent over heating, always populate processor sockets 3 and 4 with processors and heatsinks or pro cessor socket covers and heatsink blanks. To remove [...]

  • Seite 39

    Removal and replac ement procedures 39 CAUTION: The pins on the processor socket ar e very fragile. Any damage to them may require replacing th e system board. CAUTION: Failure to completely open the processor loc king lever prevents the processor from seating during installation, leading to hardware damage. IMPORTA NT: Be sure the processor remain[...]

  • Seite 40

    Removal and replac ement procedures 40 3. Press down firmly until the processor installation t ool clicks and separates from the processor, and then remove the processor installation tool.[...]

  • Seite 41

    Removal and replac ement procedures 41 4. Close the processor retaining bracke t and the processor retaining latch. 5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 6. Apply all the grease to the top of the processor in one of the following patterns to e nsure even distributi[...]

  • Seite 42

    Removal and replac ement procedures 42 o Processor 3 or 4 o Processor 1 or 2 CAUTION: Heatsink retaining screws should be tigh tened in diagonally opposite pairs (in an "X" pattern). 8. Install the heatsink:[...]

  • Seite 43

    Removal and replac ement procedures 43 o Processor 3 or 4 o Processor 1 or 2 9. Install the SAS cable, if remove d (" SAS cable " on page 29 ). 10. Install the access panel (" Access panel " on page 24 ). 11. Install the server blade. System battery If the server blade no longer automatically display s the correct date and time,[...]

  • Seite 44

    Removal and replac ement procedures 44 WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury : • Do not attempt to recharge the battery. • Do not expose the battery[...]

  • Seite 45

    Removal and replac ement procedures 45 7. Remove the hard drive backplane (" Hard drive backplane " on page 30 ). 8. Remove the front panel/hard drive cage assembly (" Front panel/hard drive cage assembly " on page 31 ). 9. Remove all DIMM baffles (" DIMM baffle " on page 25 ). 10. Remove the cache module (" HP Sm[...]

  • Seite 46

    Removal and replac ement procedures 46 CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover afte r removing the processor from the sock et. • Do not tilt or slide the processor when lowering the processor into the so cket. CAUTION: To avoid damage to the proces[...]

  • Seite 47

    Removal and replac ement procedures 47 a. Remove the processor socket protective cover. b. Open the processor retaining latch and th e processor socket retaining bracket. 3. Install the processor socket cover onto the proc essor socket of the failed sy stem board. 4. Install the processor on th e spare system board. CAUTION: The processor is design[...]

  • Seite 48

    Removal and replac ement procedures 48 5. Close the processor retaining latch and th e processor socket retaining bracket. 6. Clean the old thermal grease from the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 7. Apply all the grease to the top of the processor in one of the followin[...]

  • Seite 49

    Removal and replac ement procedures 49 IMPORTA NT: When replacing multiple processors, inst all heatsinks with attached air baffles on processors 1 and 2 only. 8. Install the heatsink. IMPORTA NT: Install all components with the same configuration that was used on t he failed system board. 9. Install all components removed from the failed system bo[...]

  • Seite 50

    Cabling 50 Cabl in g SAS cable routing Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform server blade administration, configuration, and diagnostic procedures by connecting video and US B devices directly to the server blade. For SUV cable connectors, see "HP c-C lass Blade SUV Cable (on page 62 ).[...]

  • Seite 51

    Cabling 51 Acces sing a server blade with lo cal KVM CAUTION: Before disconnecting the SUV cable from the connector, always squeeze the release buttons on the sides of the connector. Fa ilure to do so can result in damage to the equipment. NOTE: For this configuratio n, a USB hub is no t necessary. To connect additi onal devices, use a USB hub. 1. [...]

  • Seite 52

    Cabling 52 o USB CD/DVD-ROM drive o USB keyboard o USB mouse o USB diskette drive NOTE: Use a USB hub when connecting a USB diskette drive and/or USB CD-ROM drive to the server blade. The USB hub provides additional connections. Item Description 1 Monitor 2 USB mouse 3 HP c-Class Blade SUV cable 4 Server blade 5 USB hub 6 USB keyboard 7 USB CD/D VD[...]

  • Seite 53

    Diagnostic tools 53 Di agno sti c too ls Troubleshooting resources The HP ProLiant Serve rs Troubleshooting Guide provides procedures for resolving c ommon problems and comprehensive courses of action for fault isolation and i dentification, error message interpretation, issue resolution, and software maintenance on ProLiant se rv ers and server bl[...]

  • Seite 54

    Diagnostic tools 54 This functionality supports operatin g systems that may not be supported by the server blade. For operating systems supported by the server blade, see the HP webs ite ( http://www.hp.com/go/supportos ). If a significant change occur s between data-gatherin g intervals, the survey function marks the previous information and overw[...]

  • Seite 55

    Diagnostic tools 55 Legacy USB support provides USB functionality in env ironments where USB support is normally not available. Specifically, HP prov ides legacy USB functionality for: • POST • RBSU • Diagnostics • DOS • Operating environments whic h do not prov ide native USB support For more information on Pro Liant US B support, refer [...]

  • Seite 56

    Component identification 56 C ompo nent identif icati on Front panel components Item Description 1 Hard drive bay 2 2 Server blade handle 3 Server blade handle release bu tton 4 Serial pull tab 5 Hard drive bay 1 6 HP c-Class Blade SUV cable connector* 7 Power On/ Standby button * The SUV conn ector and the HP c -Class Blade SUV Cable are for som e[...]

  • Seite 57

    Component identification 57 Front panel LEDs Item Description Status 1 UID LED Blue = Identified Blue fla shing = A ctive remote manageme nt Off = No act ive remot e manag ement 2 Health LED Green = Normal operati on Amber flashi ng = Degraded condi tion Red flashin g = Critical co ndition 3 NIC 1 LED* Green = Network linked Green flashing = Networ[...]

  • Seite 58

    Component identification 58 SAS and SATA hard drive LEDs Item Description 1 Fault/U ID LED (amber/blue) 2 Onlin e LED (gree n) SAS and SATA hard drive LED combinations Online/activity LED (gr een) Fault/UID LE D (amber/blue) Interpretation On, off, o r flash ing Alternatin g amber and blue The drive has failed, or a pred ictive failure alert has be[...]

  • Seite 59

    Component identification 59 Online/activity LED (gr een) Fault/UID LE D (amber/blue) Interpretation Flashing irreg ularly Amber, flashin g regularly (1 Hz) The drive i s active, but a predicti ve failure alert has been received for th is drive. Replace the drive as soon as possible. Flashing irregularly Off The drive is activ e, and it is operating[...]

  • Seite 60

    Component identification 60 Item Description 13 Enclosure connector 2 14 System board thum bscrew 15 Embedded NIC 16 Embedded NIC 17 Smart Array E200i cach e module (under mezzanine card 3) 18 SAS cable 19 Processor socket 1 ( populated) 20 DIMM slots (Proc essor 1 memory banks A and B ) 21 System battery 22 DIMM slots (Proce ssor 3 memory banks E [...]

  • Seite 61

    Component identification 61 System maintenance switch Position Fu nction Default 1* iLO 2 security overri de Off 2 Confi guratio n lock Off 3 Reserved Off 4 Reserved Off 5* Password disabled Off 6* Reset co nfigura tion Off 7 Reserved Off 8 Reserved Off *To access redundan t ROM, set S1, S5, and S6 t o ON. System maintenance switch procedures When [...]

  • Seite 62

    Component identification 62 Accessin g the redundant R OM If the system ROM is not corrupted, use RBSU to switch to the redundant RO M. If the system ROM is corrupted, the system automatically switches to th e redundant R OM in most cases. If the system does not auto matically switch to the redundant ROM, perform the followi ng steps: 1. Power down[...]

  • Seite 63

    Specifications 63 Sp e c i fic at io n s Environmental specifications Specification Value Tempera ture rang e* Operat ing 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 60 ° C (-40 ° F to 140 ° F) Storage -20°C to 60°C (- 4°F to 140°F) Maximu m wet bul b temperatu re 30 ° C (86 ° F) Relative hu midity (noncond ensing )** Oper[...]

  • Seite 64

    Acronyms an d abbreviations 64 A c r on y ms and abbr e v iati ons ADU Array Diagnostics Utility CSR Customer Self Repair DIMM dual inline memory module ESD electrostatic discharge FC Fibre Channel HBA host bus adapter I/O input/output iLO 2 Integrated Lights-Out 2 IML Integrated Management Log LED light-emitting diode NIC network interface control[...]

  • Seite 65

    Acronyms an d abbreviations 65 PCI peripheral component interface PCIe peripheral component interconnect express RBSU ROM-Based S etup Utility ROM read-only memory SAS serial attached SCSI SATA serial ATA SFF small form-factor SIM Systems Insight Mana ger UID unit identification USB universal serial bus[...]

  • Seite 66

    Index 66 A access panel 24 ADU (Array Diagnostic Utility) 54 B battery 43 battery pack, removing 29 battery-backed write cache battery pack 29 buttons 56 C cables 50 cabling 50 cache module 2 8 cautions 21 component identification 56, 58, 59 compon ents 16, 56, 59 connector s 56, 60 CSR (customer self repair) 5 D diagnostic tools 53 diagnostics uti[...]

  • Seite 67

    Index 67 removing the server blade 23 ROM redundancy 62 S safety considerations 21 safety information 21 SAS cabling 29, 50 SAS drives 58 SAS hard dri ve LEDs 58 SAS/SATA L ED combinati ons 58 SATA hard drive 58 SATA hard driv e LEDs 58 server blade handle 32 specifications 63 specifications, environmental 63 static electricity 21 symbols on equ ip[...]