HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series Bedienungsanleitung
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Was sollte also eine ideale Gebrauchsanleitung beinhalten?
Die Gebrauchsanleitung HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series sollte vor allem folgendes enthalten:
- Informationen über technische Daten des Geräts HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series
- Den Namen des Produzenten und das Produktionsjahr des Geräts HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series
- Grundsätze der Bedienung, Regulierung und Wartung des Geräts HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series
- Sicherheitszeichen und Zertifikate, die die Übereinstimmung mit entsprechenden Normen bestätigen
Warum lesen wir keine Gebrauchsanleitungen?
Der Grund dafür ist die fehlende Zeit und die Sicherheit, was die bestimmten Funktionen der gekauften Geräte angeht. Leider ist das Anschließen und Starten von HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series zu wenig. Eine Anleitung beinhaltet eine Reihe von Hinweisen bezüglich bestimmter Funktionen, Sicherheitsgrundsätze, Wartungsarten (sogar das, welche Mittel man benutzen sollte), eventueller Fehler von HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series und Lösungsarten für Probleme, die während der Nutzung auftreten könnten. Immerhin kann man in der Gebrauchsanleitung die Kontaktnummer zum Service HP (Hewlett-Packard) finden, wenn die vorgeschlagenen Lösungen nicht wirksam sind. Aktuell erfreuen sich Anleitungen in Form von interessanten Animationen oder Videoanleitungen an Popularität, die den Nutzer besser ansprechen als eine Broschüre. Diese Art von Anleitung gibt garantiert, dass der Nutzer sich das ganze Video anschaut, ohne die spezifizierten und komplizierten technischen Beschreibungen von HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series zu überspringen, wie es bei der Papierform passiert.
Warum sollte man Gebrauchsanleitungen lesen?
In der Gebrauchsanleitung finden wir vor allem die Antwort über den Bau sowie die Möglichkeiten des Geräts HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series, über die Nutzung bestimmter Accessoires und eine Reihe von Informationen, die erlauben, jegliche Funktionen und Bequemlichkeiten zu nutzen.
Nach dem gelungenen Kauf des Geräts, sollte man einige Zeit für das Kennenlernen jedes Teils der Anleitung von HP (Hewlett-Packard) HP Compaq Notebook nc4000 Series widmen. Aktuell sind sie genau vorbereitet oder übersetzt, damit sie nicht nur verständlich für die Nutzer sind, aber auch ihre grundliegende Hilfs-Informations-Funktion erfüllen.
Inhaltsverzeichnis der Gebrauchsanleitungen
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Seite 1
Main tenan ce and Ser vice Gui de HP C ompaq Notebook nc4 000 Ser i es Doc ument P art Number : 3100 30 -001 May 200 3 This troubleshooting reference is used for maintaining and servicing the notebook. The guide provides comprehensi ve information on identifying notebook features, components, and spare parts, troubleshooting notebook problems, and [...]
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Seite 2
Thank you for purchasing this Factory Service Manual CD/DVD from servicemanuals4u.com. Please check out our eBay auctions for more great deals on Factory Service Manuals: servicemanuals4u[...]
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Seite 3
© 2003 Hewlett-P ackard Dev elopment Company , L.P . Microsoft and W indows are trademarks of Microsoft Corporation in the U.S. and/or other countries. Intel, Pe ntium, and SpeedStep are trademarks of Intel Corporation in the U.S. and/or other countries. SD Logo is a trademark. The information contained herein is su bject to change without notice.[...]
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Seite 4
Maintenance and S ervice Gui de iii Cont ent s 1 Product Description 1.1 Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6 1.3 Clearing a Password . . . . . . . . . . . . . . . . . . . . . . . . . 1–8 1.4 Power Management . [...]
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Seite 5
i v Maintenance and S ervice Gui de Cont ent s 3 Illustrated Parts Catalog 3.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 3–1 3.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 3–2 3.3 Miscellaneous Plastics Kit Components . . . . . . . . . . 3–8 3.4 Port Replicators and Mass St orage Devices . . . . . .[...]
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Seite 6
Cont ent s Maintenance and Se rvice Guide v 5.10 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–22 5.11 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–26 5.12 Display Assembly . . . . . . . . . . . . . . . . . . . . . . . . . 5–28 5.13 Top Cover. . . . . . . . . . . . . . . . . . . . .[...]
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Seite 7
Maintenance and Se rvice Guide 1–1 1 Product Des c ription The HP Compaq Notebook nc4000 Series of personal notebooks of fer advanced modularity , Intel Mobile Pentium-M processors with 64-bit architecture, industry-leading Accelerated Graphics Port (A GP) implementation, a nd extensiv e multimedia support. HP Compaq No tebook nc4000 Ser ies[...]
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Seite 8
1–2 Maintenance and S ervice Gui de Product Description 1.1 M o d e l s Notebook models are sho wn in T ables 1-1 and 1-2. Ta b l e 1 - 1 HP Compaq Notebook nc4000 Model Naming Con ventions Key Cnc4000 P 160 X2 60 0 C/C 51 O XXXXXX-XXX 12 3 4 5 6 7 8 9 1 0 Ke y Description Options 1 Brand/Series designator C = Compaq nc4000 = nc4000 2 Processor t[...]
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Seite 9
Product Description Maintenance and Se rvice Guide 1–3 Ta b l e 1 - 2 HP Compaq Notebook nc4000 Models All HP Compaq Notebook nc4000 models use configuration code LN5Z and f eature: ■ Dual point pointing de vice (T ouchP ad and pointing stick) ■ 6-cell, 4.0 wH lithium io n (Li ion) batter y pack ■ 3-year w arranty on par ts and labor Cnc400[...]
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Seite 10
1–4 Maintenance and S ervice Gui de Product Description Cnc4000 P 150 X2 40 N G/c 25 O Asia P acific Fr a n c e Germany Italy DG993A UUF DG993A ABF DG993A ABD DG993A ABZ Jap an Spain United States DG993A ABJ DG993A ABE DG993A ABA Cnc4000 P 140 X2 40 N G/N 25 O Asia P acific A ustralia Belgium Brazil Czech Repub lic Denmark Europe Fr a n c e F ren[...]
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Seite 11
Product Description Maintenance and Se rvice Guide 1–5 Cnc4000 P 140 X2 40 N G/N 25 2 Asia P acific A ustralia Belgium Brazil Czech Repub lic Denmark Europe Fr a n c e F rench Canada Germany Greece Hong K ong Hungar y Iceland India Israel Italy Jap an Japan (English) Ko r e a DG245A UUF DG245A ABG DG245A UUG DG245A AC4 DG245A AKB DG245A ABY DG245[...]
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Seite 12
1–6 Maintenance and S ervice Gui de Product Description 1. 2 F e a t u r e s ■ Intel Pentium-M 1.6-, 1.5-, 1.4-, or 1.3-GHz processor with 400-MHz processor side bus and 1024-KB L2 cache, v arying by notebook model ■ 12.1-inch XGA (1024 × 768) TFT display with ov er 16.7 million colors, v arying by notebook model ■ A TI Mobility Radeon gra[...]
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Seite 13
Product Description Maintenance and Se rvice Guide 1–7 ■ 56-Kbps V .92 modem integrated on the system board ■ Integrated Secure Digital (SD) flash media slot ■ Integrated wireless support of 802.11a/b/g and Bluetooth de vices ■ Support for one T ype I or II PC Card slot with support for both 32-bit CardBus and 16-bit PC Cards ■ External[...]
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Seite 14
1–8 Maintenance and S ervice Gui de Product Description 1. 3 C l e a r i n g a P a s s w o r d If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear CMOS: 1. Prepare the notebook for disassembly (refer to Section 5.3, “Preparing the Notebook for Disassembly , ” for more i[...]
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Seite 15
Product Description Maintenance and Se rvice Guide 1–9 1. 4 P o w e r M a n a g e m e n t The notebook comes with po wer management features that extend battery operating time and conserv e power . The notebook supports the follo wing power management features: ■ Standby ■ Hibernation ■ Setting customization by the user ■ Hotke ys for set[...]
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Seite 16
1–10 Maintenance and Serv ice Guide Product Description 1 .5 External Com ponen ts The external components on the front and right side of the notebook are sho wn in below and described in T able 1-3. . F r ont and R ight Side C omponen ts Ta b l e 1 - 3 Front and Right Side Components Item Component Function 1 Microphone Inputs si ngle-channel so[...]
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Seite 17
Product Description Maintenance and S ervice Gui de 1–11 6 Security cable slot Attaches an op tional security cable to the notebook. 7 Hard drive ba y Holds the primar y hard drive. 8 Exhaust ve nt Enables airf lo w to cool inter nal components. Ä CA UTION: T o prev ent ov erheating, do no t obstru ct vents . Using the notebook on a soft surface[...]
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Seite 18
1–12 Maintenance and Serv ice Guide Product Description The notebook rear panel and left side components are sho wn belo w and described in T able 1-4. Rear P anel and Left Side C omponents Ta b l e 1 - 4 Rear P anel and Left Side Components Item Component Function 1 Exhaust ve nt Enables airf lo w to cool inter nal components. Ä CA UTION: T o p[...]
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Seite 19
Product Description Maintenance and S ervice Gui de 1–13 4 USB connectors (2) Connect US B 1.1- and 2.0-compliant de vices to the notebook using a standard USB cable . The right connector also functions as a self-powered USB connector and allo ws an optional External MultiB ay to be connected to the notebook us ing the External MultiBa y-P owered[...]
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Seite 20
1–14 Maintenance and Serv ice Guide Product Description The notebook ke yboard components are shown belo w and described in T able 1-5. K ey board C omponents Ta b l e 1 - 5 Ke yboard Components Item Component Function 1 Fn ke y Ex ecutes frequently used system functions when pressed in combin ation with another ke y . 2 Caps lock ke y On: Caps l[...]
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Seite 21
Product Description Maintenance and S ervice Gui de 1–15 The notebook top components are sho wn below and described in T able 1-6. T op Components Ta b l e 1 - 6 T op Components Item Component Function 1 Displa y lid switch Secures the displa y when it is closed. 2 Hard drive activity light On: Th e hard drive is being accessed. 3 Num lock light [...]
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Seite 22
1–16 Maintenance and Serv ice Guide Product Description 5 P ower button When the notebook is: ■ Off , press and release to tur n on the notebook. ■ In Standby , press and release to e xit Standby . ■ In Hibernation, press and release to exit Hibernation. If t he system has stopped responding and Windows shut do wn procedures cannot be used,[...]
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Seite 23
Product Description Maintenance and S ervice Gui de 1–17 The external components on the bottom of the notebook are sho wn below and described in T able 1-7. Bott om Components Ta b l e 1 - 7 Bottom Components Item Component Function 1 Hard drive ba y Suppor ts the primar y hard dr ive. The hard drive is secured to the notebook by one scre w . 2 H[...]
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Seite 24
1–18 Maintenance and Serv ice Guide Product Description 3 Intak e vents Enable airflo w to cool inter nal components. Ä CA UTION: T o prev ent ov erheating, do no t obstruct vents. Using the notebook on a soft surface , such as a pillow , blank et, rug, or thick clothing can bloc k airflow . 4 T ra vel battery connector Connects the optional tra[...]
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Seite 25
Product Description Maintenance and S ervice Gui de 1–19 1. 6 D e s i g n O v e r v i e w This section presents a design ov erview of k ey parts and features of the notebook. Refer to Chapter 3, “Illustrated Parts Catalog, ” to identify replacement parts, and Chapter 5, “Remov al and Replacement Procedures, ” for disassembly steps. The sy[...]
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Seite 26
Maintenance and Se rvice Guide 2–1 2 T roubl eshooting Å W ARN IN G: Only au thori zed tec hnic ians tr ained by HP should r epair this equipment . All trouble shooting and repair pr ocedures ar e detailed to allo w only subas sembly/module le vel r epair . Because of the comple xity of the indi vi dual boards and suba ssemblies , do not attempt[...]
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Seite 27
2–2 Maintenance and S ervice Gui de T rouble shooting ■ Diagnostics f or Windows —A system information and diagnostic utility that is used within your W indows operating system. Use this utility whene ver possible to: ❏ Display system information. ❏ T est system components. ❏ T roubleshoot a de vice configuration problem in W indows 200[...]
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Seite 28
T rouble shooting Maintenance and Se rvice Guide 2–3 Selecting fro m the Fi le Menu Ta b l e 2 - 1 File Menu Select T o Do This System Inf or mation ■ View identification inf or mation about the notebook, a docking base , and any battery packs in the system. ■ View specification inf or mation about the processor , memor y and cache size, and [...]
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Seite 29
2–4 Maintenance and S ervice Gui de T rouble shooting Selectin g from the Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Setup P ass word Enter , change, or delete a setup pass word. The setup pass word is called an administrator pass word in Computer Security , a program accessed from the Windows Control P anel. P ower-on P asswo[...]
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Seite 30
T rouble shooting Maintenance and Se rvice Guide 2–5 Selec ting from the Adv anced Menu Ta b l e 2 - 3 Adv a nced Menu Select T o Do This Language Change the Comp uter Setup language. Boot Options Enable/disab le: ■ QuickBoot, which starts the notebook more quickly b y eliminating some star tup tests. (If you suspect a memory failure and w ant [...]
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Seite 31
2–6 Maintenance and S ervice Gui de T rouble shooting De vice Options (continued) ■ Change the parallel por t mode from Enhanced P arallel P or t (EPP , the def ault setting) to standard, bidirectional, EPP , or Enhanced Capabilities P or t (ECP). ■ Set video-out mode to NTSC (def ault), P AL, NTSC-J , or P AL-M.* ■ Enable/disab le all sett[...]
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Seite 32
T rouble shooting Maintenance and Se rvice Guide 2–7 2.2 Using Dia gnos tic s for Windo ws When you access Diagnostics for W indows, a scan of all system components is displayed on the screen before the diagnostics windo w opens. Y ou can display more or less information from anywhere within Diagnostics for W indows by selecting Le vel on the men[...]
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Seite 33
2–8 Maintenance and S ervice Gui de T rouble shooting Obtainin g , Saving, or Printin g Dia gnosti c Te s t I n f o r m a t i o n 1. Access Diagnostics for W indows by selecting Start > Settings > Control Panel > Diagnostics for W indows. 2. Select the T est tab. 3. In the scroll box, select the category or de vice you want to test. 4. S[...]
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T rouble shooting Maintenance and Se rvice Guide 2–9 6. Select the Begin T esting button. 7. Select a tab to vie w a test report: ❏ Status tab —Summarizes the tests run, passed, and failed during the current testing session. ❏ Log tab —Lists tests run on the system, the number of times each test has run, th e number of errors found on eac[...]
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Seite 35
2–10 Maintenance and Serv ice Guide T rouble shooting 2.3 T roubleshootin g Flo wc h ar ts Ta b l e 2 - 4 T roubleshooting Flowc harts Over view Flowch ar t Description 2.1 Initial troubleshooting 2.2 No power , par t 1 2.3 No power , par t 2 2.4 No power , par t 3 2.5 No power , par t 4 2.6 No video , par t 1 2.7 No video , par t 2 2.8 Nonfuncti[...]
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T rouble shooting Maintenance and S ervice Gui de 2–11 Flo wch art 2. 1—Initia l T roubl eshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device working? Go to Section 2.17, Nonfunctioning Device. Go to[...]
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Seite 37
2–12 Maintenance and Serv ice Guide T rouble shooting Flo wch art 2.2—N o P ow er , P art 1 1. Reseat the power cables in the docking station and at the AC outlet. 2. Ensure the AC power source is active. 3. Ensure that the power strip is working. Done Remove from docking station (if applicable). Power up on battery power? Power up on AC power?[...]
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Seite 38
T rouble shooting Maintenance and S ervice Gui de 2–13 Flo wc har t 2.3—No P ow er , Part 2 Continued from Section 2.2, No Power , Part 1. Visually check for debris in battery socket and clean if necessary . Done N Y Power on? Check battery by recharging, moving it to another notebook, or replacing it. Power on? Done Y Replace power supply (if [...]
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Seite 39
2–14 Maintenance and Serv ice Guide T rouble shooting Flo wch art 2.4—N o P ow er , P art 3 Continued from Section 2.3, No Power , Part 2. Reseat AC adapter in notebook and at power source. Internal or external AC adapter? Done Done Done Done Power on? Power on? Power on? Plug directly into AC outlet. Power LED on? Power outlet active? T ry dif[...]
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Seite 40
T rouble shooting Maintenance and S ervice Gui de 2–15 Flo wc har t 2.5—No P o wer , P art 4 Y N Continued from Section 2.4, No Power , Part 3. Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest. Power on? Done N Replace the following items (if applicable). Check note[...]
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Seite 41
2–16 Maintenance and Serv ice Guide T rouble shooting Flo w ch art 2.6—N o Video, P art 1 A N Stand-alone or docking station? No video. Replace the following one at a time. T est after each replacement. 1. Cable between notebook and notebook display (if applicable) 2. Inverter board (if applicable) 3. Display 4. System board Internal or externa[...]
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Seite 42
T rouble shooting Maintenance and S ervice Gui de 2–17 Flo w ch art 2.7—N o Video, P art 2 Y N Continued from Section 2.6, No Video, Part 1. Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done Check that notebook is properly seated in docking station, for bent pins on cable, and for monitor [...]
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Seite 43
2–18 Maintenance and Serv ice Guide T rouble shooting Flo wch art 2.8—N onfunc tioning Doc king Sta tion (if applicable) Y N Reseat power cord in docking station and power outlet. N Replace the following docking station components one at a time. Check notebook operation after each replacement. 1. Power supply 2. I/O board 3. Backplane board 4. [...]
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Seite 44
T rouble shooting Maintenance and S ervice Gui de 2–19 Flo wch art 2.9—N o Operatin g S ystem (OS) Loading No OS loading from hard drive, go to Section 2.10. Reseat power cord in docking station and power outlet. No OS loading from diskette drive, go to Section 2.13. No OS loading from CD- or DVD-ROM drive, go to Section 2.14. No OS loading fro[...]
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Seite 45
2–20 Maintenance and Serv ice Guide T rouble shooting Flo wc har t 2. 1 0—No OS Loa ding , Hard Driv e, P ar t 1 Go to Section 2.17, Nonfunctioning Device. Y Done N OS not loading from hard drive. Nonsystem disk message? Go to Section 2.11, No OS Loading from Hard Drive, Part 2. Reseat external hard drive. OS loading? Done Boot from CD? Go to S[...]
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Seite 46
T rouble shooting Maintenance and S ervice Gui de 2–21 Flo wch art 2. 1 1—No OS Loadin g, H ard Driv e, Part 2 Continued from Section 2.10, No OS Loading from Hard Drive, Part 1. Reseat hard drive. Done CD or diskette in drive? 1. Replace hard drive. 2. Replace system board. Go to Section 2.13, No OS Loading from Diskette Drive. Load OS using R[...]
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Seite 47
2–2 2 Maintenance and Serv ice Guide T rouble shooting Flo wc har t 2. 1 2—N o OS Loadin g, H ard Driv e, P art 3 Y System files on hard drive? Continued from Section 2.11, No OS Loading from Hard Drive, Part 2. Clean virus. Done N Install OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on diskette? Repla[...]
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Seite 48
T rouble shooting Maintenance and Se rvice Guide 2–2 3 Flo wch art 2. 1 3—No OS Loa ding , Disk et te Driv e Done Y N Reseat diskette drive. OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message? Bootable diskette in drive? Install bootable diskette and reboot notebook. Check diskette for system[...]
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Seite 49
2–2 4 Maintenance and Serv ice Guide T rouble shooting Flo wc har t 2. 1 4—No OS Loading , CD- or D VD-ROM Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD- or DVD-ROM Drive. Install bootable disc and reboot notebook. Go to Section 2.17, Nonfunctioning Device. Go to Section 2.17, Nonfunctioning Device. Install bootab[...]
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Seite 50
T rouble shooting Maintenance and Se r v ice Guide 2–2 5 Flo wch art 2. 1 5—No Audio, Part 1 No audio. N Notebook in docking station (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to Section 2.16, No Audio, Part 2. Go to Section 2.16, No Audio, Part 2. Go to Section 2.17, Nonfunction[...]
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Seite 51
2–2 6 Maintenance and Serv ice Guide T rouble shooting Flo wch art 2. 1 6—No Audio, Part 2 YN Continued from Section 2.15, No Audio, Part 1. Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker . Load drivers and set configuration in OS. Audio? Done Replace audio bo[...]
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Seite 52
T rouble shooting Maintenance and Se rvice Guide 2–2 7 Flo wch art 2. 1 7—Nonfunctionin g De vice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix or replace broken item. Nonfunctioning device. Reatt[...]
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Seite 53
2–2 8 Maintenance and Servi ce Guide T rouble shooting Flo wch art 2. 1 8—Nonfun c tioning K e yboard Y N OK? Keyboard not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external keyboard. Reseat internal keyboard connector (if applicable). Replace internal keyboard or cable. OK?[...]
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Seite 54
T rouble shooting Maintenance and Se rvice Guide 2–2 9 Flo wch art 2. 1 9—Nonfunc tioning P ointing Dev ice Y N OK? Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device. Reseat internal pointing device connector (if applicable). Replace inte[...]
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Seite 55
2–30 Maintenance and Serv ice Guide T rouble shooting Flo wc har t 2.20—No Net work/Modem Connec tion Y Disconnect all power from the notebook and open. No network or modem connection. N Done Digital line? Network or modem jack active? Replace jack or have jack activated. Connect to nondigital line. NIC/modem configured in OS? Reload drivers an[...]
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Seite 56
Maintenance and Se rvice Guide 3–1 3 I llustra ted P arts C atal og This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers and option part numbers. 3. 1 Serial N umber Loca tion When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the note[...]
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Seite 57
3–2 Maintenance and S ervice Gui de Illustr ated P ar ts Catalog 3.2 Notebook M ajor Com ponen ts Notebook Maj or Components[...]
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Seite 58
Illustr ated P arts Catalog Maintenance and Se rvice Guide 3–3 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components Item Description Spare P ar t Number 1 Display assemb ly , 12.1-inch TFT XGA with wireless device antennae 325509-001 Miscellaneous Plastics Kit, includes: 325528-001 2a 2b 2c 2d 2e 2f 2g 2h Left and right display hinge co vers S[...]
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Seite 59
3–4 Maintenance and S ervice Gui de Illustr ated P ar ts Catalog Notebook S ystem Major Components[...]
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Seite 60
Illustr ated P arts Catalog Maintenance and Se rvice Guide 3–5 T able 3-1 (Continued) Spare P ar ts: Notebook Major Components Item Description Spare P ar t Number 4 Ke yboards, include pointing stic k Asia P acific A ustralia Brazil Czech Republic Denmark Europe Fr a n c e F rench Canada Germany Greece Hong K ong Hungar y Iceland India Inter nat[...]
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Seite 61
3–6 Maintenance and S ervice Gui de Illustr ated P ar ts Catalog Notebook S ystem Major Components[...]
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Seite 62
Illustr ated P arts Catalog Maintenance and Se rvice Guide 3–7 T able 3-1 (Continued) Spare P ar ts: Notebook Major Components Item Description Spare P ar t Number 11 Processor s Intel P entium-M 1.6 GHz Intel P entium-M 1.5 GHz Intel P entium-M 1.4 GHz Intel P entium-M 1.3 GHz 319777-001 319776-001 319775-001 319774-001 12 System board 325514-00[...]
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Seite 63
3–8 Maintenance and S ervice Gui de Illustr ated P ar ts Catalog 3. 3 Miscell aneous Plas tic s Kit Comp onent s Miscell aneous Plastics Kit Components[...]
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Seite 64
Illustr ated P arts Catalog Maintenance and Se rvice Guide 3–9 Ta b l e 3 - 2 Miscellaneous Plastics Kit Components Spare P ar t Number 325528-001 Item Description 1 Left and right displa y hinge cov ers 2 Speaker/microphone 3 R TC batter y 4 PC Card slot space sa ver 5 Modem cab le 6 Mini PCI compartment covers (one wi th a 2.0×4.0 security scr[...]
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Seite 65
3–10 Maintenance and Serv ice Guide Illustr ated P ar ts Catalog 3.4 P ort Repli cators and Mass St or age De v ice s P ort Repli cators and Mas s Stor age Dev ices Ta b l e 3 - 3 P or t Replicators and Mass Storage Devices Item Description Spare P ar t Number 1 Adv anced por t replicator 316194-001 2 Common port replicator 316193-001 3 USB Multi[...]
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Illustr ated P arts Catalog Maintenance and S ervice Gui de 3–11 3.5 Miscell aneous Ta b l e 3 - 4 Spare P ar ts: Miscellaneous (not illustrated) Description Spare P ar t Number 65-watt A C adapter 239704-001 Adapter cables Air adapter cable A uto adapter cable 293204-001 293203-001 Carrying cases T op load leather cases 325817-001 and 325817-002[...]
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3–12 Maintenance and Serv ice Guide Illustr ated P ar ts Catalog P ower cor d, three-wire A ustralia Denmark Europe/Middle East/Africa Italy 246959-011 246959-081 246959-021 246959-061 Jap an Ko r e a Switzerland United Kingdom United States 246959-291 246959-AD1 246959-A G1 246959-031 246959-001 Screw Kit (includes the f ollowing screws; ref er [...]
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Maintenance and Se rvice Guide 4–1 4 Remo v al an d Repl a cement Preliminaries This chapter provides essential information for proper and safe remov al and replacement service. 4. 1 T ools Required Y ou will need the following tools to complete the remov al and replacement procedures: ■ Magnetic scre wdriv er ■ T orx T8 screwdri ver ■ T or[...]
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4–2 Maintenance and S ervice Gui de Remo val and Replaceme nt Preliminar ies 4.2 S er vice C onsidera tions The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures. ✎ As you remov e each subassem bly from the notebook, place the subassembly (and all accompanying scre ws)[...]
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Remo val and Replace ment Pr eliminarie s Maintenance and Se rvice Guide 4–3 4. 3 Pr e v enti ng Damage to Re mo v able Dri v es Remov able drives are fragile components that must be handled with care. T o prev ent damage to the notebook, damage to a remov able drive, or loss of information, observ e the follo wing precautions: ■ Before removin[...]
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4–4 Maintenance and S ervice Gui de Remo val and Replaceme nt Preliminar ies 4.4 Pre venting Elec trostatic D am ag e Many electronic components are sensiti ve to electrostatic discharge (ESD). Circuitry design and structure determine the degree of sensiti vity . Networks built into many integrated circuits provide some protection, b ut in many c[...]
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Remo val and Replace ment Pr eliminarie s Maintenance and Se rvice Guide 4–5 ■ Store reusable electrostatic-sensiti ve parts from assemblies in protecti ve packaging or nonconducti ve foam. ■ Use transporters and con veyors made of antistatic belts and roller bushings. Ensure that mechanized equipment used for moving materials is wired to gro[...]
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4–6 Maintenance and S ervice Gui de Remo val and Replaceme nt Preliminar ies 4.7 G roundin g Eq uipm ent an d Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible straps with a minimum of one megohm ±1[...]
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Remo val and Replace ment Pr eliminarie s Maintenance and Se rvice Guide 4–7 ■ Metal tote boxes ■ Electrostatic voltage le vels and protecti ve materials T able 4-1 shows ho w humidity af fects the electrostatic voltage le vels generated by dif ferent activities. T able 4-2 lists the shielding protection provided by antistatic bags and floor [...]
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Maintenance and Se rvice Guide 5–1 5 Remo v al an d Repl a cement Procedur es This chapter provides remo val and replacement procedures. T orx and Phillips screws are remo ved during disassembly . There are 55 scre ws, alignment pins, and standoffs, in 13 dif ferent sizes, that must be remov ed, replaced, and/or loosened when servicing the notebo[...]
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5–2 Maintenance and S ervice Gui de Remo val and Replaceme nt Procedur es 5. 1 S e r i al N u m b e r Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook. Ser ial Number L ocation 5 .2 Disassembl y Sequence C hart Use the chart belo w to determine [...]
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Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–3 Section Description # of Screws Removed 5.4 Notebook feet 0 5.5 Memory expansion board 1 loosened 5.6 Mini PCI communications board 1 loosened 5.7 LED s witch cov er 2 5.8 K eyboard 1 5.9 F an 3 5.10 Heat sink and fa n 2 loosened, 4 remo ved 5.11 Processor 0 5.12 Display as[...]
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5–4 Maintenance and S ervice Gui de Remo val and Replaceme nt Procedur es 5 .3 Preparing t he N otebook for Disasse mbl y Perform the follo wing steps before disassembling the notebook: 1. T urn off the notebook. 2. Disconnect the A C adapter and all external devices. 3. Remov e the battery pack by follo wing these steps: a. T urn the notebook bo[...]
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Seite 79
Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–5 4. Remov e the hard driv e by follo wing these steps: a. T urn the notebook bottom side up with the left side facing forward. b . Remov e the PM2.5×3.0 screw 1 that secures the hard dri ve to the notebook. c. Separate the hard dri ve bezel 2 . d. Use the bezel to slide the[...]
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5–6 Maintenance and S ervice Gui de Remo val and Replaceme nt Procedur es 5. Remov e the hard driv e bezel by follo wing these steps: Ä CAUT ION: The hard dr ive bez el should only be r emov ed if it is damaged and must be replaced . Unnec essarily r emo v ing the hard dr iv e bez el can r esult in damage to the hard dr ive bez el and hard dr iv[...]
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Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–7 c. Remov e the two T orx T5 M2.5×4.5 screws 1 and the tw o PM2.5×3.5 scre ws 2 that secure the hard driv e to the hard dri ve frame. d. Use a 4.0-mm socket to remo ve the two M2.0×10.0 alignment pins 3 from the back of the hard dri ve. e. Remov e the hard driv e from the[...]
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5–8 Maintenance and S ervice Gui de Remo val and Replaceme nt Procedur es 5 .4 N otebook Feet The notebook feet are adhesi ve-backed rubber pads. The notebook feet are included in the Miscellaneous Plastics Kit, spare part number 325528-001. The not ebook feet attach to the base enclosure as illustrated belo w . Replac ing the Notebook F eet[...]
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Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–9 5 .5 M emor y Expansion B oard 1. Prepare the notebook for disassembly (Section 5.3). 2. T urn the notebook bottom side up with the front facing forward. 3. Loosen the PM2.0×4.0 scre w 1 that secures the memory expansion compartment co ver to the notebook. 4. Lift the rear[...]
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5–10 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 6. Spread the retaining tabs 1 that secure the memory expansion board to the sock et. The board rises up at a 45-degree angle. 7. Pull the board aw ay from the socket at a 45-degree angle 2 . Re mov ing a Memor y Expansion Boar d Re verse the abov e procedure to install a m[...]
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Seite 85
Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–11 ✎ The mini PCI compartment cov er on notebook models equipped with a 5-GHz wireless communica tions de vice is secured by a M2.0×4.0 security scre w . This screw can only be remo ved using a special security dri ver . 4. Lift the rear edge of the cov er up and swing it[...]
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5–12 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 6. Disconnect the two antenna cables from the mini PCI communications board. Note that the longer cable 1 connects to the left socket and the shorter cable 2 connects to the right socket. 7. Spread the retaining tabs 3 that secure the mini PCI communications board to the so[...]
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Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–13 5. 7 L E D Sw i t c h C ove r 1. Prepare the notebook for disassembly (Section 5.3). 2. T urn the notebook bottom side up with the rear panel facing forward. 3. Remov e the two T8M2.0×8.0 scre ws that secure the LED switch cov er to the notebook. Re mov ing the LED Sw it[...]
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5–14 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 6. Press do wn on the esc key 1 to rev e al the notch 2 in the left side of the LED switch cov er . 7. Insert a flat-bladed tool into th e notch and lift the left side of the LED switch cov er 3 . 8. After the left side of the LED switch cov er has disengaged from the noteb[...]
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Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–15 5. 8 Keyb o a r d 1. Prepare the notebook for disassembly (Section 5.3). 2. Remov e the LED switch cov er (Section 5.7). 3. Close the notebook and turn it bottom side up with the rear panel facing forward. Ke yboards Spare P ar t Number Information Asia P acific A ustrali[...]
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5–16 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 4. Remov e the T8M2.0×8.0 screw that secures the k eyboard to the notebook. Re mov ing the Ke yboar d Scr ew 5. T urn the notebook top side up with the front facing forward. 6. Open the notebook as far as it will open.[...]
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Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–17 7. Lift the rear edge of the ke yboard 1 . 8. Slide the ke yboard toward the display 2 until the notches on the front edge of the ke yboard clear the top cover . 9. Swing the front edge of the ke yboard up and back 3 until it rests on the display . Re leasing the K ey boa[...]
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5–18 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 10. Release the zero insertion force (ZIF) connector 1 to which the pointing stick cable is attached and disconnect the pointing stick cable 2 from the system board. 11. Release the ZIF connector 3 to which the ke yboard cable is attached and disconnect the ke yboard cable [...]
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Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–19 After the ke yboard is removed, the internal memory e xpansion socket is accessible. F ollow these steps to remo ve a memory expansion board from the internal memory e xpansion socket: 1. Spread the retaining tabs 1 that secure the memory expansion board to the sock et. T[...]
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5–20 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 5. 9 F a n ✎ The fan is also spared with the heat sink, spare part number 325520-001. 1. Prepare the notebook for disassembly (Section 5.3). 2. Remov e the LED switch cov er (Section 5.7). 3. Remov e the keyboard (Section 5.8). Fan Spare P ar t Number Information F an 291[...]
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Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–21 4. Disconnect the fan cable 1 from the system board. 5. Remov e the three PM2.0×3.0 screws 2 that secure the f an to the heat sink. 6. Remov e the fan. Ä CAUT ION: When installing the fa n in the heat sink, mak e sure the f an cable is not get c rimped b y the scr ew ne[...]
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5–2 2 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 5 . 1 0 Heat Sink ✎ The fan is also spared seperately , using spare part number 291266-001. 1. Prepare the notebook for disassembly (Section 5.3). 2. Remov e the LED switch cov er (Section 5.7). 3. Remov e the keyboard (Section 5.8). Heat Sink Spare P ar t Number Informa[...]
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Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–2 3 4. Disconnect the fan cable 1 from the system board. 5. Loosen the two spring-loaded T8 M2.0×10.0 scre ws 2 that secure the heat sink to the base enclosure. 6. Fold back the insulator material 3 to e xpose the heat sink scre ws. 7. Remov e the four T8 M2.0×4.0 screws 4 [...]
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5–2 4 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es ✎ Note that the four T8 M2.0×4.0 heat sink scre ws should be remov ed and installed in the 1 , 2 , 3 , 4 sequence stamped on the heat sink. Heat Sink Scr ew R emov a l and Installati on Sequence[...]
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Re mov al and Replacemen t Procedur es Maintenance and Se r v ice Guide 5–2 5 8. Lift the front edge of the heat sink until it clears the base enclosure 1 . 9. Slide the heat sink forward at an angle 2 and remov e it. Re mov ing the H eat Sink[...]
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5–2 6 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es ✎ Each time the heat sink is remov ed, any thermal grease residue should be carefully cleaned from the heat sink 1 and processor surfaces 2 , and ne w thermal grease should be applied to both surfaces. Re mov ing the Thermal Gr ease Fr om the Heat Sink and Proce ssor Re [...]
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Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–2 7 4. Remov e the heat sink and fan (Section 5.10). 5. Use a flat-bladed tool to turn the processor locking scre w one-quarter turn counterclockwise 1 . 6. Lift the processor straight up 2 and remov e it. ✎ Note that the gold triangle 3 should be in the lo wer right corner[...]
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Seite 102
5–2 8 Maintenance and Servi ce Guide Remo val and Replaceme nt Procedur es 5 . 1 2 Di splay Assembl y 1. Prepare the notebook for disassembly (Section 5.3). 2. Disconnect the antenna cables from the mini PCI communications board. Refer to Section 5.6, “Mini PCI Communications Board, ” for instructions. 3. Remov e the LED switch cov er (Sectio[...]
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Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–2 9 7. Position the notebook so the front faces forward and open the notebook as far as it will open. 8. Remov e the display hinge cov ers by inserting a flat-bladed tool under the cov ers and lifting them up. ✎ The hinge cov ers are included in the Miscellaneous Plastics K[...]
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5–30 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 9. Remov e the wireless antenna cables 1 and 2 from the routing channel in the top cov er 3 . Re mov ing the Antenna Cable s[...]
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Seite 105
Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–31 10. Disconnect the display in verter 1 and video cables 2 from the system board. 11. Remov e the two T8M2.0×8.0 scre ws 3 that secure the display assembly to the base enclosure. Disconnec ting the Display Ca bles and Re mov ing the Displa y Assembl y Scr ew s 12. Lift th[...]
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Seite 106
5–3 2 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 5. 1 3 T o p C ove r ✎ When replacing the top cov er , determine if a Bluetooth wireless de vice is installed in the defectiv e top cov er . If a Bluetooth wireless de vice is installed, make sure the de vice is remov ed from the defecti ve top cov er and installed in th[...]
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Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–3 3 6. Remov e the following scre ws: ❏ Four T8M2.0×4.0 scre ws 1 in the battery bay ❏ One T8M2.0×4.0 scre w 2 in the hard driv e bay ❏ Eight T8M2.0×8.0 scre ws 3 Re mov ing the T op Co ve r Scr ew s 7. T urn the notebook top side up with the front facing forward.[...]
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Seite 108
5–34 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 8. If present, disconnect the Bluetooth wireless de vice cable 1 from the system board. 9. Disconnect the R TC battery cable 2 from the system board. 10. Release the ZIF connector 3 to which the T ouchPad cable is connected and disconnect the T ouchPad cable 4 from the syst[...]
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Seite 109
Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–3 5 11. Lift the rear edge 1 of the top cov er until it disengages from the base enclosure. 12. Slide the top cov er to the right 2 until the speaker 3 and microphone 4 cables are exposed. 13. Disconnect the speaker and microphone cables from the system board. 14. Remov e the[...]
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Seite 110
5–3 6 Maintenance and Servi ce Guide Remo val and Replaceme nt Procedur es 5 . 1 4 Bluetooth Wireless De vice 1. Prepare the notebook for disassembly (Section 5.3) and remov e the following components: ❏ LED switch cov er (Section 5.7) ❏ K eyboard (Section 5.8) ❏ Display assembly (Section 5.12) ❏ T op cover (Section 5.13) 2. T urn the top[...]
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Seite 111
Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–3 7 5. 1 5 T o u c hPa d ✎ The T ouchPad is also included in the Miscellaneous Plastics Kit, spare part number 325528-001. 1. Prepare the notebook for disassembly (Section 5.3) and remov e the following components: ❏ LED switch cov er (Section 5.7) ❏ K eyboard (Section [...]
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Seite 112
5–38 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 3. Remov e the two PM2.0×4.0 scre ws that secure the T ouchPad bracket to the top co ver . Re mov ing the T ouchP ad Scr ew s 4. Lift the left side of the bracket 1 until it rests at an angle. 5. Slide the bracket to the right 2 and remo ve it. Re mov ing the T ouchP ad Br[...]
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Seite 113
Re mov al and Replacemen t Procedur es Maintenance and Se r v ice Guide 5–3 9 6. Release the ZIF connector 1 to which the T ouchPad cable is attached and disconnect the cable 1 from the T ouchPad board. 7. Lift the T ouchPad straight up and remo ve it 3 . Re mov ing the T ouchP ad Re verse the abov e procedure to install the T ouchPad.[...]
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Seite 114
5–40 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 5. 1 6 RTC B a t t e r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 325528-001, and is also included with the top cov er , spare part number 325510-001. 1. Prepare the notebook for disassembly (Section 5.3) and remov e the followin[...]
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Seite 115
Re mov al and Replacemen t Procedur es Maintenance and S ervice Gui de 5–41 5 . 1 7 Spea k er/Micro phone ✎ The speaker/microphone is included in the Miscellaneous Plastics Kit, spare part number 325528-001, and is also included with the top cov er , spare part number 325510-001. 1. Prepare the notebook for disassembly (Section 5.3) and remov e[...]
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Seite 116
5–4 2 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 5. 1 8 Sw i t c h B o a r d 1. Prepare the notebook for disassembly (Section 5.3) and remov e the following components: ❏ LED switch cov er (Section 5.7) ❏ K eyboard (Section 5.8) ❏ Display assembly (Section 5.12) ❏ T op cover (Section 5.13) 2. Remov e the two PM2.[...]
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Seite 117
Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–4 3 5. 1 9 Sys t e m B o a r d ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defectiv e system board and installed on the replacement system board: ■ Memory expansion boards (Section 5.5) ■ Mini PCI communications board ([...]
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Seite 118
5–44 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 3. Remov e the following scre ws: ❏ T wo T8M2.0×6.0 scre ws 1 from the rear panel ❏ One T8M2.0×4.0 scre w 2 in the upper right corner of the system board ❏ One T8M2.0×4.0 scre w 3 in front of the hard driv e bay ❏ One T8M2.0×4.0 scre w 4 in the lower left corner[...]
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Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–4 5 5. Remov e the grounding tape 1 that grounds the RJ-11 and RJ-45 connectors to the base enclosure. 6. Lift the left side of the system board 2 until the battery connector 3 clears the base enclosure. 7. Slide the system board aw ay from the base enclosure at an angle 4 . [...]
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Seite 120
5–46 Maintenance and Serv ice Guide Remo val and Replaceme nt Procedur es 5. 2 0 M o d e m B o a r d 1. Prepare the notebook for disassembly (Section 5.3) and remov e the following components: ❏ LED switch cov er (Section 5.7) ❏ K eyboard (Section 5.8) ❏ Heat sink and fan (Section 5.10) ❏ Display assembly (Section 5.12) ❏ T op cover (Se[...]
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Seite 121
Re mov al and Replacemen t Procedur es Maintenance and Se rvice Guide 5–4 7 3. Disconnect the modem board cable 1 from the modem board. 4. Remov e the two PM2.0×3.0 scre ws 2 that secure the modem board to the system board. 5. Lift the rear edge of the modem board 3 to disconnect it from the system board. 6. Remov e the modem board. 7. If the mo[...]
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Seite 122
Maintenance and Se rvice Guide 6–1 6 Spec ifica tions This chapter provides physical and performance specif ications. Ta b l e 6 - 1 Notebook Dimensions Height Width Depth 2.79 cm 27.94 cm 23.37 cm 1.1 in. 11.0 in. 9.2 in. W eight (varies by configur ation) 1.58 kg 3.5 lbs Stand-alone power requirements Nominal operating vol t a g e Maximum opera[...]
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Seite 123
6–2 Maintenance and S ervice Gui de Spe cificat ion s Altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating ( 1 4 . 7t o4 . 4p s i a ) 0 to 3,048 m 0 to 9,144 m 0 to 10,000 ft 0 to 30,000 ft Shock Operating Nonoperating 40 G, 2 ms, half-sine 240 G, 11 ms, half-sine Vibration Operating Nonoperating 0.5 G zero-to-peak, 10 to 500 Hz, 0[...]
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Spe cificat ion s Maintenance and Se rvice Guide 6–3 Ta b l e 6 - 2 12.1.0-inch XGA, TFT Displa y Dimensions Height Width Diagonal 26.1 cm 19.9 cm 30.7 cm 10.3 in 7.8 in 12.1 in Number of colors up to 16.8 million Contrast ratio 125:1 Refresh rate 60 Hz Brightness 130 nit typical A C only (115 nit minimum); 70 nit on batter y Pixel resolution Pit[...]
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Seite 125
6–4 Maintenance and S ervice Gui de Spe cificat ion s Ta b l e 6 - 3 Hard Drives 60 GB 40 GB 30 GB User capacity per drive 1 60 GB 40 GB 30 GB Dimensions Height Width We i g h t 9.5 mm 70 mm 99 gm 9.5 mm 70 mm 99 gm 9.5 mm 70 mm 99 gm Interface type ATA - 5 ATA - 5 ATA - 5 T ransfer rate Synchronous (maximum) Security 100 MB/sec ATA 100 MB/sec AT[...]
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Seite 126
Spe cificat ion s Maintenance and Se rvice Guide 6–5 Ta b l e 6 - 4 External A C Adapter W eight 0.29 kg 0.65 lb P ower supply Operating v oltage Operating current Operating frequency range Maximum transient 90 to 264 V A C (auto-s witching) 1.6 A RMS 47 to 63 Hx A C 4/50 kV Ta b l e 6 - 5 6-cell, Primary Li ion Battery Pac k Dimensions Height Wi[...]
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Seite 127
6–6 Maintenance and S ervice Gui de Spe cificat ion s Ta b l e 6 - 6 6-cell, T ravel Li ion Battery Pa ck Dimensions Height Width Depth We i g h t 2.3 cm 6.3 cm 20.7 cm 306 g 0.90 in 2.48 in 8.15 in 0.67 lb Energ y Vo l t a g e Amp-hour capacity W att-hour capacity 11.1 V 3.96 aH 40 wH Te m p e r a t u r e Operating Nonoperating 5 to 45° C -20 t[...]
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Seite 128
Spe cificat ion s Maintenance and Se rvice Guide 6–7 Ta b l e 6 - 7 System DMA Hard ware DMA System Function DMA0 A vailab le for audio DMA1* Entertainment audio (default; alternate = DMA0, DMA3, none) DMA2* Disk ette dr ive DMA3 ECP parallel por t LPT1 (default; alternate = DMA0, none) DMA4 DMA controller cascading (not av ailable) DMA5* A vaila[...]
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Seite 129
6–8 Maintenance and S ervice Gui de Spe cificat ion s T able 6-8 System Interrupts Hard ware IRQ System Function IRQ0 System timer IRQ1 K eyboard controller IRQ2 Cascaded IRQ3 COM2 IRQ4 COM1 IRQ5 A udio (def ault)* IRQ6 Disk ette dr ive IRQ7 P arallel por t IRQ8 R TC IRQ9 Infrared IRQ10 System use IRQ11 System use IRQ12 Inter nal point stick or e[...]
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Spe cificat ion s Maintenance and Se rvice Guide 6–9 Ta b l e 6 - 9 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller no . 1 010 - 01F Unused 020 - 021 Interrupt controller no. 1 022 - 024 Opti chipset configuration registers 025 - 03F Unused 02E - 02F 8 7334 “Super I/O” configuration fo[...]
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6–10 Maintenance and Serv ice Guide Spe cificat ion s I/O Address (he x) System Function (shipping configuration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller no . 2 0E0 - 0EF Unused 0F0 - 0F1 Coprocessor busy clear/reset 0F2 - 0FF U nused 100 - 16F Unused 170 - 177 Secondar y fixed disk controller 178 - 1EF U nused 1F0 - 1F7 Primar y fixed disk con[...]
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Spe cificat ion s Maintenance and S ervice Gui de 6–11 I/O Address (he x) System Function (shipping configuration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared port 300 - 31F Unused 320 - 36F Unused 370 - 377 Secondar y diskette drive controller 378 - 37F P arallel por t (LPT1/default) 380 - 387 Unused 388 - 38B FM synthesizer—OPL3 38C - 3AF Unused 3B0 [...]
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6–12 Maintenance and Serv ice Guide Spe cificat ion s T able 6-10 System Memory Map Size Memor y Address System Function 640 KB 00000000-0009FFFF Base memor y 128 KB 000A0000-000BFFFF Video memor y 48 KB 000C0000-000CBFFF Video BIOS 160 KB 000C8000-000E7FFF Unused 64 KB 000E8000-000FFFFF System BIOS 15 MB 00100000-00FFFFFF Extended memory 58 MB 0[...]
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Seite 134
Maintenance and Se rvice Guide A–1 A Conn ec tor P in As signm en ts Ta b l e A - 1 RJ-45 Network Interface Pin Signal Pin Signal 1 T ransmit + 5 Unused 2 T ransmit – 6 Receive – 3 Receiv e + 7 Unused 4U n u s e d 8U n u s e d 6 5 4 3 2 1 7 8[...]
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Seite 135
A–2 Maintenance and S ervice Gui de Connec tor P in Assignments Ta b l e A - 2 RJ-11 Modem Pin Signal Pin Signal 1U n u s e d 4U n u s e d 2 Tip 5 Unused 3R i n g 6U n u s e d Ta b l e A - 3 Universal Serial Bus Pin Signal Pin Signal 1 +5 VDC 3 Data + 2 Data – 4 Ground Ta b l e A - 4 S-Video Pin Signal Pin Signal 1 Ground (Y) 3 Y -Luminance (In[...]
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Seite 136
Connec tor P in Assignments Maintenance and Se rvice Guide A–3 Ta b l e A - 5 External Monitor Pin Signal Pin Signal 1 Red analog 9 +5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data 5 Ground 13 Hor izontal sync 6 Ground analog 14 V er tical sync 7 Ground analog 15 DDC 2B clock 8 Ground analog 1 6 11 5 [...]
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A–4 Maintenance and S ervice Gui de Connec tor P in Assignments Ta b l e A - 6 Stereo Speaker/Headphone Pin Signal Pin Signal 1 A udio out 2 Ground 2 1 Ta b l e A - 7 Microphone Pin Signal Pin Signal 1 A udio in 2 Ground 2 1[...]
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Seite 138
Maintenance and Se rvice Guide B–1 B P o w er C ord Set Requirem ents 3-Con duc tor P o wer Cord Set The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 volts A C. The po wer cord set receiv ed with the notebook meets the requirements for use in the country where the equipment is[...]
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B–2 Maintenance and S ervice Gui de P ow er Cor d Set Requirements Countr y- Spec ifi c Requirements 3-Conductor P ower Cord Set Requirements Country Accredited Agency Applicable Note Number A ustralia EANSW 1 A ustr ia O VE 1 Belgium CEBC 1 Canada CSA 2 Denmark DEMK O 1 Finland FIMK O 1 Fr a n c e U T E 1 Ger many VDE 1 Italy IMQ 1 Jap an M E TI[...]
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Seite 140
P ow er Cor d Set Requirements Maintenance and Se rvice Guide B–3 United Kingdom BSI 1 United States UL 2 Notes 1. The fle xible cord must be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm 2 conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cert ification mark of th e agency responsible f or ev aluation[...]
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Seite 141
Maintenance and Se rvice Guide C–1 C Scre w List ing This appendix provides specif ication and reference information for the scre ws used in the notebook. All screws listed in this appendix are av ailable in the Miscellaneous Screw Kit, spare part number 325529-001.[...]
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Seite 142
C–2 Maintenance and Serv ice Guide Scr ew Listing Phillips M2 .5×3 .0 Sc re w Location Ta b l e C - 1 Phillips PM2.5×3.0 Screw Color Qty . Length Thread Head Width Black 1 3.0 mm 2.5 mm 5.0 mm Where used: One screw that secures the hard driv e to the notebook (documented in Section 5.3) mm[...]
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Seite 143
Scr ew Listing Maintenance and Se rvice Guide C–3 T orx T5 M2 .5×4. 5 and Phillips M2 .5×3 . 5 Scr ew Locati ons Ta b l e C - 2 T orx T5 M2.5×4.5 Screw Color Qty . Length Thread Head Width Silver 2 4.5 mm 2.5 mm 5.0 mm Where used: 1 T wo scre ws that secure the hard drive to the hard drive frame (documented in Section 5.3) Ta b l e C - 3 Phill[...]
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Seite 144
C–4 Maintenance and Serv ice Guide Scr ew Listing 4. 0 -mm Sock et M2 .0×10. 0 Alignment P in Locati ons Ta b l e C - 4 4.0-mm Socket M2.0×10.0 Alignment Pin Color Qty . Length Thread Head Width Silver 2 10.0 mm 2.0 mm 4.0 mm Where used: T wo alignment pins that secure the hard driv e to the hard dr ive fr ame (documented in Section 5.3) mm[...]
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Seite 145
Scr ew Listing Maintenance and Se rvice Guide C–5 Phillips P M2 .0×3 .0 Sc re w Locations Ta b l e C - 5 Black Phillips PM2.0×3.0 Scre w Color Qty . Length Thread Head Width Black 2 3.0 mm 2.0 mm 4.5 mm Where used: T wo scre ws that secure the hard drive upper bezel to the hard driv e frame (documented in Section 5.3) mm[...]
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Seite 146
C–6 Maintenance and Serv ice Guide Scr ew Listing Phillips M2 .0×4.0 Sc re w Locations Ta b l e C - 6 Phillips PM2.0×4.0 Screw Color Qty . Length Thread Head Width Black 6 4.0 mm 2.0 mm 5.0 mm Where used: 1 One screw that secures the memory expansion compartment cover to the notebook (documented in Section 5.5) 2 One screw that secures the mini[...]
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Seite 147
Scr ew Listing Maintenance and Se rvice Guide C–7 Phillips P M2 .0×4. 0 Scr ew L ocations Ta b l e C - 6 Phillips PM2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 6 4.0 mm 2.0 mm 4.5 mm Where used: T wo scre ws that secure the T ouchP ad to the top cover (documented in Section 5.15) mm[...]
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Seite 148
C–8 Maintenance and Serv ice Guide Scr ew Listing Phillips P M2 .0×4. 0 Scr ew L ocations Ta b l e C - 6 Phillips PM2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 6 4.0 mm 2.0 mm 4.5 mm Where used: T wo scre ws that secure the spea ker/microphone to the top co ver (documented in Section 5.17) mm[...]
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Seite 149
Scr ew Listing Maintenance and Se rvice Guide C–9 M2 .0×4.0 Secur it y Scr ew Location Ta b l e C - 7 M2.0×4.0 Security Screw Color Qty . Length Thread Head Width Black 1 4.0 mm 2.0 mm 5.0 mm Where used: One screw that secures the mini PCI co mpartment cover to the notebook on models equipped with a 5-GHz wireless LAN board (documented in Secti[...]
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Seite 150
C–10 Maintenance and S ervice Gui de Scr ew Listing Phillips P M2 .0×3 .0 Sc re w Locations Ta b l e C - 8 Silver Phillips PM2.0×3.0 Screw Color Qty . Length Thread Head Width Silver 7 3.0 mm 2.0 mm 4.0 mm Where used: Three screws that secure the f an to the heat sink (documented in Section 5.9) mm[...]
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Seite 151
Scr ew Listing Maintenance and S ervice Gui de C–11 Phillips P M2 .0×3 .0 Sc re w Locations Ta b l e C - 8 Silver Phillips PM2.0×3.0 Screw (Continued) Color Qty . Length Thread Head Width Silver 7 3.0 mm 2.0 mm 4.0 mm Where used: T wo scre ws that secure the s w itch board to the system board (documented in Section 5.18) mm[...]
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Seite 152
C–12 Maintenance and S ervice Gui de Scr ew Listing Phillips P M2 .0×3 .0 Sc re w Locations Ta b l e C - 8 Silver Phillips PM2.0×3.0 Screw (Continued) Color Qty . Length Thread Head Width Silver 7 3.0 mm 2.0 mm 4.0 mm Where used: T wo scre ws that secure the mode m board to the system board (documented in Section 5.20) mm[...]
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Seite 153
Scr ew Listing Maintenance and S ervice Gui de C–13 T orx T8 M2 .0×8. 0 Scr ew L ocations Ta b l e C - 9 T orx T8 M2.0×8.0 Screw Color Qty . Length Thread Head Width Black 15 8.0 mm 2.0 mm 4.5 mm Where used: 1 T wo scre ws that secure the LE D switch co ver to the notebook (documented in Section 5.7) 2 One screw that secures th e k eyboard to t[...]
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Seite 154
C–14 Maintenance and S ervice Gui de Scr ew Listing T orx T8 M2 .0×8. 0 Scr ew L ocations Ta b l e C - 9 T orx T8 M2.0×8.0 Screw (Continued) Color Qty . Length Thread Head Width Black 15 8.0 mm 2.0 mm 4.5 mm Where used: T wo scre ws that secure the displa y hinge co vers to the notebook (documented in Section 5.12) mm[...]
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Seite 155
Scr ew Listing Maintenance and S ervice Gui de C–15 T orx T8 M2 .0×8. 0 Scr ew L ocations Ta b l e C - 9 T orx T8 M2.0×8.0 Screw (Continued) Color Qty . Length Thread Head Width Black 15 8.0 mm 2.0 mm 4.5 mm Where used: T wo scre ws that secure the disp lay assemb ly to the notebook (documented in Section 5.12) mm[...]
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Seite 156
C–16 Maintenance and S ervice Gui de Scr ew Listing T orx T8 M2 .0×8. 0 Scr ew L ocations Ta b l e C - 9 T orx T8 M2.0×8.0 Screw (Continued) Color Qty . Length Thread Head Width Black 15 8.0 mm 2.0 mm 4.5 mm Where used: Eight screws that secure the top co ver to the notebook (documented in Section 5.13) mm[...]
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Seite 157
Scr ew Listing Maintenance and S ervice Gui de C–17 Spr ing-Loaded T orx T8 M2 . 0×10.0 S cr ew L ocations T able C-10 Spring-Loaded T orx T8 M2.0×10.0 Screw Color Qty . Length Thread Head Width Silver 2 10.0 mm 2.0 mm 5.0 mm Where used: T wo scre ws that secure the heat sink to the notebook (documented in Section 5.10; screws and springs secur[...]
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Seite 158
C–18 Maintenance and S ervice Gui de Scr ew Listing T orx T8 M2 .0×4. 0 Scr ew L ocations T able C-11 T orx T8 M2.0×4.0 Screw Color Qty . Length Thread Head Width Black 12 4.0 mm 2.0 mm 4.5 mm Where used: F our screws that secure th e heat sink to the notebook (documented in Section 5.10) mm[...]
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Seite 159
Scr ew Listing Maintenance and S ervice Gui de C–19 T orx T8 M2 .0×4. 0 Scr ew L ocations T able C-11 T orx T8 M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 12 4.0 mm 2.0 mm 4.5 mm Where used: Five scre ws that secure th e top cover to the notebook (documented in Section 5.13) mm[...]
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Seite 160
C–20 Maintenance and S ervice Gui de Scr ew Listing T orx T8 M2 .0×4. 0 Scr ew L ocations T able C-11 T orx T8 M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 12 4.0 mm 2.0 mm 4.5 mm Where used: Three screws that secure th e system board to the notebook (documented in Section 5.19) mm[...]
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Seite 161
Scr ew Listing Maintenance and S ervice Gui de C–21 T o r x T 8 M 2.0× 6 .0 Sc rew Lo c a t io n s T able C-12 T orx T8 M2.0×6.0 Screw Color Qty . Length Thread Head Width Black 2 6.0 mm 2.0 mm 4.5 mm Where used: T wo scre ws that secure the s ystem board to the notebook (documented in Section 5.19) mm[...]
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Seite 162
C–2 2 Main tenance and Servi ce Guide Scr ew Listing 5.0 - m m S o cke t M 2.0× 9 .0 S t a n d of f Lo c a t i o n s T able C-13 5.0-mm Socket M2.0×9.0 Standoff Color Qty . Length Thread Head Width Silver 2 9.0 mm 2.0 mm 5.0 mm Where used: T wo standoffs that secure the syst em board to the base enclosure (documented in Section 5.19) mm[...]
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Seite 163
Maintenance and Se rvice Guide Index–1 Ind e x A AC adapter spare part number 3–11 specifications 6–5 advanced port replicator, spare part number 3–10 air adapter cable, spare part number 3–11 antenna cable disconnecting 5–12 routing 5–30 application key 1–13 audio line-out jack location 1–12 audio troubleshooting 2–25 auto adap[...]
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Seite 164
Index–2 Maintenance and Se r vi ce Guide Index components bottom 1–16 front 1–9 keyboard 1–13 left side 1–11 rear panel 1–11 right side 1–9 top 1–14 Computer Setup Advanced Menu 2–5 File Menu 2–3 overview 2–1 Security Menu 2–4 connector pin assignments external monitor connector A–3 headphone jack A–4 microphone jack A?[...]
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Seite 165
Index Maintenance and Se rvice Guide Index–3 F fan removal 5–20 spare part number 3–5 , 5–20 features 1–6 feet locations 5–8 Fn key 1–13 front components 1–9 function keys 1–13 G grounding equipment and methods 4–6 H hard drive OS loading problems 2–20 removal 5–5 spare part numbers 3–7 , 3–10 , 5–5 specifications 6–[...]
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Seite 166
Index–4 Maintenance and Se r vi ce Guide Index microphone input jack location 1–12 microphone jack pin assignments A–4 Microsoft Windows logo key 1–13 mini PCI communications board removal 5–10 spare part numbers 3–7 , 5–10 mini PCI communications compartment cover, removal 5–10 mini PCI compartment 1–17 Miscellaneous Plastics Kit[...]
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Seite 167
Index Maintenance and Se rvice Guide Index–5 Q Quick Launch buttons 1–14 R real time clock battery cable, disconnecting 5–34 real time clock battery, removal 5–40 rear panel components 1–11 removal preliminaries 4–1 procedures 5–1 replacement preliminaries 4–1 procedures 5–1 right side components 1–9 RJ-11 jack location 1–12 p[...]
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Seite 168
Index–6 Maintenance and Se r vi ce Guide Index top cover removal 5–32 spare part number 3–5 , 5–32 TouchPad location 1–15 removal 5–37 spare part number 3–5 , 5–37 TouchPad bracket, removal 5–38 TouchPad buttons 1–15 TouchPad cable, disconnecting 5–34 , 5–39 transporting precautions 4–4 travel battery carrier, spare part n[...]