Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset Bedienungsanleitung

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Richtige Gebrauchsanleitung

Die Vorschriften verpflichten den Verkäufer zur Übertragung der Gebrauchsanleitung Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset an den Erwerber, zusammen mit der Ware. Eine fehlende Anleitung oder falsche Informationen, die dem Verbraucher übertragen werden, bilden eine Grundlage für eine Reklamation aufgrund Unstimmigkeit des Geräts mit dem Vertrag. Rechtsmäßig lässt man das Anfügen einer Gebrauchsanleitung in anderer Form als Papierform zu, was letztens sehr oft genutzt wird, indem man eine grafische oder elektronische Anleitung von Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset, sowie Anleitungsvideos für Nutzer beifügt. Die Bedingung ist, dass ihre Form leserlich und verständlich ist.

Was ist eine Gebrauchsanleitung?

Das Wort kommt vom lateinischen „instructio”, d.h. ordnen. Demnach kann man in der Anleitung Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset die Beschreibung der Etappen der Vorgehensweisen finden. Das Ziel der Anleitung ist die Belehrung, Vereinfachung des Starts, der Nutzung des Geräts oder auch der Ausführung bestimmter Tätigkeiten. Die Anleitung ist eine Sammlung von Informationen über ein Gegenstand/eine Dienstleistung, ein Hinweis.

Leider widmen nicht viele Nutzer ihre Zeit der Gebrauchsanleitung Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset. Eine gute Gebrauchsanleitung erlaubt nicht nur eine Reihe zusätzlicher Funktionen des gekauften Geräts kennenzulernen, sondern hilft dabei viele Fehler zu vermeiden.

Was sollte also eine ideale Gebrauchsanleitung beinhalten?

Die Gebrauchsanleitung Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset sollte vor allem folgendes enthalten:
- Informationen über technische Daten des Geräts Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset
- Den Namen des Produzenten und das Produktionsjahr des Geräts Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset
- Grundsätze der Bedienung, Regulierung und Wartung des Geräts Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset
- Sicherheitszeichen und Zertifikate, die die Übereinstimmung mit entsprechenden Normen bestätigen

Warum lesen wir keine Gebrauchsanleitungen?

Der Grund dafür ist die fehlende Zeit und die Sicherheit, was die bestimmten Funktionen der gekauften Geräte angeht. Leider ist das Anschließen und Starten von Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset zu wenig. Eine Anleitung beinhaltet eine Reihe von Hinweisen bezüglich bestimmter Funktionen, Sicherheitsgrundsätze, Wartungsarten (sogar das, welche Mittel man benutzen sollte), eventueller Fehler von Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset und Lösungsarten für Probleme, die während der Nutzung auftreten könnten. Immerhin kann man in der Gebrauchsanleitung die Kontaktnummer zum Service Intel finden, wenn die vorgeschlagenen Lösungen nicht wirksam sind. Aktuell erfreuen sich Anleitungen in Form von interessanten Animationen oder Videoanleitungen an Popularität, die den Nutzer besser ansprechen als eine Broschüre. Diese Art von Anleitung gibt garantiert, dass der Nutzer sich das ganze Video anschaut, ohne die spezifizierten und komplizierten technischen Beschreibungen von Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset zu überspringen, wie es bei der Papierform passiert.

Warum sollte man Gebrauchsanleitungen lesen?

In der Gebrauchsanleitung finden wir vor allem die Antwort über den Bau sowie die Möglichkeiten des Geräts Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset, über die Nutzung bestimmter Accessoires und eine Reihe von Informationen, die erlauben, jegliche Funktionen und Bequemlichkeiten zu nutzen.

Nach dem gelungenen Kauf des Geräts, sollte man einige Zeit für das Kennenlernen jedes Teils der Anleitung von Intel Intel Core2 Duo Processor and Mobile Intel GME965 Express Chipset widmen. Aktuell sind sie genau vorbereitet oder übersetzt, damit sie nicht nur verständlich für die Nutzer sind, aber auch ihre grundliegende Hilfs-Informations-Funktion erfüllen.

Inhaltsverzeichnis der Gebrauchsanleitungen

  • Seite 1

    Document Number: 316704-001 Intel ® Core TM 2 Duo processor and Mobile Intel ® GME965 Express Chipset Development Kit User Manual June 2007[...]

  • Seite 2

    2 316704-001 / Developm ent Kit Use r’s Manual INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS . NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES N[...]

  • Seite 3

    316704-001 / Developm ent Kit Us er’s Manual 3 Contents 1 About This Manual ............................................................................................6 1.1 Content Overview ...................................................................................6 1.2 Text Conventions ...................................................[...]

  • Seite 4

    4 316704-001 / Developm ent Kit Use r’s Manual Figures Figure 1. Developme nt Board Block Diagram....................................................... 24 Figure 2. Development Boar d Component Lo cations ............................................. 39 Figure 3. Back Panel Connector Lo cations ...................................................[...]

  • Seite 5

    316704-001 / Developm ent Kit Us er’s Manual 5 Revision History Document Number Revision Number Description Revision Date 316704 001 Initial publi c release. June 2007 §[...]

  • Seite 6

    About This Manual 6 316704-001 / Developm ent Kit Use r’s Manual 1 About This Manual This user’s manual describes the use of the Intel ® Core TM 2 Duo processor and Mobile Intel ® GME965 Express Chipset development kit. Thi s manual has been written for OEMs, system evaluators, and embedded syst em developers. This document defines all jumper[...]

  • Seite 7

    About This Manual 316704-001 / Developm ent Kit Us er’s Manual 7 Table 1. Text Conventions Notation Defini tion # The pound symbol (#) appended to a si gnal name indicates that the signal is active low. (e.g., PRSNT1#) Variables Variables are shown in italics. Variabl es must be replaced with correct values. Instructions Instruction mnemonics ar [...]

  • Seite 8

    About This Manual 8 316704-001 / Developm ent Kit Use r’s Manual 1.3 Glossary of Terms and Acronyms Table 2 defines conventions and terminol ogy used throughout this document. Table 2. Terms and Acronyms Term/Acronym Definition Aggressor A network that transmits a coupled signal to another network. Anti-etch Any plane-split, void or cutout in a V[...]

  • Seite 9

    About This Manual 316704-001 / Developm ent Kit Us er’s Manual 9 Term/Acronym Definition manufacturer’s conditions required for AC timing specifications; i.e., ringback, etc.) and the output pin of the driving agent crossing the switching voltage when the driver is driving a test load used to specify the driver’s AC timings. Maximum and Minim[...]

  • Seite 10

    About This Manual 10 316704-001 / Developm ent Kit Use r’s Manual Term/Acronym Definition System Bus The System Bus is the mi croprocessor bus of the processor. Setup Window The time between the beginni ng of Setup to Clock (TSU_MIN) and the arrival of a valid clock edge. This wind ow may be different for each type of bus agent in the system. Sim[...]

  • Seite 11

    About This Manual 316704-001 / Developm ent Kit Us er’s Manual 11 Acronym Definition BIOS Basic Input/Output System CK-SSCD Spread Spectr um Differential Clock CMC Common Mode Choke CMOS Complementary Metal-Oxide-Semiconductor CPU Central Processing Unit (processor) DDR Double Data Rate DMI Direct Memory Interface ECC Error Correcting Code EEPROM[...]

  • Seite 12

    About This Manual 12 316704-001 / Developm ent Kit Use r’s Manual Acronym Definition LOM LAN on Motherboard LPC Low Pin Count LS Low-speed. Refers to USB LVDS Low Voltage Differential Signaling mBGA Mini Ball Grid Array MC Modem Codec MEC Media Expansion Card MHz Mega-Hertz OEM Original Equipment Manufacturer PCIe PCI Express* PCM Pulse Code Modu[...]

  • Seite 13

    About This Manual 316704-001 / Developm ent Kit Us er’s Manual 13 Acronym Definition VREG Voltage Regulator XDP eXtended Debug Port 1.4 Support Options 1.4.1 Electronic Support Systems Intel’s web site ( http://www.intel.com/ ) provide s up-to -date techn ical informa tion and product support. This information i s available 24 hours per day, 7 [...]

  • Seite 14

    About This Manual 14 316704-001 / Developm ent Kit Use r’s Manual Intel Literature Fulfi lment Center P.O. Box 5937 Denver, Colorado 80217-9808 USA Email a request to: intelsupport@hibbertgroup.com Please make sure to in clude in your mailed/em ailed req uest: SKU # Company Name Your Name (first, last ) Full mailing a ddre ss Daytime Phone Number[...]

  • Seite 15

    Getting Started 316704-001 / Developm ent Kit Us er’s Manual 15 2 Getting Started This chapter identifies the development ki t’s key components, features and specifications. It also details basic devel opment board setup and operation. 2.1 Overview The development board consists of a baseboard populated with the Intel ® Core TM 2 Duo processor[...]

  • Seite 16

    Getting Started 16 316704-001 / Developm ent Kit Use r’s Manual Development Board Implementation Comments PCI Express* Three x1 connectors One x16 connector Revision 1.1 compliant There are Five x1 PCI Express* slots but slots 2 and 4 are not intended for use with PCI Express* add-in cards. Only slots 1, 3 and 5 are supported. On-Board LAN 10/100[...]

  • Seite 17

    Getting Started 316704-001 / Developm ent Kit Us er’s Manual 17 Development Board Implementation Comments Power Management ACPI Compliant S0 – Power On S3 – Suspend to RAM S4 – Suspend to Disk S5 – Soft Off M0 – All Wells powered M1 – Main Well down. Only ME power o n M-off – ME powered off Form Factor ATX 2.2 like form fact or 10 l[...]

  • Seite 18

    Getting Started 18 316704-001 / Developm ent Kit Use r’s Manual Note: While every care was taken to ensure the latest versions of drivers were provi ded on the enclosed CD at time of publicati on, newer revisions may be avail able. Updated drivers for Intel components can be found at: http://developer.intel.com/design/i ntarch/software/index.htm [...]

  • Seite 19

    Getting Started 316704-001 / Developm ent Kit Us er’s Manual 19 VGA Monitor: Any standard VG A or multi-resolution monitor may be used. The se tup instructions in this chapter assume the use of a standard VGA monitor, TV, or fl at panel monitor. Keyboard: The development board can support either a PS/2 or USB style keyboard. Mouse: The developmen[...]

  • Seite 20

    Getting Started 20 316704-001 / Developm ent Kit Use r’s Manual Other Devices and Adapters: The development board functions much like a standard desktop computer motherboard. Most PC-compatible peripherals can be attached and configured to work with the development board. 2.5 Setting Up the Development Board Once the necessary hardware (described[...]

  • Seite 21

    Getting Started 316704-001 / Developm ent Kit Us er’s Manual 21 Note: Ensure that the processor has been locked into the socket by turning the socket screw fully clockwise. Note: For pro per insta llation of the CPU therma l solution, ple ase refe r to Appendix A 5. Connect a SATA or IDE hard disk drive. 6. Connect any additional storage devi ces[...]

  • Seite 22

    Theory of Operation 22 316704-001 / Developm ent Kit Use r’s Manual 3 Theory of Operation 3.1 Block Diagram Figure 1. Development Board Block Diagram 3.2 Mechanical Form Factor The development board conforms to the ATX form factor. For extra protection in a development environment, you may want to instal l the development board in an ATX[...]

  • Seite 23

    Theory of Operation 316704-001 / Developm ent Kit Us er’s Manual 23 chassis. Internal and rear panel system I/O connectors are described i n Section 3.4 . An overview of connector and slot locations i s provided in Chapter 4 . 3.3 Thermal Management The objective of thermal management is to ensure that the temperature of each componen t is mainta[...]

  • Seite 24

    Theory of Operation 24 316704-001 / Developm ent Kit Use r’s Manual • SDVO interface via PCI Express* x16 connector provides maximum displ ay flexibility o Can drive up to two display outputs 3.4.1.1 System Memory The development board supports DDR2 533/667 main memory. Two 200-pin SODIMM connectors (one per channel) on the development board su[...]

  • Seite 25

    Theory of Operation 316704-001 / Developm ent Kit Us er’s Manual 25 3.4.1.4 PCI Express x16 Slot The development board provides access to one x16 PCI Express* connector. Any industry standard x1 or x16 PCI Express* video adapter may be used with this interface . Additiona lly, any indust ry stand a rd non-graphics x1, x4 or x8 adapter may also be[...]

  • Seite 26

    Theory of Operation 26 316704-001 / Developm ent Kit Use r’s Manual 3.4.2.3 On-Board LAN The development board has one RJ-45 interface – at connector J5A1 - through which 10/100/1000 ethernet is available. The ethernet MAC is located i n the ICH8-M and the PHY is located externally in the 82566MM LAN Connect Interface (LCI) device. The 82566MM [...]

  • Seite 27

    Theory of Operation 316704-001 / Developm ent Kit Us er’s Manual 27 connector at J5A1. Four ports are routed to USB front panel headers at J6H3 and J6H4. The last is routed to the PCI-Express* docking connector at J9C1. There are Five UHCI Host Controllers and tw o EHCI Host Controllers. Each UHCI Host Controller includes a root hub with two sepa[...]

  • Seite 28

    Theory of Operation 28 316704-001 / Developm ent Kit Use r’s Manual Table 7. BIOS Location Strapping Options ICH8-M Signal GNT#0 SPI_CS1# BIOS Location 0 1 SPI 1 0 PCI 1 1 LPC (Default) Note: GNT#0 is configur able via jump er J8E2 . Further details on its loca tion can be found in Section 4.3 . SPI_CS1# is c onfigura ble via stuffing option R7U [...]

  • Seite 29

    Theory of Operation 316704-001 / Developm ent Kit Us er’s Manual 29 3.4.3 POST Code Debugger A Port 80-83 Add-in card can be plugged i nto to the development board at the TPM header (J9A1). This card decodes the LPC bus BIOS POST codes and displays them on four 7-segment LED displays. For AMI* BIOS POST codes, please visit: http://www.ami.com 3.5[...]

  • Seite 30

    Theory of Operation 30 316704-001 / Developm ent Kit Use r’s Manual State Description G0/S0/C3 Deep Sleep: DPSLP# signal active G0/S0/C4 Deeper Sleep: DPRSLP# signal active G1/S3 Suspend To RAM (all switched rails are turned off) G1/S4 Suspend To Disk G2/S5 Soft Off G3 Mechanical Off Table 10. Power Management M-States M- State Description Main S[...]

  • Seite 31

    Theory of Operation 316704-001 / Developm ent Kit Us er’s Manual 31 Table 11. Sleep Signals and M-State Definition Signal SLP_S3# SLP_S4# SLP_S5# S4_STATE# SLP_M# S0/M0 High High High High High S3/M1 Low High High High High S4/M1 Low High High Low High S5/M1 Low High Low Low High S3/M-off Low High High High Low S4/M-off Low Low High Low Low S5/M-[...]

  • Seite 32

    Theory of Operation 32 316704-001 / Developm ent Kit Use r’s Manual Table 12. Development Board Voltage Rails Component / Interface Voltage Plane Supply Rail Reference Designator CPU VR 5V +V5S +V5S_IMVP6 R1B1 CPU VR Battery +VBAT +VDC_PHASE R2P12 CPU VR Variable 6208_1_PHASE_LOUT +VCC_CORE R3D1 CPU VR Variable 6208_2_PHASE_LOUT +VCC_CORE R2D1 CP[...]

  • Seite 33

    Theory of Operation 316704-001 / Developm ent Kit Us er’s Manual 33 Component / Interface Voltage Plane Supply Rail Reference Designator GMCH 1.8V +V1.8 +V1.8_GMCH R5D1 GMCH 1.8V +V1.8_GMCH +V1.8_SM_CK R5D2 GMCH 1.8V +V1.8 +V1.8_TXLVDS R5U25 GMCH 1.8V +V1.8 +V1.8_DLVDS R5E5 GMCH 3.3V +V3.3S +V3.3S_HV R5U2 GMCH 3.3V +V3.3S +V3.3S_SYNC R5F9 GMCH 3.[...]

  • Seite 34

    Theory of Operation 34 316704-001 / Developm ent Kit Use r’s Manual Component / Interface Voltage Plane Supply Rail Reference Designator Memory 1.8V +V1.8 +V1.8_DIMM1 R5B10 Memory 3.3V +V3.3M +V3.3M_DIMM0 R4C1 (0.022 Ω ) Memory 3.3V +V3.3M +V3.3M_DIMM1 R4B26 (0.022 Ω ) LAN 3.3V +V3.3M_LAN_SW +V3.3M_LAN R6A23 LAN 1.8V +V1.8_LAN +V1.8_LAN_M R6M[...]

  • Seite 35

    Theory of Operation 316704-001 / Developm ent Kit Us er’s Manual 35 Component / Interface Voltage Plane Supply Rail Reference Designator Panel LVDS 5V +V5S +V3.3S_LVDS_DDC R6U9* CK505 3.3V +V3.3M_CK505 VDD_CK505 R5G11 CK505 3.3V +V3.3S +V3.3S_DB800 R7C10 CK505 0.9V IO_VOUT_D +VDDIO_CLK R5V11 LPC 3.3V +V3.3 +V3.3_LPCSLOT R8F2 LPC 5V +V5 +V5_LPCSLO[...]

  • Seite 36

    Theory of Operation 36 316704-001 / Developm ent Kit Use r’s Manual Component / Interface Voltage Plane Supply Rail Reference Designator System ATX +V5A +V5_ATX R4J1* System ATX +V3.3A +V3.3_ATX R4W23* System ATX +V12_ATX +VBATA R4Y1 System ATX -V12_ATX -V12A R4Y 2 System ATX +V5SB_ATX +V5SB_ATXA R5H17 System +VAC_B RCK +VAC_BRCK_IN NEG_SENSE R1G[...]

  • Seite 37

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 37 4 Hardware Reference This sec tion pr ovides r eferen ce inform ation on t he hard ware, inc luding loc ations of development board components, connector pinout informati on and jumper settings. 4.1 Primary Features Figure 2 shows the major components of the development board and [...]

  • Seite 38

    Hardware Reference 38 316704-001 / Developm ent Kit Use r’s Manual Table 13. Development Board Component Location Legend Reference Designator Function BT5H1 CMOS Battery J1C1 Reserved J1D1 XDP Connector J1F4 CPU FSB Sideband Signals J1G1 Reserved J1G3 Reserved J1G4 Reserved J1G6 AC Brick Connector J1G7 Battery Connector B J1H1 Battery Connector A[...]

  • Seite 39

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 39 Reference Designator Function J7J4 PATA Connector J8A1 Reserved J8A2 Reserved J8B3 PCI Slot 3 J8B4 PCI Express Slot 3 J8D1 PCI Express Slot 4 J8E1 LPC Slot J8G2 Extended Mobile Access Header J8J1 SATA Port 0, Direct Connect J9A1 Trusted Platform Module Header J9C1 PCI Express Dock[...]

  • Seite 40

    Hardware Reference 40 316704-001 / Developm ent Kit Use r’s Manual Figure 3. Back Panel Connector Locations n o p q r s t u Table 14. Back Panel Connector Definitions Item Description Ref Des Item Description Ref Des 1 PS/ 2 Mouse J 1A1 5 RJ-45 LAN J5A1 2 TV-Out D-Connector J2A1 6 PS/2 Keyboard J1A1 3 Serial Port J2A2 7 VGA J2A2 4 3 USB Ports J3A[...]

  • Seite 41

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 41 Figure 4. D-Connector to Component Video Cable Figure 5. D-Connector to Composite Video Cable Figure 6. D-Connector to S-Video Cable 4.3 Configuration Settings Note: Do not move jumpers with the power on. Always turn off the power and unplug the power cord from the computer before[...]

  • Seite 42

    Hardware Reference 42 316704-001 / Developm ent Kit Use r’s Manual The unsupported jumpers must remain in their default posi tion or the operation of the development board is unpredictabl e. The development board is shipped wi th the jumpers and switches shunted in the default locati ons. Figure 7. Configuration Jumper and Switch Locations Table [...]

  • Seite 43

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 43 Reference Designator Function Default Setting Optional Setti ng Override For each VID signal IN: Tied to logic low OUT: Tied to logic high 13 and 14 = VID0 11 and 12 = VID1 9 and 10 = VID2 7 and 8 = VID3 5 and 6 = VID4 3 and 4 = VID5 1 and 2 = VID6 J2F3 Reserved OUT Do not alter j[...]

  • Seite 44

    Hardware Reference 44 316704-001 / Developm ent Kit Use r’s Manual Reference Designator Function Default Setting Optional Setti ng J3J1 Reserved OUT Do not alter jumper setting J3J2 Reserved OUT Do not alter jumper setting J3J3 Reserved OUT Do not alter jumper setting J4H1 ME G3 to M1 OUT: Normal operation IN: J ump power state from G3 to M1 J5H1[...]

  • Seite 45

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 45 Reference Designator Function Default Setting Optional Setti ng H8 Programming NMI enabled programming J9H3 KBC Disable OUT: Normal operation, Keyboard Controller enabled IN: Keyboard Controller disabled J9H4 SMC MD0 IN: Normal operation. External programming allowed OUT: No exter[...]

  • Seite 46

    Hardware Reference 46 316704-001 / Developm ent Kit Use r’s Manual 4.5 LEDs The development board has a number of LEDs. These LEDs provide status for vari ous functions on the development board. Figure 8 indicates the l ocation of the LEDs and Table 16 describes their function. Figure 8. LED Locations Table 16. LED Functions Function Reference De[...]

  • Seite 47

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 47 Function Reference Designator VID 0 CR1B1 VID 1 CR1B2 VID 2 CR1B3 VID 3 CR1B4 VID 4 CR1B5 VID 5 CR1B6 VID 6 CR1B7 M0/M1 CR4H1 System Power Good CR5J1 Reserved CR8G1 4.6 Other Headers, Slots and Sockets 4.6.1 H8 Programming Headers The microcontroller firmware for system management[...]

  • Seite 48

    Hardware Reference 48 316704-001 / Developm ent Kit Use r’s Manual d. J9H2 (1-2) (default: 1-X), disable 1 Hz Cl ock. 4. Attach an ATX power supply or AC to DC adapter to the system and power up the development board. 5. From the directory where you extracted the files, run the “kscfl ash ksc.bin / remote” command to program the H8 via the se[...]

  • Seite 49

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 49 Reference Designator Slot/Socket Description Detail J6H5 Front Panel Header Table 28 J6H3, J6H4 USB Header Table 29 4.6.2.1 478 Pin Grid Array (Micro-FCPGA) Socket The pin locking mechanism on the CPU socket i s released by rotating the screw on the socket 180 degrees counter-cloc[...]

  • Seite 50

    Hardware Reference 50 316704-001 / Developm ent Kit Use r’s Manual Pin Description Pin Description A11 PERST# B11 WAKE# Key A12 GND B12 RSVD A13 REFCLK+ B13 GND A14 REFCLK- B14 LANE 0 (T+) A15 GND B15 LANE 0 (T-) A16 LANE 0 (R+) B16 GND A17 LANE 0 (R-) B17 PRSNT2* A18 GND B18 GND End of x1 Connector A19 RSVD B19 LANE 1 (T+) A20 GND B20 LANE 1 (T-[...]

  • Seite 51

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 51 Pin Description Pin Description A43 LANE 6 (R+) B43 GND A44 LANE 6 (R-) B44 GND A45 GND B45 LANE 7 (T+) A46 GND B46 LANE 7 (T-) A47 LANE 7 (R+) B47 GND A48 LANE 7 (R-) B48 PRSNT#2 A49 GND B49 GND End of x8 Connector A50 RSVD B50 LANE 8 (T+) A51 GND B51 LANE 8 (T-) A52 LANE 8 (R+) [...]

  • Seite 52

    Hardware Reference 52 316704-001 / Developm ent Kit Use r’s Manual Pin Description Pin Description A77 LANE 14 (R-) B77 GND A78 GND B78 LANE 15 (T+) A79 GND B79 LANE 15 (T-) A80 LANE 15 (R+) B80 GND A81 LANE 15 (R-) B81 PRST2# A82 GND B82 RSVD 4.6.2.3 ADD2/Media Expansion Card (MEC) Slot When not being used for PCI Express*, the x16 slot can be u[...]

  • Seite 53

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 53 Pin Description Pin Description A18 GND B18 GND End of x1 Connector A19 Reserved B19 SDVO_Green+ A20 GND B20 SDVO_Green- A21 SDVOB_Int+ B21 GND A22 SDVOB_Int- B22 GND A23 GND B23 SDVOB_Blue+ A24 GND B24 SDVOB_Blue- A25 SDVO_Stall+ B25 GND A26 SDVO_Stall- B26 GND A27 GND B27 SDVOB_[...]

  • Seite 54

    Hardware Reference 54 316704-001 / Developm ent Kit Use r’s Manual Pin Description Pin Description A50 Reserved B50 N/C A51 GND B51 N/C A52 N/C B52 GND A53 N/C B53 GND A54 GND B54 N/C A55 GND B55 N/C A56 N/C B56 GND A57 N/C B57 GND A58 GND B58 N/C A59 GND B59 N/C A60 N/C B60 GND A61 N/C B61 GND A62 GND B62 N/C A63 GND B63 N/C A64 N/C B64 GND A65 [...]

  • Seite 55

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 55 Table 20. MEC Slot (J6B2) Pin Description Pin Description A1 N/C B1 12 V A2 12 V B2 12 V A3 12 V B3 Reserved A4 GND B4 GND A5 N/C B5 N/C A6 N/C B6 N/C A7 N/C B7 GND A8 N/C B8 3.3 V A9 3.3 V B9 N/C A10 3.3 V B10 +3.3VA A11 RESET B11 WAKE# Key A12 GND B12 Reserved A13 REFCLK+ B1 3 G[...]

  • Seite 56

    Hardware Reference 56 316704-001 / Developm ent Kit Use r’s Manual Pin Description Pin Description End of x4 Connector A33 Reserved B33 N/C A34 GND B34 N/C A35 N/C B35 GND A36 N/C B36 GND A37 GND B37 N/C A38 GND B38 N/C A39 N/C B39 GND A40 N/C B40 GND A41 GND B41 N/C A42 GND B42 N/C A43 N/C B43 GND A44 N/C B44 GND A45 GND B45 N/C A46 GND B46 N/C [...]

  • Seite 57

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 57 Pin Description Pin Description A66 GND B66 SDVOB_Clk+ A67 GND B67 SDVOB_Clk- A68 N/C B68 GND A69 N/C B69 GND A70 GND B70 SDVOB_Blue+ A71 GND B71 SDVOB_Blue- A72 SDVO_Stall+ B72 GND A73 SDVO_Stall- B73 GND A74 GND B74 SDVOB_Green+ A75 GND B75 SDVOB_Green- A76 SDVOB_Int+ B76 GND A7[...]

  • Seite 58

    Hardware Reference 58 316704-001 / Developm ent Kit Use r’s Manual Pin Description Pin Description Key A12 GND B12 RSVD A13 REFCLK+ B13 GND A14 REFCLK- B14 LANE 0 (T+) A15 GND B15 LANE 0 (T-) A16 LANE 0 (R+) B16 GND A17 LANE 0 (R-) B17 PRSNT2* A18 GND B18 GND 4.6.2.5 IDE Connector The IDE interface can support up to two devi ces, a master and a s[...]

  • Seite 59

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 59 4.6.2.6 SATA Pinout Up to three SATA devices may be suppo rted by the SATA connectors on the development board. Table 23 describes the SATA ‘Di rect Connect’ connector and Table 24 describes the SATA ‘Cable Connect’ connectors. Table 23. SATA Port 0 ‘Direct Co nnect’ C[...]

  • Seite 60

    Hardware Reference 60 316704-001 / Developm ent Kit Use r’s Manual Connector J2B3 is used to power the CPU fa n. Connectors J2C1 and J2F1 are not used in the default operation of the devel opment board. Table 26. Fan Connectors (J2B3, J2C1) Pin Signal 1 +V 2 TACH 3 GND Table 27. Fan Connector (J2F1) Pin Signal 1 +5V 2 NC 3 GND 4.6.2.8 Front Panel[...]

  • Seite 61

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 61 16 +V5 5 volt suppl y 4.6.2.9 USB Headers (J6H3, J6H4) The USB headers implement 4 additi onal USB ports on the development board. Connector J6H3 implements ports 7 and 8 and connector J6H4 impl ements ports 2 and 4. Table 29. USB Headers Pin Signal Definition 1 +V5A_L_USBPWR 5 vo[...]

  • Seite 62

    Hardware Reference 62 316704-001 / Developm ent Kit Use r’s Manual Appendix A . Heatsink Installation Instructions It is necessary for the Intel ® Core TM 2 Duo processor to have a thermal solution attache d to it in order to keep it wit hin its ope rating temperat ure. Caution: An ESD wrist str ap must b e used when handlin g the b oard and ins[...]

  • Seite 63

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 63 Figure 10. Backplate Pins 4. Clean the die of the processor with i sopropyl alcohol before the heatsink i s attached to the processor. This ensures that the surface of the die is cl ean. 5. Remove the tube of thermal grease from the package and use it to coat the exposed die of th[...]

  • Seite 64

    Hardware Reference 64 316704-001 / Developm ent Kit Use r’s Manual Figure 11. Applying the Thermal Grease 6. Pick up the heatsink and squeeze the activati on arm until it comes in contact with the ba se plate that is at tached to the he atsink base. This will c ause the springs on the heatsink attachment mechanism to compress. Figure 12. Squeezin[...]

  • Seite 65

    Hardware Reference 316704-001 / Developm ent Kit Us er’s Manual 65 7. While keeping the acti vation arm compressed, place the heatsink over the pi ns of the heatsink backplate. Lower the heatsink until the lugs have inserted into the base of the heatsink. Slide the heat sink over the l ugs on the backplate pins so that the base is directly over t[...]

  • Seite 66

    Hardware Reference 66 316704-001 / Developm ent Kit Use r’s Manual Figure 14. Plugging in the Fan Figure 15. Completed Assembly[...]