HP (Hewlett-Packard) DL785 manuel d'utilisation

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Un bon manuel d’utilisation

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Le mot vient du latin "Instructio", à savoir organiser. Ainsi, le manuel d’utilisation HP (Hewlett-Packard) DL785 décrit les étapes de la procédure. Le but du manuel d’utilisation est d’instruire, de faciliter le démarrage, l'utilisation de l'équipement ou l'exécution des actions spécifiques. Le manuel d’utilisation est une collection d'informations sur l'objet/service, une indice.

Malheureusement, peu d'utilisateurs prennent le temps de lire le manuel d’utilisation, et un bon manuel permet non seulement d’apprendre à connaître un certain nombre de fonctionnalités supplémentaires du dispositif acheté, mais aussi éviter la majorité des défaillances.

Donc, ce qui devrait contenir le manuel parfait?

Tout d'abord, le manuel d’utilisation HP (Hewlett-Packard) DL785 devrait contenir:
- informations sur les caractéristiques techniques du dispositif HP (Hewlett-Packard) DL785
- nom du fabricant et année de fabrication HP (Hewlett-Packard) DL785
- instructions d'utilisation, de réglage et d’entretien de l'équipement HP (Hewlett-Packard) DL785
- signes de sécurité et attestations confirmant la conformité avec les normes pertinentes

Pourquoi nous ne lisons pas les manuels d’utilisation?

Habituellement, cela est dû au manque de temps et de certitude quant à la fonctionnalité spécifique de l'équipement acheté. Malheureusement, la connexion et le démarrage HP (Hewlett-Packard) DL785 ne suffisent pas. Le manuel d’utilisation contient un certain nombre de lignes directrices concernant les fonctionnalités spécifiques, la sécurité, les méthodes d'entretien (même les moyens qui doivent être utilisés), les défauts possibles HP (Hewlett-Packard) DL785 et les moyens de résoudre des problèmes communs lors de l'utilisation. Enfin, le manuel contient les coordonnées du service HP (Hewlett-Packard) en l'absence de l'efficacité des solutions proposées. Actuellement, les manuels d’utilisation sous la forme d'animations intéressantes et de vidéos pédagogiques qui sont meilleurs que la brochure, sont très populaires. Ce type de manuel permet à l'utilisateur de voir toute la vidéo d'instruction sans sauter les spécifications et les descriptions techniques compliquées HP (Hewlett-Packard) DL785, comme c’est le cas pour la version papier.

Pourquoi lire le manuel d’utilisation?

Tout d'abord, il contient la réponse sur la structure, les possibilités du dispositif HP (Hewlett-Packard) DL785, l'utilisation de divers accessoires et une gamme d'informations pour profiter pleinement de toutes les fonctionnalités et commodités.

Après un achat réussi de l’équipement/dispositif, prenez un moment pour vous familiariser avec toutes les parties du manuel d'utilisation HP (Hewlett-Packard) DL785. À l'heure actuelle, ils sont soigneusement préparés et traduits pour qu'ils soient non seulement compréhensibles pour les utilisateurs, mais pour qu’ils remplissent leur fonction de base de l'information et d’aide.

Table des matières du manuel d’utilisation

  • Page 1

    HP Pr oL ian t DL7 8 5 Se r v er Maint enance and Se r v i ce Gui de Gener ati on 5 and Ge ner ati on 6 Maint enance and Se r v ice Gui de HP P art Number : AH2 3 3-900 2A_ed7 P ublished: January 20 1 0 E dition: 7[...]

  • Page 2

    © Copyright 2008–2010 Hewlett-P ackard Development Company , L.P . The information contained herein is subject to change without notice. The only w arranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warra[...]

  • Page 3

    T a ble of C on ten ts 1 C usto mer self r epair ....................................................................................................... 7 R ép ar a ti o n pa r l e cl i en t ( CS R )................................................................................................................7 R ip ar a zi o ne d a p ar t e de l [...]

  • Page 4

    R e- en te ri ng t he s er v er s er ia l nu mb er a nd p ro du ct I D....................................................................4 8 S ys te m ba tt er y.......................................................................................................................................4 8 I /O b ac kp la ne a ss em bl y..................[...]

  • Page 5

    8 T echni cal support ......................................................................................................... 83 B ef or e y ou c o nt ac t HP ...........................................................................................................................83 H P co nt ac t in fo rm at io n................................[...]

  • Page 6

    6[...]

  • Page 7

    1 C ust omer se lf r epair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, H[...]

  • Page 8

    Les pièces CSR sont livrées le jour ouvré suiv ant, dans la limite des stocks disponibles et selon votre situation géographique. Si v otre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. P our bénéficier d'une assistance téléphonique, appelez le Cent[...]

  • Page 9

    • Z wingend T eile, für die das Customer Self Repair-V erfahren zwingend vorgegeben ist. W enn Sie den Austausch dieser T eile von HP v ornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet. • Optional T eile, für die das Customer Self Repair-V erfahren optional ist. Diese T eile sind auch für Customer Se[...]

  • Page 10

    normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que llev e a cabo el cliente, HP se hará cargo de todos los gastos de [...]

  • Page 11

    • Obrigatória P eças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. • Opcional Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a[...]

  • Page 12

    12 Customer self repair[...]

  • Page 13

    2 Illus tr ated P ar ts Cat alog In this section • “Mechanical components” (page 13) • “System components” (page 16) Mec hanical co mponen ts IMPORT ANT: The list of part numbers is current and correct as of the publication of the document. P art numbers change often. Check the HP Partsurfer w ebsite, http://partsurfer .hp.com/ , to ens[...]

  • Page 14

    Customer self repair ( Chapter 1 (page 7) ) Spare part number Assembly part number Description Item Mandatory 1 491911-001 AH233-3417A Filler , memory air blocker (DIMM filler) * Optional 2 491102-001 AH233-2117E Mezzanine filler * Mandatory 1 492133-001 AH233-3402A Mezzanine filler bezel * Mandatory 1 449433-001 440204-001 Blank, power supply 7 Ma[...]

  • Page 15

    3 No: Kein—Einige T eile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das T eil von einem HP Servicepartner ersetzt w erden. Im illustrierten T eilekatalog sind diese T eile mit „No“ bzw . „Nein“ gekennzeichnet. 1 Mandatory: Obligatorio—componentes para los que la reparación por [...]

  • Page 16

    S y stem com ponents 16 Illustrated P arts Catalog[...]

  • Page 17

    IMPORT ANT: The list of part numbers is current and correct as of the publication of the document. P art numbers change often. Check the HP Partsurfer w ebsite, http://partsurfer .hp.com/ , to ensure you hav e the latest part numbers associated with this server . Customer self repair ( Chapter 1 (page 7) ) Spare part number Assembly part number Des[...]

  • Page 18

    Customer self repair ( Chapter 1 (page 7) ) Spare part number Assembly part number Description Item Optional 2 448405-001 448208-001 AMD Opteron 8356 2.3 GHz 75W replacement kit (G5) Optional 2 448404-001 448208-002 AMD Opteron 8354 2.2 GHz 75W replacement kit (G5) Optional 2 508593-001 509498-001 AMD Opteron 8384 2.7 GHz 75W replacement kit (G5) O[...]

  • Page 19

    Customer self repair ( Chapter 1 (page 7) ) Spare part number Assembly part number Description Item Mandatory 1 404785-001 375861-B21 72 GB 10k SAS single port hard drive Mandatory 1 432321-001 418373-008 72 GB 15k single port SAS hard drive Mandatory 1 376597-001 375863-004 72 GB 10k dual port SAS hard drive Mandatory 1 418398-001 418373-004 72 GB[...]

  • Page 20

    2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. T outefois, si vous demandez à HP de remplacer ces pièces, l'interv ention peut ou non vous être facturée, selon le type de garantie applicab[...]

  • Page 21

    1 Mandatory: Obrigatória—P eças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. 2 Optional: Opcional—P eças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No ent[...]

  • Page 22

    22[...]

  • Page 23

    3 R emo val and r eplacemen t pr ocedur es In this section • “Required tools” (page 23) • “Safety considerations” (page 23) • “Preparation procedures” (page 24) • “Media module (SID assembly)” (page 28) • “Front Bezel” (page 29) • “Mezzanine filler ” (page 29) • “Mezzanine filler bezel” (page 29) • “Mez[...]

  • Page 24

    T o prevent electrostatic damage: • A void hand contact by transporting and storing products in static-safe containers. • Keep electrostatic-sensitiv e parts in their containers until they arrive at static-free workstations. • Place parts on a grounded surface before removing them from their containers. • A void touching pins, leads, or cir[...]

  • Page 25

    P ow er do wn the se r v er IMPORT ANT: If installing a hot-plug device, it is not necessary to pow er down the server . T o power down the server: 1. Shut down the OS as directed by the OS documentation. 2. Press the P ower On/Standby button to place the serv er in standby mode. When the server enters standby power mode, the system pow er LED chan[...]

  • Page 26

    NO TE: The release latches will lock into place when the rails are fully extended. W ARNI NG! T o reduce the risk of personal injury , be careful when pressing the server rail-release latches and sliding the server into the rack. The sliding rails could pinch y our fingers. 3. After performing the installation or maintenance procedure, slide the se[...]

  • Page 27

    5. Place the server on a sturdy , level surface. R emo v ing the acces s panel W ARNI NG! T o reduce the risk of personal injury from hot surfaces, allow the driv es and the internal system components to cool before touching them. CA UTION: Do not operate the serv er for long periods with the access panel open or removed. Operating the server in th[...]

  • Page 28

    4. After installing hardw are options, replace the access panel. Be sure that the panel is securely locked into place before powering up the serv er . Media module (S ID asse mbly) T o remove the media module: 1. P ower down the serv er ( “Pow er down the server ” (page 25) ). 2. Extend or remove the serv er from the rack ( “Extending the ser[...]

  • Page 29

    NO TE: The release latch does not need to be pressed to reinsert the media module. F r ont Bez el T o remove the front bezel: 1. P ower down the serv er ( “Pow er down the server ” (page 25) ). 2. Extend or remove the serv er from the rack ( “Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26) [...]

  • Page 30

    1. P ower down the serv er ( “Pow er down the server ” (page 25) ). 2. Press the release button. 3. Open the lever . 4. Grasp the lever and slide the processor memory cell from the enclosure. Place a hand under the component to support it as y ou remove it from the enclosure. CA UTION: Alw ays place the processor memory cell on a flat, level, a[...]

  • Page 31

    CA UTION: The cell filler is required to be place in cells 3 – 6 in a four-processor configuration. CA UTION: Before starting this procedure, read the information about protecting against electrostatic discharge ( “Preventing electrostatic discharge” (page 23) ). CA UTION: T o prevent possible serv er malfunction and damage to the equipment, [...]

  • Page 32

    5. Remove the heatsink. 6. Open the processor retaining latch and the processor socket retaining bracket. 32 Remov al and replacement procedures[...]

  • Page 33

    7. Using your fingers, remov e the failed processor . 8. If the processor has separated from the installation tool, carefully reinsert the processor in the tool. IMPORT ANT: Be sure the replacement processor remains inside the processor installation tool. 9. Align the processor installation tool with the socket and install the spare processor . CA [...]

  • Page 34

    11. Close the processor retaining latch and the processor socket retaining bracket. 34 Remov al and replacement procedures[...]

  • Page 35

    12. Clean the old thermal grease from the heatsink with an alcohol sw ab. Allow the alcohol to ev aporate before continuing. 13. Apply all the new grease to the top of the processor in one of the following patterns to ensure even distribution. 14. Install the heatsink. 15. Close the heatsink retaining bracket. 16. Replace the processor memory airfl[...]

  • Page 36

    17. Install the processor memory cell into the serv er . 18. P ower up the serv er . DIMMs Each processor memory cell can hold two to eight DIMMs, At least one pair of DIMMs must be installed in slots 1A and 2A on each processor memory cell to operate the serv er . The following DDR2 667-MHz DIMM sizes are supported: • 1 GB • 2 GB • 4 GB • [...]

  • Page 37

    S A S har d dri v e blank T o remove a SAS hard driv e blank: 1. Squeeze the tabs on the front of the filler to release it from the slot in the driv e bay . 2. Pull gently until the filler slides out of the chassis. S A S har d dri v es CA UTION: Alw ays power down the serv er if the boot partition resides on the drive you are replacing or if you a[...]

  • Page 38

    T o replace the component, reverse the remov al procedure. D VD , CD dri v e or blank T o remove a DVD, CD driv e or blank: 1. P ower down the serv er ( “Pow er down the server ” (page 25) ). 2. Extend or remove the serv er from the rack ( “Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26) ).[...]

  • Page 39

    3. Remove the pow er supply . T o replace the component, reverse the remov al procedure. Hot-plug fans The server supports redundant hot-plug fans, each with tw o individual fans rotors, in a 5+1 configuration to provide proper airflow to the server . The airflow strategy contains two thermal zones with three fan units in the bottom zone (accessed [...]

  • Page 40

    2. Pull on the fan tray release bar , pull the fan housing unit straight out from the rear of the chassis until it stops, and tilt the tray down to expose the fan housing unit. 3. Insert your thumb and forefinger into the openings on the top of the fan and squeeze until the fan releases from the socket. 4. Pull the fan straight up and out of the ch[...]

  • Page 41

    5. Pull the fan straight up and out of the chassis. IMPORT ANT: Remov e and replace only one fan at a time. If the system detects two fan failures, the server shuts down to av oid thermal damage. 6. Install a new hot-plug fan. CA UTION: T o prevent serv er components from overheating, replace a fan within 20 seconds. Failure to observe this caution[...]

  • Page 42

    T o replace the component, reverse the remov al procedure. Expansi on boar ds PCIe I/O backplane Description Item PCI Express x8 non-hot-plug expansion slot 11 1 PCI Express x16 non-hot-plug expansion slot 10 2 PCI Express x8 non-hot-plug expansion slot 9 3 PCI Express x16 non-hot-plug expansion slot 8 4 PCI Express x4 non-hot-plug expansion slot 7[...]

  • Page 43

    PCIe I/O backplane Description Item PCI Express x4 non-hot-plug expansion slot 4 8 PCI Express x4 non-hot-plug expansion slot 3 9 PCI Express x4 non-hot-plug expansion slot 2 10 PCI Express x8 non-hot-plug expansion slot 1 11 Combo PCIe/HTx I/O backplane Description Item Blank slot 1 HyperT ransport non-hot-plug expansion slot 9 2 Blank slot 3 Hype[...]

  • Page 44

    2. Extend or remove the serv er from the rack ( “Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26) ). 3. Remove the access panel ( “Removing the access panel” (page 27) ). 4. Disconnect any internal or external cables attached to the expansion board. 5. Push and hold the spring loaded latch t[...]

  • Page 45

    CA UTION: Do not detach the cable that connects the battery pack to the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. R emo v ing the cac he module CA UTION: After the serv er is powered down, w ait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED[...]

  • Page 46

    3. Remove the access panel ( “Removing the access panel” (page 27) ). CA UTION: T o prevent a serv er malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. CA UTION: After the serv er is powered down, w ait 15 seconds and th[...]

  • Page 47

    IMPORT ANT: The battery pack might hav e a low charge when installed. In this case, a POST error message displays when the serv er is powered up, indicating that the battery pack is temporarily disabled. No action is necessary . The internal circuitry automatically recharges the batteries and enables the battery pack. This process can take up to fo[...]

  • Page 48

    T o replace the component, reverse the remov al procedure. SP I (cor e I/O) boar d The System P eripheral Interconnect (SPI) board implements all the logic to support the internal devices and the standard connectivity of the product. The board includes a RAID5 SAS controller which supports up to eight of the sixteen embedded SAS disk drives. CA UTI[...]

  • Page 49

    1. P ower down the serv er ( “Pow er down the server ” (page 25) ). 2. Extend or remove the serv er from the rack ( “Extending the server from the rack” (page 25) or “Removing the server from the rack” (page 26) ). 3. Remove the access panel ( “Removing the access panel” (page 27) ). 4. Locate the battery on the SPI board ( “SPI b[...]

  • Page 50

    8. Pull the I/O backplane assembly out of the chassis. T o replace the component, reverse the remov al procedure. Mi dplane boar d CA UTION: Before starting this procedure, read the information about protecting against electrostatic discharge ( “Preventing electrostatic discharge” (page 23) ). TIP: HP recommends troubleshooting the system using[...]

  • Page 51

    CA UTION: When removing the midplane board do not allow the low er connectors to touch the chassis. Allowing the midplane board connectors to touch the chassis can damage the board. 10. Tilt the board to avoid contact betw een the lower connectors and the chassis, and pull the board out through the front of the serv er . T o replace the component, [...]

  • Page 52

    52[...]

  • Page 53

    4 Di agnos tic tools In this section • “SmartStart softw are” (page 53) • “SmartStart Scripting T oolkit” (page 53) • “HP Instant Support Enterprise Edition” (page 54) • “Option ROM Configuration for Arrays” (page 54) • “HP ROM-Based Setup Utility” (page 54) • “ROMP aq utility” (page 55) • “System Online ROM [...]

  • Page 54

    server configuration process. This automated serv er configuration process cuts time from each server deploy ed, making it possible to scale server deployments to high volumes in a rapid manner . For more information, and to download the SmartStart Scripting T oolkit, refer to the HP website ( http://www.hp.com/servers/sstoolkit ). HP Inst ant Supp[...]

  • Page 55

    R OMP aq utilit y The ROMP aq utility enables you to upgrade the system firmw are (BIOS) or Lights-Out 100 firmw are. T o upgrade the firmware, insert a ROMP aq diskette into the diskette drive or ROMP aq USB Key into an available USB port and boot the system. The ROMP aq utility checks the system and provides a choice (if more than one exists) of [...]

  • Page 56

    access to any authorized network client, sends alerts, and provides other serv er management functions. Using iLO 2, you can: • Remotely power up, pow er down, or reboot the host server . • Send alerts from iLO 2 regardless of the state of the host server . • Access adv anced troubleshooting features through the iLO 2 interface. • Diagnose [...]

  • Page 57

    by default in the system ROM. HP hardw are supports USB version 1.1 or 2.0, depending on the version of the hardw are. Legacy USB support provides USB functionality in environments where USB support is normally not av ailable. Specifically , HP provides legacy USB functionality for: • POST • RBSU • Diagnostics • DOS • Operating environmen[...]

  • Page 58

    3. Reseat the remaining processors, rebooting after each installation to identify any failed processors. 4. Replace the processor in socket 1. 5. Replace the processor board, if applicable. 6. Replace the midplane board. IMPORT ANT: If replacing the SPI board or clearing NVRAM, you must re-enter the serv er serial number through RBSU, see “Re-ent[...]

  • Page 59

    2. Bring the server to base configuration by removing all components that are not required by the server to complete POST . This process can include removing all: • “Expansion boards” (page 42) • “Processors” (page 30) IMPORT ANT: The server requires a minimum of processor memory cells 1, 2, 7, 8 and the cell filler populated with the m[...]

  • Page 60

    60[...]

  • Page 61

    5 C ompo nent i dentif i catio n In this section • “Front panel components” (page 61) • “Front panel LEDs and buttons” (page 63) • “System Insight Display LEDs” (page 64) • “SAS and SA T A hard drive LEDs” (page 66) • “SAS and SA T A hard drive LED combinations” (page 66) • “Processor memory cell components” (pag[...]

  • Page 62

    Description Item Hard drive bay 3 right 8 Hard drive bay 4 right 9 Hard drive bay 5 right 10 Hard drive bay 6 right 11 Hard drive bay 7 right 12 Hard drive bay 8 right 13 Hard drive bay 1 left (optional) not shown Hard drive bay 2 left (optional) not shown Hard drive bay 3 left (optional) not shown Hard drive bay 4 left (optional) not shown Hard dr[...]

  • Page 63

    F r ont panel LEDs and buttons Status Color Description Item UID button is not activated Off UID button and LED 1 UID button is activated for serv er identification Solid blue Server is being remotely managed Flashing blue Normal (system is off or in standby mode) Off External health LED 2 Normal (system is powered on) Solid green Redundant power s[...]

  • Page 64

    Status Color Description Item NIC not used NO TE: Rear panel NIC can show link or activity while in standby mode. Off NIC 2 LED 5 Linked to the network Solid green Linked with activity on the network Flashing green No ac power to the system Off P ower button and LED 6 System has ac power and is in standby mode Solid amber System has ac power and is[...]

  • Page 65

    system attributes. The System Insight Display LEDs identify components experiencing an error , event, or failure. CA UTION: Do not block airflow by pushing the SID flush against the serv er while it is in the down position. IMPORT ANT: When removing the access panel to view the Systems Insight Display LEDs, leav e the server pow ered on. The System[...]

  • Page 66

    Component LED Processor PROCESSOR/MEMOR Y BOARD X PROC X Processor DIMM board PROCESSOR/MEMOR Y BOARD X BOARD X S A S and S A T A hard dr i ve LEDs Status Color Des cription Item Drive failure Amber Fault/UID LED 1 Fault-process activity Flashing amber Unit identification is active Blue No fault-process activity Off Drive activity Green Online/acti[...]

  • Page 67

    Interpretation Fault/UID LED (amber/blue) Online/activity LED (green) The drive is online, but is not currently activ e. Off On CAUT I ON: Do not remov e the drive. Removing a driv e can terminate the current operation and cause data loss. The drive is part of an array that is undergoing capacity expansion or stripe migration, but a predictive fail[...]

  • Page 68

    Description Item DIMM slot 6C 6 DIMM slot 7D 7 DIMM slot 8D 8 Processor socket 9 R ear panel com ponents Description Item NIC connector 1 1 Keyboard connector 2 USB connector 3 Video connector 4 Serial connector 5 iLO 2 connector 6 Mouse connector 7 NIC connector 2 8 P ower supply 1 9 P ower supply 2 10 P ower supply 3 11 Redundant power supply 4 ([...]

  • Page 69

    Description Item Fan 5 18 Fan 6 19 R ear panel LEDs and buttons Status LED Color Des cription Item Activ ated Solid blue UID 1 Server remotely managed Flashing blue Deactiv ated Off Linked to network Green LAN Link LED 2 Not linked to network Off Network activity Green (solid or flashing) LAN Activity LED 3 No network activity Off Rear panel LEDs a[...]

  • Page 70

    P o w er suppl y LED Status Color No ac power Off ac power; standby pow er on Blinking green Full power on; normal operation Solid green P ower supply failure Blinking amber Inte rnal co mponen ts Description Item Media module 1 Fan 3 2 Fan 2 3 70 Component identification[...]

  • Page 71

    Description Item Fan 1 4 System maintenance switch SW6 5 System maintenance switch SW1 6 SPI Board 7 PCI Express x8 non-hot-plug expansion slot 11 8 PCI Express x16 non-hot-plug expansion slot 10 9 PCI Express x8 non-hot-plug expansion slot 9 10 PCI Express x16 non-hot-plug expansion slot 8 11 PCI Express x4 non-hot-plug expansion slot 7 12 PCI Exp[...]

  • Page 72

    Combo PCIe/HTx I/O backplane Description Item Blank slot 3 HyperT ransport non-hot-plug expansion slot 8 4 PCI Express x4 non-hot-plug expansion slot 7 5 PCI Express x4 non-hot-plug expansion slot 6 6 PCI Express x16 non-hot-plug expansion slot 5 7 PCI Express x4 non-hot-plug expansion slot 4 8 PCI Express x4 non-hot-plug expansion slot 3 9 PCI Exp[...]

  • Page 73

    Function Sw itch Description P osition System configuration can be changed Off Configuration lock 2 System configuration is locked On Reserved — Reserved 3 Reserved — Reserved 4 P assword is enabled Off P assword protection override 5 P assword is disabled On Switch has no function Off Reset configuration 6 ROM reads system configuration as inv[...]

  • Page 74

    S y stem maint enance s w itc h (S W1 ) CA UTION: All supported AMD Opteron quad-core processors 3.1 GHz or greater and all supported AMD Opteron six-core processors require the system maintenance switch, located on the I/O backplane, (SW1) position 5 to be in the On position. HP recommends updating to the latest v ersion of firmw are. Earlier firm[...]

  • Page 75

    T able 5- 2 Batter y health and BBW C status LED patterns (continued) Interpretation LED 4 pattern LED 3 pattern The battery pack is below the minimum charge level and is being charged. Features that require a battery (such as write cache, capacity expansion, stripe size migration, and RAID migration) are temporarily unavailable until charging is c[...]

  • Page 76

    Description Item Fan 1 1 Fan 2 2 Fan 3 3 Fan 4 4 Fan 5 5 Fan 6 6 76 Component identification[...]

  • Page 77

    6 C abling In this section • “Cabling overview” (page 77) • “BBWC cabling” (page 77) • “SAS and SA T A hard drive cabling” (page 78) • “SAS expander cabling” (page 78) • “High power graphics card cabling” (page 80) Ca bling o v erv ie w This section provides guidelines that help you make informed decisions about cablin[...]

  • Page 78

    S A S and S A T A hard dr i ve ca bling CA UTION: When routing cables, alw ays be sure that the cables are not in a position where they can be pinched or crimped. S A S e xpander cabling T o install a SAS expander: 1. P ower down the serv er ( “Pow er down the server ” (page 25) ). 2. Extend or remove the serv er from the rack ( “Extending th[...]

  • Page 79

    6. Install together the Smart Array Controller into slot 1 and the SAS expander into slot 2 ( “Expansion boards” (page 42) ). 7. Route and connect the cables from the SAS expander to the SAS backplanes. SAS expander cabling 79[...]

  • Page 80

    TIP: For best cable management route the cable to SAS backplane 1 under the pow er cable at the power supply backplane and the cable to SAS backplane 2 under other cables in the center cable routing channel. Hi gh po w er gr aphic s car d cabling IMPORT ANT: Install high pow ered graphics cards in PCIe 16x slots for optimum performance. The server [...]

  • Page 81

    7 S pec if i catio ns In this section • “Environmental specification” (page 81) • “Server specifications” (page 81) En vir onmental s pec ifi cation V alue Specification T emperature range 10°C to 35°C (50°F to 95°F) 1 Operating -30°C to 60°C (-22°F to 140°F) 2 Non-operating 28°C (82.4°F) Maximum wet bulb temperature Relative [...]

  • Page 82

    V alue Specification 47- 63 Hz 47- 63 Hz Rated input frequency 14A at 200 V ac 24A at100 V ac Rated input current 2800 W 2400 W Rated input power 9554 8189 BTUs per hour High line 3 Low line Power supply output 1200 W per P .S.U. at 3 P .S.U. active 800 W per P .S.U. at 3 P .S.U. active P ower supply output Acoustic Noise 4 L W Ad 7.6 B Idle LpAm 5[...]

  • Page 83

    8 T echni cal support In this section • “Before you contact HP” (page 83) • “HP contact information” (page 83) Bef or e yo u contac t HP Be sure to have the following information av ailable before you call HP: • T echnical support registration number (if applicable) • Product serial number • Product model name and number • Appli[...]

  • Page 84

    84[...]

  • Page 85

    A A c r on y ms and abbr e v iati ons ABEND abnormal end ACU Array Configuration Utility ADU Array Diagnostics Utility AMD Adv anced Micro Devices ASR Automatic Server Recov ery BBWR battery-backed write cache BIOS Basic Input/Output System CSA Canadian Standards Association CSR Customer Self Repair DIMM dual inline memory module DOS disk operating[...]

  • Page 86

    TMRA recommended ambient operating temperature UID unit identification UPS uninterruptible pow er system USB univ ersal serial bus VCA V ersion Control Agent 86 Acronyms and abbreviations[...]

  • Page 87

    Inde x A access panel, 27 ASR ( see Automatic Server Recov ery (ASR)) Automatic Server Recov ery (ASR), 56 B battery-backed write cache battery pack, 45 data recovery , 47 battery-backed write cache (BBWC), 44 BBWC ( see battery-backed write cache) LED ( see LED, battery pack) blanks DVD or CD, 38 hard drive, 37 power supply , 38 C cabling, 77–80[...]

  • Page 88

    R rack extending server from, 25 removing server from, 26 RBSU (HP ROM-Based Setup Utility), 54 remov al and replacement procedures, 23 required tools, 23 ROM updating, 55 ROMP aq Utility , 55 S safety considerations, 23 SAS backplane, 44 hard drives, 37 serial number , 48 SID ( see System Insight Display) SmartStart Scripting T oolkit, 53 SmartSta[...]

  • Page 89

    89[...]

  • Page 90

    *AH233-9002A_ed7* Prin ted in the US[...]