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Intel 0.9 manuel d'utilisation

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Table des matières du manuel d’utilisation

  • Page 1

    Intel ATX Powe r Supply Design Guide Version 0.9[...]

  • Page 2

    Intel ATX Power Supply D esign Guide Version 0.9 Page 2 IMPORTANT INFORMATION AND DISCLAIMERS 1. I NTEL CORPORATI ON (AND ANY CONTRI BUTOR) MAKES NO WARRANTIES WI TH REGARD TO THI S DOCUMENT AND IN PARTI CUL AR DOES NOT WARRANT OR REPRESENT THAT THIS DOCUMENT OR ANY PRODUCTS MADE I N CONFORMANCE WITH I T WI L L WORK IN THE I NTENDED MANNER. NOR DOE[...]

  • Page 3

    Intel ATX Power Supply D esign Guide Version 0.9 Page 3 Content s 1. Scope .................................................................................................................. 6 2. A pplicable Documents ...................................................................................... 7 3. Electrical Specification ................[...]

  • Page 4

    Intel ATX Power Supply D esign Guide Version 0.9 Page 4 4.4 AC Connector ........................................................................................................................ 23 4.5 DC Connectors ...................................................................................................................... 23 4.5.1 ATX Mai[...]

  • Page 5

    Intel ATX Power Supply D esign Guide Version 0.9 Page 5 Figures Figure 1: Power Supply Tim ing ............................................................................................................. 16 Figure 2: Power Supply Dimensions f or Chassis in W hich the P/S Does Not Cool Pr ocess or ............21 Figure 3: Power Supply Dimensions f [...]

  • Page 6

    Intel ATX Power Supply D esign Guide Version 0.9 Page 6 1. Scope This document outlines a reference ATX power supply that complies with the ATX Specification, Version 2.02 for motherboards and chassis. I t is intended to provide additional power supply design information not detailed in the ATX 2.02 specification, including information about the ph[...]

  • Page 7

    Intel ATX Power Supply D esign Guide Version 0.9 Page 7 2. Applicable Document s The latest revision in effect of the following documents forms a part of this document to the extent speci fied. AB13-94-146 EACEM European Association of Consumer Electronics Manufacturers. Hazardous Substance List / Certification. ANSI C62.41-1991 IEEE Recommended Pr[...]

  • Page 8

    Intel ATX Power Supply D esign Guide Version 0.9 Page 8 3. Electrical S pecification The electrical requirem ents that foll ow are to be met over the envi ronmental ranges specified in Section 5 unless otherwise noted. 3.1 A C Input Requirements The power supply shall be capable of supplying full rated output power over two input voltage rang es ra[...]

  • Page 9

    Intel ATX Power Supply D esign Guide Version 0.9 Page 9 3.1.4 Immunity 3.1.4.1 Slow Transients The DC output(s) shall not exceed the limits specified in Section 3.2.1 as a result of the input power line noise defined in Table 2 under any load condition per EN 61000-4-11. Table 2: A C Line Voltage Transient Limits Duration Sag / Surge Operating AC V[...]

  • Page 10

    Intel ATX Power Supply D esign Guide Version 0.9 Page 10 3.1.4.2.3 Ring Wav e, A NSI C62.45-1992 The crest value of the first half peak of the injected oscillatory wave will be 3.0 kV open circuit, with 200 and 500 A short circuit currents for the common and the normal modes of transient surge injection, respectively . No unsafe operation is allowe[...]

  • Page 11

    Intel ATX Power Supply D esign Guide Version 0.9 Page 11 3.1.5 Catastrophi c Fai l ur e Pr otecti on The primary circuit design and the components specified in the same should be such that, should a component failure occur, the power supply should not ex hibit any of the following: • Flame • Excessive smoke • Charred PCB • Fused PCB conduct[...]

  • Page 12

    Intel ATX Power Supply D esign Guide Version 0.9 Page 12 3.3 Ty pical Pow er Distribution Although power requirements and distributions will depend on the specific sy stem options and implementation, this section identifies several potential configurations. For a sing le processor mini-tower configuration with one I SA slot, three PCI slots, one sh[...]

  • Page 13

    Intel ATX Power Supply D esign Guide Version 0.9 Page 13 Table 6: Ty pical Pow er Distribution for a 250 W Configuration Output Min. Current (amps) Max. Current (amps) Peak Current (amps) Notes: Requires the 1x 6 auxiliary power connector to carry the 3.3 V & 5 V currents to the PCB. +12VDC 0.0 10.0 12.0 +5VDC 1.0 25.0 +3.3VDC and +5VDC combine[...]

  • Page 14

    Intel ATX Power Supply D esign Guide Version 0.9 Page 14 3.3.3 Output Ripple/Noise The following output ripple/noise requirements should be met throughout the load rang es specified in Section 3.3, and under all input voltage conditions as specified in Section 3.1. Ripple and noise are defined as periodic or random signals over a frequency band of [...]

  • Page 15

    Intel ATX Power Supply D esign Guide Version 0.9 Page 15 3.3.7 +5VDC/+3.3VDC Pow er Sequencing The +5VDC output leve l must be equal to or g reater than the +3.3VDC output at a ll times during power-up and normal operation. The time between the +5VDC output reaching its minimum in-regulation level and +3.3VDC reaching its mini mum in-regulati on le[...]

  • Page 16

    Intel ATX Power Supply D esign Guide Version 0.9 Page 16 3.4 Timing / Housekeeping / Control PS_ON# +5VDC/+3.3VDC O/P PWR_OK PWR_OK Sense Lev el = 95% of nominal Off On 95% 10% ~ ~ ~ T2 T3 T5 T4 Figure 1: Pow er Supply Timing Notes: T 2 is defined in Section 3.4.5. T 3 , T 4 , and T 5 are defined in Table 9. 3.4.1 PWR_OK PWR_OK is a “power good?[...]

  • Page 17

    Intel ATX Power Supply D esign Guide Version 0.9 Page 17 3.4.2 PS_ON# PS_ON# is an active-low, TTL -compatible signal that a llows a motherboard to remote ly control the power supply in conjunction with features such as soft on/off, wake-on-LAN, or wake-on-modem. When PS_ON# is pulled to TTL low, the power supply should turn on the five main DC out[...]

  • Page 18

    Intel ATX Power Supply D esign Guide Version 0.9 Page 18 3.4.5 Risetime The output voltages shall rise from <10% of nominal to within the reg ulation ranges specified in Section 3.2.1 within 0.1 ms to 20 ms (0.1 ms ≤ T 2 ≤ 20 ms). 3.4.6 Overshoot at Tur n-on/Turn-off The output voltage overshoot upon the application or removal of the input v[...]

  • Page 19

    Intel ATX Power Supply D esign Guide Version 0.9 Page 19 3.5 Output Protection 3.5.1 Overv oltage Protection The overvoltage sense circuitry and reference shall reside in packages that are separate and distinct from the regulator control circuitry and reference. No single point fault shall be able to cause a sustained overvoltage condition on any o[...]

  • Page 20

    Intel ATX Power Supply D esign Guide Version 0.9 Page 20 4. Mechanical Requirement s 4.1 Labeling / Marking Each supply shall be marked with the following, at minimum: • Access warning text (“Do not remove this cover. Trained service personnel only . No user serviceable components inside.”) in English, German, Spanish, French, Chinese, and Ja[...]

  • Page 21

    Intel ATX Power Supply D esign Guide Version 0.9 Page 21 3. T olerances: X +/- 1 X.X +/- 0.5 4. If a wire grill is required f or acoustics or thermals, the grill and screws must be flush mounted. Air inlet grill, 55% open area. Optional air inlet area. Optional air inlet area. 53 REF WIRE HARNESS 16 REF 150 REF 20.0 (2X) 4.0X6 (2X) 146.0 140 REF No[...]

  • Page 22

    Intel ATX Power Supply D esign Guide Version 0.9 Page 22 53 REF WIRE HARNESS 16 REF 150 REF 20.0 (2X) 4.0X6 94.0 11.0 x 5.0 cutouts (4X); min 6.0 clearance under cutout from inside top cov er. See Note 5. Area on top surf ace inside dotted lines should hav e 60% minimum open area f or proper venting. Eight rectangular holes are f or air duct mounti[...]

  • Page 23

    Intel ATX Power Supply D esign Guide Version 0.9 Page 23 4.3 A irflow / Fan I n general, exhausting warm air from the chassis enclosure via a power supply fan at the rear panel is the preferred sy stem-level airflow solution. Other solutions may be implemented, however, and some sy stem/chassis designers may reverse this airflow to meet specific sy[...]

  • Page 24

    Intel ATX Power Supply D esign Guide Version 0.9 Page 24 +3.3VDC COM +5VDC COM +5VDC COM PWR_OK +5VSB +12VDC +3.3VDC -12VDC COM PS_ON# COM COM COM -5VDC +5VDC +5VDC Pin 11 Pin 1 A TX Main P ow er Connector COM COM COM +3.3VDC +3.3VDC +5VDC A ux P ower Pin 1 Pin 6 (250 W & 300 W Systems) Connector +12VDC COM COM +5VDC P eripheral P ower Connecto[...]

  • Page 25

    Intel ATX Power Supply D esign Guide Version 0.9 Page 25 4.5.2 A uxiliary Pow er Connector (for 250 W and 300 W Configur ati ons) Connector: Molex 90331-0010 (key ed pin 6) or equivalent Pin Signal 16 AWG Wire 1 COM Black 2 COM Black 3 COM Black 4 +3.3VDC Orange 5 +3.3VDC Orange 6 +5VDC Red 4.5.3 Peri pheral Connector (s) Connector: A MP 1-480424-0[...]

  • Page 26

    Intel ATX Power Supply D esign Guide Version 0.9 Page 26 5. Environment al Requirement s 5.1 Temperature Operating ambient +10 °C min +50 °C max (At full load, with a maximum rate of chang e of 5 °C/10 minutes, but no more than 10 °C/hr.) Nonoperating ambient -40 °C to +70 °C (Maximum rate of change of 20 °C/hr.) 5.2 Thermal Shock (Shipping)[...]

  • Page 27

    Intel ATX Power Supply D esign Guide Version 0.9 Page 27 5.6 Random Vibration Nonoperating 0.01 g ²/Hz at 5 Hz, sloping to 0.02 g²/Hz at 20 Hz, and maintaining 0.02 g²/Hz from 20 Hz to 500 Hz. The area under the PSD curve is 3.13 gRMS. The duration shall be 10 minutes per axis for all three axes on all samples. 5.7 A coustics Acoustic requiremen[...]

  • Page 28

    Intel ATX Power Supply D esign Guide Version 0.9 Page 28 6. Electromagnetic Co mp atibility 6.1 EMI The power supply shall comply with CI SPR 22, Class B, for both conducted and radiated emissions with a 4 dB margin. Tests shall be conducted using a shielded DC output cable to a shielded load. The load shall be adjusted as follows for three t ests:[...]

  • Page 29

    Intel ATX Power Supply D esign Guide Version 0.9 Page 29 7. Reliability 7.1 Component Derating The following component derating g uidelines shall be followed: • Semiconductor junction temperatures shall not exceed 110 °C with an ambient of 50 °C. Any ex ceptions are subject to final approval. • I nductor case temperature shall not exceed safe[...]

  • Page 30

    Intel ATX Power Supply D esign Guide Version 0.9 Page 30 8. Safety Requirement s 8.1 North A merica The power supply must be certified by UL or CSA for use in the USA and Canada under the following conditions: • The supply must be Recognized for use in Information Technology Equipment including Electrical Business Equipment per UL 1950, 3 rd edit[...]

  • Page 31

    Intel ATX Power Supply D esign Guide Version 0.9 Page 31 8.2 International The vendor must provide a complete CB certificate and test report to I EC 950, 2 nd edition + A1, A2, A3, and A4. The CB report must include AL L CB member country national deviations. CB report must include evaluation to EN60 950, + A1, A2, A3, A4 and EMKO-TSE (74-SEC) 207/[...]