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Intel OCPRF100 MP manuel d'utilisation

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Table des matières du manuel d’utilisation

  • Page 1

    OCPRF100 MP Server System Supporting Up T o Eight Intel ® Penti um ® II I Xeo n ™ Processors T echnical Product Specification Intel O rder #75367 4-001 Revision 1.0[...]

  • Page 2

    OPRF100 M P Board Set Tech nical Product Specifi cation Revi sion 1. 0 Revision History Disc laimers Except as pr ovided in I ntel’ s T erms and Condit ions of Sale for such pro duct s, INTEL DISCLAIMS ALL LIABILITIES AND W ARRANTIES (EXPRES S, IMPLIED OR OTHERWISE) ASSOCIA TED WITH THE INFORMA TION CONT AINED WITHIN THIS DOCUMENT , OR FOR ANY PR[...]

  • Page 3

    OPRF100 M P Board Set Technical Prod uct Specification Revi sion 1. 0 Only approved soft ware drivers and accessories th at are recommended for the revision numbe r of the boards and system being operated should be used with Int el products . Please note that, as a result of warr anty repair s or replacement s, alternate soft ware and firmware vers[...]

  • Page 4

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 i Introduct ion ..... ......... ......... ......... ......... ......... ........... .......... ......... ......... ......... ........... ...... ........ 1 Server System Chassis and Assemblies ......... .. .............. .. .. ................ ............... .. .. .. .......[...]

  • Page 5

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 ii Fan Connector ............ .. ............ .. ............... .. ............ .. ............... .. ............ .. ............... . 47 Peri ph e r a l Bay P o w e r C o n nec t or .......... ...... ....... ....... .. ...... ....... ....... ...... ....... .. ....... ....[...]

  • Page 6

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 iii Adv anced M enu ....... ....... ...... ....... ....... ...... ....... ...... ....... ....... ...... ....... ....... ...... ....... .... 7 8 Sec ur it y M e n u . .. ....... ....... ...... ... ...... ....... ...... ....... ....... .. ...... ....... ....... ...... ....... [...]

  • Page 7

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 iv Mech anical Des criptio n .... ....... ....... ...... ....... ...... ....... ....... ...... ....... ....... ........ ....... ....... .... 111 Board La y out ........ .. ...... ....... ....... .. ....... ...... ....... ...... ....... ....... ...... ....... ....... .. .....[...]

  • Page 8

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 1 1. Introduction This document provides an over view of the OCPRF100 MP server syste m and includ es informa- tion on cabling, conne ctors, power supply , and regulatory requirement s. Document S tructure and Outl ine This document is organized i nto ten chapt ers: Chapter [...]

  • Page 9

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 2 This p age intentionall y left blank.[...]

  • Page 10

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 3 2. Serve r Syste m Chas si s an d Ass embli es This chapter desc ribes the chassis and assembly pieces that re side within the chassis. Thi s chapter i s divided int o the following areas: • Front p anel assembly • Peripheral bay • T op cover assembly • Fan bay •[...]

  • Page 11

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 4 2.1 Front Panel Assembly The front panel as sembly consist s of an upper and lower bezel. The bezels se rve as cosmetic pieces onl y , and can be integr ator specific. Fi nger grips are provided t o make it easy t o remove the bezels. Removi ng the bezel s expose s the fro[...]

  • Page 12

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 5 Figure 2-3: Peripheral Bay 2.3 T op Cover Assembl y The top cover assembly i s released by removi ng the two retaining scr ews loca ted on the top toward the front (E in Fig ure 2-4: Hot- plug PCI Access Door), between the fan bay assembl y and the top cover assembl y mark[...]

  • Page 13

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 6 2.3.1 Hot-plug PCI Access Door The hot-plug PCI access door is re leased by removi ng the two ret aini ng screws (A in Figur e 2-4: Hot-plug PCI Access Door) located on the top, middle area of the server . The cover slides toward the rear of the server and lift s straight [...]

  • Page 14

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 7 The fan bay will operate at hi gh speed on the fol l owing conditions: • Internal temperature has r eached an elevat ed, but noncriti cal set-point. • Ambient temperat e exceeds 30 ° C. • A fan has entered into t he predi cti ve failure mode. • A fan has failed. I[...]

  • Page 15

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 8 Fans are inst all ed with th e connect or on the lef t side fac ing down. The cavi ties i n the fan bay are keyed to prevent a fan fr om being i nst alled backwards. The fan bay is inst alled after the Profusio n carrier assembly is insta lled and complet ely seated into t[...]

  • Page 16

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 9 Figure 2-6: Front Panel Board Installation 2.6 Processor Mezzanine Board The base configura tion of an OCPRF100 MP server system consist s of a single processor mez- zanine board. The processor mezzanine board is designed t o support one to four Pentium ® III Xeon ™ pro[...]

  • Page 17

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 10 Figure 2-7: Processor Retention Mechanism A processor/t ermi nation card pai r is secured wi th a hold- down strap (B) that hooks into the back of the retention mechani sm and is fas tened at the fr ont wi th two captive screws (A). (The reten- tion str ap is for a p ai r[...]

  • Page 18

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 11 2.8 Profusion ® Carrier T ray The processor mez zani ne boards plug into the Profusion car ri e r tr ay . The Profusion car rier tray serves as a pla tf orm to prov ide power and signals to the processor mezzani ne board , route sig- nals through th e 1008-pi n grand con[...]

  • Page 19

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 12 then moving back int o place fo r connection to the Profusion carri er board. Place the four lock bars over the protrudi ng tabs and onto the Profusion car rier board (B). The release handles of the lock bars (C) should be pointed to the outsid e of the board and they sho[...]

  • Page 20

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 13 nectors begin to engage, rotate the levers back until the connect ors are fully engaged. Levers should be in an upright or near upr igh t position. Secure the tray and the process or ret ention mechanism to th e sides of the chassis wit h screws (1) and (2) as indicated i[...]

  • Page 21

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 14 Figure 2- 1 1 : Midplane Assembly In stalled in S ystem 2.10 I/O Carr ie r The I/O car rier is t he in terf ace that con nect s t he I/ O port of t he Pr ofusio n chi p s et to the foll owing : • T en hot-swappabl e PCI slot s (four of which support 66 -MHz transactions[...]

  • Page 22

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 15 Figure 2-12: I/O Carrier Tray The I/O c arrier tr ay features t abs on the base of the tr ay that engage i nto slots on the horiz ontal members in the chassis . Lower th e tray from the to p of the system and sli de the tr ay toward the center of the chassis usi ng t he t[...]

  • Page 23

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 16 The PHP mechanism is a rotat ing part that actuat es a swit ch located on the PHP board. There are four l ight emitti ng diodes ( LEDs) per slot- -two can be vi ewed from the r ear of the sy stem and two from i nside the syst em . Once the LED shows which slot is powered [...]

  • Page 24

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 17 3. System Ov erv iew This chapter desc ri bes the features of the OCPRF100 MP server system chassis. System Features T able 3-1 provi des a list and brief descript ion of the feat ures of the OCPRF100 MP server sys- tem, which uti lizes t he OPRF100 board set. 3.1 Introdu[...]

  • Page 25

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 18 up to 16 GB o f error correcti on code (ECC) PC-100 comp atible regi stered DIMMs. The I/O c arrier conta ins four 66-MHz and six 33-MHz 64-bit hot-swap PCI sl ots, I/O ports, and various control - lers. Figure 3-1: OCPRF10 0 MP Server System Chassis with Per ipheral Bay [...]

  • Page 26

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 19 Figure 3-2 : OPRF100 Boar d Set/Sys tem Board Lo cations within Server Ch assis The peripheral bay mounted at t he lower front of the chas sis supports a 3.5- in ch floppy drive, a half-height 5.25-inch dev ice (e.g., CD-ROM) and two 3.5-i nch by 1.0- or 1 .6-inch hot- sw[...]

  • Page 27

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 20 Figure 3-3 : OCPRF100 M P Server Sy stem Chassis Block Diagram 3.2 External Chassis Featur es 3.2.1 Front V iew of Chas sis The front bezel of the serv er has two main user-accessible areas : Front pa nel liquid cryst al display (LCD), switche s and indi cat ors. Replacea[...]

  • Page 28

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 21 Figure 3-4: Front V iew of Chassis with No Bezel T a ble 3-2: Syst em Feature s – Front Item F eatu re Desc ript ion Front Panel Co ntrols and Indicators A Power swit ch When pres sed, turns th e DC power inside the server o n or off. B Reset sw itch When pres sed, rese[...]

  • Page 29

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 22 F Fan fault L ED (yellow) When lit, in dicates eith er a fan failur e, or that a pred ictive fan fail ure has been dete cted in the s erver . G Drive fa ult LED (yellow) When con tinuously l it, indicates a n asserted fault status o n one or more hard dis k d riv es in th[...]

  • Page 30

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 23 3.2.2 Rea r View of Chassis Figure 3-5 : Rear V i ew of Chassis T able 3-3: System Features – Re ar Item Descrip tion A PCI add -in board slo ts. B Exter nal L V DS connect or . C I C MB connectors in /out. D I /O riser board . E AC in put po wer co nnec t or . F Three [...]

  • Page 31

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 24 3.2.3 Riser Boa rd External I/O Connectors Figur e 3-6: Riser Bo ard Extern al I/O Connect ors G PWR LED (g reen) – power condi tio n – refe r to Chapter Power Supp ly for deta ils. H F AIL LED (yellow) – failure cond ition – refer to C hapter Power Supp ly for de[...]

  • Page 32

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 25 3.2.4 P eriphe ral Ba y An optional periphera l bay provides the following: • One 3.5-inch fl oppy dri ve bay • One 5.25-i nch user-accessibl e drive bay for removable media • T wo 3.5 -i nch by 1.0- or 1.6-inch hot-swap bays for SCSI SCA hard disk dri ves Figure 3-[...]

  • Page 33

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 26 3.2.5 3 .5-inch User-a ccessible Drive Bay The system ship s from the factory without the per ipheral bay instal led. 3.2.6 5 .25-inch User- accessible Driv e Bay The system ship s from the factory without the per ipheral bay instal led. Note: Inst allation of hard disk d[...]

  • Page 34

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 27 3.3 Internal Chassis Features 3.3.1 Powe r Syst em Three 750-W suppli es in a st andard configurati on provide the modular power sys tem for the sys- tem. The power system may be c onfigured with t hree power suppli es (2+1) for power redun- dancy , or with two supplies i[...]

  • Page 35

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 28 Profusi on ® Min. Load Adc 4.60 0.75 0.25 0.000 0.00 21. 93 Carrier w/ Max. Lo ad Adc 12.00 1.50 46.00 0.000 0.00 599.10 Mezzanines Max. Step Load Adc 2.00 0.75 18.00 Front P anel M in. Load Adc 0.00 0.05 2.00 0.001 0.10 24. 76 Max. Load Ad c 0.00 0.23 5.40 0.010 0.25 67[...]

  • Page 36

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 29 Notes: 1. There is no 240 V A protectio n circuit in the OCPRF100 MP server sy stem. 2. Minimum load for second memory carrier is zero; assumes no carrier is inst alled. 3.3.2 Cooling Syst em 3.3.2.1 Descr iption There are two independent cool ing subsystems: The upper sy[...]

  • Page 37

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 30 ies the fan i nput voltag e. At 28 ° C ambient temperatu re, the fan input volt age is 8.0 ± 0.5 Vdc, and at 35 ° C, t he fan input voltage is 13.5 Vdc. 3.3.2.3 Cooling Summary The system fans are size d to provi de cooling for up to eight Pentium III Xeon proc essors.[...]

  • Page 38

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 31 3.3.3 PCI Hot-plug 3.3.3.1 Descr iption PCI hot plug (PHP) is the concept of remo vin g or inser ti ng a standard PCI adapter card fr om a system without stoppi ng the softwar e or poweri ng down the system as a whole. “ Hot Replace ” means the user can repl ace a PCI[...]

  • Page 39

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 32 • Receive s user in put and sends requests to the service layer • Displays th e st at us of the PCI slot • Provides user with acces s to PHP functions that may be avail able through multiple in ter- face s Hot-plug Servi ce • Provides communication between the use[...]

  • Page 40

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 33 • A 240 V A protect ive shield on t he I/O baseboard and the plasti c dividers between PCI slot s The LED PC board contai ns both t he green and amber LEDs, as well as the switch that controls the PCI slot power . These it ems wil l no longe r resi de on the I/O carrier[...]

  • Page 41

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 34 Figure 3-10: PCI Ca rd Retention Mechanism Revised non- hot plug, hot plug, and top c over s are re quired t o ac commodate t he addit ional hard - ware used i n this enhanced so lution. 3.4 Server Management The server syste m management archi tect ure features several m[...]

  • Page 42

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 35 the +5 V standb y output of the power supply . Th e FPC takes part in implement ing the following syste m fun c ti ons: • Powe r a n d re s e t s w it ch in te r face s • Fan failur e detect ion • Chassis FRU inventory • System hard reset gener ation • System po[...]

  • Page 43

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 36 • Secure mode, video blan k, and floppy write prote ct • Front pa nel NMI monitoring • Software front p anel NMI generation 3.4.3 Hot-swap Controller The hot-swap con troll er (HSC) on th e L VDS SCSI hot-swap backpl ane is con necte d to o ther sys - tem boards via[...]

  • Page 44

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 37 3.6 Specificati ons 3.6.1 Environme ntal Spe c ifications The system will be tes ted to the envi ronmental speci fications as indi cated in T able 3-8. 3.6. 2 Phy sical Specif ications T able 3-8 descri bes the physical specifications of the system. T able 3 -8: Envi ronm[...]

  • Page 45

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 38 Notes: 1. The sys tem weight li sted above is only an a pproximatio n and can va ry depending on numb er of periphera ls and add-in c ards in the sys tem. 2. The syste m dimensions exclude the power supply handles for dep th. T able 3-8: Dimensions and Weight Specificati [...]

  • Page 46

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 39 4. Cab les and Connectors This chapter desc ribes cables and connectors that inte rconn ect various component s of the OCPRF100 MP server system. The block diagr am in Figure 4-1: OCPRF100 Server System Interconnect Diagr am shows cabl es that connect t he boards used i n[...]

  • Page 47

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 40 Fig ure 4-1: OCPRF1 00 Serve r System Inter connect Diagra m Mezzanine Memory Carrier (16 DIMMs) Hot-Swap Power Supply 5-1/4 CD-ROM Half Height (Single Device Option Only) Floppy 36 Pin Berg* Connector CBL,PWR,AC (External Interface) FAN FAN FAN FAN FAN FAN Front panel Fl[...]

  • Page 48

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 41 4.1 Cables T able 4-1 th rough T able 4-3 list flat ri bbon c ables and wir e b undles t hat ar e used in t he assembly of the O CPRF100 MP server s ystem. T able 4-1: Flat Ri bbon Cables Quantity Number of Pins T ype Path 1 68 Wide SCSI c able w/VHDCI interco nne ct modu[...]

  • Page 49

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 42 4.2 Connectors The followi ng secti on describes the signals and pinout s for various connectors on the OPRF100 board set. 4.2.1 User-accessible I/O Connectors 4.2.1.1 Keyboard and Mouse Ports These ident ical PS/2-compa tible ports share a common housin g. The top port i[...]

  • Page 50

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 43 4.2.2 S erial Port s The I/O carrie r provides two stacked RS-232C ser ial ports (the top one is COM1 and the bottom one is COM2). They are D-subminiature 9-pin connectors. Ea ch serial port can be e nabled sepa- rately wit h the conf iguration control provi ded on the I/[...]

  • Page 51

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 44 4.2.3 P arallel Port The IEEE 1284-compat ible parallel port — us ed primarily for a printe r — sends data in p arallel for- mat. The pa rallel port is accessed th rough a D-subminiature 25-pin connect or . Figure 4-4: Paralle l Port Connector 4.2.4 VGA V ideo Port Th[...]

  • Page 52

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 45 Figure 4-5: V ideo Connector 4.2.5 Univ ersal Serial Bus Interface The built-in USB port s permit the direct connecti on of two USB perip herals without an external hub. If more devi ces are r equi red, an exte rnal hub can be connected t o eit her o f the bui lt-in port [...]

  • Page 53

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 46 Figure 4- 6: Dual USB C onnector 4.2.6 ICMB Connectors The ICMB connector provides ext ernal access to the ICMB. This makes it possible to ext ernal ly access chass is management functi ons, alert logs , post-mortem dat a, etc. I t also provides a mechanism for chassi s p[...]

  • Page 54

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 47 Figure 4-7: ICMB Connector 4.2.7 Fan Connector 4.2. 8 Periphe ral Bay Power Connector T able 4-10: Fan C onnectors ( J1A1,J9A1, J10A1) Pin Signal 1G r o u n d 2 VCCF AN 3G r o u n d 4 F AN_T ach T able 4-1 1: Peripheral Bay Power Connector Pin Signal Color 1+ 1 2 V Y e l [...]

  • Page 55

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 48 4.2.9 P eripheral Bay Ba ckplane Header 12 GND Blac k 13 +12V Y e llow 14 +5V Red 15 GND Blac k 16 +5V Red 17 GND Blac k 18 SD A Light Blue 19 GND Blac k 20 RST_I2C_L Violet T able 4 -12: Periph eral Bay Ba ckplane He ader (240 posi tion) Column A B C D E 1 RESET(1) GND D[...]

  • Page 56

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 49 16 D A1 (33) GND DA0 (3 5) G ND FD_MT R1_L 17 DASP (39) G ND CS1 (38) GND FD_MSEN1 18 GND GND GND GND FD_DIR_L 19 GND GND FD_STEP_L GND GND 20 FD_WDA T A_L G ND GND GND FD_WGA TE_L 21 GND GND FD_TRK0_L GND FD_MSEN0 22 FD_WPROT_L GND GND GND FD_RDA T A_L 23 GND GND FD_HDSE[...]

  • Page 57

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 50 4.2.10 LED Board Connector 46 +5V +5V S68 (-DB 1 1) GND GN D 47 +5V +5V S34 (+DB 1 1) SDA RST_I2C_L 48 +5V +5V +5V PW R_GOOD SCL T able 4-13: LED Board Connectors Signal Name Pin # Pin # Signal Name S1_A_SWITCH 1 2 S2_A_SWITC H S1_A_GREEN 3 4 S2_A_GREEN S1_A_AMBER 5 6 S2_[...]

  • Page 58

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 51 4.2.1 1 SCSI Connector T able 4-14: SCS I Connector WIDE SCSI CONNECTOR Pin S ignal Signal Pin 1 S1 (+ DB 12) S35 ( -DB 12 ) 35 2 S2 (-DB 13 ) S36 (-DB 13) 36 3 S3 (+ DB 14) S37 ( -DB 14 ) 37 4 S4 (+ DB 15) S38 ( -DB 15 ) 38 5 S5 (+DB P1 ) S39 (-DB P1) 39 6 S6 (+ DB 0) S4[...]

  • Page 59

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 52 4.2.12 IDE Connectors 28 S28 (+C /D) S62 (-C/D) 62 29 S29 (+R EQ) S63 (-REQ) 63 30 S30 (+I /O) S64 (-I/O) 64 31 S31 (+D B 8) S6 5 (-DB8) 65 32 S32 (+D B 9) S6 6 (-DB 9) 66 33 S33 (DB 1 0) S67 (-DB 10) 67 34 S34 (DB 1 1) S68 (-DB 1 1) 68 T able 4-15: IDE Con nectors IDE 40[...]

  • Page 60

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 53 4.2.13 Floppy Connectors 33 DA1 PDI AG 34 35 DA0 DA2 36 37 CS0 CS1 38 39 DASP GND 40 T able 4-16: Floppy Connectors FLOPPY CONNECT O R Pin Pin 1 GND FD_DENSEL 2 3 GND N/C 4 5 KEY FD_DRA TE0 6 7 GND FD_INDEX_L 8 9 GND FD_M TR0_ L 10 1 1 GND FD_DR1_L 12 13 GN D FD_DR0_L 14 [...]

  • Page 61

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 54 5. Power Supply This document defines the r equirements for a univer sal input swit chi ng power suppl y , which pro- vides 750 wat t s DC with power factor corrected AC input and with curr ent and remote sense reg- ulation . The power suppl y is used with its DC output s[...]

  • Page 62

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 55 The power supply dimensions are 5. 0" H by 5.3" W by 1 1.5" D. 5.1.2 Fan Requirement s The power su pply incorporates a 120 mm fan for self-cooling. The air co m es in from th e connec- tor side, pa sses through the power supply , and exhausts on the f an s[...]

  • Page 63

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 56 Notes: 1. Power blad es (P1 – P12) are rated at 25 A each . 2. Sign al pin s (A1 – D6) are rated a t 1 A each. Figure 5-2: DC Connector Drawing 5.3 Marking and Identificatio n The power suppl y marking must s upport the fol lowing requ irements: safety agency r equire[...]

  • Page 64

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 57 Figu re 5- 3: Int erna l Labe l The power supply i s marked with the inter nation al l abel to i ndicat e that no user servi ceable p arts are cont ained in the power supply . This lab el is shown in Figure 5-4: Service Label. T his label i s printed on bri ght yell ow vi[...]

  • Page 65

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 58 5.5 Elect rical Requirement s 5.5.1 E fficiency The power supply has a minimum eff iciency of 65% to its DC output pins at maxi m um load cur- rent s and at rat ed nominal i nput volt ages and frequencies. The power suppl y has a minimum ef fi- ciency of 70% to it s DC ou[...]

  • Page 66

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 59 tion s. P rotection circ uits in the power supply wil l not cause th e AC fuse to blow unless a compo- nent in th e power suppl y has fai led. This includes DC output load short condi t ions. The DC load short ci rcuit protect ion circuits will shut down or limit power su[...]

  • Page 67

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 60 5.5.4.2 Remote Sense The power su pply provides remote sense on the +3.3 Vdc, +5 Vdc, and +12 Vdc out puts and their common DC return t o provi de regulat ion at those remote points. 5.5.4.3 Ripple and Noise Ripple and noise are defi ned as periodic or random signals over[...]

  • Page 68

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 61 5.5.4.4 Over-volt age Protection The power supply over-volt age protection is s ensed local ly . The power supply wi ll s hut down i n a latch of f mode after an over-volt age condition. The latch is cl eared by tog gling the power supply on signal, or by an AC power inte[...]

  • Page 69

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 62 Protecti on. A hard short circuit s hould turn of f the power supply immediately . A hard short cir cuit is defined as when the lo ad level is l ess than 10 milliohms. 5.5.4.7 Current Share Requi rements Equal power shar ing of p ar alleled power suppli es is requ ir ed. [...]

  • Page 70

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 63 † Meas ured relative to the power supply DC com mon output g round pins 5.6.3 Power Good (Output) Each power supply provides a power good si gnal . A pin must be allocat ed for this signal. This signal indi cates that all output s have reached accept able operating volt[...]

  • Page 71

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 64 Figure 5-5: Power Good Si gnal Charac te r istics 5.6.4 Power Supply P resent Indicator (Output ) This signal is used to sens e the number of power suppli es in the system (operational or not). A pin on t he output connect or must be all ocated to pull the power supply pr[...]

  • Page 72

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 65 of that power supply is necessary . A “ low ” st ate indicat es the power s upply failure. The power supply failure signa l is an out put signal fro m the power s upply to the syst em. † Meas ured relative to the power supply DC com mon output g round pins. 5.6.7 Po[...]

  • Page 73

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 66 † Meas ured relative to the power supply DC com mon output g round pins. 5.6.8 Power Supply Fi eld Replacement Unit Signals Four pins are allocat ed for the FRU information on the power supply connector . One pin is the Serial Clo ck (SCL). The second pin is used fo r S[...]

  • Page 74

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 67 5.7 Fan Speed Control The fan circuitr y implements variabl e speed fan cont rol and fan fail ure detection. 5.8 Enviro nm ental Requirement s 5.8.1 P hysical Env ironment The power su pply is loc ated inside a n Intel ® system assembly . A system may contain two or thre[...]

  • Page 75

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 68 6. System So ftw a re This chapter descri bes three so ft ware compon ent s of t he OCPRF100 MP server system pro duct : • System BIOS • BIOS Setup Utility • iFLASH Detai led i nform ation abou t these c omponent s ca n be f ound in t he OPRF100 MP Boar d Set T ech [...]

  • Page 76

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 69 entered by pressing F2 duri ng P OST . BIOS Setup is further descri bed in Sect ion BIOS Setup Utilit y. 1 The iFLASH utility updates th e syste m flash ROM . It provi des secur ity features that reduce the risk of tampering. A recovery boo t bloc k all ows recovery from [...]

  • Page 77

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 70 If the boot strap proce ssor (BSP) fails during POST , BIOS will att empt to boot the system using another pr ocessor . This feature is called fault resilient boot ing (FRB). Fo r additional inf ormation on FRB, see the OPRF100 MP Boar d Set T echnical Product Specificati[...]

  • Page 78

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 71 Ultra I /O chip also pr ovides a keyboard c ontroller cont aining Phoenix* microcode. BIOS down- loads commands to the keyboar d controller t o provide variou s security feat ures. The I/O carrie r contains 10 hot-plug PCI sl ots plus a PCI SVGA controller (Ci rr us Logic[...]

  • Page 79

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 72 The system support s the S1, S4 OS, and S5 sleep st at es. It also supports W ake-on-LAN* fr om the S1 and S4 states. After t he operating syst em sends the command t o switch to ACPI mode, the power button act s as a sleep but ton and a power but ton. If the but ton is p[...]

  • Page 80

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 73 the system BIOS provid es the run-time functions necess ary to boot from an I 2 O mass-storage adapter c ard. I 2 O devi ces are added to the interrupt 13h chain and b ooted using these c alls. 6.2.3 M anagement Management of client s and servers is a major issue for end [...]

  • Page 81

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 74 6.3 BIO S Setup Utility The OCPRF100 MP serv er system BIOS aut omatically configur es system resources. BIOS Setup allows the user to set prefer ences about system operation. It stor es thes e preferences in CMOS configura tion RAM. Because BIOS Setup r esides in fla sh [...]

  • Page 82

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 75 6.3.1 Mai n Menu T able 6-3: Main Menu through T able 6-6: Keyboard Features Submenu describe the Main Menu and it s submenus. ESC Exit The Esc ape ke y allo ws the us er to back ou t of an y field . When the Esc ape key is pres se d while editing a fiel d, the ed it of t[...]

  • Page 83

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 76 NOTES: Default v alues are marke d with the " † " symbol . Legacy Diskette B: Disabled † 360KB, 5 ¼” 1.2 MB , 5 ¼” 720KB, 3 ½” 1.44/ 1.25 MB, 3 ½” 2.88 MB, 3 ½” Select s the floppy di skette type for drive B. Prim ary Mast er Selects IDE subme[...]

  • Page 84

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 77 NOTES: Default v alues are marke d with the " † " symbol . LBA Mode Control Disabled Enabled Dis plays stat us of Logica l Block Access . Autotyped by BI OS. 32 Bit I/O Disabled † Enabled Ena bl es 32-bit IDE dat a trans fers . T ransfer Mod e S tandard Fast[...]

  • Page 85

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 78 NOTES: Default value s are marked with the " † " s ymbol. 6.3.2 Advanced Menu T able 6-7 through T able 6-1 1 descri be the Advanced Menu and submenus. W arning: Setti ng items on th is menu to in correct values may cause the syst em to malfunc tion. T able 6-[...]

  • Page 86

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 79 NOTES: Default v alues are marke d with the " † " symbol . Pause Bef ore Boot Disab led Enabled † If enabled, BIO S pauses for fi ve seconds before booti ng the operating syste m. PCI Confi guration Select s PCI Config uration subm enu. I/O De vice Conf igu-[...]

  • Page 87

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 80 NOTES: Default v alues are marke d with the " † " symbol . T abl e 6-9: PCI M ode Subme nu Feature Option Description Option ROM Scan Disabled Enabled † Enab les option R OM scan. Enable M aster Disabl ed Enabled † Enab les device (s) as a PCI bus master .[...]

  • Page 88

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 81 NOTES: Default v alues are marke d with the " † " symbol . NOTES: Default v alues are marke d with the " † " symbol . Mode Output on ly Bidirecti onal † EPP ECP Select s the mode of the LPT port. Base I/O Address 378h † 278h 178h 3BCh Select s [...]

  • Page 89

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 82 6.3.3 S ecurity Menu T able 6-12: Security Menu describes t he Securi ty Menu. NOTES: Default v alues are marke d with the " † " symbo l. T abl e 6-12: Secur ity Men u Feature Option Description User Password is Set Clear † S tatus only . A dministrator p as[...]

  • Page 90

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 83 6.3.4 Serv er Menu T able 6-13: Server Menu through T able 6-16: Console Redire ction Submenu descri be the Server Menu and submenus. NOTES: Default v alues are marke d with the " † " symbol . T able 6-13: Ser ver Menu Feature Option Description System Managem[...]

  • Page 91

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 84 NOTES: Default v alues are marke d with the " † " symbol . Clear E vent Log D isabled † Enabled Clears the system ev ent log. This o ption is reset to disabled o n each boot. Memor y Scrub bing D isabl ed Enabled † En ables memo ry scrubbing by the Profusi[...]

  • Page 92

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 85 NOTES: Defa ult values are m arked with the " † " symbol. 6.3.5 Boot Menu T able 6-17 describes the Boot Menu options, whic h allow t he user to sel ect the boot dev ic e. This tabl e also shows an example list of devices order ed in pr iority of the boot invo[...]

  • Page 93

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 86 NOTES: Default v alues are marke d with the " † " symbol . 6.3.6 E xit Menu T able 6-18 descri bes the Exit Menu. 6.4 Flash Utility The Flash Memory Update util i ty (iFLASH) updates the flash ROM with new system software. The loaded code and dat a incl ude th[...]

  • Page 94

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 87 • System BIOS • Embedded video BIOS and SCSI BIOS • BIOS Setup Utility • Integrat or-supplied user binary area • Language file iFLASH communicates wi th t he existing BIOS to provide securi ty mechanisms which reduce the risk of ta mpering. It also communicat es[...]

  • Page 95

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 88 7. Reg ulatory Specif ications The OCPRF100 MP server system, util i zing the OPRF100 board set, meets the specific ations and regulati ons for safety and EMC as defined in this chapter . 7.1 Safety Compliance 7.2 Electromagneti c C omp atibi lity 7.3 CE Mark The CE marki[...]

  • Page 96

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 89 7.4 Electromagneti c C omp atibili ty No tice (USA) This equipment has been tes ted and foun d to comply wi th the limits for a Class A digit al device, pursuant to p art 15 of the FCC Rules. These limits are designed to pr ovi de reasonab le pro tec- tion agai nst harmfu[...]

  • Page 97

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 90 8. Periph eral Ba y Back plane Bo ard This chapter desc ribes the features and functional ity of the peripheral bay backplane boar d, which is also refer red to as the backplane. The backplane is desi gned in compl ianc e with the SCSI Command Set For En closure Services [...]

  • Page 98

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 91 8.1.1 Arc hitectural Ov erview The backplane is an integral p art of th e OCPRF1 00 MP Serv er System. It is d esigned to provide a cost ef fective ease of power-on (hot- swap) drive replacement, provide easy RAID integr at ion over a wi de range of RAI D controller produ[...]

  • Page 99

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 92 Figure 8-2: Functional Block Diagram 8.2.1 Hot-swap C onnectors The backplane provi des two hot-swap SCA-2 right angle connector s, which provide power and SCSI signals using a single c onnector . Each SCSI drive att aches to the backpl ane using one o f these connector s[...]

  • Page 100

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 93 ² Spin-down of a dr ive when failur e is detected and reported (usi ng enclosure se rvices messages) via the SCSI bus. An applic ation or RAID controller dete cts a drive-re la ted problem th at indicat es a dat a risk. In r esponse, i t t akes the dri ve out of servi ce[...]

  • Page 101

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 94 8.2.7.3 Fault LEDs The hot-swap contr oller is responsible for tur ning the drive fault LEDs on or of f accord ing to the stat es specified via commands r eceived through SAF-TE and the IPMB. The drive f ault LEDs are yellow and serve to indic ate failure st atus for eac [...]

  • Page 102

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 95 supply . The second is the output from an on board Dall as DS1233* reset cont roll er , in which RST is kept active for approxi mately 350 ms after the power supply has reached the select ed tol er- ance. These two signal s are ORed to keep the boar d in reset . When both[...]

  • Page 103

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 96 Since the st andard 80C51 onchip functions are the same on the 80C652, the SFR locations , bit locati ons, and oper ation are unchanged. The only exceptio n is in the interrupt enable and int er- rupt pr iority SFRs. Thes e have been changed to include the i nterrupt from[...]

  • Page 104

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 97 Noise margin mini mu m on the high level is 0.2 V DD . 8.3.3 SCSI Controller The SCSI controlle r sel ected for this backplane is an 8-bit SYM53C80S controlle r . Device selec- tion is memory mapped at address FB00-FC00. It is reset on power up and when reset is assert ed[...]

  • Page 105

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 98 S tan dby (Disable Mode) 5 µ A 3 pF channel capaci t ance 8.4.2 Single Ended T ermination The foll owing is a list of the featur es of the si ngle-ended SCSI terminati on. • Fully c ompliant with SCSI, SCSI -2, and SCSI-3 standards. • Backward compat ible to the DS21[...]

  • Page 106

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 99 A descripti on of each memory bl ock is provided, showing the purpose and func ti on as deter - mined by mi crocontroller programming. These func tions may also be controlled by system soft- ware using SCSI commands defined in the SAF-TE specifi cat ion. Figure 8-4: Micro[...]

  • Page 107

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 100 each region is a single addr ess. Thus, aliases will occur on byte boundar ies throughout the remainder of th e region decoded for that function . Note tha t the eighth region from 0xFF00 – 0xFFFF is not used. In regis ter bi t descri pt ions l isted b elow , five fiel[...]

  • Page 108

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 101 8.6.1.3. 3 Drive Present Status Regi on (0xF A00 – 0xF AFF) The absence or presence of each drive is dete cted by the st ate of pin 44 on that dri ve ’ s SCA con- nector . A dri ve that is pr esent will have it s corresponding b it set to one i n thi s registe r . Bi[...]

  • Page 109

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 102 Notes: † “ Fixed ” indicate s whether the f unction/pin is def ined by the mic rocontroll er pinout (fix ed) or is implementation- specific (not fixed). 8.6.2.3 P2 P2 is the high-or der addr ess and data bus for externa l device access. It is not used for general I[...]

  • Page 110

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 103 Notes: † “ Fi xed ” indica tes whether the function/pin is defined by the microco ntroller pinou t (fixed) or is im plementa - tion- specific (not fi xed). 8.7 Signal Descriptions This sect ion defines the function of si gnal pins on the backplane connect or interf[...]

  • Page 111

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 104 8.7.5 CONN_MODE This becomes th e TM S input on t he JT AG por ts of all the PLDs. TMS i s a mode select pin which controls the funct ion of the JT AG port. If th e enable signal i s high (i.e., disabled), the mode signa l is degat ed from the TMS pin, and TMS is held hi[...]

  • Page 112

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 105 Figure 8-5: SCA-2 Connector 80P T abl e 8-7: SCA- 2 Con nector 80-pin con nector cont act and signa l name Cable conduc tor numbers are not ap plicable 80-pin c onnector cont act and signal na me 1 12V Charge (L) (L) 12V Gro und 41 2 12V (S) ( L) 12V Ground 42 3 12V (S) [...]

  • Page 113

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 106 8.8.1.3 Floppy Disk Port Connection 20 -DB(P) (S) (S) +DB(P) 60 21 -DB(7) (S) (S) +DB(7) 61 22 -DB(6) (S) (S) +DB(6) 62 23 -DB(5) (S) (S) +DB(5) 63 24 -DB(4) (S) (S) +DB(4) 64 25 -DB(3) (S) (S) +DB(3) 65 26 -DB(2) (S) (S) +DB(2) 66 27 -DB(1) (S) (S) +DB(1) 67 28 -DB(0) ([...]

  • Page 114

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 107 8.8.1.4 BERG* 240-pin Right Angle 5 X 48 Connec tor 9 GND 10 FD_MT R0_L 1 1 GND 12 FD_DR1 _L 13 GND 14 FD_DR0 _L 15 GND 16 FD_M TR1_L 17 FD_MSEN1 18 FD_DIR_L 19 GND 20 FD_STEP_L 21 GND 22 FD _WDA T A_L 23 GND 24 FD_ WGA TE_L 25 GND 26 FD_ TRK0 _L 27 FD_MSEN0 28 FD_WPROT_[...]

  • Page 115

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 108 9 DD0 (17) GND GND GND FD_STEP_L 10 GND GND DIOW (23) GND FD_DIR_L 1 1 DM ARQ (21) GND CSEL (28) GND FD_MSEN1 12 GND GND DIOR (25) GND FD_MTR1_L 13 IORDY (27) GND GND GND F D_DR0_L 14 DMACK (29) GND RESERVED (32) GND F D _DR1_L 15 G ND GND PDIAG ( 34) GN D FD_MTR0_ L 16 [...]

  • Page 116

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 109 8.8.1.5 IDE Connector 41 +5v +5v S7 (+DB 1) S42 (-DB 2) S9 (+DB 3) 42 + 5v +5v S 3 8 (-DB 15) S 5 (+D B P1) S40 (-DB 0) 43 + 5v + 5v S4 (+DB 1 5) S39 (-DB P1 ) S6 ( +DB 0) 44 +5v +5v S35 (-DB 12) S2 (+DB 13) S37 (-DB 14) 45 + 5v + 5v S1 (+DB 1 2) S36 (-DB 13) S3 ( + DB 1[...]

  • Page 117

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 110 8.8.1.6 Power Supply Connectors 35 DA 0 36 DA2 37 CS1P_L 38 DS3P_L 39 DHACT_L 40 GROUND T able 8-10: Powe r Supply Co nnectors Pin # Signal: 1 VCC12 2G N D 3G N D 4 VCC5 T able 8-9: IDE Conn ector[...]

  • Page 118

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 111 9. Periph eral Ba y Board ( Chassis Side) This chapt er describe s t he design of the peripher al bay boar d (chassi s side). Thi s board, use d in the OCPRF100 MP server sy stem, is att ached to the OCPRF100 MP serve r system chas si s and provides power and si gnal dis[...]

  • Page 119

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 112 Figure 9-1: Peripheral Bay Board (Chassis Side) Layout F i g u r e 9 - 2 : P e r i p h e r i g Figure 9-2: Peripheral Bay Board (Chassis Side) Connec tor Layoui 1.) 89009 -149 (BERG*) Blind Mate Connecto r Header 2.) 73475 -101 (BERG) Guid e Pin Housing 3.) 70295 -001 (B[...]

  • Page 120

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 113 10. Front Pa nel This chapter desc ri bes the design and external inter face of the OCPRF100 MP server syst em front p anel . The front panel provi des a user int erface to the OCPRF100 MP server syst em via push buttons, indic ator LEDs, an LCD pa nel, and a spea ker . [...]

  • Page 121

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 114 All of the front p anel ’ s f unctions are cont rolled by a Philips 80C652 microcontroller and are avail- able at all times when AC power is avai labl e. The connection from the front p anel to the rest of the OCPRF100 MP server system is via the 80-pin connect or to t[...]

  • Page 122

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 115 10.2.2.1 Device Maps 10.2.2.2 I/O Memory Maps T able 10-2: I/O Signals and Devices provides a cros s ref erenc e between the I /O signals and the individual device s. These can be referenced against t he devic e map sectio n to resol ve the abso- lute addr ess. T able 10[...]

  • Page 123

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 116 ICMB/COM2 COM2_T O_SIO_EN Micro Port 1 - RW - 4 ICMB/ COM2 C OM2_TO_FP _EN_L M icro Po rt 1 - RW - 5 I 2 C Interf aces I2 C_BACKUP_SCL Micro Port 1 - R W - 6 I 2 C Interf aces I2 C_BACKUP_SDA Micro Port 1 - R W - 7 Not App licable Not Applic able (Upper Addre ss Bus) M i[...]

  • Page 124

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 117 LCD DB 4 Out put L atch # 0 FFE0 R W - 0 LCD DB 5 Out put L atch # 0 FFE0 R W - 1 LCD DB 6 Out put L atch # 0 FFE0 R W - 2 LCD DB 7 Out put L atch # 0 FFE0 R W - 3 LED P OWER_F AIL_LED_ C MD Output Latch # 0 FFE0 RW - 4 LED D RIVE_F AIL_LED_C MD Output Latch # 0 FFE0 RW [...]

  • Page 125

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 118 NOTE : Th e programmab le logic de vice (PLD) addre sses are calc ulated usin g offset t erm and the follo wing equation : ADDRESS = PLD_BASE + OFFSET * 80 H 10.2.3 Mem o ry 10.2.3.1 Program Memory , Flash The front panel cont ains an A TMEL 29C512* f or storing program [...]

  • Page 126

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 119 10.2.3.3 UART A universal asyn chronous receiver/tr ansmitter (UART) is memory mapped to the microc ontrol- ler ’ s bus t o allow concurrent operation of t he ICMB and EMP port s. The UAR T is used for the EMP interf ace. 10.2.3.4 Serial EEPROM/T emperature Sensor The [...]

  • Page 127

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 120 T able 10-5: FRU Informatio n list s the board specific FRU inf ormation that is programmed into the board infor m ati on area. Notes: 1. Actual v alue programme d into the boa rd. 2. Example v alue. Actual v alue varies w ith each bo ard and/or fab re vision. T able 10-[...]

  • Page 128

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 121 0x07 1 Common he ader checksum 0xCE 0x08 80 Internal us e area 0x5 8 1 Cha ssis in form at ion a rea fo r mat ve rsion 0 x01 0x59 1 Chassis info rmation area l ength (8-byte multiples) 0x04 0x5A 1 Chassis type 0x1 1 0x5 B 1 Chass is part number t ype/ lengt h byte 0xCA 0[...]

  • Page 129

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 122 10.2.3.5 System Event Log (SEL) The system event log (SEL) seri al EEPROM (which res ides on the OCPRO F100 I/O carri er on the BMC ’ s private I 2 C bus ) can be accesse d by the front panel ’ s private bus under cert ain condi- tions. Thi s feat ure has been added [...]

  • Page 130

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 123 10.2.5 Front Panel LCD The front panel LCD is a S t anley GMD1620 A*. The LCD and the LCD ’ s LED backlighting uni t are powered of f of the main +5 V . Therefore, thi s cap ability is only avai l able when the +5 V power is availabl e. In order to avoid l oss of 5 V s[...]

  • Page 131

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 124 All four latche s may be read by the microc ontroller . Reading by the micr ocontroller causes the latch t o be deasserted (a ssuming that the as serting signal is also deass erted). With this int errupti ng scheme, it is suggested th at the FPC use the power interrupt i[...]

  • Page 132

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 125 10.2.7.1 Resetting the System The FPC has the capab il ity to reset the entire sys tem (processors, chip set s, etc.) by asserting the HARD_RESET sig nal. It must be asserted for a minimum of 500 ms. Ther e is no maximum. 10.2.7.2 Reset Input s The stat e of the res et s[...]

  • Page 133

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 126 10.2.7.6 Development and T e st Reset In development and board testi ng th e PLD and microcont rol ler can be put into a reset sta te by asserti ng the PB_RST_L signal. 10.2. 8 Spea ker The front p anel cont ains a speaker that is controll ed by either t he FPC or the I/[...]

  • Page 134

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 127 10.2.10.2 Receive Forced Swit ching In cert ain cases it is desirable to force a specific RXD (COM2 or ICMB) into the FPC ’ s RXD input. This sect ion covers t his forced s witch capab ility . T o force th e IC M B ’ s R XD signal into the FPC ’ s RXD input, as ser[...]

  • Page 135

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 128 10.2.10.5 ICMB T ransmit Control The FPC ’ s TXD (transmitt ed) pin drives both the COM2 ’ s SOUT_TTL_COM2 s i gnal and the ICM B ’ s SOUT_TTL_ICMB signal. There i s no interloc k for preventing the FPC from simul ta- neously tran smit ting on both ICMB and COM2; i[...]

  • Page 136

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 129 T o switch between the SMC and FPC connectio n of COM2, both signa ls should be deasser ted before ei ther signal is asserted. When main power is of f, the COM2_T O_SIO_EN signal should never be assert ed. 10.2.10.7 T ransmit and SMC /Fro nt Panel Connection Control The [...]

  • Page 137

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 130 † Note that al though the k eypa d press-releas e cycle may be as short as z ero, worst cas e, the firmwa re is only required to detect a c ycle as short a s 50 ms. 10.2.1 1.2 NMI Switch The NMI push button is hidden behind the main front panel bezel, except for a smal[...]

  • Page 138

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 131 Figure 10-2: Device s Not Supporting M ult ima ster Mode 10.2.12.2 Gl obal I 2 C Bus The global I 2 C bus is conne cted automatically to the IPMB whenever power is valid . Thi s bus is used to allow communicat ion between smart I 2 C devices that operate i n multim ast e[...]

  • Page 139

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 132 cifica ll y , this bus connect s the FPC and BMC. Also, there may be an SMM based device on the bus and a cluster card conn ector based device. On the FPC, this bus consist s of the I2C_BACKUP_SCL and the I2C_BACKUP_SDA signals. 10.2.12.3 I 2 C Development Support Jumper[...]

  • Page 140

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 133 Appendix A: Glossary This appendix cont ains import ant te rms used in the preceding chapters. Te r m D e f i n i t i o n ACPI Advanced Co nfiguration and Po wer Interface AP Applica tion processor APIC Advanced Pro grammable Interr upt Controll er ASR Asyn chronous sy s[...]

  • Page 141

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 134 FRU Field rep laceable unit GB Gigaby te. 1024 MB GPNV General pu rpose nonvol atile [storage] GPO G eneral purpos e output HSC Hot -swap controll er I/O In put/Output I/O A PIC APIC that delivers interru pts from d evices to the p rocessors I 2 C* Inter I ntegrated Circ[...]

  • Page 142

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 135 PHP PCI hot-plug PIC Programm able interrupt controller PID Programm able interrupt device PIIX4e PCI ISA ID E (and USB) accelera tor chip from 82440LX chip se t PIRQ PCI interrup t request line PMM POST me mory man ager PnP Plug an d Play POST Power-On Self T est Profus[...]

  • Page 143

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 136 VID V olta ge ID VRM V o lt a ge regu lat or module WB Write- back cach eable Word A 16-bit quan tity WP Write p r otect ed[...]

  • Page 144

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 137 Appendix B: References The followi ng document s further describe th e OCPRF100 MP Server System: • Saber System Exte rnal A rchi te cture Specification , Int el Corporation, OR-1300. • OCPRF100 MP Server System BIOS External Archi te cture Specification , Revi sion [...]

  • Page 145

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 138 • PCI Hot-plug (PHP) Usage Model Whitep aper , vers ion 0.55. I 2 O • Intell igent I/O (I 2 O) Arc hitec t u re S pe c if ic a ti on , Revision 1.0, I 2 O Speci al Interest G roup. MPS • MultiP r o ce s s o r S p ec i fic a t io n , V ersions 1.1 and 1.4, Intel Cor[...]

  • Page 146

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 139 PID • Programmable Interrupt De vic e External Product Specifi cat ion , Revision 1.1, I ntel Corpo- ration, Number OR4-680777. PIIX4 • 82371AB PCI-T O-ISA/IDE Xcelerat or (PIIX4) Dat asheet , April 1997, Int el Corporation, Number 290562-001 , ftp://d ownload.intel.[...]

  • Page 147

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 140 • FDC37C93xAPM Advance Informati on , 15 July 1996, S t andard Microsystems Corpo ra- tion .* USB • Unive rsal Serial Bus Sp ecif icatio n , Revision 1.0, 15 Januar y 1996, http://www .us b.org/ developers. VGA • CL-GD5446 Advance Product Bull etin , Cirrus Logic. [...]

  • Page 148

    OCPRF100 MP Server System T echnical Product Sp ecification Revi sion 1. 0 i Index C Cables 39 Flat Rib bon 41 Wire B undles 41 Chassis an d Assembl ies, Overvi ew of 3 Fan Bay 6 Fron t Panel Assembly 4 Fron t Panel Board 8 I/O Carrier 14 Midplane Assembly 13 OCPRF1 00 MP Server System Cha ssis 16 Periphe ral Bay 4 Power S upply 16 Process or Mezza[...]

  • Page 149

    OCPRF100 MP Server System Techni cal Product Specific ation Revi sion 1. 0 ii Mechani cal Requiremen ts 54 Regula tory Ag enc y Requ ir em ents 67 R References 137 Regula tory Sp eci f ica t io ns 88 CE Mark 88 Electroma gnetic Com patibility 88 Electroma gnetic Com patibility Notice (US A) 89 Electroma gnetic Com patibility Notices (Intern ational[...]