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Intel 320028-001 manuale d’uso - BKManuals
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Intel 320028-001 manuale d’uso

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La parola deriva dal latino "instructio", cioè organizzare. Così, il manuale d’uso Intel 320028-001 descrive le fasi del procedimento. Lo scopo del manuale d’uso è istruire, facilitare lo avviamento, l'uso di attrezzature o l’esecuzione di determinate azioni. Il manuale è una raccolta di informazioni sull'oggetto/servizio, un suggerimento.

Purtroppo, pochi utenti prendono il tempo di leggere il manuale d’uso, e un buono manuale non solo permette di conoscere una serie di funzionalità aggiuntive del dispositivo acquistato, ma anche evitare la maggioranza dei guasti.

Quindi cosa dovrebbe contenere il manuale perfetto?

Innanzitutto, il manuale d’uso Intel 320028-001 dovrebbe contenere:
- informazioni sui dati tecnici del dispositivo Intel 320028-001
- nome del fabbricante e anno di fabbricazione Intel 320028-001
- istruzioni per l'uso, la regolazione e la manutenzione delle attrezzature Intel 320028-001
- segnaletica di sicurezza e certificati che confermano la conformità con le norme pertinenti

Perché non leggiamo i manuali d’uso?

Generalmente questo è dovuto alla mancanza di tempo e certezza per quanto riguarda la funzionalità specifica delle attrezzature acquistate. Purtroppo, la connessione e l’avvio Intel 320028-001 non sono sufficienti. Questo manuale contiene una serie di linee guida per funzionalità specifiche, la sicurezza, metodi di manutenzione (anche i mezzi che dovrebbero essere usati), eventuali difetti Intel 320028-001 e modi per risolvere i problemi più comuni durante l'uso. Infine, il manuale contiene le coordinate del servizio Intel in assenza dell'efficacia delle soluzioni proposte. Attualmente, i manuali d’uso sotto forma di animazioni interessanti e video didattici che sono migliori che la brochure suscitano un interesse considerevole. Questo tipo di manuale permette all'utente di visualizzare tutto il video didattico senza saltare le specifiche e complicate descrizioni tecniche Intel 320028-001, come nel caso della versione cartacea.

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Prima di tutto, contiene la risposta sulla struttura, le possibilità del dispositivo Intel 320028-001, l'uso di vari accessori ed una serie di informazioni per sfruttare totalmente tutte le caratteristiche e servizi.

Dopo l'acquisto di successo di attrezzature/dispositivo, prendere un momento per familiarizzare con tutte le parti del manuale d'uso Intel 320028-001. Attualmente, sono preparati con cura e tradotti per essere comprensibili non solo per gli utenti, ma per svolgere la loro funzione di base di informazioni e di aiuto.

Sommario del manuale d’uso

  • Pagina 1

    Order Number: 320028-00 1 Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design Guide June 2008[...]

  • Pagina 2

    Intel® Core™ 2 Duo Mobile Processors on 45-nm process fo r Embedded Applications TDG June 2008 2 Order Number: 320028-001 INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL ’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUC TS, INTEL ASSUMES NO LIABILITY WHA TSOEVER, AND INTEL DISCLAIMS ANY [...]

  • Pagina 3

    Core™ 2 Duo Mobile Processors—Contents Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 3 Order Number: 320028-001 Contents 1.0 Introducti on ......... ........... ........ ........... .......... ........... .......... ........... .......... ........... ....... 6 1.1 Design Flow ......... ... .......[...]

  • Pagina 4

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 4 Figures—Core™ 2 Duo Mobile Processors Figures 1 Thermal Design P rocess ............ ........... .......... ........... .......... ............. ........... .......... ...... 7 2 Primary Side Keep Out Zone Requirements?[...]

  • Pagina 5

    Core™ 2 Duo Mobile Processors—Tables Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 5 Order Number: 320028-001 Revision History Date Revision Description June 2008 1.0 First Public release.[...]

  • Pagina 6

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 6 Introduction—Core™ 2 Duo Mobile Processors 1.0 Introduction The power dissipation of electronic components has risen along with the increase in complexity of computer systems. T o ensure quality , reliability , and perfo[...]

  • Pagina 7

    Core™ 2 Duo Mobile Processors—Introduction Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 7 Order Number: 320028-001 1.2 Definition of Terms Figure 1. Thermal Design Process Table 1. Definition of Terms (Sheet 1 of 2) Term Definition FCPGA Flip Chip Pin Grid Array . A pin grid ar ray packaging tec [...]

  • Pagina 8

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 8 Introduction—Core™ 2 Duo Mobile Processors 1.3 Reference Documents The reader of this specification should also be familiar with material and concepts presented in the following documents: • Intel® Core™2 Duo Proces[...]

  • Pagina 9

    Core™ 2 Duo Mobile Processors—Package Information Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 9 Order Number: 320028-001 2.0 Package Information The Intel® Core™2 Duo Processor (XE and SV) is av ailable in 478-pin Micro-FCPGA packages as well as 479-ball Micro-FCBGA packages. The Intel® Core[...]

  • Pagina 10

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 10 Thermal Specifications—Core™ 2 Duo Mobile Processors 3.0 Thermal Specifications 3.1 Thermal Design Power The Therm al Design P ower (TDP ) specification is listed in Ta b l e 2 . Heat transfer through the micro- FCBGA, [...]

  • Pagina 11

    Core™ 2 Duo Mobile Processors—Mechanical Specifications Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 11 Order Number: 320028-001 4.0 Mechanical Specifications 4.1 Package Mechanical Requirements 4.1.1 Die Pressure/Load Upper Limit From a die mechanical integrity standpoint, the m axi mum allowabl[...]

  • Pagina 12

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 12 Mechanical Specifications—Core™ 2 Duo Mobile Processors Notes: 1. Dimension in millimeters [inches]. Figure 2. Primary Side Keep Out Zone Requ ire ments— Micro-FCPGA[...]

  • Pagina 13

    Core™ 2 Duo Mobile Processors—Mechanical Specifications Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 13 Order Number: 320028-001 Notes: 1. Dimension in millimeters [inches]. Figure 3. Primary Side Keep Out Zone Requirements— Micr o-FCBGA[...]

  • Pagina 14

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 14 Mechanical Specifications—Core™ 2 Duo Mobile Processors Notes: 1. Dimension in millimeters [inches]. Figure 4. Se condar y Side Ke ep Out Zone Requirements[...]

  • Pagina 15

    Core™ 2 Duo Mobile Processors—Thermal Solution Requirements Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 15 Order Number: 320028-001 5.0 Thermal Solution Requirements 5.1 Thermal Solution Characterization The thermal characterization par ameter , Ψ (“psi”), is used to characterize thermal so[...]

  • Pagina 16

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 16 Thermal Solution Requirements—Core™ 2 Duo Mobile Processors 5.1.1 Calculating the Required Th ermal Performance for the Intel ® Core™2 Duo processor Overall thermal performance, Ψ JA, is then defined using the therm[...]

  • Pagina 17

    Core™ 2 Duo Mobile Processors—Thermal Solution Requirements Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 17 Order Number: 320028-001 It is evident from the above calculations that a reduction in the local ambient temperature can have a significant effect on the junction-to-ambient thermal resista[...]

  • Pagina 18

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 18 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.0 Reference Thermal Solutions Intel has developed reference thermal solutions de signed to meet the cooling needs of embedded form factor applications. This ch[...]

  • Pagina 19

    Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 19 Order Number: 320028-001 6.2 Keep Out Zon e Requir ements The keep out zone requirements on the PC B to use this heatsink are detailed in Appendix B, “Mechanical Drawings” . Because it ex[...]

  • Pagina 20

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 20 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.4.1 Keep Out Zone Re qui r emen ts The keep out zone requ irements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawin gs” . Bec[...]

  • Pagina 21

    Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 21 Order Number: 320028-001 6.5 Compact PCI Reference Heatsink The cPCI reference thermal solution is shown in Figure 10 . The maximum heatsink height is constrained to 8.7 mm. The heatsink uses[...]

  • Pagina 22

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 22 Reference Thermal Solutions—Core™ 2 Duo Mobile Processors 6.5.1 Keep Out Zone Re qui r emen ts The keep out zone requ irements on the PCB to use this heatsink are detailed in Appendix B, “Mechanical Drawin gs. ” Bec[...]

  • Pagina 23

    Core™ 2 Duo Mobile Processors—Reference Thermal Solutions Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 23 Order Number: 320028-001 Thermal interface materials have thermal impedance (resistance) that will increase as the material degrades ov er time. It is important for thermal solu tion designer[...]

  • Pagina 24

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 24 Thermal Metrology—Core™ 2 Duo Mobile Processors 7.0 Thermal Metrology The system designer must make temper ature measurements to accur ately determine the performance of the thermal solution. V alidation of the processo[...]

  • Pagina 25

    Core™ 2 Duo Mobile Proce ssors—Thermal Metrology Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 25 Order Number: 320028-001 It is worthwhile to determine the local ambient te mperature in the chassis around the processor to understand the effect it may ha ve on the case temperature. T LA is best me[...]

  • Pagina 26

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 26 Thermal Metrology—Core™ 2 Duo Mobile Processors Note: Drawing not to scale. Figure 13. Measuring T LA with an Active Heatsink[...]

  • Pagina 27

    Core™ 2 Duo Mobile Proce ssors—Thermal Metrology Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 27 Order Number: 320028-001 Note: Dra wing not to scale. Figure 14. Measuring T LA with a Passive Heatsink[...]

  • Pagina 28

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 28 Reliability Guidelines—Core™ 2 Duo Mobile Processors 8.0 Reliability Guidelines Each motherboard, heatsink, and attach combin ation ma y vary the mechanical loading of the component. The user should carefully evaluate t[...]

  • Pagina 29

    Core™ 2 Duo Mobile Processors—Thermal Solution Component Suppliers Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 29 Order Number: 320028-001 Appendix A Thermal Solution Compo nent Suppliers These vendors and devices are listed by Intel as a convenience to Intel’ s gener al customer base. Intel d[...]

  • Pagina 30

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 30 Mechanical Drawings—Core™ 2 Duo Mobile Processors Appendix B Mechanical Drawings Ta b l e 6 lists the mechanical drawings included in this appendix. Table 6. Mechanical Drawings Description Figure Advanced T CA* Referen[...]

  • Pagina 31

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 31 Order Number: 320028-001 Figure 15. AdvancedTCA* Refer ence Heatsink PCB Keep Out Zone Requireme nts (Sheet 1 of 2)[...]

  • Pagina 32

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 32 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 16. AdvancedTCA* Refere nce Heatsink PCB Keep Out Zone Require ments (Sheet 2 of 2)[...]

  • Pagina 33

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 33 Order Number: 320028-001 Figure 17. AdvancedT CA* Reference Heatsink A ssembly[...]

  • Pagina 34

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 34 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 18. AdvancedTCA* Re ference Heatsink[...]

  • Pagina 35

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 35 Order Number: 320028-001 Figure 19. CompactPCI* Refer ence Heatsink PCB Keep O ut Zone Requirements (Sheet 1 of 2)[...]

  • Pagina 36

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 36 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 20. CompactPCI* R eference Heatsink PCB Keep Out Zone Re quirements (She et 2 of 2)[...]

  • Pagina 37

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 37 Order Number: 320028-001 Figure 21. CompactPCI* Reference Heatsink Assembly[...]

  • Pagina 38

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 38 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 22. CompactPCI* R eference Heatsink[...]

  • Pagina 39

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 39 Order Number: 320028-001 Figure 23. 1U Reference He atsink PCB Keep Out Require ments (Sheet 1 of 2)[...]

  • Pagina 40

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 40 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 24. 1U Ref erence Heatsink PCB Keep Out Requirement s (Sheet 2 of 2)[...]

  • Pagina 41

    Core™ 2 Duo Mobile Processors—Mechanical Drawings Intel® Core™ 2 Duo Mobile Pr ocessors on 45-nm process- Thermal Design Guide TDG June 2008 41 Order Number: 320028-001 Figure 25. 1U Refe rence Heatsink Assembly[...]

  • Pagina 42

    Intel® Core™ 2 Duo Mobile Proc essors on 45-nm process for Embed ded Applications June 2008 TDG Order Number: 320028-001 42 Mechanical Drawings—Core™ 2 Duo Mobile Processors Figure 26. 1U Re fe rence Heatsink[...]