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Intel 5100 manuale d’uso - BKManuals
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Intel 5100 manuale d’uso

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Le regole impongono al rivenditore l'obbligo di fornire all'acquirente, insieme alle merci, il manuale d’uso Intel 5100. La mancanza del manuale d’uso o le informazioni errate fornite al consumatore sono la base di una denuncia in caso di inosservanza del dispositivo con il contratto. Secondo la legge, l’inclusione del manuale d’uso in una forma diversa da quella cartacea è permessa, che viene spesso utilizzato recentemente, includendo una forma grafica o elettronica Intel 5100 o video didattici per gli utenti. La condizione è il suo carattere leggibile e comprensibile.

Che cosa è il manuale d’uso?

La parola deriva dal latino "instructio", cioè organizzare. Così, il manuale d’uso Intel 5100 descrive le fasi del procedimento. Lo scopo del manuale d’uso è istruire, facilitare lo avviamento, l'uso di attrezzature o l’esecuzione di determinate azioni. Il manuale è una raccolta di informazioni sull'oggetto/servizio, un suggerimento.

Purtroppo, pochi utenti prendono il tempo di leggere il manuale d’uso, e un buono manuale non solo permette di conoscere una serie di funzionalità aggiuntive del dispositivo acquistato, ma anche evitare la maggioranza dei guasti.

Quindi cosa dovrebbe contenere il manuale perfetto?

Innanzitutto, il manuale d’uso Intel 5100 dovrebbe contenere:
- informazioni sui dati tecnici del dispositivo Intel 5100
- nome del fabbricante e anno di fabbricazione Intel 5100
- istruzioni per l'uso, la regolazione e la manutenzione delle attrezzature Intel 5100
- segnaletica di sicurezza e certificati che confermano la conformità con le norme pertinenti

Perché non leggiamo i manuali d’uso?

Generalmente questo è dovuto alla mancanza di tempo e certezza per quanto riguarda la funzionalità specifica delle attrezzature acquistate. Purtroppo, la connessione e l’avvio Intel 5100 non sono sufficienti. Questo manuale contiene una serie di linee guida per funzionalità specifiche, la sicurezza, metodi di manutenzione (anche i mezzi che dovrebbero essere usati), eventuali difetti Intel 5100 e modi per risolvere i problemi più comuni durante l'uso. Infine, il manuale contiene le coordinate del servizio Intel in assenza dell'efficacia delle soluzioni proposte. Attualmente, i manuali d’uso sotto forma di animazioni interessanti e video didattici che sono migliori che la brochure suscitano un interesse considerevole. Questo tipo di manuale permette all'utente di visualizzare tutto il video didattico senza saltare le specifiche e complicate descrizioni tecniche Intel 5100, come nel caso della versione cartacea.

Perché leggere il manuale d’uso?

Prima di tutto, contiene la risposta sulla struttura, le possibilità del dispositivo Intel 5100, l'uso di vari accessori ed una serie di informazioni per sfruttare totalmente tutte le caratteristiche e servizi.

Dopo l'acquisto di successo di attrezzature/dispositivo, prendere un momento per familiarizzare con tutte le parti del manuale d'uso Intel 5100. Attualmente, sono preparati con cura e tradotti per essere comprensibili non solo per gli utenti, ma per svolgere la loro funzione di base di informazioni e di aiuto.

Sommario del manuale d’uso

  • Pagina 1

    Order N um be r: 31 867 6- 0 03US Intel ® 5100 Memory Controller Hub Chipset for Communica tions, Embedded, and Storage Applications The rma l/ Mec ha n ic al D esi gn Gui de July 2008 Revision 003US[...]

  • Pagina 2

    Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 2 Order Number: 318676-003US Legal Lines and Disclaim ers INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED , BY EST OPPEL OR OTHERWISE, T O ANY INTELLECTUA L PROPER TY RIGHTS[...]

  • Pagina 3

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 3 Intel ® 5100 MCH Chipse t Contents 1.0 In tr oduct io n ........... ............ ........... ........... ............ ........... ............ ........... ........... ........ 6 1.1 Design Fl ow . .........[...]

  • Pagina 4

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 4 Order Number: 318676-003US Figures 1 Thermal Design Process . .... ........... ............ ........... ........... ............ ........... ............ ... ..... 7 2 MCH Package Dime nsions (Top Vie w) ..[...]

  • Pagina 5

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 5 Intel ® 5100 MCH Chipse t Revision History Date Revisi on Descript ion July 2008 003 Added the Comp actPC I* refere nce solution Added Fi gure 26 , Figure 27 , and Figur e 28 Updated the s upplier infor mat[...]

  • Pagina 6

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 6 Order Number: 318676-003US 1.0 Introduction As the complexity of computer syste ms increases, so do the power dissipation requiremen ts. Care must be tak en to en sure t hat the ad diti onal po wer i s prop[...]

  • Pagina 7

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 7 Intel ® 5100 MCH Chipse t 1.2 Definition of Terms Figur e 1. Therm a l De si gn Proce ss Tabl e 1 . Defi nit ion of Ter ms Term Definiti o n FC -BGA Flip Chip Ball Grid Array . A package type de fined by a [...]

  • Pagina 8

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 8 Order Number: 318676-003US 1.3 Relat ed Documents Intel ® Elec t ronic Des i gn Kit s (EDKs ) prov ide on line , real - ti me co lla ter al updates. The follow ing li n ks tak e you to the EDK serv er and [...]

  • Pagina 9

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 9 Intel ® 5100 MCH Chipse t 1.4 Ther ma l Sim ula tio n Intel pr o vid es th ermal si mu latio n model s of t he Intel ® 5 100 M CH C hipse t and associated user’s g uides to aid system design ers in simul[...]

  • Pagina 10

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 10 Order Number: 318676-003US Figu r e 2. M CH Pac k a g e Dime nsions ( Top View ) Figu r e 3. MCH P ackag e Dime nsi ons (S id e Vie w) MCH IHS Handling Excl usio n Are a 42.5 mm . 42.5 mm. 38.5 m m. 38.5 m[...]

  • Pagina 11

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 11 Intel ® 5100 MCH Chipse t 2.1 Package Mechanical Requirements The Inte l ® 5100 MCH Chipset package has an integrated heat spreader (IHS) that is capable of sustaining a maximum static normal load of 15 l[...]

  • Pagina 12

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 12 Order Number: 318676-003US Note: Thes e s pe ci ficatio ns appl y to uni form co mp ressive loadin g in a dir e c t ion perpe n d ic ular to the IHS top surfa ce. Note: These specifications are b ased on l[...]

  • Pagina 13

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 13 Intel ® 5100 MCH Chipse t The case-to-local ambient thermal characterization par ameter ( Ψ CA ) is used as a measure of th e thermal perf orm ance o f the ov erall th ermal so lu tion . It is defi ned by[...]

  • Pagina 14

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 14 Order Number: 318676-003US 2. Define a target local ambient temper ature, T LA . 3. Use Equa tio n 1 and Equat ion 2 to de termin e the req ui r ed therma l p er fo rmance need ed to coo l th e devic e. Th[...]

  • Pagina 15

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 15 Intel ® 5100 MCH Chipse t Ta b l e 4 summ a riz e s th e therm a l budget requir e d to ad equate ly coo l the Inte l ® 51 00 MCH C hipset in one config uration usi ng a TD P of 25 W . Furth er cal culati[...]

  • Pagina 16

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 16 Order Number: 318676-003US 5.1.2 T hermal Calibration an d Controls It is reco mmended that full and routin e cali bration o f tem perature me asurem ent equipm en t be per f orme d bef ore at te mpt in g [...]

  • Pagina 17

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 17 Intel ® 5100 MCH Chipse t Figure 6. IHS Groo ve Di mens ions[...]

  • Pagina 18

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 18 Order Number: 318676-003US 5.1.4 T hermocouple Condit ioning and Preparation 1. Use a calib r ated th ermo couple as sp eci fied in Ta b l e 5 . 2. Measure the thermocouple resistance by holding both wires[...]

  • Pagina 19

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 19 Intel ® 5100 MCH Chipse t 2. P lace the thermoco uple wire i nside t he g roov e le tting the exposed wire an d bead extend about 3.2 mm ( 0 . 12 5") pa s t the end of the gro ove. Secure it w it h K [...]

  • Pagina 20

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 20 Order Number: 318676-003US Figure 10. Thermoco u pl e Bead Placem en t Fig ur e 11 . Positioni n g B ea d on G r oo ve[...]

  • Pagina 21

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 21 Intel ® 5100 MCH Chipse t Figure 12. Using 3D Micromani pu lator to Secure Bead Location Figure 1 3. Meas uring R esistance between Thermo couple and IHS[...]

  • Pagina 22

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 22 Order Number: 318676-003US 5.1.6 C uring Process 1. Let the t hermocouple attach sit in the op en air for at least half an hour . Using any curing accelerator l ike the Locite* 7452 T ak Pak* acceler at or[...]

  • Pagina 23

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 23 Intel ® 5100 MCH Chipse t 5.1.7 Thermocouple Wire Management Figure 15. Ther mocou ple Wi re Mana geme nt i n Groo ve Figur e 16. Remov in g Excess Adhesi ve from I H S[...]

  • Pagina 24

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 24 Order Number: 318676-003US Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below t he IHS top surface by running a flat blade on top of the IHS, for example. 5.2 Power Si[...]

  • Pagina 25

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 25 Intel ® 5100 MCH Chipse t The Intel ® 5100 MCH Chipset has a lower TDP than the Intel ® 5000 S eries Chipset and a similar package size. Due to this, any thermal solutions fo r the Intel ® 5000 Series C[...]

  • Pagina 26

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 26 Order Number: 318676-003US Whe n using heatsi nks tha t exte nd beyond the MCH c hipse t refere nce hea tsink e nvelope shown in Figure 19 , any motherboard components placed between the heatsink and moth [...]

  • Pagina 27

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 27 Intel ® 5100 MCH Chipse t Full mechanical drawings of the thermal solution assemb ly and the heatsink clip are provid ed in Appe ndix A . Append ix B conta i ns vend or in format io n for ea c h the rmal s[...]

  • Pagina 28

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 28 Order Number: 318676-003US 6.1.8.1 Effect o f Pressure on TIM Performan ce As mechanical pressure increases on the TIM, the th ermal resistance of the TIM decreases. This phenomenon is due to the decrease [...]

  • Pagina 29

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 29 Intel ® 5100 MCH Chipse t 6.2 CompactPCI* Referen ce Heatsink Intel has also developed a reference thermal solution compatible with the CompactPCI* form factor . The reference solution was developed assumi[...]

  • Pagina 30

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 30 Order Number: 318676-003US 6.2.2 T hermal Solution Pe rforman ce Characteristics Fig ur e 22 shows the per formance of the CompactPCI* reference heatsink. This figure shows the thermal pe rformance of the [...]

  • Pagina 31

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 31 Intel ® 5100 MCH Chipse t Appendix A Mechanical Drawings Ta b l e 9 li sts the me chan ic al drawings in clude d in thi s append ix. Table 9. Mechan ical Drawing List Drawing Description Figure Number Adv [...]

  • Pagina 32

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 32 Order Number: 318676-003US Figure 23. A dvancedTCA* He atsink As sembly Drawing[...]

  • Pagina 33

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 33 Intel ® 5100 MCH Chipse t Figur e 24 . Advan ced TCA* H eatsink Drawin g[...]

  • Pagina 34

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 34 Order Number: 318676-003US Figure 25. A dvancedTCA* C omponent K eepout Zo ne[...]

  • Pagina 35

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 35 Intel ® 5100 MCH Chipse t Figure 26. Compac tPCI* He atsin k Ass embly D raw ing[...]

  • Pagina 36

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 36 Order Number: 318676-003US Figure 27. CompactPCI* Heatsin k Drawi ng[...]

  • Pagina 37

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 37 Intel ® 5100 MCH Chipse t Figur e 28 . CompactPCI* Comp onent Kee pou t Zone[...]

  • Pagina 38

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 38 Order Number: 318676-003US Fig ure 29. To rsion al Clip Hea tsink Cl ip Dr awing[...]

  • Pagina 39

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 39 Intel ® 5100 MCH Chipse t Figur e 30 . T I M 2 Draw ing[...]

  • Pagina 40

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 40 Order Number: 318676-003US Appendix B Thermal Solution Compone nt Suppliers Table 10. MC H Torsion al Clip Hea t si nk Therm a l So lutio n Part Intel Part Number Supplie r (Part Number) Con tact Informati[...]