Intel BX80637G2010 manuale d’uso

Document Number: 326764 -008  Desktop 3rd Generation Intel ® Core™ Processor Family, Desktop Intel ® Pentium ® Processor Family, and Desktop Intel ® Celeron ® Processor Family Datasheet – Volume 1 of 2 November 2013[...]

2 Datasheet, Volume 1 INFORMA TION IN THIS DOCUMENT IS PROV IDED IN CONNECTION WITH INTEL PRODUCTS . NO LICENSE, EXPRESS OR IMPLIED , BY ESTOPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT . EXCEPT AS PROVIDED IN INTEL 'S TERMS AND CONDIT IONS OF SALE FOR SUCH PRODUCTS, IN TEL ASSUMES NO LIABILITY W HA TSOE[...]

Datasheet, Volume 1 3  Contents 1I n t r o d u c t i o n ......... ......... .......... ........... ........ ........... .......... ......... .......... ......... .......... .... 9 1.1 Processor Feature De tails .......... .......... ............. .......... ........... .......... ........... ........ 11 1.1.1 Supported Tech nologies ..... .....[...]

4 Datasheet, Volume 1 2.4.1 3D and Vide o Engines for Graphics P rocessing ..................... ........... .......... .. 33 2.4.1.1 3D Engine Ex ecution Units ..... ........... ........... ........ ........... .......... .. 33 2.4.1.2 3D Pipeline ........ .. .. ........ .. .. .. ......... .. .. .. ......... .. .. .. ........ ... .. ........ ..34 [...]

Datasheet, Volume 1 5  4.2.4 Core C-states ........ .. .. ........... ........ .. ... .. ........ .. .. .. ......... .. .. .. ......... .. .. .. ...... 52 4.2.4.1 Core C0 State...... .......... ........... .......... ........... ........ ........... ........ 52 4.2.4.2 Core C1 / C1E State .............. .......... ........... .......... ........[...]

6 Datasheet, Volume 1 7.7 Signal Groups .... ........... .......... ........... .......... ........... ........... ........ ........... .......... .. 80 7.8 Test Access Port (TAP) Connection ............ .. .. .. ... .......... .. ........... .......... .. ........... .... 82 7.9 Storage Conditions Specificatio ns ................ .. ..............[...]

Datasheet, Volume 1 7  6-2 Memory Channe l A Signals ............. .......... ........... .......... ........... .......... ......... .......... .. 66 6-3 Memory Channe l B Signals ............. .......... ........... .......... ......... .......... ........... .......... .. 67 6-4 Memory Reference and Compensation ............ ........... .....[...]

8 Datasheet, Volume 1 Revision History § § Revision Number Description Revision Date 001 • Initial release April 2012 002 • Added Desktop 3rd Generation Intel ® Core™ i5 -3470T , i5-347 0, i5-3470S, i5-3475S, i5-3570, i5-3570S proc essors June 2012 003 • Updated Section 1.2.2, PCI Express* • Updated Section 2.1. 1, Syst em Memory T ech[...]

Datasheet, Volume 1 9 Introduction  1 Introduction The Desktop 3rd Generation Intel ® Core™ processor family , Desktop Intel ® Pe nt i u m ® processor family , and Desktop Intel ® Celeron ® processor family are the next generation of 64-bit, multi-core processors built on 22-nanometer process technology . The processors are designed for a[...]

Introduction 10 Datasheet, Volume 1 Figure 1-1. Desktop Processor Platform I n t e l ® F l e x i b l e D i s p l a y I n t e r f a c e DMI2 x4 Discrete Graphics (PEG) Analog CRT Giga bit Network Connec ti on USB 2.0 / USB 3.0 1 Intel ® HD Audio FWH Super I/O Seria l ATA DDR3 PCI Express* 3 . 0 1 x16 or 2x8 8 PCI Express* 2.0 x1 Ports (5 GT/s) SPI[...]

Datasheet, Volume 1 11 Introduction  1.1 Processor Feature Details • Four or two execution cores • A 32-KB instruction and 32-KB data first-level cache (L1) for each core • A 256-KB shared instruction / data second-level cache (L2) for each core • Up to 8-MB shared instruction / data thir d-level cache (L3), shared among all cores 1.1.1 [...]

Introduction 12 Datasheet, Volume 1 • Support memory configurations that mix DDR3 DIMMs/DRAMs with DDR3L DIMMs/DRAMs running at 1.5 V • The type of the DIMM modules supported by the processor i s dependent on the PCH SKU in the target platform: — Desktop PCH platforms support non-ECC UDIMMs only — All In One platforms (AIO) support SO-DIMMs[...]

Datasheet, Volume 1 13 Introduction  to transmit data across this interface. This also does not account for packet overhead and link maintenance. • Maximum theoretical bandwidth on the interface of 8 GB/s in each direction simultaneously , for an aggregate of 16 GB/s when x16 Gen 2 • Gen 3 raw bit -rate on the data pins of 8.0 GT/s, resultin[...]

Introduction 14 Datasheet, Volume 1 1.2.3 Direct Media Interface (DMI) • DMI 2.0 sup port • Four lanes in each direction • 5 GT/s point-to-point DMI interface to PCH is supported • Raw bit-r ate on the data pins of 5.0 Gb/s, resulting in a real bandwid th per pair of 500 MB/s given the 8b/10b encoding used to transmit data across this inter[...]

Datasheet, Volume 1 15 Introduction  • DirectX* Video Acceleration (DXV A) support for accelerating video processing — Full AVC/VC1/MPEG2 HW Decod e • Advanced Scheduler 2.0, 1.0, XPDM supp ort • Windows* 7, Wi ndows* XP , OSX, Linu x OS Support • DirectX* 11, Dire ctX* 10.1, DirectX* 10, D irectX* 9 support •O p e n G L * 3 . 0 s u [...]

Introduction 16 Datasheet, Volume 1 1.3.5 Direct Media Interface (DMI) • L0s and L1 ASPM power management capa bility 1.3.6 Processor Graphics Controller (GT) •I n t e l ® Rapid Memory Power Management (Intel ® RMPM) – CxSR •I n t e l ® Graphics P erformance Modulation T echnology (Intel ® GPMT) •I n t e l ® Smart 2D Display T echnol[...]

Datasheet, Volume 1 17 Introduction  1.5 Package The processor socket type is noted as LGA 1155. The p ackage is a 37.5 x 37.5 mm Flip Chip Land Grid Array (FCLGA 1155). See the Desktop 3rd Generation Intel ® Core™ Processor Family, Desktop Intel ® Pentium ® Processor Family, Desktop Intel ® Celeron ® Processor Family, and LGA1155 Socket [...]

Introduction 18 Datasheet, Volume 1 1.6 Processor Compatibility The Desktop 3rd Generation Intel ® Core™ processor family , Desktop Intel ® Pent i u m ® processor family , Desktop Intel ® Celeron ® processor F amily has specific platform requirements that differentiate it from a 2nd Generation Intel ® Core™ processor family Desktop, Intel[...]

Datasheet, Volume 1 19 Introduction  1.7 Terminology Table 1-2. Terminology (Sheet 1 of 3) Term Description ACPI Advanced C onfigurat ion and Power Interface ADB Automatic Display Brightness APD Active Power Down ASPM Active State Power Managemen t BGA Ball Grid Array BL T Block Level T ransfer CL TT Cl osed Loop T hermal Thr o ttling CRT Cathod[...]

Introduction 20 Datasheet, Volume 1 Intel ® VT -d Intel ® Virtualization T echnology (Intel ® VT) for D irecte d I/O. In tel VT -d is a ha rdwar e assist , unde r syste m softwa re (Vi rtual M ach ine Manager or operating sys t em) c ontro l, for enabling I/O device virtualization. Inte l VT -d also brings robust security by providing pro tectio[...]

Datasheet, Volume 1 21 Introduction  Storage Cond itions A non-oper ational state. The processor ma y be installed in a platform, in a tr ay , or loose. Processors ma y be sealed in pack aging or exposed to free air . Under the se conditions, processor landings should not be conne cted to any supply v oltages, have any I/Os biased or receive an [...]

Introduction 22 Datasheet, Volume 1 1.8 Related Documents Note: Contact your Intel representative for the latest revision of this item. § § Table 1-3. Related Documents Document Document Number / Location Desktop 3rd Generation Intel ® Core™ Processor Family, Deskto p Intel ® Pentium ® Processor Family, and Desktop Intel ® Celero n ® Proce[...]

Datasheet, Volume 1 23 Interfaces  2 Interfaces This chapter describes the interfac es supported by the processor . 2.1 System Memory Interface 2.1.1 System Memory Tec hnology Supported The Integrated Memory Controller (IMC) supports DDR3 / DDR3L protocols with two independent, 64-bit wid e channel s, each accessing one or two DIMMs. The type of[...]

Interfaces 24 Datasheet, Volume 1 Note: 1. DIMM module support is based on av ailability and is subject to change. Note: 1. System memory configurations are based on av ailability and are subject to change. 2.1.2 System Memory Timing Support The IMC supports the following Speed Bins, CAS Write Latency (CWL), and command signal mode timings on the m[...]

Datasheet, Volume 1 25 Interfaces  Note: 1. System memory timing support is based on availability and is s ubject to change. 2.1.3 System Memory Orga nization Modes The IMC supports two memory organization modes, single-channel and dual-chann el. Depending upon how the DIMM Mo dules are populated in each memory channel, a number of different con[...]

Interfaces 26 Datasheet, Volume 1 2.1.3.2.1 Dual-Channel Sy mmetric Mode Dual-Chann el Symmetric mode, also kn own as interleaved mod e, provides maxi m um performance on real world applications. Addresses are ping-ponged between the channels after each cache line (6 4-byte boun dary). If there are two requests, and the second request is to an addr[...]

Datasheet, Volume 1 27 Interfaces  2.1.5 Technology Enhancements of Intel ® Fast Mem ory Access (Intel ® FMA) The following sections describe the Just-i n - Time Scheduling, Command Ov erlap, and Out-of -Order Scheduling Intel FMA technology enhancements. 2.1.5.1 Just-in-Time Command Scheduling The memory cont roller has an a dvanced command s[...]

Interfaces 28 Datasheet, Volume 1 2.2 PCI Express* Interface This section describes the PCI Express interface capabilities of the processor . See the PCI Express Base Specification for details of PCI Express. The number of PCI Express controllers is depen d ent on the platform. Refer to Chapter 1 for details. 2.2.1 PCI Express* Architecture Compati[...]

Datasheet, Volume 1 29 Interfaces  2.2.1.1 Transaction Laye r The upper layer of the PCI Express* architecture is the T ransaction Layer . The T ransaction Layer's primary responsibilit y is the assembly and disassembly of T ransaction Layer P ackets (TLPs). TLPs are used to communicate transactions, such as read and write, as well as certa[...]

Interfaces 30 Datasheet, Volume 1 2.2.2 PCI Express* Co nfiguration Mechanism The PCI Express (external graphics) link is mapped through a PCI-to-PCI bridge structure. PCI Express extends the configuration spac e to 4096 bytes per-device/function, as compared to 256 bytes allowed by the Conventional PCI Specification . PCI Express configuration spa[...]

Datasheet, Volume 1 31 Interfaces  2.2.3 PCI Express* Port The PCI Express interface on the processor is a single, 16-lane (x16) port that can also be configured at narrower widths. The PCI Express port is being designed to be compliant with the PCI Express Base Specification, Revision 3.0. 2.2.3.1 PCI Express* Lanes Connection Figure 2-5 demons[...]

Interfaces 32 Datasheet, Volume 1 2.3 Direct Media Interface (DMI) Direct Media Interface (DMI) connects the processor and the PCH. Next generation DMI 2.0 is supported. Note: Only DMI x4 configuration is supported. 2.3.1 DMI Error Flow DMI can only generate SERR in response to errors, never SCI, SMI, MSI, PCI INT , or GPE. Any DMI related SERR act[...]

Datasheet, Volume 1 33 Interfaces  2.4 Processor Graphics Controller (GT) New Graphics Engine Architecture includes 3D compute elements, Multi-format hardware assisted decode/encode pipeline, and Mid-Level Cache (ML C) for superior high defini tion playback, video quality , and improve d 3D performance and M edia. The Display Engine handles deli[...]

Interfaces 34 Datasheet, Volume 1 2.4.1.2 3D Pipeline 2.4.1.2.1 Vertex Fetch (VF) Stage The VF stage executes 3DPRIMITIVE commands. Some enhancements have been included to better support legacy D3D APIs as well as SGI OpenGL*. 2.4.1.2.2 Vertex Shad er (VS) Stage The VS stage performs shading of vertices output by the VF f unction. The VS un it prod[...]

Datasheet, Volume 1 35 Interfaces  2.4.1.4 2D Engine The Display Engine fetches the raw data from the memory , puts the data into a stream, converts the data into r aw pixels, organizes pixels into images, blends diff erent planes into a single image, encodes the data, and sends the data out to the display device. The Display Engine executes its[...]

Interfaces 36 Datasheet, Volume 1 2.4.2 Processor Graphics Display The Processor Graphics controller display pipe can be broken down into three components: •D i s p l a y P l a n e s • Display P ipes • DisplayPort* and Intel ® FDI 2.4.2.1 Display Pla nes A display plane is a single displayed su rface in memory and contains one image (desktop[...]

Datasheet, Volume 1 37 Interfaces  2.4.2.2 Display Pipes The display pipe blends and synchronizes pixe l data received from one or more display planes and adds the timing of the displa y output device upon which the image is displayed. The display pipes A, B, and C operate independently of each other at the rate of 1 pixel per clock. They can at[...]

Interfaces 38 Datasheet, Volume 1 2.5 Platform Environment Control Interface (PECI) The PECI is a one-wire interface that pr ovides a communication channel between a PECI client (processor) and a PECI master . The processor implements a PECI interface to: • Allow communication of processor thermal and other information to the PECI master . • Re[...]

Datasheet, Volume 1 39 Technologies  3 Technologies This chapter provides a high-level description of Intel technologies implemented in the processor . The implementation of the features may vary between the processor SKUs. Details on the different technologies of In tel processors and other relev ant external notes are located at the In tel tec[...]

Technologies 40 Datasheet, Volume 1 3.1.2 Intel ® Virtualization Technology (Intel ® VT) for  IA-32, Intel ® 64 and Intel ® Architecture  (Intel ® VT-x) Features The processor core supports the following Intel VT -x features: • Extended Pa g e T ables (EPT) — EPT is hardware assisted page table virtualization — It eliminates VM exi[...]

Datasheet, Volume 1 41 Technologies  3.1.4 Intel ® Virtualization Technology (Intel ® VT) for Directed  I/O (Intel ® VT-d) Features The processor supports the following Intel VT -d features: • Memory controller and processor graphics comply with Intel ® VT -d 1.2 specification •T w o V T - d D M A r e m a p e n g i n e s : —i G F X [...]

Technologies 42 Datasheet, Volume 1 3.2 Intel ® Trusted Execution Technology (Intel ® TXT) Intel T rusted Execution T echnology (Intel TXT) defines platform-level enhancements that provide the building blocks for creating trusted platforms. The Intel TXT platform helps to provide the authenticity of the controlling environment such that those wis[...]

Datasheet, Volume 1 43 Technologies  3.4 Intel ® Turbo Boost Technology Intel ® T urbo Boost T echnology is a feature that allows the processor core to opportunistically and automatically run faster than its r ated operating frequency/render clock if it is operating below power , temp erature, and current limits. The Intel T urbo Boost T echno[...]

Technologies 44 Datasheet, Volume 1 3.5 Intel ® Advanced Vector Extensions (Intel ® AVX) Intel Advanced V ector Extensions (Intel AVX) is the latest expansion of the Intel instruction set. It extends the Intel Stream ing SIMD Extensions (Intel S SE) from 128- bit vectors to 256-bit vectors. Intel A VX addresses the continued need for vector float[...]

Datasheet, Volume 1 45 Technologies  3.6.3 RDRAND Instruction The processor introduces a software visible r andom number generation mechanism supported by a high quality entropy source. This capability will be made available to programmers through the new RDRAND inst ruction. The resultant r andom number generation capability is designed to comp[...]

Technologies 46 Datasheet, Volume 1 • More efficient MSR interface to access APIC registers. — T o enhance inter-processor and self dire cted interrupt delivery as well as the ability to virtualize the local APIC, the APIC register set can be accessed only through MSR based interfaces in the x2APIC mode. The Memory Mapped IO (MMIO) interface us[...]

Datasheet, Volume 1 47 Power Management  4 Power Management This chapter provides information on the following power management topics: • Advanced Configuration and Po wer Interface (ACPI) States • Processor Core • Integrated Memory Controller (IMC) • PCI Express* • Direct Media Interface (DMI) • Processor Graphics Controller Figure [...]

Power Management 48 Datasheet, Volume 1 4.1 Advanced Configuration and Power Interface  (ACPI) States Supported The ACPI states supported by the processor are described in this section. 4.1.1 System States 4.1.2 Processor Core / Package Id le States 4.1.3 Integrated Memory Controller States Table 4-1. System States State Description G0/S0 Full O[...]

Datasheet, Volume 1 49 Power Management  4.1.4 PCI Express* Link States 4.1.5 Direct Media Interface (DMI) States 4.1.6 Processor Graphi cs Controller States 4.1.7 Interface State Co mbinations Table 4-4. PCI Express* Link States State Description L0 Full on – Activ e transfer s tate. L0s First Active Power Management low power state – Low e[...]

Power Management 50 Datasheet, Volume 1 4.2 Processor Core Power Management While executing code, Enhanced Intel SpeedS tep T echnology optimizes the processor’s frequency and core voltage based on workload. Each frequency and voltage operatin g point is defined by ACPI as a P-state. When the processor is not executing code, it is idle. A low-pow[...]

Datasheet, Volume 1 51 Power Management  Entry and exit of the C- States at the thread and core level are shown in Figure 4-3 . While individual threads can request low power C-states, power saving actions only take place once the core C -state is resolved. Core C-states are automatically resolved by the processor . For thread and core C -states[...]

Power Management 52 Datasheet, Volume 1 4.2.3 Requesting Low-Power Idle States The primary software interfaces for requestin g low power idle states are through the MWAIT instruction with sub-state hints an d the HL T instruction (for C1 and C1E). However , software may make C-state requests using the legacy method of I/O reads from the ACPI-define[...]

Datasheet, Volume 1 53 Power Management  4.2.4.2 Core C1 / C1E State C1/C1E is a low power state entered when all threads within a core execute a HL T or MW AIT(C1/C1E) instruction. A System Management Interrupt (SMI) handler returns execution to either Norm al state or the C1/C1E state. See the Intel ® 64 and IA-32 Architect ure Software Devel[...]

Power Management 54 Datasheet, Volume 1 4.2.5 Package C-States The processor supports C0, C1/C1E, C3, an d C6 power states. The following is a summary of the general rules for package C -state entry . These apply to all package C- states unless specified otherwise: • A package C-state request is determined by the lowest numerical core C-state amo[...]

Datasheet, Volume 1 55 Power Management  4.2.5.1 Package C0 P ackage C0 is the normal operating state for the processor . The processor remains in the normal state when at least one of its cores is in the C0 or C1 state or when the platform has not granted perm ission to the processor to go into a low power state. Individual cores may be in lowe[...]

Power Management 56 Datasheet, Volume 1 4.2.5.3 Pa ckage C3 State A processor enters the package C3 low power state when: • At least one core is in the C3 state • The other cores are in a C3 or lower power state, and the processor has been granted permission by the platform • The platform has not granted a request to a package C6 state but ha[...]

Datasheet, Volume 1 57 Power Management  4.3.2 DRAM Power Manageme nt and Initialization The processor implements extensive support for power management on the SDRAM interface. The re are four SD RA M oper ations associated with the Clock Enable (CKE) signals that the SDRAM controller supports. The processor drives four CKE pins to perform these[...]

Power Management 58 Datasheet, Volume 1 It is important to understand that since the power down decision is per r ank, the MC can find a lot of opportunities to pow er down ran ks, even while running memory intensive applications; savings may be significant (up to a few W atts, depending on DDR configuration). This becomes more sign ificant when ea[...]

Datasheet, Volume 1 59 Power Management  The target behavior is to enter self -refresh for the package C3 and C6 states as long as there are no memory requests to service. 4.3.2.3 Dynamic Power Down Operation Dynamic power do w n of memory is e m ployed during normal oper ation. Based on idle conditions, a given memory rank may be powered down. [...]

Power Management 60 Datasheet, Volume 1 4.4 PCI Express* Power Management • Active power management support using L0s and L1 states. • All inputs and outputs disabled in L2/L3 Ready state. Note: PCIe* interface does not support Hot-Plug. Note: An increase in power consumption may be observ ed when PCIe Active State Power Management (ASPM) capab[...]

Datasheet, Volume 1 61 Power Management  4.6.4 Intel ® Smart 2D Display Technology (Intel ® S2DDT) Intel S2DD T reduces display refresh memo ry tr affic by reducing memory reads required for display refresh. P ower consumption is reduce d by less accesses to the IMC. S2DDT is only enabled in single pipe mode. Intel S2DDT is most effective with[...]

Power Management 62 Datasheet, Volume 1[...]

Datasheet, Volume 1 63 Thermal Management  5 Thermal Management For thermal specifications and design guidelines refer to the Desktop 3rd Generation Intel ® Core™ Processor Family, Desktop Intel ® Pentium ® Processor, Desktop Intel ® Celeron ® Processor, and LGA1155 Socket Thermal and Mechanical Specific ations and Design Guidelines. § ?[...]

Thermal Management 64 Datasheet, Volume 1[...]

Datasheet, Volume 1 65 Signal Description  6 Signal Description This chapter describes the processor signals. They are arr anged in functional groups according to their associated interface or ca tegory . The following notations are used to describe the signal type. The signal description also includes the type of buffer used for the particular [...]

Signal Description 66 Datasheet, Volume 1 6.1 System Memory Interface Signals Table 6-2. Memory Channel A Signals Signal Name Description Direction/ Buffer Type SA_BS[2:0] Bank Select : The se signals define which ban ks are selected within each SDRAM rank. O DDR3 SA_WE# Write Enable Control Signal: This signal is used with SA_RAS# and SA_CAS # (al[...]

Datasheet, Volume 1 67 Signal Description  6.2 Memory Reference and Compensation Signals Table 6-3. Memory Channel B Signals Signal Name Description Direction/ Buffer Type SB_BS[2:0] Bank Select: These signals define whic h banks are selected wi thin each SDRAM ra nk. O DDR3 SB_WE# Write Enable Control Signal: This signal is us ed with SB_RAS# a[...]

Signal Description 68 Datasheet, Volume 1 6.3 Reset and Miscellaneous Signals Note: 1. PCIe* bifurcation support v aries with the processor and PCH SKUs us ed. Table 6-5. Reset and Miscellaneous Signals Signal Name Description Direction/ Buffer Type CFG[17:0] Configuration Signals: The CFG signals ha ve a default v alue of '1' if not ter [...]

Datasheet, Volume 1 69 Signal Description  6.4 PCI Express*-based Interface Signals Note: 1. PE_TX[3:0]/PE_TX#[3:0] and PE_RX[3:0]/PE_RX#[3:0] si gnals are only used for platforms that support 20 PCIe lanes . These signals are reserv ed on Desktop 3rd Ge neratio n Intel Core™ i 7/i5 processors, Desktop Intel ® Pen ti u m ® processors and Des[...]

Signal Description 70 Datasheet, Volume 1 6.6 Direct Media Interface (DMI) Signals 6.7 Phase Lock Loop (PLL) Signals 6.8 Test Access Points (TAP) Signals Table 6-8. Direct Media Interface (DMI) Sign als – Processor to PC H Serial Interface Signal Name Description Direction/ Buffer Type DMI_RX[3:0] DMI_RX#[3:0] DMI Input from PCH: Direct Media Int[...]

Datasheet, Volume 1 71 Signal Description  6.9 Error and Thermal Protection Signals Table 6-11. Error and Thermal Protection Signals Signal Name Description Direction/ Buffer Type CA TERR# Catastrophic Error: This signal indicates that the system has experienced a cat astrophic error and cannot continue to operate . The processor will set this f[...]

Signal Description 72 Datasheet, Volume 1 6.10 Power Sequencing Signals Table 6-12. Power Sequencing Signals Signal Name Description Direction/ Buffer Type SM_DRAMPWROK SM_DRAMPWROK Proces sor Input : Connects to PCH DRAMPWROK. I Asynchronous CMOS UNCOREPWRGOOD The processor requi res this input sign al to be a clean indication that the V CCSA , V [...]

Datasheet, Volume 1 73 Signal Description  6.11 Processor Power Signals Note: 1. The VCCSA_VID can toggle at most o nce in 500 uS; The slew rate of VCCSA_VID is 1 V/nS. 6.12 Sense Signals Table 6-13. Processor Power Sig nals Signal Name Description Direction/ Buffer Type VCC Processor core power rail. Ref VCCIO Processo r power for I/O. Ref VDDQ[...]

Signal Description 74 Datasheet, Volume 1 6.13 Ground and Non-Critical to Function (NCTF) Signals 6.14 Processor Internal Pull-Up / Pull-Down Resistors § § Table 6-15. Ground and Non-Critical to Function (NCTF) Signals Signal Name Description Direction/ Buffer Type VSS Processor ground node GND VSS_NCTF (BGA Only) Non-Critic al to Function: These[...]

Datasheet, Volume 1 75 Electrical Specifications  7 Electrical Specifications 7.1 Power and Ground Lands The processor has VC C, VDDQ , VCCPLL, VCCS A, VCCAXG, VCCIO and VS S (ground) inputs for on-chip power distribution. All power lands must be connected to their respective processor power planes, while all VSS lands must be connected to the s[...]

Electrical Specifications 76 Datasheet, Volume 1 7.3 Processor Clocking (BCLK[0], BCLK#[0]) The processor uses a diffe ren tial clock to gener ate the processor co re ope r ating frequency , memory cont r oller freque ncy , syste m agent freq uencies, an d o t her interna l clocks. The processor core frequency is dete rmined by multiplying the proc[...]

Datasheet, Volume 1 77 Electrical Specifications  Table 7-1. VR 12.0 Voltage Identifica tion Definition (S heet 1 of 3) VID 7 VID 6 VID 5 VID 4 VID 3 VID 2 VID 1 VID 0 HEX V CC_MAX VID 7 VID 6 VID 5 VID 4 VID 3 VID 2 VID 1 VID 0 HEX V CC_MAX 0 0 0 0 0 0 0 0 0 0 0.00000 1 0 0 0 0 0 0 0 8 0 0.88500 0 0 0 0 0 0 0 1 0 1 0.25000 1 0 0 0 0 0 0 1 8 1 0[...]

Electrical Specifications 78 Datasheet, Volume 1 0 0101110 2 E 0 . 47500 1 0 1 0 1 1 1 0 A E 1.11500 0 0101111 2 F 0 . 48000 1 0 1 0 1 1 1 1 A F 1.12000 0 0110000 3 0 0 . 48500 1 0 1 1 0 0 0 0 B 0 1.1 2500 0 0110001 3 1 0 . 49000 1 0 1 1 0 0 0 1 B 1 1.1 3000 0 0110010 3 2 0 . 49500 1 0 1 1 0 0 1 0 B 2 1.1 3500 0 0110011 3 3 0 . 50000 1 0 1 1 0 0 1 [...]

Datasheet, Volume 1 79 Electrical Specifications  0 1 0 1 1 1 0 1 5 D 0.71000 1 1 0 1 1 1 0 1 D D 1.35000 0 1 0 1 1 1 1 0 5 E 0.71500 1 1 0 1 1 1 1 0 D E 1.35500 0 1 0 1 1 1 1 1 5 F 0.72000 1 1 0 1 1 1 1 1 D F 1.36000 0 1 1 0 0 0 0 0 6 0 0.72500 1 1 1 0 0 0 0 0 E 0 1.36500 0 1 1 0 0 0 0 1 6 1 0.73000 1 1 1 0 0 0 0 1 E 1 1.37000 0 1 1 0 0 0 1 0 6[...]

Electrical Specifications 80 Datasheet, Volume 1 7.5 System Agent (SA) V CC VID The V CCSA is configured by the processor outp ut land VCCSA_VID . VCCSA_VID output default logic state is low for 2nd generation and 3rd generation Desktop Core processors, and configures V CCSA to 0.925 V . 7.6 Reserved or Unused Signals The following are the general [...]

Datasheet, Volume 1 81 Electrical Specifications  Table 7-2. Signal Groups (Sheet 1 of 2) 1 Signal Group Type Signals System Reference Clock Differential CMOS Input BCLK[0], BCLK#[0] DDR3 Reference Clocks 2 Differential DDR3 Output SA_CK[3:0], SA_CK#[3:0] SB_CK[3:0], SB_CK#[3:0] DDR3 Command Signals 2 Single Ended DDR3 Output SA_RAS#, SB _RAS#, [...]

Electrical Specifications 82 Datasheet, Volume 1 Notes: 1. R efer to Chapter 8 for signal description details. 2. SA and SB refer to DDR3 Channe l A and DDR3 C hannel B. 3. The maximum rise/fall time of UNCOREPWRGOOD is 20 ns. 4. PE_TX[3:0]/PE_TX#[3:0] and PE_RX[3:0]/PE_RX#[3:0] signals are only used fo r platforms that support 20 PCIe* lanes. Thes[...]

Datasheet, Volume 1 83 Electrical Specifications  7.9 Storage Conditions Specifications Environmental storage condition limits define the temper ature and relative humidit y to which the device is exposed to while being stored in a moisture barrier bag. The specified storage conditions are for component lev el prior to board attach. T able 7-3 s[...]

Electrical Specifications 84 Datasheet, Volume 1 7.10 DC Specifications The processor DC specifications in this section are define d at the processor pads, unless noted otherw ise. See Chapter 8 for the processor land listings and Chapter 6 for signal defin itions. V oltage and cu rrent specifications are detailed in T able 7-4 , T able 7-5 , and T[...]

Datasheet, Volume 1 85 Electrical Specifications  Notes: 1. Each processor is programmed with a maximum valid voltage identification valu e (VID), which is set at manufacturing and canno t be altered. Individual maxi mu m VID v alues are cal ibr ated duri ng man ufact uring such that two processors at the same frequency may have different settin[...]

Electrical Specifications 86 Datasheet, Volume 1 Notes: 1. VCCSA must be provided using a separ ate voltage source and not be connec ted to V CC . This specification is measure d a t VCCSA_SENSE. 2. ±5% total. Minimum of ±2% DC and 3% AC at th e sense point. di/dt = 50 A/us with 150 ns step. Table 7-5. Processor System Agent I/O Bu ffer Supply DC[...]

Datasheet, Volume 1 87 Electrical Specifications  Notes: 1. V AXG is VID based rail. 2. The V AXG_MIN and V AXG_M AX loadlines represent static and tr ansient limits. 3. The loadlines specify voltage limits at the die meas ured at the V AXG_SENSE and VSSAXG_SENSE lan ds. V o ltage re gulation feedback for voltag e regulat or circ uits must also [...]

Electrical Specifications 88 Datasheet, Volume 1 Notes: 1. Unless otherwise noted, all specifications in this table apply to a ll processor frequencies. 2. V IL is defined as the maximum voltage level at a receiv ing agent that will be interpreted as a logical low valu e. 3. V IH is defined as the minimum voltage level at a receiv ing agent that wi[...]

Datasheet, Volume 1 89 Electrical Specifications  Notes: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. The V CCIO referred to in these specificat ions refers to instantaneous V CCIO . 3. For V IN between “0” V a nd V CCIO . Measured when th e d river is tri-stated. 4. V IH and V OH ma y ex[...]

Electrical Specifications 90 Datasheet, Volume 1 7.11 Platform Environmental Control Interface (PECI) DC Specifications PECI is an Intel proprietary interface that provides a communication channel between Intel processors and chipset components to external thermal monitoring devices. The processor contains a Digital Thermal Sensor (DTS) that report[...]

Datasheet, Volume 1 91 Electrical Specifications  7.11.2 DC Characteristics The PECI interface operates at a nominal voltage set by V CCIO . The DC electrical specifications shown in T able 7-10 are used with devices normally oper ating from a V CCIO interface supply . V CCIO nominal levels will v ary between processor families. All PECI devices[...]

Electrical Specifications 92 Datasheet, Volume 1[...]

Datasheet, Volume 1 93 Processor Land and Signal Information  8 Processor Land and Signal Information 8.1 Processor Land Assignments The processor land map is shown in Figure 8-1 . T able 8-1 provides a listing of all processor lands ordered alphabetically by land name. Note: SA_ECC_CB[7:0] and SB_ECC_CB[7:0] Land s are RSVD o n Desktop 3rd Gene[...]

Processor Land and Signal Information 94 Datasheet, Volume 1 Figure 8-1. LGA Socket Land Map 4 0 3 9 3 8 3 7 3 6 3 5 3 4 3 3 3 2 3 1 3 0 2 9 2 8 2 7 2 6 2 5 2 4 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 987654321 AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 4 0 3 9 3 8 3 7 3 6 3 5[...]

Datasheet, Volume 1 95 Processor Land and Signal Information  Table 8-1. Processor Land List by Land Name Land Name Land # Buffer Type Dir. BCLK_ITP C40 Di ff Clk I BCLK_ITP# D40 Diff Clk I BCLK[0] W2 Diff Clk I BCLK#[0] W1 Diff Clk I BPM#[0] H40 GTL I/O BPM#[1] H38 GTL I/O BPM#[2] G38 GTL I/O BPM#[3] G40 GTL I/O BPM#[4] G39 GTL I/O BPM#[5] F38 [...]

Processor Land and Signal Information 96 Datasheet, Volume 1 PECI J35 Async I/O PEG_COMPI B4 Analog I PEG_ICOMPO B5 Analog I PEG_RCOMPO C4 Analog I PEG_RX[0] B11 PCI Express I PEG_RX[1] D12 PCI Express I PEG_RX[2] C10 PCI Express I PEG_RX[3] E10 PCI Express I PEG_RX[4] B8 PCI Express I PEG_RX[5] C6 PCI Express I PEG_RX[6] A5 PCI Express I PEG_RX[7][...]

Datasheet, Volume 1 97 Processor Land and Signal Information  RSVD D38 RSVD H7 RSVD H8 RSVD J33 RSVD J34 RSVD J9 RSVD K34 RSVD K9 RSVD L31 RSVD L33 RSVD L34 RSVD L9 RSVD M34 RSVD N33 RSVD N34 RSVD P35 RSVD P37 RSVD P39 RSVD R34 RSVD R36 RSVD R38 RSVD R40 RSVD J31 RSVD AD34 RSVD AD35 RSVD K31 RSVD_NCTF AV 1 RSVD_NCTF AW 2 RSVD_NCTF AY 3 RSVD_NCTF[...]

Processor Land and Signal Information 98 Datasheet, Volume 1 SA_DQ[44] AR39 DDR3 I/O SA_DQ[45] AR38 DDR3 I/O SA_DQ[46] AN39 DDR3 I/O SA_DQ[47] AN40 DDR3 I/O SA_DQ[48] AL40 DDR3 I/O SA_DQ[49] AL37 DDR3 I/O SA_DQ[50] AJ38 DDR3 I/O SA_DQ[51] AJ37 DDR3 I/O SA_DQ[52] AL39 DDR3 I/O SA_DQ[53] AL38 DDR3 I/O SA_DQ[54] AJ39 DDR3 I/O SA_DQ[55] AJ40 DDR3 I/O S[...]

Datasheet, Volume 1 99 Processor Land and Signal Information  SB_DQ[6] AJ6 DDR3 I/O SB_DQ[7] AJ7 DDR3 I/O SB_DQ[8] AL7 DDR3 I/O SB_DQ[9] AM7 DDR3 I /O SB_DQ[10] AM10 DDR3 I/O SB_DQ[11] AL10 DDR3 I/O SB_DQ[12] AL6 DDR3 I/O SB_DQ[13] AM6 D DR3 I/O SB_DQ[14] AL9 DDR3 I/O SB_DQ[15] AM9 D DR3 I/O SB_DQ[16] AP7 D DR3 I/O SB_DQ[17] AR7 DDR3 I/O SB_DQ[1[...]

Processor Land and Signal Information 100 Datasheet, Volume 1 SB_MA[10] AN23 DDR3 O SB_MA[11] AU17 DDR3 O SB_MA[12] A T18 DDR3 O SB_MA[13] AR26 DDR3 O SB_MA[14] A Y16 DDR3 O SB_MA[15] AV16 DDR3 O SB_ODT[0] AL26 DDR3 O SB_ODT[1] AP26 DDR3 O SB_ODT[2] AM26 DDR3 O SB_ODT[3] AK26 DDR3 O SB_RAS# AP24 DDR3 O SB_WE# AR25 DDR3 O SKTOCC# AJ33 Analog O SM_DR[...]

Datasheet, Volume 1 101 Processor Land and Signal Information  VCC F18 PWR VCC F19 PWR VCC F21 PWR VCC F22 PWR VCC F24 PWR VCC F25 PWR VCC F27 PWR VCC F28 PWR VCC F30 PWR VCC F31 PWR VCC F32 PWR VCC F33 PWR VCC F34 PWR VCC G15 PWR VCC G16 PWR VCC G18 PWR VCC G19 PWR VCC G21 PWR VCC G22 PWR VCC G24 PWR VCC G25 PWR VCC G27 PWR VCC G28 PWR VCC G30 [...]

Processor Land and Signal Information 102 Datasheet, Volume 1 VCCAXG AB36 PWR VCCAXG AB37 PWR VCCAXG AB38 PWR VCCAXG AB39 PWR VCCAXG AB40 PWR VCCAXG AC33 PWR VCCAXG AC34 PWR VCCAXG AC35 PWR VCCAXG AC36 PWR VCCAXG AC37 PWR VCCAXG AC38 PWR VCCAXG AC39 PWR VCCAXG AC40 PWR VCCAXG T33 PWR VCCAXG T34 PWR VCCAXG T35 PWR VCCAXG T36 PWR VCCAXG T37 PWR VCCAX[...]

Datasheet, Volume 1 103 Processor Land and Signal Information  VCCSA J10 PWR VCCSA K10 PWR VCCSA K11 PWR VCCSA L11 PWR VCCSA L12 PWR VCCSA M10 PWR VCCSA M11 PWR VCCSA M12 PWR VCCSA_SENSE T2 An alog O VCCSA_VID P34 CMOS O VDDQ AJ13 PWR VDDQ AJ14 PWR VDDQ AJ20 PWR VDDQ AJ23 PWR VDDQ AJ24 PWR VDDQ AR20 PWR VDDQ AR21 PWR VDDQ AR22 PWR VDDQ AR23 PWR [...]

Processor Land and Signal Information 104 Datasheet, Volume 1 VSS AK28 GND VSS AK31 GND VSS AK32 GND VSS AK33 GND VSS AK34 GND VSS AK35 GND VSS AK36 GND VSS AK37 GND VSS AK4 GND VSS AK40 GND VSS AK5 GND VSS AK6 GND VSS AK7 GND VSS AK8 GND VSS AK9 GND VSS AL11 GND VSS AL14 GND VSS AL17 GND VSS AL19 GND VSS AL24 GND VSS AL27 GND VSS AL30 GND VSS AL36[...]

Datasheet, Volume 1 105 Processor Land and Signal Information  VSS AT 2 8 G N D VSS AT 2 9 G N D VSS AT 3 G N D VSS AT 3 0 G N D VSS AT 3 1 G N D VSS AT 3 2 G N D VSS AT 3 3 G N D VSS AT 3 4 G N D VSS AT 3 5 G N D VSS AT 3 6 G N D VSS AT 3 7 G N D VSS AT 3 8 G N D VSS AT 3 9 G N D VSS AT 4 G N D VSS AT 4 0 G N D VSS AT 5 G N D VSS AT 6 G N D VSS[...]

Processor Land and Signal Information 106 Datasheet, Volume 1 VSS F10 GND VSS F13 GND VSS F14 GND VSS F17 GND VSS F2 GND VSS F20 GND VSS F23 GND VSS F26 GND VSS F29 GND VSS F35 GND VSS F37 GND VSS F39 GND VSS F5 GND VSS F6 GND VSS F9 GND VSS G11 GND VSS G12 GND VSS G17 GND VSS G20 GND VSS G23 GND VSS G26 GND VSS G29 GND VSS G34 GND VSS G7 GND VSS G[...]

Datasheet, Volume 1 107 Processor Land and Signal Information  § § VSS R39 GND VSS R8 GND VSS T1 GND VSS T5 GND VSS T6 GND VSS U8 GND VSS V1 GND VSS V2 GND VSS V33 GND VSS V34 GND VSS V35 GND VSS V36 GND VSS V37 GND VSS V38 GND VSS V39 GND VSS V40 GND VSS V5 GND VSS W6 GND VSS Y5 GND VSS Y8 GND VSS_NCTF A4 GND VSS_NCTF AV3 9 G ND VSS_NCTF AY3 [...]

Processor Land and Signal Information 108 Datasheet, Volume 1[...]

Datasheet, Volume 1 109 DDR Data Swizzling  9 DDR Data Swizzling T o achieve better memory performance and timing, Intel Design performed DDR Data pin swizzling that allows a better use of the product across different platform s. Swizzling has no effect on functional oper ation and is invisible to the operating system/software. However , during [...]

DDR Data Swizz ling 110 Datasheet, Volume 1 Table 9-1. DDR Data Swizzling Table – Channel A Land Name Land # MC Land Name SA_DQ[0] AJ3 DQ0 6 SA_DQ[1] AJ4 DQ0 5 SA_DQ[2] AL3 DQ01 SA_DQ[3] AL4 DQ00 SA_DQ[4] AJ2 DQ0 4 SA_DQ[5] AJ1 DQ0 7 SA_DQ[6] AL2 DQ02 SA_DQ[7] AL1 DQ03 SA_DQ[8] AN1 DQ15 SA_DQ[9] AN4 DQ12 SA_DQ[10] AR3 DQ0 8 SA_DQ[11] AR4 DQ0 9 SA[...]

 DDR Data Swizzling Datasheet, Volume 1 111 § § Table 9-2. DDR D ata Swizzling table – Ch a nnel B Land Name Land # MC Land Name SB_DQ[0] AG7 DQ04 SB_DQ[1] AG8 DQ05 SB_DQ[2] AJ9 DQ02 SB_DQ[3] AJ8 DQ03 SB_DQ[4] AG5 DQ07 SB_DQ[5] AG6 DQ06 SB_DQ[6] AJ6 DQ00 SB_DQ[7] AJ7 DQ01 SB_DQ[8] AL7 DQ12 SB_DQ[9] AM7 DQ13 SB_DQ[10] AM10 DQ08 SB_DQ[11] AL10[...]

DDR Data Swizzling 112 Datasheet, Volume 1[...]