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Compaq COM Express Extension manual

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Table of contents for the manual

  • Page 1

     COM Express™ Extension  Specification Rev. 013[...]

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  • Page 3

    Table of Contents Copyright © COM E xpress™ Extension Specification Rev 01 2 iii Table of Contents 1 User Information ......................................................................................................................... 5 1.1 About This Document..................................................................................[...]

  • Page 4

    Table of Contents Copyright © COM E xpress™ Extension Specification Rev 01 2 iv 6.4.2 User editor for default s ettings....................................................................................... 20 7 Apendix A: PC Architec ture Information .............................................................................. 21 7.1 Buses ...[...]

  • Page 5

    1 User Information Copyright © COM E xpress™ Extension Specification Rev 01 3 5 1 User Information 1.1 About This Document This document provides information about pr oducts from Kontr on Embedded Modules GmbH, and /or its subsidiaries. No warranty of suitability, purpose, or fitness is i mplied. While every at tempt has been made to ensure that[...]

  • Page 6

    2 Introduction Copyright © COM E xpress™ Extension Specification Rev 01 3 6 2 Intr oduction 2.1 COM Express ™ Extension Specification The COM Express ™ Extension Specification builds on the COM Express™ (COM.0) standard as defined by the PCI Indust rial Computer Manufacturers’ Group ( PICMG®) whi ch is an industry standard adopted for C[...]

  • Page 7

    2 Introduction Copyright © COM E xpress™ Extension Specification Rev 01 3 7 Differential S ignalling) interfaces. The se include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other h and. Key features include:  Rich complement of contem porary high bandwidth serial interfaces, including P CI Express, Seria[...]

  • Page 8

    2 Introduction Copyright © COM E xpress™ Extension Specification Rev 01 3 8 specific features rather t han caring for a CPU board de sign. The OEM also benefits from a wide choice of modules providing a scalable range of price and performance upg rade options. 2.4 Objective Consistent wi th the objective of t he P ICMG® COM Express™ Specifica[...]

  • Page 9

    3 COM Express™ Module sizes Copyright © COM E xpress™ Extension Specification Rev 01 3 9 3 COM Expr ess ™ Module sizes 3.1 Overview - Module Size The prim ary dif ference between t he curr ent basic module an d the extended module as well as future compact footprints like microETXexpress and nanoETXexpress is the over-all physical size and t[...]

  • Page 10

    3 COM Express™ Module sizes Copyright © COM E xpress™ Extension Specification Rev 01 3 10 Figure - Ov erview – three module sizes All coordinates in mm . top view ( X1 is on bottom side, seen through pcb) 3.1.1 S mall Form Facto r nan o, COM Ex press™ Type 1[...]

  • Page 11

    3 COM Express™ Module sizes Copyright © COM E xpress™ Extension Specification Rev 01 3 11 The PCB size for the nano m odule is defined as 55mm x 84mm . The holes shown in this drawing are intended for mounting the m odule / heat-spreader com bination to the carrier board. An independent, im plementation specific set of holes and spa cers shall[...]

  • Page 12

    4 Signal Description Copyright © COM E xpress™ Extension Specification Rev 01 3 12 4 Signal Description 4.1 Graphic Signal Description Based on t he different available graphic interfaces of fered by t he different chipsets from silicon vendors including Intel, ATI, VIA, etc., there is a need f or optional assignment in addition to the ones alre[...]

  • Page 13

    4 Signal Description Copyright © COM E xpress™ Extension Specification Rev 01 3 13 C78 P EG_RX8+ DVO D11 C79 P EG_RX8- DVO D10 C80 GND (FI XED) GND (FIXED) GND (FIXED) C81 P EG_RX9+ DVO D9 C82 P EG_RX9- DVO D8 C83 RSV D RSVD RSVD C84 GND GND GND C85 P EG_RX10+ DVO D7 DPD_AUX C86 P EG_RX10- DVO D6 DPD_AUXB C87 GND GND GND C88 P EG_RX11+ DVO CLK+ [...]

  • Page 14

    4 Signal Description Copyright © COM E xpress™ Extension Specification Rev 01 3 14 D61 PEG_TX3+ SDVOB_CLK+ TMDS Clock + DPB_LANE3 D62 PEG_TX3- SDVOB_CLK- TMDS Cl ock - DPB_LANE3# D63 RSVD RSVD RSVD RSVD D64 RSVD RSVD RSVD RSVD D65 PEG_TX4+ SDVOC_RE D+ TMDS DATA 5+ DPC_LANE0 D66 PEG_TX4- SDVOC_RE D- TMDS DATA 5- DPC_LANE0# D67 GND GND GND GND D68[...]

  • Page 15

    5 Hardware extensions Copyright © COM E xpress™ Extension Specification Rev 01 3 15 5 Hardwar e extensions Wide Range Input Power for basic, exte nded and micro form factor Wide range input power: + 8.5VDC to +18VDC It allows direct operation from 108 nominal 3 cell l ithium ion b attery pack to 4-cell lithium-ion battery packs (16,8 V fully cha[...]

  • Page 16

    5 Hardware extensions Copyright © COM E xpress™ Extension Specification Rev 01 3 16 5.2 GPIO General Purpose I/O Recomm ended Use In general, GPIOs are defined f or specific customers. Any generi c GPIO s should be be set as well in order to assure compatibility of various COM Express™ compliant modules and carrier boards. Pin Description Reco[...]

  • Page 17

    5 Hardware extensions Copyright © COM E xpress™ Extension Specification Rev 01 3 17 5.2.1 Altern ative GPIO use f or SDIO Inter face Pin GPIO SDIO Pin GPIO SDIO A54 GPI0 DATA0 B54 GPO1 CMD A63 GPI1 DATA1 B57 GPO2 W P A67 GPI2 DATA2 B63 GPO3 CD# A85 GPI3 DATA3 A93 GPO0 CLK SDIO Pin description Signal Type Description SD_DATA[3:0] I/O CMOS3.3 SD I[...]

  • Page 18

    5 Hardware extensions Copyright © COM E xpress™ Extension Specification Rev 01 3 18 5.3 Thermal Control A three-pin fan hea der is stuffed onboard the module to support t hermal control through the use of a fan. Through BIO S-settings, it is possible to control the f an de pending o n t he Active Tri p Poi nt temperature. The fan switches on/off[...]

  • Page 19

    6 Software extensions Copyright © COM E xpress™ Extension Specification Rev 01 3 19 6 Software extensions 6.1 TPM support Trusted Computing is a technology de veloped and promoted by the Trusted Computing Group (TCG). The ter m is t aken from t he field of trusted systems and has a spe cialized meaning. " Trusted computing" means that [...]

  • Page 20

    6 Software extensions Copyright © COM E xpress™ Extension Specification Rev 01 3 20 MARS = M obile A pplicati on platform for R echargeable S ystem s Please following the link listed below t o the document where you can find more information regarding a Smart Battery reference sy stem: http://emea.kontron.com/products/com puteronmodules/etx/m ar[...]

  • Page 21

    7 Apendix A: PC Architecture I nformation Copyright © COM E xpress™ Extension Specification Rev 01 3 21 7 Apendix A: PC Ar chitectur e Information The following sources of inform ation can help you better understand PC architecture. 7.1 Buses 7.1.1 ISA, Sta ndard PS/2 – Conn ectors  AT Bus Design: Eight and Sixteen- Bit ISA, E-ISA and EISA [...]

  • Page 22

    7 Apendix A: PC Architecture I nformation Copyright © COM E xpress™ Extension Specification Rev 01 3 22  The PC Handbook: For Engineers, Programme r s, and Other Serious PC Us ers, Sixth Edition , John P. Choisser and John O. Foster, Annabooks, 1997, I SBN 0- 929392-36- 1 7.3 Ports 7.3.1 RS-232 Serial  EIA-232-E standard The EIA-232-E stan[...]

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    7 Apendix A: PC Architecture I nformation Copyright © COM E xpress™ Extension Specification Rev 01 3 23 7.4 Programming  C Programmer’s Guide to Serial Commun ications , Second Edition, Joe Cam pbell, SAMS, 1987, ISBN 0-672-22584- 0  Programmer’s Guide to the EGA, VG A, and Super VGA Cards , Third Edi tion, Richard Ferraro, Addison-Wes[...]

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    8 APPENDIX B: DOCUMENT- REVISION HISTORY Copyright © COM E xpress™ Extension Specification Rev 01 3 24 8 APPENDIX B: DOCUMENT -REVISION HIST OR Y Revision Date Edited by Chan ges 0.1 0 2.06.06 Z. Loncaric Created preliminary specification. 0.2 0 5.10.06 Z. Loncaric Index updates: - no microETXexpress inpu ts anymore, now a separate specification[...]