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Cypress Semiconductor CY7C1302DV25 manual

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Table of contents for the manual

  • Page 1

    9-Mbit Burst of T wo Pipelined SRAMs with Q DR™ Architecture CY7C1302DV25 Cypress Semiconductor Corpora tion • 198 Champion Cou rt • San Jose , CA 95134-1 709 • 408-943-2 600 Document #: 38-05625 Rev . *A Revised March 23, 2006 Features • Separate independent Read and Write data ports — Supports concurrent transactions • 167-MHz clock[...]

  • Page 2

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 2 of 18 Selection Guide CY7C1302 DV25-167 U nit Maximum Operating Freq uency 167 MHz Maximum Operating Current 500 mA Pin Configuration 165-ball FBGA (13 x 15 x 1.4 mm ) Pinout CY7C1302DV25 (512K x 18) 1 2 3456789 1 0 1 1 A NC Gnd/144M NC/36M WPS BWS 1 K NC RPS NC/18M Gnd/72M NC B NC Q9 D9 A NC K BWS [...]

  • Page 3

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 3 of 18 Introduction Functional Overview The CY7C1302DV25 is a synchronous pipelined Burst SRAM equipped with both a Rea d port and a Write port. The Read port is dedicated to Read o perations and the Write port is dedicated to Write operations. Data flows into the SRAM through the Write port and out [...]

  • Page 4

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 4 of 18 Synchronous intern al circuitry will automatically thre e-state the outputs following the next rising edg e of the positive output clock (C). This will allow for a seamless transition between devices without the insertio n of wait states in a depth expanded memory . Write Operations Write oper[...]

  • Page 5

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 5 of 18 T ruth T able [2, 3, 4, 5, 6, 7] Operation K RPS WPS DQ DQ Write Cycle: Load address on the rising edge of K clock; input write data on K and K rising edges. L-H X L D(A+0) at K(t) ↑ D(A+1) at K (t) ↑ Read Cycle: Load address on the rising edge of K clock; wait one cycle; read data on 2 co[...]

  • Page 6

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 6 of 18 IEEE 1 149.1 Serial Boundary Sc an (JT AG) These SRAMs incorporate a serial bo undary scan test access port (T AP) in the FBGA package. This part is fully compliant with IEEE S tandard #1 149.1-1900. The T AP operates using JEDEC standard 2.5V I/O logi c levels. Disabling the JT AG Feature It [...]

  • Page 7

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 7 of 18 is loaded into the instruction register upon power-up or whenever the T AP controller is given a test logic reset state. SAMPLE Z The SAMPLE Z instruction caus es the b oundary scan register to be connected between th e TDI and TDO pins when th e T AP controller is in a Shift-DR state. The SAM[...]

  • Page 8

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 8 of 18 T AP Controller St ate Diagram [9] Note: 9. The 0/1 next to each state re present s the value at TMS at the rising edge of TCK. TEST -LOGIC RESET TEST -LOGIC/ IDLE SELECT DR-SCAN CAPTURE-DR SHIFT -DR EXIT1-DR P AUSE-DR EXIT2-DR UPDA TE-DR SELECT IR-SCAN CAPTURE-DR SHIFT -IR EXIT1-IR P AUSE -IR[...]

  • Page 9

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 9 of 18 T AP Controller Block Diagram T AP Electrical Characteristics Over the Operatin g Range [10, 13, 15] Parameter Description T est Condition s Min. Max. Unit V OH1 Output HIGH V oltage I OH = − 2.0 mA 1.7 V V OH2 Output HIGH V oltage I OH = − 100 µ A2 . 1 V V OL1 Output LOW V oltage I OL = [...]

  • Page 10

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 10 of 18 Output Times t TDOV TCK Clock LOW to TDO V alid 20 ns t TDOX TCK Clock LOW to TDO Invalid 0 ns T AP Timing and T est Conditions [12] Identification Register Definitions Instruction Field Va l u e Description CY7C1302DV25 Revision Number (31:29) 000 V ersion number . Cypress Device ID (28:12) [...]

  • Page 11

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 1 1 of 18 Scan Register Sizes Register Name Bit Size Instruction 3 Bypass 1 ID 32 Boundary Scan 107 Instruction Codes Instruction Code Description EXTEST 000 C aptures the Input/Output ring contents. IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. [...]

  • Page 12

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 12 of 18 Boundary Scan Order Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bump ID 0 6R 27 11 H 54 7B 81 3G 1 6P 28 10 G 55 6B 82 2G 2 6N 29 9G 56 6A 83 1J 3 7P 30 11 F 57 5B 84 2J 4 7N 31 11 G 58 5A 85 3K 5 7R 32 9F 59 4A 86 3J 6 8R 33 10F 60 5C 87 2K 7 8P 34 11 E 61 4B 88 1K 8 9R 35 10E 62 3A 89 2[...]

  • Page 13

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 13 of 18 Maximum Ratings (Above which the useful life may be impaired.) S torage T e mperature .............. .............. ..... – 65°C to + 150°C Ambient T emperature with Power Applied ........... ............................ ..... – 55°C to + 125°C Supply V oltage on V DD Relative to GND.[...]

  • Page 14

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 14 of 18 Thermal Resist ance [20] Parameter Description T est Conditions 165 FBGA Package Unit Θ JA Thermal Resistance (Junction to Ambient) T est conditions follow standard test methods and procedures fo r measuring thermal impedance, per EIA/JESD51. 16.7 ° C/W Θ JC Thermal Resistance (Junction to[...]

  • Page 15

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 15 of 18 Output Times t CO t CHQV C/ C Clock Rise (or K/K in single clock mode) to Data V alid 2.5 ns t DOH t CHQX Dat a Output Hold after Output C/C Clock Rise (Active to Active) 1.2 ns t CHZ t CHZ Clock (C and C ) Rise to High-Z (Active to Hig h-Z) [23, 24] 2.5 ns t CLZ t CLZ Clock (C and C ) Rise t[...]

  • Page 16

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 16 of 18 Switching W aveforms [25, 26, 27] Notes: 25. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0 i.e., A0+1 . 26. Outputs are disabled (High- Z) one clock cycle after a NOP . 27. In this example, if address A 2=A1 then dat a Q20=D10 and[...]

  • Page 17

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 17 of 18 © Cypress Semi con duct or Cor po rati on , 20 06 . The information con t a in ed he re i n is su bject to change wi t hou t n oti ce. C ypr ess S em ic onduct or Corporation assumes no resp onsibility f or the u se of any circuitry o ther than circui try embodied i n a Cypress prod uct. Nor[...]

  • Page 18

    CY7C1302DV25 Document #: 38-05625 Rev . *A Page 18 of 18 Document History Page Document Title:CY7C1302DV25 9-Mb Burst o f 2 Pipelined SRAM wi th QDR ™ Architecture Document Number: 38-05625 REV . ECN NO. Issue Date Orig . of Change Description of Change ** 253010 See ECN SYT New Data Sheet *A 436864 See ECN NXR Converted from Preliminary to Final[...]