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Cypress Semiconductor CY7C1360C manual

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Table of contents for the manual

  • Page 1

    9-Mbit (256K x 36/512K x 18) Pipelined SRAM CY7C1360C CY7C1362C Cypress Semiconductor Corpora tion • 198 Champion Cou rt • San Jose , CA 95134-1 709 • 408-943-2 600 Document #: 38-05540 Rev . *H Revised September 14, 2006 Features • Supports bus operation up to 250 MHz • A vailable speed grades are 250, 20 0, and 166 MHz • Registered in[...]

  • Page 2

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 2 of 31 . Selection Guide 250 MHz 200 MHz 166 MHz Unit Maximum Access T ime 2.8 3.0 3.5 ns Maximum Operating Curren t 250 220 180 mA Maximum CMOS S tandby Current 40 40 40 mA ADDRESS REGISTER ADV CLK BURST COUNTER AND LOGIC CLR Q1 Q0 ADSP ADSC MODE BWE GW CE 1 CE 2 CE 3 OE ENABLE REGISTER OUTPU[...]

  • Page 3

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 3 of 31 Pin Configurations A A A A A 1 A 0 NC/72M NC/36M V SS V DD NC/18M A A A A A A A A DQP B DQ B DQ B V DDQ V SSQ DQ B DQ B DQ B DQ B V SSQ V DDQ DQ B DQ B V SS NC V DD ZZ DQ A DQ A V DDQ V SSQ DQ A DQ A DQ A DQ A V SSQ V DDQ DQ A DQ A DQP A DQP C DQ C DQc V DDQ V SSQ DQ C DQ C DQ C DQ C V [...]

  • Page 4

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 4 of 31 Pin Configurations (continued) A A A A A 1 A 0 NC/72M NC/36M V SS V DD NC/18M NC A A A A A A A DQP B DQ B DQ B V DDQ V SSQ DQ B DQ B DQ B DQ B V SSQ V DDQ DQ B DQ B V SS NC V DD ZZ DQ A DQ A V DDQ V SSQ DQ A DQ A DQ A DQ A V SSQ V DDQ DQ A DQ A DQP A DQP C DQ C DQ C V DDQ V SSQ DQ C DQ [...]

  • Page 5

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 5 of 31 Pin Configurations (continued) 234 5 67 1 A B C D E F G H J K L M N P R T U V DDQ NC/288M NC/144M DQP C DQ C DQ D DQ C DQ D AA A A ADSP V DDQ CE 2 A DQ C V DDQ DQ C V DDQ V DDQ V DDQ DQ D DQ D NC NC V DDQ V DD CLK V DD V SS V SS V SS V SS V SS V SS V SS V SS NC/576M NC/1G NC NC TDO TCK [...]

  • Page 6

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 6 of 31 Pin Configurations (continued) 165-Ball FBGA Pinout (3 Chip Enable with JT AG) CY7C1360C (256 K x 36) 234 56 7 1 A B C D E F G H J K L M N P R TDO NC/288M NC/144M DQP C DQ C DQP D NC DQ D CE 1 BW B CE 3 BW C BWE A CE2 DQ C DQ D DQ D MODE NC DQ C DQ C DQ D DQ D DQ D NC/36M NC/72M V DDQ B[...]

  • Page 7

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 7 of 31 Pin Definitions Name I/O Description A 0 , A 1 , A Input- Synchronous Address In puts used to select one of the add ress locations . Sample d at the rising edge of the CLK if ADSP or ADSC is active LOW , and CE 1 , CE 2 , and CE 3 [2] are sampled active. A 1 , A 0 are fed to the two-bit[...]

  • Page 8

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 8 of 31 Functional Overview All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. Maximum access delay from the clock rise (t CO ) is 2.8 ns (250-MHz device). The[...]

  • Page 9

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 9 of 31 conducted, the data presented to the DQs is written into the corresponding address location i n the memory core. If a Byte Write is conducted, only the se lected byte s are written. Bytes not selected during a Byte Write operation will remain unaltered. A synchronou s self-timed Write m[...]

  • Page 10

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 10 of 31 READ Cycle, Begin Burst External L H L L H L X H L L-H Q READ Cycle, Begin Burst External L H L L H L X H H L-H T ri-St a te READ Cycle, Continue Burst Next X X X L H H L H L L-H Q READ Cycle, Continue Burst Next X X X L H H L H H L-H T ri-St a te READ Cycle, Continue Burst Next H X X [...]

  • Page 11

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 1 1 of 31 IEEE 1 149.1 Serial Boundary Sc an (JT AG) The CY7C1360C/CY7C1362C incorpora tes a serial boundary scan test access port (T AP) in the BGA package only . The TQFP package does not offer this functionality . This part operates in accordance with IEEE S t andard 1 149.1-1900, but doesn?[...]

  • Page 12

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 12 of 31 T AP Controller Block Diagram Performing a T AP Reset A RESET is performed by forcing TMS HIGH (V DD ) for five rising edges of TCK. This RESE T does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power-up, the T AP is reset in ternally to ens[...]

  • Page 13

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 13 of 31 IDCODE The IDCODE instruction causes a ven dor-specific, 32-bit code to be loaded into the instruction re gister . It also places the instruction register betwee n the TDI and TDO balls and allows the IDCODE to be shifted out of the device when th e T AP controller enters the Shift-DR [...]

  • Page 14

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 14 of 31 3.3V T AP AC T est Conditions Input pulse levels ............... .............. .............. ..... V SS to 3.3V Input rise and fall times ......... .............. ...................... ... ... 1 ns Input timing referenc e levels ...... .............. ........... ............1.5V Out[...]

  • Page 15

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 15 of 31 V OL2 Output LOW V oltage I OL = 100 µA V DDQ = 3.3V 0.2 V V DDQ = 2.5V 0.2 V V IH Input HIGH V oltage V DDQ = 3.3V 2.0 V DD + 0.3 V V DDQ = 2.5V 1.7 V DD + 0.3 V V IL Input LOW V oltage V DD Q = 3.3V –0.5 0.7 V V DDQ = 2.5V –0.3 0.7 V I X Input Load Current GND < V IN < V D[...]

  • Page 16

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 16 of 31 165-ball FBGA Boundary Scan Order CY7C1360C (256K x 36) CY7C1362C (512K x 18) Bit# ball ID Signal Name Bit# ball ID Signal Name Bit# ball ID Signal Name Bit# ball ID Signal Name 1 B6 CLK 37 R 6 A0 1 B6 CLK 37 R6 A0 2B 7 G W 38 P6 A1 2 B7 GW 38 P6 A1 3A 7 B W E 39 R4 A 3 A7 BWE 39 R4 A [...]

  • Page 17

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 17 of 31 1 19-ball BGA Boundary Scan Ord er CY7C1360C (256K x 36) CY7C1362C (512K x 18) Bit# ball ID Signal Name Bit# ball ID Signal Name Bit# ball ID Signal Name Bit# ball ID Signal Name 1 K4 CLK 37 P4 A0 1 K4 CLK 37 P4 A0 2H 4 G W 38 N4 A1 2 H4 GW 38 N4 A1 3M 4 B W E 39 R6 A 3 M4 BWE 39 R6 A [...]

  • Page 18

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 18 of 31 Maximum Ratings (Above which the useful life may be impaired. For user guide- lines, not tested.) S torage T emp erature ............. .............. ...... –65°C to +150°C Ambient T emperature with Power Applied ........... ............................ ...... –55°C to + 125°C [...]

  • Page 19

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 19 of 31 Cap acit ance [16] Parameter Description T est Conditions 100 TQFP Max. 1 19 BGA Max. 165 FBGA Max. Unit C IN Input Capacitance T A = 25°C, f = 1 MHz, V DD = 3.3V V DDQ = 2.5V 55 5 p F C CLK Clock Input Capacitance 5 5 5 pF C I/O Input/Output Capacitance 5 7 7 pF Thermal Resist ance [[...]

  • Page 20

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 20 of 31 Switching Characteristics Over the Operating Range [17, 18] Parameter Description –250 –200 –166 Unit Min. Max. Min. Max. Min. Max. t POWER V DD (T ypical) to the First Access [19] 11 1 m s Clock t CYC Clock Cycle Time 4.0 5.0 6.0 ns t CH Clock HIGH 1.8 2.0 2.4 ns t CL Clock LOW [...]

  • Page 21

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 21 of 31 Switching W aveforms Read Cycle Timing [23] Note: 23. On this diagram, when CE is LOW: CE 1 is LOW, C E 2 is HIGH and CE 3 is LOW. When CE is HIGH: CE 1 is HIGH or CE 2 is LOW or CE 3 is HIGH. t CYC t CL CLK ADSP t ADH t ADS ADDRESS t CH OE ADSC CE t AH t AS A1 t CEH t CES GW, BWE, BWx[...]

  • Page 22

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 22 of 31 Write Cycle T iming [23, 24] Note: 24. Full width Write can be initiate d by either GW LOW; or by GW HIGH, BWE LOW and BW X LOW. Switching W aveforms (continued) t CYC t CL CLK ADSP t ADH t ADS ADDRESS t CH OE ADSC CE t AH t AS A1 t CEH t CES BWE, BW X D ata Out (Q) High-Z ADV BURST RE[...]

  • Page 23

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 23 of 31 Read/Write Cycle Timing [23, 25, 26 ] Notes: 25. The data bus (Q) remains in high-Z following a W rite cycle, unless a new Read access is initiated by ADSP or ADSC . 26. GW is HIGH. Switching W aveforms (continued) t CYC t CL CLK ADSP t ADH t ADS ADDRESS t CH OE ADSC CE t AH t AS A2 t [...]

  • Page 24

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 24 of 31 ZZ Mode T iming [27, 28] Notes: 27. Device must be desele ct ed when entering ZZ mode. See Cycle Descr iptions t able for all possible signal conditions to deselect the device. 28. DQs are in High-Z when exiting ZZ sleep mode. Switching W aveforms (continued) t ZZ I SUPPLY CLK ZZ t ZZR[...]

  • Page 25

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 25 of 31 Ordering Information Not all of the spe ed, package and temperature ran ges are available. Please contact your local sales r epresentative or visit www . cypress.com for actual pro duct s offered. Speed (MHz) Ordering Code Pa ckage Diagram Part and Packa ge T ype Operating Range 166 CY[...]

  • Page 26

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 26 of 31 200 CY7C1360C-200AXC 51-8 5050 100-pin Thin Quad F lat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) Comm ercial CY7C1362C-200AXC CY7C1360C-200AJXC 51-8 5050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (2 Chip Enable) CY7C1362C-200AJXC CY7C1360C-200BGC 51-851 15 1 19-b[...]

  • Page 27

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 27 of 31 250 CY7C1360C-250AXC 51-8 5050 100-pin Thin Quad F lat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) Comm ercial CY7C1362C-250AXC CY7C1360C-250AJXC 51-8 5050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (2 Chip Enable) CY7C1362C-250AJXC CY7C1360C-250BGC 51-851 15 1 19-b[...]

  • Page 28

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 28 of 31 Package Diagrams NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE 3. DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMAT[...]

  • Page 29

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 29 of 31 Package Diagrams (continued) 1.27 20.32 2 16 5 4 37 L E A B D C H G F K J U P N M T R 12.00 19.50 30° TYP. 2.40 MAX. A1 CORNER 0.70 REF. U T R P N M L K J H G F E D C A B 21 43 65 7 Ø1.00(3X) REF. 7.62 22.00±0.20 14.00±0.20 1.27 0.60±0.10 C 0.15 C B A 0.15(4X) Ø0.05 M C Ø0.75±0[...]

  • Page 30

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 30 of 31 © Cypress Semi con duct or Cor po rati on , 20 06 . The information contained he re i n is su bj ect to ch ange without notice. Cypress S em ic on duct or Corpo ration assu mes no resp onsib ility for th e u se of any circuitry o ther than circui try embodied i n a Cypress prod uct. N[...]

  • Page 31

    CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 31 of 31 Document History Page Document Title: CY7C1360C/CY7C1362C 9-Mbit (256K x 36/512K x 18 ) Pipelined SRAM Document Number: 38-05540 REV . ECN NO. Issue Date Orig. of Change Description of Change ** 2416 90 See ECN RKF New data sheet *A 278130 See ECN RKF Changed Boundary Scan order to mat[...]