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Cypress Semiconductor enCoRe CY7C64215 manual

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Table of contents for the manual

  • Page 1

    CY7C64215 enCoRe™ III Full S peed USB Controller Cypress Semiconducto r Corporation • 198 Champion Court • San Jose , CA 95134-1709 • 408-943-2600 Document 38-08036 Rev . *C Revised December 0 8, 2008 Features ■ Powerful Harvard Architecture Processor ❐ M8C Processor S peeds to 24 MHz ❐ T wo 8x8 Multi ply , 32-bit Accumu la te ❐ 3.0[...]

  • Page 2

    CY7C64215 Document 38-08036 Rev . *C Page 2 of 30 Applications ■ PC HID devices ❐ Mouse (Optomechanical, Optical, Trackball) ❐ Keyboards ❐ Joysticks ■ Gaming ❐ Game Pads ❐ Console Keyboards ■ General Purpose ❐ Barcode Scanners ❐ POS T erminal ❐ Consumer Electronics ❐ To y s ❐ Remote Controls ❐ USB to Serial enCoRe III Fu[...]

  • Page 3

    CY7C64215 Document 38-08036 Rev . *C Page 3 of 30 The Analog Syst em The Analog System is composed of six configurable blocks, comprised of an opamp circuit allowing the creation of complex analog signal flow s. Analog periph erals are very flexib le and are customized to support specif ic application requ irements. enCoRe III analog fu nction supp[...]

  • Page 4

    CY7C64215 Document 38-08036 Rev . *C Page 4 of 30 with detailed programming information, reference the PSoC™ Mixed-Signal Array T echn ical Referen ce Manual . For up-to-date Ordering, Packag i ng, and Electrical S pecification information, refe rence the latest enCoRe III device data sheets on the web at ht tp ://www .cypress.com . Development K[...]

  • Page 5

    CY7C64215 Document 38-08036 Rev . *C Page 5 of 30 Application Editor In the Application Editor you can edit your C la nguage and Assembly language source co de. Y ou can also assemble, compile, link, and build. Assembler . Th e macro assembler allow s the assembly code to merge seamlessly with C code. Th e link libraries auto matically use absolute[...]

  • Page 6

    CY7C64215 Document 38-08036 Rev . *C Page 6 of 30 Each user module establishes t he basic register settings that implement the selected function. It also provides parameters that allow you to tailor its precise configura tion to your particular application. For exa mple, a Pulse Width Modulato r User Module configures one or more di gital PSoC bloc[...]

  • Page 7

    CY7C64215 Document 38-08036 Rev . *C Page 7 of 30 Document Conventions Acronyms Used The following table lists the acronyms that are used in this document. Units of Measure A units of measure table is locat ed in the Electrical S p ecifications section. T able 5 on page 13 lists all the abbre viations used to measure the enCoRe III devices. Numeric[...]

  • Page 8

    CY7C64215 Document 38-08036 Rev . *C Page 8 of 30 56-Pin Part Pinout The CY7C64215 enCo Re III device is availabl e in a 56-pin package which is liste d and illustrated in the following table. Every port pin (labeled “P”) is capable of Digital IO. However , Vss and Vdd are not capable of Digital IO. T ab le 2. 56-Pin Pa rt Pinout (MLF * ) Pin N[...]

  • Page 9

    CY7C64215 Document 38-08036 Rev . *C Page 9 of 30 28-Pin Part Pinout The CY7C64215 enCo Re III device is availabl e in a 28-pin package which is liste d and illustrated in the following table. Every port pin (labeled with a “P”) is capable of Digital IO. Ho wever , Vss and Vdd are not capable of Digital IO. T ab le 3. 28-Pin Pa rt Pinout (SSOP)[...]

  • Page 10

    CY7C64215 Document 38-08036 Rev . *C Page 10 of 30 Register Reference The register convention s specific to this section are l isted in the following table . Register Map ping T ables The enCoRe III device has a total register addre ss space of 512 bytes. The re gister space is referred to as IO space and is divided into two banks. Th e XOI bit in [...]

  • Page 11

    CY7C64215 Document 38-08036 Rev . *C Page 1 1 of 30 Register Map Bank 0 T abl e: User Sp ace Name Addr (0,Hex) Access Name Addr (0,Hex) Access Name A ddr (0,H ex) Access Name Addr (0,Hex) Access PRT0DR 00 RW PMA0_DR 40 RW ASC10CR0 80 RW C0 PRT0IE 01 RW PMA1_DR 41 RW ASC10CR1 81 RW C1 PRT0GS 02 RW PMA2_DR 42 RW ASC10CR2 82 RW C2 PRT0DM2 03 RW PMA3_D[...]

  • Page 12

    CY7C64215 Document 38-08036 Rev . *C Page 12 of 30 Register Map Bank 1 T able: Configuration S pace Name Addr (1,Hex) Access Name Addr (1,Hex) Access Name Addr (1,Hex) Access Name Addr (1,Hex) Access PRT0DM0 00 RW PMA0_W A 40 RW ASC10CR0 80 RW USBIO_CR2 C0 RW PRT0DM1 01 RW PMA1_W A 41 RW ASC10CR1 81 RW USB_CR1 C1 # PRT0IC0 02 RW PMA2_W A 42 RW ASC1[...]

  • Page 13

    CY7C64215 Document 38-08036 Rev . *C Page 13 of 30 Electrical Specifications This section presents the DC and AC electrical spe cifications of the CY7C64215 enCoRe III. For the most up to date electrical specifications, confirm that you have the most recent dat a sheet by going to the web at http://www .cypress.com. S pecificati ons are valid for 0[...]

  • Page 14

    CY7C64215 Document 38-08036 Rev . *C Page 14 of 30 Absolute Maximum Ratings Operating T emperature μ V microvolts s sigma: one standard deviation μ V rms microvolt s root-mean-square V volts T able 5. Units of Measure (continued) Symbol Unit of Measure Symbol Unit of Measure T ab le 6. Absolu te Maximum Ratings Parameter Descr iption Min Ty p Max[...]

  • Page 15

    CY7C64215 Document 38-08036 Rev . *C Page 15 of 30 DC Electrical Characteristics DC Chip-Level Specificatio ns The following table lists guaranteed ma ximum and minimum spe cific ati ons for the voltage and tem perature ranges: 4.75 V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypic[...]

  • Page 16

    CY7C64215 Document 38-08036 Rev . *C Page 16 of 30 DC Full-Speed USB Specifications The following table lists guaranteed ma ximum and minimum spe cific ati ons for the voltage and tem perature ranges: 4.75 V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypical parameters apply to 5V a[...]

  • Page 17

    CY7C64215 Document 38-08036 Rev . *C Page 17 of 30 DC Analog Refe rence Specificatio ns The following tables list guaranteed maximum and minimum specific ations fo r the voltage and temperature ra nges: 4.75V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypical parameters apply to 5V [...]

  • Page 18

    CY7C64215 Document 38-08036 Rev . *C Page 18 of 30 DC Analog enCoRe III Block Specifications The following table lists guaranteed ma ximum and minimum spe cific ati ons for the voltage and tem perature ranges: 4.75 V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypical parameters appl[...]

  • Page 19

    CY7C64215 Document 38-08036 Rev . *C Page 19 of 30 DC POR and L VD Specifications The following table lists guaranteed ma ximum and minimum spe cific ati ons for the voltage and tem perature ranges: 4.75 V to 5.25V and 0 ° C < T A < 70 ° C, or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypical p arameters apply to 5 V or[...]

  • Page 20

    CY7C64215 Document 38-08036 Rev . *C Page 20 of 30 DC Programming Specifications The following table lists guaranteed ma ximum and minimum spe cific ati ons for the voltage and tem perature ranges: 4.75 V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypical parameters apply to 5V an d[...]

  • Page 21

    CY7C64215 Document 38-08036 Rev . *C Page 21 of 30 AC Electrical Characteristics AC Chip-Level Specifications The following table lists guaranteed ma ximum and minimum spe cific ati ons for the voltage and tem perature ranges: 4.75 V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypica[...]

  • Page 22

    CY7C64215 Document 38-08036 Rev . *C Page 22 of 30 AC General Purpose IO Specifications The following table lists guaranteed ma ximum and minimum spe cific ati ons for the voltage and tem perature ranges: 4.75 V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypical parameters apply to [...]

  • Page 23

    CY7C64215 Document 38-08036 Rev . *C Page 23 of 30 AC Digital Block Specifications The following table lists guaranteed ma ximum and minimum spe cific ati ons for the voltage and tem perature ranges: 4.75 V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypical parameters apply to 5V an[...]

  • Page 24

    CY7C64215 Document 38-08036 Rev . *C Page 24 of 30 AC Analog Output Buffer Specifications The following tables list guaranteed maximum and minimum specific ations fo r the voltage and temperature ra nges: 4.75V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypical parameters apply to 5[...]

  • Page 25

    CY7C64215 Document 38-08036 Rev . *C Page 25 of 30 AC Programming Specifications The following table lists guaranteed ma ximum and minimum spe cific ati ons for the voltage and tem perature ranges: 4.75 V to 5.25V and 0 ° C < T A < 70 ° C , or 3.0V to 3.6V and 0 ° C < T A < 70 ° C, respectively . T ypical parameters apply to 5V an d[...]

  • Page 26

    CY7C64215 Document 38-08036 Rev . *C Page 26 of 30 Figure 8. Defini tion for T iming for Fast/S tand ard Mode on t he I 2 C Bus SD A SC L S Sr S P T BU F I2C T SPI2C T HDS TA I2 C T SU ST OI2C T SU ST AI2C T LOWI 2C T HI GHI 2 C T HDDA TI 2 C T H D ST AI 2C T SU D AT I 2C [+] Feedback [+] Feedback[...]

  • Page 27

    CY7C64215 Document 38-08036 Rev . *C Page 27 of 30 Packaging Information This section illustrates the package specific ation for the CY7C64215 enCoRe III, a long with the thermal impedance for th e packa ge. Important Note Emulation tools may require a la rger area on the target PCB than the chip’s footprint. For a detailed description of the emu[...]

  • Page 28

    CY7C64215 Document 38-08036 Rev . *C Page 28 of 30 Figure 10. 28-Pin Shrunk Small Outline Package Thermal Impedanc e Solder Reflow Peak T emperature Following is the minimum solder reflow peak temperature to achieve go od solderability . T ab le 27 . Th ermal Impedance for the Package Package T y pical θ JA * 56 Pin MLF 20 o C/W 28 Pin SSOP 96 o C[...]

  • Page 29

    CY7C64215 Document 38-08036 Rev . *C Page 29 of 30 Ordering Information Package Handling Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leavin g the factory . A label on the packaging has details about actual bak e temperat ure and the mi nimum ba ke time to remo ve thi s moi[...]

  • Page 30

    Document 38-08036 Rev . *C Revised December 08, 20 08 Page 30 of 30 enCoRe, PSoC, and Programm able Syste m-on-Chip ar e trademarks of Cypress Se miconducto r Corporation. Purchase of I2C compone nts f rom Cypress or one of its sublicensed Associated Companies conveys a license under the Ph ilips I2C Patent Rights to use these components in an I2C [...]