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Cypress CY7C1370D manual

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Table of contents for the manual

  • Page 1

    18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL™ Architecture CY7C1370D CY7C1372D Cypress Semiconductor Corpora tion • 198 Champion Cou rt • San Jose , CA 95134-1 709 • 408-943-2 600 Document #: 38-05555 Rev . *F Revised June 28, 2006 Features • Pin-comp atible and functionally equiv a le nt to ZBT™ • Supports 250-MHz bus operati[...]

  • Page 2

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 2 of 28 Selection Guide 250 MHz 200 MHz 167 MHz Unit Maximum Access T ime 2.6 3.0 3.4 ns Maximum Operating Curren t 350 300 275 mA Maximum CMOS S tandby Cu rrent 70 70 70 mA A0, A1, A C MODE BW a BW b WE CE1 CE2 CE3 OE READ LOGIC DQs DQP a DQP b D A T A S T E E R I N G O U T P U T B U F F E R S[...]

  • Page 3

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 3 of 28 Pin Configurations A A A A A 1 A 0 V SS V DD A A A A A A V DDQ V SS DQb DQb DQb V SS V DDQ DQb DQb V SS NC V DD DQa DQa V DDQ V SS DQa DQa V SS V DDQ V DDQ V SS DQc DQc V SS V DDQ DQc V DD V SS DQd DQd V DDQ V SS DQd DQd DQd V SS V DDQ A A CE 1 CE 2 BW a CE 3 V DD V SS CLK WE CEN OE A A[...]

  • Page 4

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 4 of 28 Pin Configurations (continued) 234 5 6 7 1 A B C D E F G H J K L M N P R T U DQ a V DDQ NC/576 M NC/1G DQ c DQ d DQ c DQ d AA A A AV DDQ CE 2 A V DDQ V DDQ V DDQ V DDQ NC/144 M NC A DQ c DQ c DQ d DQ d TMS V DD A NC/72M DQP d A A ADV/LD AC E 3 NC V DD AA N C V SS V SS NC DQP b DQ b DQ b[...]

  • Page 5

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 5 of 28 Pin Configurations (continued) 234 5 67 1 A B C D E F G H J K L M N P R TDO NC/576M NC/1G DQP c DQ c DQP d NC DQ d A CE 1 BW b CE 3 BW c CEN A CE2 DQ c DQ d DQ d MODE NC DQ c DQ c DQ d DQ d DQ d NC/36M NC/72M V DDQ BW d BW a CLK WE V SS V SS V SS V SS V DDQ V SS V DD V SS V SS V SS NC V[...]

  • Page 6

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 6 of 28 Pin Definitions Pin Name I/O T ype Pin Description A0 A1 A Input- Synchronous Address Inputs used to select one of the addres s locations . Sa mpled at the rising e dge of the CLK. BW a BW b BW c BW d Input- Synchronous Byte Write Select Input s, active LOW . Qualified with WE to conduc[...]

  • Page 7

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 7 of 28 Introduction Functional Overview The CY7C1370D and C Y7C1372D are synchronous-pipeli ned Burst NoBL SRAMs designed specifically to eliminate wait states during Write/Read transi tions. All synchronous input s pass through input registers co ntrolled by the rising ed ge of the clock. The[...]

  • Page 8

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 8 of 28 Asserting the Write Enable input (WE ) with the selected Byte Write Select (BW ) input will selectively write to only the desired bytes. Bytes not selected during a byte write operation will remain unaltered. A synchronous self-timed w rite mechanism has been provided to simplify the wr[...]

  • Page 9

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 9 of 28 Notes: 1. X = “Don't Care”, H = Lo gic HIGH, L = Logic L OW , CE stands fo r ALL Chip Ena bles active. BWx = L signifies at least one Byte W rite Select is active, BW x = V alid signifies that the desired byte writ e selects are as se rted, see Write Cycle Description table for[...]

  • Page 10

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 10 of 28 Partial Write Cycle Description [1, 2, 3, 8] Function (CY7C1370D) WE BW d BW c BW b BW a Read H X X X X Write – No bytes written L H H H H Wri te Byte a – (D Q a and DQP a ) L HHH L Wri te Byte b – (D Q b and DQP b )L H H L H Write Bytes b, a L H H L L Write Byte c – (DQ c and [...]

  • Page 11

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 1 1 of 28 IEEE 1 149.1 Serial Boundary Scan (JT AG) The CY7C1370D/CY7C1372D incorpora tes a serial boundary scan test access por t (T AP). This p art is fully compliant with 1 149.1. The T AP operates using JEDEC-standard 3.3V or 2.5V I/O logic levels. The CY7C1370D/CY7C1372 D contains a T AP c[...]

  • Page 12

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 12 of 28 When the T AP controller is in the Capture-IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board -level serial test data path. Byp ass Register T o save time when serial ly shifting data through registers, it is som[...]

  • Page 13

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 13 of 28 in the T AP controller , i t will directly control the state of the output (Q-bus) pins, when t he EXTEST is entered as the current instruction. When HIGH, it will e nable the output buffers to drive the output bus. When LOW , this bit will place the output bus into a High-Z condition.[...]

  • Page 14

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 14 of 28 3.3V T AP AC T est Conditions Input pulse levels ... ............... .............. .............. .. V SS to 3.3V Input rise and fall times ......... ........ ........... ... ........... ... ...... 1 ns Input timing referenc e levels .................... ........... ............1.5V O[...]

  • Page 15

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 15 of 28 Identification Register Definitions Instruction Field CY7C137 2D CY7C1370D Description Revision Number (31:29) 000 000 Reserved for version number . Cypress Device ID (28:12) [12] 0101 1001000100101 0101 1001000010101 Reserved for future use. Cypress JEDEC ID (1 1:1) 000001 10100 00000[...]

  • Page 16

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 16 of 28 1 19-Ball BGA Boundary Scan Order [13, 14] Bit # Ball ID Bit # Ball ID Bit # Ball ID Bit # Ball ID 1 H4 23 F6 45 G4 67 L1 2T 4 2 4 E 7 4 6 A 4 6 8 M 2 3T 5 2 5 D 7 4 7 G 3 6 9 N 1 4T 6 2 6 H 7 4 8 C 3 7 0 P 1 5R 5 2 7 G 6 4 9 B 2 7 1 K 1 6L 5 2 8 E 6 5 0 B 3 7 2L 2 7R 6 2 9 D 6 5 1 A 3[...]

  • Page 17

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 17 of 28 165-Ball BGA Boundary Scan Order [13, 15] Bit # Ball ID Bit # Ball ID Bit # Ball ID 1N 6 3 1 D 1 0 6 1G 1 2N 7 3 2 C 1 1 6 2 D 2 3N 1 0 3 3 A 1 1 6 3 E 2 4P 1 1 3 4 B 1 1 6 4 F 2 5P 8 3 5 A 1 0 6 5G 2 6R 8 3 6 B 1 0 6 6 H 1 7R 9 3 7 A 9 6 7 H 3 8P 9 3 8 B 9 6 8 J 1 9P 1 0 3 9 C 1 0 6 9[...]

  • Page 18

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 18 of 28 Maximum Ratings (Above which the useful life may be impaired. For user guide- lines, not tested.) S torage T e mperature ............. .............. ...... –65 °C to +150°C Ambient T emperature with Power Applied ........... ............................ ...... –55 °C to +125°C[...]

  • Page 19

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 19 of 28 Note: 18. T ested initially and af ter any design or proc ess chan ge that may affect these p arameters. Cap acit ance [18] Parameter Description T est Conditions 1 00 TQ FP Max. 1 19 BGA Max. 165 FBGA Max. Unit C IN Input Capacitance T A = 25 ° C, f = 1 MHz, V DD = 3.3V . V DDQ = 2.5[...]

  • Page 20

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 20 of 28 Switching Characteristics Over the Operating Range [23, 24] Parameter Descriptio n –250 –200 –167 Unit Min. Max. Min. Max. Min. Max. t Power [19] V CC (typical) to the first access read or write 1 1 1 ms Clock t CYC Clock Cycle T ime 4.0 5 6 ns F MAX Maximum Operating Frequency 2[...]

  • Page 21

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 21 of 28 Switching W aveforms Read/Wri te/Timing [25, 26, 27] Notes: 25. For this waveform ZZ is tied LOW. 26. When C E is LOW, CE 1 is LOW , C E 2 is HIGH and CE 3 is LOW . When CE is HIGH,CE 1 is HIGH or CE 2 is LOW or CE 3 is HIGH. 27. Order of the Burst sequ ence is determined by the statu [...]

  • Page 22

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 22 of 28 Notes: 28. The Ignore Clock Edge or St all cycle (Clock 3) illustrated CEN being used to create a p ause. A write is not perfor m ed durin g this cycle. 29. Device must be deselected when entering ZZ mode. See cycle descr ipt ion table for all possible signal co nditions to deselect th[...]

  • Page 23

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 23 of 28 Ordering Information Not all of the spe ed, package and temperature ran ges are available. Please contact your local sales r epresentative or visit www .cypress.com for actual pro duct s offered. Speed (MHz) Ordering Code Packa ge Diagram Part and Packa ge T ype Operating Range 167 CY7[...]

  • Page 24

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 24 of 28 250 CY7C1370D-250AXC 51-8 5050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free Commercial CY7C1372D-250AXC CY7C1370D-250BGC 51-851 15 1 1 9-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1372D-250BGC CY7C1370D-250BGXC 51-851 15 1 1 9-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-F[...]

  • Page 25

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 25 of 28 Package Diagrams NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE 3. DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMAT[...]

  • Page 26

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 26 of 28 Package Diagrams (continued) 1.27 20.32 2 16 5 4 37 L E A B D C H G F K J U P N M T R 12.00 19.50 30° TYP. 2.40 MAX. A1 CORNER 0.70 REF. U T R P N M L K J H G F E D C A B 21 43 65 7 Ø1.00(3X) REF. 7.62 22.00±0.20 14.00±0.20 1.27 0.60±0.10 C 0.15 C B A 0.15(4X) Ø0.05 M C Ø0.75±0[...]

  • Page 27

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 27 of 28 © Cypress Semi con duct or Cor po rati on , 20 06 . The information con t a in ed he re i n is su bject to change wi t hou t n oti ce. C ypr ess S em ic onduct or Corporation assumes no resp onsibility f or the u se of any circuitry o ther than circui try embodied i n a Cypress prod u[...]

  • Page 28

    CY7C1370D CY7C1372D Document #: 38-05555 Rev . *F Page 28 of 28 Document History Page Document Title: CY7C1372D/CY7C1370D 18-Mbit (512 K x 36/1M x 18) Pipelined SRAM with NoBL™ Architecture Document Number: 38-05555 REV . ECN No. Issue Date Orig. of Change Description of Chang e ** 254509 See ECN RKF New data sheet *A 276690 See ECN VBL C hang ed[...]