English dropdown-ico

HP Intel Xeon X5667 manual

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102

Go to page of

Similar user manuals

A good user manual

The rules should oblige the seller to give the purchaser an operating instrucion of HP Intel Xeon X5667, along with an item. The lack of an instruction or false information given to customer shall constitute grounds to apply for a complaint because of nonconformity of goods with the contract. In accordance with the law, a customer can receive an instruction in non-paper form; lately graphic and electronic forms of the manuals, as well as instructional videos have been majorly used. A necessary precondition for this is the unmistakable, legible character of an instruction.

What is an instruction?

The term originates from the Latin word „instructio”, which means organizing. Therefore, in an instruction of HP Intel Xeon X5667 one could find a process description. An instruction's purpose is to teach, to ease the start-up and an item's use or performance of certain activities. An instruction is a compilation of information about an item/a service, it is a clue.

Unfortunately, only a few customers devote their time to read an instruction of HP Intel Xeon X5667. A good user manual introduces us to a number of additional functionalities of the purchased item, and also helps us to avoid the formation of most of the defects.

What should a perfect user manual contain?

First and foremost, an user manual of HP Intel Xeon X5667 should contain:
- informations concerning technical data of HP Intel Xeon X5667
- name of the manufacturer and a year of construction of the HP Intel Xeon X5667 item
- rules of operation, control and maintenance of the HP Intel Xeon X5667 item
- safety signs and mark certificates which confirm compatibility with appropriate standards

Why don't we read the manuals?

Usually it results from the lack of time and certainty about functionalities of purchased items. Unfortunately, networking and start-up of HP Intel Xeon X5667 alone are not enough. An instruction contains a number of clues concerning respective functionalities, safety rules, maintenance methods (what means should be used), eventual defects of HP Intel Xeon X5667, and methods of problem resolution. Eventually, when one still can't find the answer to his problems, he will be directed to the HP service. Lately animated manuals and instructional videos are quite popular among customers. These kinds of user manuals are effective; they assure that a customer will familiarize himself with the whole material, and won't skip complicated, technical information of HP Intel Xeon X5667.

Why one should read the manuals?

It is mostly in the manuals where we will find the details concerning construction and possibility of the HP Intel Xeon X5667 item, and its use of respective accessory, as well as information concerning all the functions and facilities.

After a successful purchase of an item one should find a moment and get to know with every part of an instruction. Currently the manuals are carefully prearranged and translated, so they could be fully understood by its users. The manuals will serve as an informational aid.

Table of contents for the manual

  • Page 1

    Reference Number: 321323-002 Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide March 2010[...]

  • Page 2

    2 Thermal/Mechanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPL IED, BY ESTOPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT . EXCEPT AS PROVIDED IN INTEL 'S TERMS AND CONDIT IONS OF SALE FOR SUCH PRODUCTS, IN TEL ASSUMES NO LIABIL[...]

  • Page 3

    Thermal/Mechanical Design Guide 3 Contents 1I n t r o d u c t i o n ......... ........... .......... ........... .......... ........... .......... ........... ........... .......... ...... 9 1.1 References ........... .......... ........... .......... ........... .......... ........... .......... ........... ........ 10 1.2 Definition of Term s ...[...]

  • Page 4

    4 Thermal/Mechanical Design Guide 6.2 Intel Refe rence Compon ent Validation ................ ............ ........... ............ ........... .... 43 6.2.1 Board Functional Test Seque nce ............. ................ ........... ........... .......... .. 43 6.2.2 Post-Test Pass Crite ria ............ .......... ............. ........... .......[...]

  • Page 5

    Thermal/Mechanical Design Guide 5 B-9 Heatsink Shoulder Screw (1U, 2U and Tower) ............... ........... ............ ............. .... 58 B-10 Heatsink Compression Spring (1U, 2U and Tower) .................... ............ ............. .... 59 B-11 Heatsink Retaining Ring (1U , 2U and Towe r) ......... ............ ............. ...........[...]

  • Page 6

    6 Thermal/Mechanical Design Guide Tables 1-1 Reference Documents..... .......... ........... .......... ........... ............. .......... ........... ........10 1-2 Terms and Descriptions .......... ........... ............ ........... ........... ............ ........... ........10 4-1 Socket Compone nt Mass .............. ............ ........[...]

  • Page 7

    Thermal/Mechanical Design Guide 7 Revision History § Document Number Revision Number Description Revision Date 321323 001 Public Release March 2009 321323 002 Updates / additions in this revision include: • Changed to reflect addition of Intel® X eon® Processor 5600 Series • Figure 1-1: replaced to show ILM load pl ate with cut out • T abl[...]

  • Page 8

    8 Thermal/Mechanical Design Guide[...]

  • Page 9

    Thermal/Mechanical Design Guide 9 Introduction 1 Introduction This document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-sock et W orkstation processors listed in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 and in the Intel® Xeon® Processor 5600 Series Datasheet, Volume 1. The c[...]

  • Page 10

    Introduction 10 Thermal/Mechanical Design Guide 1.1 References Material and concepts av ailable in the following documents may be beneficial when reading this document. Notes: 1. Document numbers indicat ed in Location column are subject to c hange. See the appr opriate Electronic Design Kit (EDK) for the mo st up-to-date Document n umber . 2. Av a[...]

  • Page 11

    Thermal/Mechanical Design Guide 11 Introduction § TCC Thermal Control Circuit: Thermal monitor uses th e TCC to reduce the die temperature by using clock modulation and/or operating fr equency and input voltag e adjustment when the die temp erature is ve ry near its operating limits. T CONTROL T CONTROL is a static value b elow TCC activat ion use[...]

  • Page 12

    Introduction 12 Thermal/Mechanical Design Guide[...]

  • Page 13

    Thermal/Mechanical Design Guide 13 LGA1366 Socket 2 LGA1366 Socket This chapter describes a surface mount, L G A (Land Grid Array) socket intended for processors in the Intel® X eon® 5500 Platfo rm. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts array ed about a cavity in the center of the socket with lead-f[...]

  • Page 14

    LGA1366 Socket 14 Thermal/Mechanical Design Guide Figure 2-2. LGA1366 Socket C ontact Numbering (Top View of Socket) 31 29 27 25 23 21 19 17 15 13 11 9 7 5 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF A[...]

  • Page 15

    Thermal/Mechanical Design Guide 15 LGA1366 Socket 2.1 Board Layout The land pattern for the LGA1366 socket is 40 m ils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round- off (conversion) error between sock et pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent. Figure 2-3. LGA1366 Socke t Land Pattern[...]

  • Page 16

    LGA1366 Socket 16 Thermal/Mechanical Design Guide 2.2 Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw , extra solder , adhesive, and so on) to attach the socket. As indicated in Figure 2-4 , the Independent Loading Mechanism (ILM) is not present durin[...]

  • Page 17

    Thermal/Mechanical Design Guide 17 LGA1366 Socket compatible with immersion silver (ImAg) motherboard surface finish and a SAC alloy solder paste. The co-planarity (prof ile) and true position re quirements are de fined in Appendix C . 2.3.3 Contacts Base material for the contacts is high strength copper allo y . For the area o n socket contacts wh[...]

  • Page 18

    LGA1366 Socket 18 Thermal/Mechanical Design Guide 2.4 Package Installation / Removal As indicated in Figure 2-6 , access is provided to facilitate manual installation and removal of the package. T o assist in package orientation and alignment with the socket: • The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for pro[...]

  • Page 19

    Thermal/Mechanical Design Guide 19 LGA1366 Socket 2.5 Durability The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Ta b l e 4 - 4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and removal. 2.6 Markings There are thr[...]

  • Page 20

    LGA1366 Socket 20 Thermal/Mechanical Design Guide 2.9 LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of th e sock et as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuit[...]

  • Page 21

    Thermal/Mechanical Design Guide 21 Independent Loading Mechanism (ILM ) 3 Independent Loading Mechanism (ILM) The Independent Loading Mechanism (ILM) pr ovides the force needed to se at the 1366-LGA land package onto the socket contacts. The ILM is physically separ ate from the socket body . The assembly of the ILM to the board is expected to occur[...]

  • Page 22

    Independ ent Loading Mecha nism (ILM) 22 Thermal/Mechanical Design Guide 3.1.2 ILM Back Plate Design Overview The unified back plate for 2-socket server and 2-socket W orkstation products consists of a flat steel back plate with threaded st uds for ILM attach, and internally threaded nuts for heatsink attach. The threaded studs hav e a smooth surfa[...]

  • Page 23

    Thermal/Mechanical Design Guide 23 Independent Loading Mechanism (ILM ) 3.2 Assembly of ILM to a Motherboard The ILM design allows a bottoms up assemb ly of the components to the board. In step 1, (see Figu re 3-3 ), the back plate is placed in a fixture. Holes in the motherboard provide alignment to the thread ed studs. In step 2, the ILM co ver a[...]

  • Page 24

    Independ ent Loading Mecha nism (ILM) 24 Thermal/Mechanical Design Guide . Figure 3-3. ILM Assembly[...]

  • Page 25

    Thermal/Mechanical Design Guide 25 Independent Loading Mechanism (ILM ) As indicated in Figure 3-4 , socket protrusion and ILM key features prev ent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever . § Figure 3 -4. Pi n1 and IL M Lever[...]

  • Page 26

    Independ ent Loading Mecha nism (ILM) 26 Thermal/Mechanical Design Guide[...]

  • Page 27

    Thermal/Mechanical Design Guide 27 LGA1366 Socket and ILM Electrica l, Mechanical, and Environmental Specifications 4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications This chapter describes the electrical, mechan ical, and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism. 4.1 C[...]

  • Page 28

    LGA1366 Socket and ILM Electrical , Mechan ical, and Env ironmental Specifications 28 Thermal/Mechanical Design Guide 4.4 Loading Specifications The socket will be tested against the conditions lis ted in the LGA1366 Socket V alidation Reports with heatsink and the ILM attached, under the loading cond itions outlined in this chapter . Ta b l e 4 - [...]

  • Page 29

    Thermal/Mechanical Design Guide 29 LGA1366 Socket and ILM Electrica l, Mechanical, and Environmental Specifications 4.6 Environmental Requirements Design, including materials, shall be consiste nt with the manufacture of units that meet the following environmental reference points. The reliability targets in this chapter are ba sed on the expected [...]

  • Page 30

    LGA1366 Socket and ILM Electrical , Mechan ical, and Env ironmental Specifications 30 Thermal/Mechanical Design Guide A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability .pdf . § Figure 4-1. Flow Chart of Knowledge-Based Reliabilit y Evaluati on Methodology Establish t he marke[...]

  • Page 31

    Thermal/Mechanical Design Guide 31 Thermal Solutions 5 Thermal Solutions This section describes a 1U reference heatsink, design targets for 2U and T ower heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design guidelines for processors in the Intel® X eon® 5500 Platform. 5.1 Performance Targets V alues for boundary con[...]

  • Page 32

    Thermal Solutions 32 Thermal/Mechanical Design Guide 3 . A i r f l o w t h r o u g h t h e h e a t s i n k f i n s w i t h z e r o b y p a s s . M a x t a r g e t f o r p r e s s u r e d r o p ( d P ) m e a s u r e d i n i n c h e s H 2 O. 4. Reference system configuration. Proces sor is downstre am from memory in EEB (Entry-Lev el Electronics Bay)[...]

  • Page 33

    Thermal/Mechanical Design Guide 33 Thermal Solutions 5. Dimensions of heatsink do not include socket or pr ocessor. The 25.5 mm heatsink hei ght + socket/processor height (7.729 mm, Table 4-2 ) complies with 33.5mm max height for SSI blade boards (http://ssiforum.o rg/ ). 6. Passive heatsinks. Dow Corning TC-1996 thermal interface material. 5.2 Hea[...]

  • Page 34

    Thermal Solutions 34 Thermal/Mechanical Design Guide 5.3 Assembly The assembly process for the 1U referenc e heatsink begins with application of Honeywell PCM45F thermal interface material to improv e conduction from the IHS. T ape and roll format is recommended. Pad siz e is 35 x 35mm, thickness is 0.25mm. Next, position the heatsink such that the[...]

  • Page 35

    Thermal/Mechanical Design Guide 35 Thermal Solutions 5.3.1 Thermal Interface Material (TIM) TIM should be verified to be w ithin its recommended shelf life before use. Surfaces should be free of foreign ma terials prior to application of TIM. Use isopropyl alcohol and a lint free cloth to remove old TIM before applying new TIM. 5.4 Structural Consi[...]

  • Page 36

    Thermal Solutions 36 Thermal/Mechanical Design Guide 5.5.2 Dual Thermal Profile Processors that offer dual thermal profile are specified in the appropriate datasheet. Dual thermal profile helps mitigate limita tions in volumetrically constrained form factors and allows trade-offs between heatsink cost and TCC activ ation risk. For heatsinks that co[...]

  • Page 37

    Thermal/Mechanical Design Guide 37 Thermal Solutions Compliance to Profile A ensures that no me asurable performance loss will occur due to TCC activ ation. It is expected that TCC would only be activ ated for very brief periods of time when running a worst -case real world application in a worst -case thermal condition. A worst-case real world app[...]

  • Page 38

    Thermal Solutions 38 Thermal/Mechanical Design Guide 5.6.1.1 T CONTROL Guidance F actory configured T CONTROL values are av ailable in the appropria te Dear Customer Letter or may be extr acted by issuing a Ma ilbox or an RDMSR instruction. See the appropriate datasheet for more information. Due to increased thermal headroom based on thermal char a[...]

  • Page 39

    Thermal/Mechanical Design Guide 39 Thermal Solutions Using a smaller aver aging constant could cause premature detection of failure. The Critical T emperature threshold genera lly triggers somewhere between PECI of -0.75 and -0.50. T o avoid false shutdown s, initiate soft shutdown at -0.25. Since customer designs, boundary condit ions, an d failur[...]

  • Page 40

    Thermal Solutions 40 Thermal/Mechanical Design Guide 5.7.2 Thermal Excursion Power for Processors with Single Thermal Prof ile Under fan failure or other anomalous thermal excursions, T case may exceed the thermal profile for a duration totaling less than 360 hours per ye ar without affecting long term reliability (life) of the processor . For more[...]

  • Page 41

    Thermal/Mechanical Design Guide 41 Quality and Reliability Requirements 6 Quality and Reliability Requirements 6.1 Test Conditions The T est Conditions provided in Ta b l e 6 - 1 address processor heatsink failure mechanisms only . T est Conditions, Qualification and Visual Criteria v ary by customer; Ta b l e 6 - 1 applies to Intel requirements. S[...]

  • Page 42

    Quality and Reliability Requirements 42 Thermal/Mechanical Design Guide 8a) Thermal Performance fo r Intel ® Xe on® Processor 5500 Series Using 1U heatsink and 1U airflow from Ta b l e 5 - 1 : 1) TT V @ 95W (Profile B), Note 1. Using 2U heatsink and 2U airflow from Ta b l e 5 - 1 : 2) TT V @ 95W (Profile A), Note 1. 3) TT V @ 80W . 4) TT V @ 60W [...]

  • Page 43

    Thermal/Mechanical Design Guide 43 Quality and Reliability Requirements 6.2 Intel Reference Component Validation Intel tests reference components both indivi dually and as an assembly on mechanical test boards, and assesses performance to the env elopes specified in previous sections by varying bo undary conditions. While component validation shows[...]

  • Page 44

    Quality and Reliability Requirements 44 Thermal/Mechanical Design Guide 2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 3. No signs of physical damage on baseboard surface due to i[...]

  • Page 45

    Thermal/Mechanical Design Guide 45 Component Suppliers A Component Suppliers V arious suppliers have developed support components for processors in the Intel® X eon® 5500 Platform. These suppliers and components are listed as a convenience to customers. Intel does not guarantee quality , reliability , functionality or compatibility of these compo[...]

  • Page 46

    Component Suppliers 46 Thermal/Mechanical Design Guide A.1.3 Alternative Thermal Solution The alternative thermal solutions are preliminary an d are not verified by Intel to meet the criteria outlined in Ta b l e 6 - 1 . Customers can purchase the alternative thermal solutions from the suppliers listed in Ta b l e A - 3 . Table A-2. Suppliers for t[...]

  • Page 47

    Thermal/Mechanical Design Guide 47 Component Suppliers Notes: 1) Standard - Design and technolo gy sim ilar to Intel Reference or Collaboration designs, however, may not meet thermal requirements for all proce ssor SKUs. 2) Performance - 1U Heats ink designed with premium materials or technology expected to pr ovide optimum thermal p erformance for[...]

  • Page 48

    Component Suppliers 48 Thermal/Mechanical Design Guide[...]

  • Page 49

    Thermal/Mechanical Design Guide 49 Mechanical Drawings B Mechanical Drawings Table B-1. Mechanical Drawing List Description Figure Board Keepin / K eepout Zones (Sheet 1 of 4) Figure B-1 Board Keepin / K eepout Zones (Sheet 2 of 4) Figure B-2 Board Keepin / K eepout Zones (Sheet 3 of 4) Figure B-3 Board Keepin / K eepout Zones (Sheet 4 of 4) Figure[...]

  • Page 50

    Mechanical Drawings 50 Thermal/Mechanical Design Guide Figure B-1. Board Keepin / Keepout Zones (Sheet 1 of 4) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 49.90 [1.965 ] SOCKET BODY OUTLINE, FOR REFERENCE ONLY 44.70 [1.760 ] CENTERLINE OF OUTER SOCKET BALL ARRAY 47.50 [1.870 ][...]

  • Page 51

    Thermal/Mechanical Design Guide 51 Mechanical Drawings Figure B-2. Board Keepin / Ke epout Zones (She et 2 of 4) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 2X 0.00 0.000 [] 2X 0.00 0.000 [] 2X 7.50 0.295 [] 9.60 0.378 [] 12.30 0.484 [] 67.70 2.665 [] 2X 72.50 2.854 [] 32.85 1[...]

  • Page 52

    Mechanical Drawings 52 Thermal/Mechanical Design Guide Figure B-3. Board Keepin / Keepout Zones (Sheet 3 of 4) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 8X 6.00 0.236 [] 5.00 0.197 [] 5.00 0.197 [] 0.00 0.000 [] 0.00 0.000 [] 5.00 0.197 [] 17.17 0.676 [] 62.83 2.474 [] 75.00[...]

  • Page 53

    Thermal/Mechanical Design Guide 53 Mechanical Drawings Figure B-4. Board Keepin / Ke epout Zones (She et 4 of 4) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R REVISION HISTORY ZONE REV DESCRIPTION DATE APPROVED - A ORIGINAL RELEASE 09/29/06 - B M.B COMPONENT HEIGHT RESTRICTION C[...]

  • Page 54

    Mechanical Drawings 54 Thermal/Mechanical Design Guide Figure B-5. 1U Reference Heat sink Assembly (Sheet 1 of 2)[...]

  • Page 55

    Thermal/Mechanical Design Guide 55 Mechanical Drawings Figure B-6. 1U Reference Heatsink Assembly (Sheet 2 of 2)[...]

  • Page 56

    Mechanical Drawings 56 Thermal/Mechanical Design Guide Figure B-7. 1U Reference H eatsink Fin and Base (Sheet 1 of 2)[...]

  • Page 57

    Thermal/Mechanical Design Guide 57 Mechanical Drawings Figure B-8. 1U Reference Heatsink Fin and Base ( Sheet 2 of 2)[...]

  • Page 58

    Mechanical Drawings 58 Thermal/Mechanical Design Guide Figure B-9. Heatsink Shoulder Scre w (1U, 2U and Tower) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A A A D89880 1 03 DWG. NO SHT. REV SHEET 1 OF 1 DO NOT SCALE DRAWING SCALE: 1 03 D89880 D REV DRAWING NUMBER SIZE SCREW, SHOULDER, M3 X 0.5 TITLE 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA C[...]

  • Page 59

    Thermal/Mechanical Design Guide 59 Mechanical Drawings Figure B-10. Heatsink Com pression Spring (1U, 2U and Tower)[...]

  • Page 60

    Mechanical Drawings 60 Thermal/Mechanical Design Guide Figure B-11. Heatsink Re tain ing Ring (1U, 2U and Tower)[...]

  • Page 61

    Thermal/Mechanical Design Guide 61 Mechanical Drawings Figure B-12. Heatsink Load Cup (1U, 2U and To wer)[...]

  • Page 62

    Mechanical Drawings 62 Thermal/Mechanical Design Guide Figure B-13. 2U Collaborative He atsink Assembly (Sheet 1 of 2)[...]

  • Page 63

    Thermal/Mechanical Design Guide 63 Mechanical Drawings Figure B-14. 2U Collaborative Hea tsink Assembly (Sheet 2 of 2)[...]

  • Page 64

    Mechanical Drawings 64 Thermal/Mechanical Design Guide Figure B-15. 2U Collaborative Heat sink Volumetric (Sheet 1 of 2)[...]

  • Page 65

    Thermal/Mechanical Design Guide 65 Mechanical Drawings Figure B-16. 2U Collaborative Hea tsink Volumetric (Sheet 2 of 2)[...]

  • Page 66

    Mechanical Drawings 66 Thermal/Mechanical Design Guide Figure B-17. Tower Collaborative He atsink Assembly (Sheet 1 of 2)[...]

  • Page 67

    Thermal/Mechanical Design Guide 67 Mechanical Drawings Figure B-18. Tower Collaborative He atsink Assembly (Sheet 2 of 2)[...]

  • Page 68

    Mechanical Drawings 68 Thermal/Mechanical Design Guide Figure B-19. Tower Collaborative He atsink Volumetric (Sheet 1 of 2)[...]

  • Page 69

    Thermal/Mechanical Design Guide 69 Mechanical Drawings Figure B-20. Tower Collaborative He atsink Volumetric (Sheet 2 of 2)[...]

  • Page 70

    Mechanical Drawings 70 Thermal/Mechanical Design Guide Figure B-21. 1U Refere nce Heatsink Assembly with TIM (Sheet 1 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R E32409 1 01 DWG. NO SHT. REV SHEET 1 OF 2 DO NOT SCALE DRAWING SCALE: 1.500 01 E32409 D REV DRAWING NUMBER SI[...]

  • Page 71

    Thermal/Mechanical Design Guide 71 Mechanical Drawings Figure B-22. 1U Reference Heatsink Assembly with TI M (She et 2 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 35.0# 1.0 1.38# 0.03 [] 35.0# 1.0 1.38# 0.03 [] 27.5# 0.5 1.08# 0.01 [] 27.5# 0.5 1.08?[...]

  • Page 72

    Mechanical Drawings 72 Thermal/Mechanical Design Guide Figure B-23. 2U Refere nce Heatsink Assembly with TIM (Sheet 1 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R E32410 1 01 DWG. NO SHT. REV SHEET 1 OF 2 DO NOT SCALE DRAWING SCALE: 1.500 01 E32410 D REV DRAWING NUMBER SI[...]

  • Page 73

    Thermal/Mechanical Design Guide 73 Mechanical Drawings Figure B-24. 2U Reference Heatsink Assembly with TI M (She et 2 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 35.0# 1.0 1.38# 0.03 [] 35.0# 1.0 1.38# 0.03 [] 27.5# 0.5 1.08# 0.01 [] 27.5# 0.5 1.08?[...]

  • Page 74

    Mechanical Drawings 74 Thermal/Mechanical Design Guide Figure B-25. Tower Reference He atsink Assembly with TIM (Sheet 1 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R E32412 1 01 DWG. NO SHT. REV SHEET 1 OF 2 DO NOT SCALE DRAWING SCALE: 1.500 01 E32412 D REV DRAWING NUMBER[...]

  • Page 75

    Thermal/Mechanical Design Guide 75 Mechanical Drawings Figure B-26. Tower Refer ence Heatsink Assembly with TI M (Sheet 2 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 35.0# 1.0 1.38# 0.03 [] 35.0# 1.0 1.38# 0.03 [] 27.5# 0.5 1.08# 0.01 [] 27.5# 0.5 1.[...]

  • Page 76

    Mechanical Drawings 76 Thermal/Mechanical Design Guide Figure B-27. 25.5mm Refer ence He atsink Assembly (Sheet 1 of 2)[...]

  • Page 77

    Thermal/Mechanical Design Guide 77 Mechanical Drawings Figure B-28. 25.5mm Re ference He atsink Assembly (Sheet 2 of 2)[...]

  • Page 78

    Mechanical Drawings 78 Thermal/Mechanical Design Guide Figure B-29. 25.5mm Re ference Heatsink Fin an d Base (Sheet 1 of 2)[...]

  • Page 79

    Thermal/Mechanical Design Guide 79 Mechanical Drawings Figure B-30. 25.5mm Reference Heat sink Fin and Base (Sheet 2 of 2)[...]

  • Page 80

    Mechanical Drawings 80 Thermal/Mechanical Design Guide Figure B-31. 25.5mm Refe rence Heatsink Assembly with TIM (Sheet 1 of 2)[...]

  • Page 81

    Thermal/Mechanical Design Guide 81 Mechanical Drawings Figure B-32. 25.5mm Reference Heatsink Assembly with TI M (Sheet 2 of 2)[...]

  • Page 82

    Mechanical Drawings 82 Thermal/Mechanical Design Guide §[...]

  • Page 83

    Thermal/Mechanical Design Guide 83 Socket Mechanical Drawings C Socket Mechanical Drawings Ta b l e C - 1 lists the mechanical draw ings included in this appendix. Table C-1. Mechanical Drawing List Drawing Description Figure Number “Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 ?[...]

  • Page 84

    Socket Mechanical Drawings 84 Thermal/Mechanical Design Guide Figure C-1. Socket Mechanic al Drawing (Sheet 1 of 4)[...]

  • Page 85

    Thermal/Mechanical Design Guide 85 Socket Mechanical Drawings Figure C-2. Socket Mechanic al Drawing (Sheet 2 of 4)[...]

  • Page 86

    Socket Mechanical Drawings 86 Thermal/Mechanical Design Guide Figure C-3. Socket Mechanic al Drawing (Sheet 3 of 4)[...]

  • Page 87

    Thermal/Mechanical Design Guide 87 Socket Mechanical Drawings § Figure C-4. Socket Mechanic al Drawing (Sheet 4 of 4)[...]

  • Page 88

    Socket Mechanical Drawings 88 Thermal/Mechanical Design Guide[...]

  • Page 89

    Thermal/Mechanical Design Guide 89 Heatsink Load Metrology D Heatsink Load Metrology T o ensure complia nce to max socket loading value listed in Ta b l e 4 - 3 , and to meet the performance targets for Thermal Interface Material in Ta b l e 5 . 3 , the Heatsink Static Compressive Load can be assessed using the items listed below: • HP34970A DAQ [...]

  • Page 90

    Heatsink Load Metrology 90 Thermal/Mechanical Design Guide § Figure D-1. Intel Xeon Processor 5500 Series Load Cell Fixture[...]

  • Page 91

    Thermal/Mechanical Design Guide 91 Embedded Thermal Solutions E Embedded Thermal Solutions This section describes the L V processors and Embedded reference heatsinks for NEBS (Network Equipment Building Systems) comp liant A T CA (Advanced T elecommunications Computing Architecture) systems. These L V processors are good for any form factor that ne[...]

  • Page 92

    Embedded Thermal Solutions 92 Thermal/Mechanical Design Guide socket only and the 38 W proces sor can be used in dual soc ket. 4. Local Ambient Temperature written 50/65 o C means 50 o C under Nominal conditions but 65 o C is allowed for Short-Term NEBS excursions. 5. Passive heatsinks with TIM. 6. See Sectio n 5.1 for standard 1U solutions that do[...]

  • Page 93

    Thermal/Mechanical Design Guide 93 Embedded Thermal Solutions NOTES: 1.) The thermal specifications shown in this graph are for referen ce only. See the appropri ate Datasheet for the Thermal Profile specifications. In case of conflict, the da ta in the datasheet supersedes any data in this figure. 2.) The Nominal Thermal Pro file must be used for [...]

  • Page 94

    Embedded Thermal Solutions 94 Thermal/Mechanical Design Guide NOTES: Thermal sample only , retention not pro duction read y . NOTES: Heat sink should be optimized for the layout. Figure E-3. UP ATCA Thermal Soluti on Figure E-4. UP ATC A System Layout[...]

  • Page 95

    Thermal/Mechanical Design Guide 95 Embedded Thermal Solutions § Figure E-5. UP ATCA Heat S ink Drawing[...]

  • Page 96

    Embedded Thermal Solutions 96 Thermal/Mechanical Design Guide E.3 Mechanical Drawings and Supplier Information See Appendix B for retention and keep out drawings. The part number below represent Intel refe rence designs for a DP A TCA heatsink. Customer implem entation of these com ponen ts may be unique and require validation by the customer . Cus[...]

  • Page 97

    Thermal/Mechanical Design Guide 97 Embedded Thermal Solutions § Figure E-6. ATCA Reference Heat Sink Assembly (Sheet 1 of 2)[...]

  • Page 98

    Embedded Thermal Solutions 98 Thermal/Mechanical Design Guide § Figure E-7. ATCA Reference Heat Sink Assembly (Sheet 2 of 2 )[...]

  • Page 99

    Thermal/Mechanical Design Guide 99 Embedded Thermal Solutions § Figure E-8. ATCA Reference He atsink Fin and Base (Sheet 1 of 2)[...]

  • Page 100

    Embedded Thermal Solutions 100 Thermal/Mechanical Design Guide § § Figure E-9. AT CA Reference H eatsink Fin and Base (Sheet 2 of 2)[...]

  • Page 101

    Thermal/Mechanical Design Guide 101 Processor Installation Tool F Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for details regarding this tool: Billy Hsieh billy .hsieh@tycoelectron ics.com +81 44 844 8292[...]

  • Page 102

    Processor Installation Tool 102 Thermal/Mechanical Design Guide § Figure F-1. Processor Installation Tool[...]