Intel BX80633I74930K manual

329366-001 Intel ® Core™ i7 Processor Family for LGA2011 Socket Datasheet – Volume 1 of 2 Supporting Desktop Intel ® Core™ i7-4960X Extreme Edition Processor Series for the LGA2011 Socket Supporting Desktop Intel ® Core™ i7-49xx and i7-48xx Processor Series for the LGA2011 Socket September 2013[...]

2 Datasheet INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH Intel ® PRODUCTS. NO LICENSE, Express* OR IMPLIED, BY EST OPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DO CUMENT . EXCEPT AS PROVIDED IN INTEL 'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHA TSOEVER, AN D IN[...]

Datasheet 3 Table of Contents 1 Introduction .............................................................................................................. 8 1.1 Processor Feature Details ..................................................................................... 9 1.2 Supported Technologies ...............................................[...]

4 Datasheet 4.2 Processor Core / Package Power Management ...................................................... 32 4.2.1 Enhanced Intel ® SpeedStep ® Technology ................................................. 32 4.2.2 Low-Power Idle States ............................................................................ 33 4.2.3 Requesting Low-Powe[...]

Datasheet 5 Figures 1-1 Processor Platform Block Diagram Example ............................................................. 9 1-2 PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2) .................. 12 2-1 PCI Express* Layering Diagram ........................................................................... 19 2-2 Packet [...]

6 Datasheet 7-10 Voltage Specifications ........................................................................................ 63 7-11 Current Specifications........................................................................................ 65 7-12 V CC Overshoot Specifications ................................................................[...]

Datasheet 7 Revision History § Revision Number Description Date 001 • Initial release September 2013[...]

Introduction 8 Datasheet 1 Introduction The Intel ® Core™ i7 processor family for LGA2011 socket are the next gener ation of 64-bit, multi-core desktop processors built on 22-nanometer process technology . Based on the low-power/high-performance Intel ® Core™ i7 processor micro-architecture, the processor is designed for a two-chip platform i[...]

Datasheet 9 Introduction 1.1 Processor Feature Details • Up to 6 execution cores • Each core supports two threads (Intel ® Hyper- Threading T echnology), up to 12 threads per socket • 32KB instruction and 32-KB data first-level cache (L1) for each core • 256KB shared instruction/data mid-level (L2) cache for each core • Up to 15MB last l[...]

Introduction 10 Datasheet 1.2 Supported Technologies • Intel ® Virtualization T echnology (Intel ® VT) • Intel ® Virtualization T echnology (Intel ® VT) for Directed I/O (Intel ® VT -d) • Intel ® Virtualization T echnology (Intel ® VT) Processor Extensions • Intel ® 64 Architecture • Intel ® Streaming SIMD Extensions 4.1 (Intel ?[...]

Datasheet 11 Introduction 1.3.2 PCI Express* • The PCI Express* port(s) are fully-compliant with the PCI Express* Base Specification , Revision 3.0 (PCIe 3.0) • Support for PCI Express* 3.0 (8.0 GT/s), 2.0 (5.0 GT/s), and 1.0 (2.5 GT/s) • Up to 40 lanes of PCI Express* interconnect for general purpose PCI Express* devices at PCIe* 3.0 speeds [...]

Introduction 12 Datasheet 1.3.3 Direct Media Interface Gen 2 (DMI2) • Serves as the chip-to-chip interface to the PCH • The DMI2 port supports x4 link width and only operates in a x4 mode when in DMI2 • Operates at PCI Express* 1.0 or 2.0 speeds • T ransparent to software • Processor and peer-to-peer writes and reads with 64-bit address s[...]

Datasheet 13 Introduction 1.3.4 Platform Environment Control Interface (PECI) The PECI is a one-wire interface that provides a communication channel between a PECI client (the processor) and a PECI master (the PCH). Refer to the Processor Thermal Mechanical Specifications and Design Guide for additional details on PECI services av ailable in the pr[...]

Introduction 14 Datasheet 1.6 Package Summary The processor socket type is noted as LGA2011. The processor package is a 52.5 x 45 mm FC-LGA package (L GA2011). Refer to the Processor Thermal Mechanical Specification and Design Guide (see Related Documents section) for the package mechanical specifications. 1.7 Terminology Table 1-1. Terminology (Sh[...]

Datasheet 15 Introduction Intel ® VT -d Intel ® Virtualization T echnology (Intel ® VT) for Directed I/O. Intel VT -d is a hardware assist, under system software (Virtual Machine Manager or operating system) control, for enabling I/O device virtualization. Intel VT -d also brings robust security by providing protection from errant DMAs by using [...]

Introduction 16 Datasheet 1.8 Related Documents Refer to the following documents for additional information. TSOD Thermal Sensor on DIMM UDIMM Unbuffered Dual In-line Module Uncore The portion of the processor comprising the shared cache, IMC, HA, PCU, and UBox. Unit Interval Signaling convention that is binary and unidirectional. In this binary si[...]

Datasheet 17 Introduction § Table 1-3. Public Specifications Document Document Number / Location Advanced Configuration and Power Interface Specification 3.0 http://www.acpi.info PCI Local Bus Specification 3.0 http://www.pcisig.com/specifications PCI Express Base Specification - Revision 2.1 and 1.1 PCI Express Base Specification - Revision 3.0 h[...]

Interfaces 18 Datasheet 2 Interfaces This chapter describes the functional behaviors supported by the processor . T opics covered include: • System Memory Interface • PCI Express* Interface • Direct Media Interface 2 (DMI2) / PCI Express* Interface • Platform Environment Control Interface (PECI) 2.1 System Memory Interface 2.1.1 System Memo[...]

Datasheet 19 Interfaces 2.2 PCI Express* Interface This section describes the PCI Express* 3.0 interface capabilities of the processor . See the PCI Express* Base Specification for details of PCI Express* 3.0. 2.2.1 PCI Express* Architecture Compatibility with the PCI addressing model is maintained to ensure that all existing applications and drive[...]

Interfaces 20 Datasheet 2.2.1.1 Transaction Layer The upper layer of the PCI Express* architecture is the T ransaction Layer . The T ransaction Lay er's primary responsibility is the assembly and disassembly of T ransaction Lay er Pack ets (TLPs). TLPs are used to communicate transactions, such as read and write, as well as certain types of ev[...]

Datasheet 21 Interfaces 2.3 Direct Media Interface 2 (DMI2) / PCI Express* Interface Direct Media Interface 2 (DMI2) connects the processor to the Platform Controller Hub (PCH). DMI2 is similar to a four-lane PCI Express* supporting a speed of 5 GT/s per lane. Refer to Section 6.3 for additional details. Note: Only DMI2 x4 configuration is supporte[...]

Technologies 22 Datasheet 3 Technologies This chapter covers the following technologies: • Intel ® Virtualization T echnology (Intel ® VT) • Security T echnologies • Intel ® Hyper- Threading T echnology (Intel ® HT T echnology) • Intel ® T urbo Boost T echnology • Enhanced Intel ® SpeedStep ® T echnology • Intel ® Advanced V ect[...]

Datasheet 23 Technologies 3.1.2 Intel ® VT-x Features The processor core supports the following Intel VT - x features: • Extended Page T ables (EPT) — hardware assisted page table virtualization. — eliminates VM exits from guest operating system to the VMM for shadow page- table maintenance. • Virtual Processor IDs (VPID) — Ability to as[...]

Technologies 24 Datasheet 3.1.3.1 Intel ® VT-d Features Supported The processor supports the following Intel VT -d features: • Root entry , context entry , and default context • Support for 4-K page sizes only • Support for register-based fault recording only (for single entry only) and support for MSI interrupts for faults — Support for f[...]

Datasheet 25 Technologies 3.2 Security Technologies 3.2.1 Intel ® Advanced Encryption Standard New Instructions (Intel ® AES-NI) Instructions These instructions enable fast and secure data encryption and decryption, using the Advanced Encryption Standard (Intel AES-NI) which is defined by FIPS Publication number 197. Since Intel AES-NI is the dom[...]

Technologies 26 Datasheet 3.4 Intel ® Turbo Boost Technology Intel T urbo Boost T echnology is a feature that allows the processor to opportunistically and automatically run faster than its rated oper ating frequency if it is operating below power , temperature, and current limits. The result is increased performance in multi- threaded and single [...]

Datasheet 27 Technologies 3.6 Intel ® Advanced Vector Extensions (Intel ® AVX) Intel Advanced V ector Extensions (Intel A VX) is a new 256-bit vector SIMD extension of Intel Architecture. The introduction of Intel A VX started with the 2nd Generation Intel ® Core™ processor family . Intel AVX acceler ates the trend of parallel computation in g[...]

Technologies 28 Datasheet • Compatibility – Intel A VX is backward compatible with previous ISA extensions including Intel SSE4: — Existing Intel SSE applications/libr ary can: • Run unmodified and benefit from processor enhancements • Recompile existing Intel ® S SE intrinsic using compilers that generate Intel A VX code • Inter-oper [...]

Datasheet 29 Power Management 4 Power Management This chapter provides information on the following power management topics: • Advanced Configur ation and P ower Interface (ACPI) States Supported • Processor Core / Package P ower Management • System Memory P ower Management • Direct Media Interface 2 (DMI2) / PCI Express* Power Management 4[...]

Power Management 30 Datasheet Notes: 1. Package C7 is not supported. 2. All package states are defined to be "E" states – such that the states always exit back into the LFM point upon execution resume 3. The mapping of actions for PC3, and PC6 are suggestions – microcode will dynamically determine which actions should be taken based o[...]

Datasheet 31 Power Management 4.1.3 Integrated Memory Controller (IMC) States 4.1.4 Direct Media Interface Gen 2 (DMI2) / PCI Express* Link States Note: L1 is only supported when the DMI2/PCI Express* port is operating as a PCI Express* port. Table 4-4. System Memory Power States State Description Power Up/Normal Oper ation CKE asserted. Active Mod[...]

Power Management 32 Datasheet 4.1.5 G, S, and C State Combinations 4.2 Processor Core / Package Power Management While executing code, Enhanced Intel SpeedStep ® T echnology optimizes the processor frequency and core voltage based on workload. Each frequency and voltage operating point is defined by ACPI as a P-State. When the processor is not exe[...]

Datasheet 33 Power Management 4.2.2 Low-Power Idle States When the processor is idle, low-power idle states (C -states) are used to save power . More power savings actions are taken for numerically higher C -States. However , higher C-states ha ve longer exit and entry latencies. R esolution of C-states occurs at the thread, processor core, and pro[...]

Power Management 34 Datasheet Note: 1. If enabled, the core C-state will be C1E if all actives cores ha ve also resolved a core C1 state or higher . 4.2.3 Requesting Low-Power Idle States The core C-state will be C1E if all activ es cores have also resolved a core C1 state or higher . The primary software interfaces for requesting low-power idle st[...]

Datasheet 35 Power Management 4.2.4 Core C-states The following are general rules for all core C -states, unless specified otherwise: • A core C-state is determined by the lowest numerical thread state (such as, Thread 0 requests C1E while Thread 1 requests C3, resulting in a core C1E state). See T able 4-6 . • A core transitions to C0 state wh[...]

Power Management 36 Datasheet 4.2.4.6 Delayed Deep C-States The Delayed Deep C -states (DDCst) feature on this processor replaces the “C-state auto-demotion” scheme used in the previous processor generation. Deep C -states are defined as CC3 through CC7 (refer to T able 4-3 for supported deep C-states). The Delayed Deep C -states are intended t[...]

Datasheet 37 Power Management There is also a concept of Execution Allowed (EA). When EA status is 0, the cores in a socket are in C3 or a deeper state; a socket initiates a request to enter a coordinated package C-state. The coordination is across all sock ets and the PCH. T able 4-9 shows an example of a dual-core processor package C-state resolu[...]

Power Management 38 Datasheet 4.2.5.2 Package C1/C1E State No additional power reduction actions are taken in the package C1 state. However , if the C1E substate is enabled, the processor automatically transitions to the lowest supported core clock frequency , followed by a reduction in voltage. Autonomous power reduction actions that are based on [...]

Datasheet 39 Power Management 4.2.5.5 Package C6 State A processor enters the package C6 low-power state when: • At least one core is in the C6 state. • The other cores are in a C6 or lower power state, and the processor has been granted permission by the platform. • L3 shared cache retains context and becomes inaccessible in this state. • [...]

Power Management 40 Datasheet 4.3.1 CKE Power-Down The CKE input land is used to enter and exit different power-down modes. The memory controller has a configurable activity timeout for each r ank. When no reads are present to a given rank for the configured interv al, the memory controller will transition the rank to power -down mode. The memory c[...]

Datasheet 41 Power Management 4.3.2.2 Self-Refresh Exit Self-refresh exit can be either a message from an external unit (PCU in most cases, but also possibly from any message-channel master) or as reaction for an incoming transaction. Here are the proper actions on self-refresh exit: • CK is enabled, and four CK cycles driven. • When proper ske[...]

Thermal Management Specifications 42 Datasheet 5 Thermal Management Specifications The processor requires a thermal solution to maintain temperatures within oper ating limits. Any attempt to operate the processor outside these limits may result in permanent damage to the processor and potentially other components within the system. Maintaining the [...]

Datasheet 43 Signal Descriptions 6 Signal Descriptions This chapter describes the processor signals. The signals are arranged in functional groups according to their associated interface or category . 6.1 System Memory Interface Signals Table 6-1. Memory Channel DDR0, DDR1, DDR2, DDR3 Signal Name Description DDR{0/1/2/3}_BA[2:0] Bank Address: These[...]

Signal Descriptions 44 Datasheet 6.2 PCI Express* Based Interface Signals Note: PCI Express* Ports 1, 2, and 3 signals are receive and tr ansmit differential pairs. Table 6-2. Memory Channel Miscellaneous Signal Name Description DDR_RESET_C01_N DDR_RESET_C23_N System Memory Reset: Reset signal from processor to DRAM devices on the DIMMs. DDR_RESET_[...]

Datasheet 45 Signal Descriptions PE2B_TX_DN[7:4] PE2B_TX_DP[7:4] PCIe Transmit Data Output PE2C_TX_DN[11:8] PE2C_TX_DP[11:8] PCIe Transmit Data Output PE2D_TX_DN[15:12] PE2D_TX_DP[15:12] PCIe Transmit Data Output Table 6-5. PCI Express* Port 3 Signals Signal Name Description PE3A_RX_DN[3:0] PE3A_RX_DP[3:0] PCIe Receive Data Input PE3B_RX_DN[7:4] PE[...]

Signal Descriptions 46 Datasheet 6.3 Direct Media Interface Gen 2 (DMI2) / PCI Express* Port 0 Signals 6.4 Platform Environment Control Interface (PECI) Signal 6.5 System Reference Clock Signals 6.6 Joint Test Action Group (JTAG) and Test Access Point (TAP) Signals Table 6-7. DMI2 and PCI Express Port 0 Signals Signal Name Description DMI_RX_DN[3:0[...]

Datasheet 47 Signal Descriptions 6.7 Serial Voltage Identification (SVID) Signals 6.8 Processor Asynchronous Sideband and Miscellaneous Signals TDO Test Data Out: This signal transfers serial test data out of the processor . TDO provides the serial output needed for JT AG specification support. TMS Test Mode Select: This signal is a JT AG specifica[...]

Signal Descriptions 48 Datasheet PROCHOT_N Processor Hot: PROCHOT_N will go activ e when the processor temperature monitoring sensor detects that the processor has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit has been activated, if enabled. This signal can also be driven to the processor [...]

Datasheet 49 Signal Descriptions TXT_AGENT Intel ® Trusted Execution Technology (Intel ® TXT) Agent: This is a strap signal: 0 = Default. The socket is not the Intel ® TXT Agent. 1 = The socket is the Intel ® TXT Agent. In non-Scalable dual-processor (DP) platforms, the legacy socket (identified by SOCKET_ID[1:0] = 00b) with Intel TXT Agent sho[...]

Signal Descriptions 50 Datasheet 6.9 Processor Power and Ground Supplies § § § § Table 6-14. Power and Ground Signals Signal Name Description VCC V ariable power supply for the processor cores, lowest level caches (LLC), ring interface, and home agent. It is provided by a VRM/EVRD 12.0 compliant regulator for each processor socket. The output v[...]

Datasheet 51 Electrical Specifications 7 Electrical Specifications This chapter covers the following topics: • Processor Signaling • Signal Group Summary • Power -On Configuration (POC) Options • Absolute Maximum and Minimum Ratings • DC Specifications 7.1 Processor Signaling The processor includes 2011 lands that use various signaling te[...]

Electrical Specifications 52 Datasheet 7.1.4 Platform Environmental Control Interface (PECI) PECI is an Intel proprietary interface that provides a communication channel between Intel processors and chipset components to external system management logic and thermal monitoring devices. The processor contains a Digital Thermal Sensor (DTS) that repor[...]

Datasheet 53 Electrical Specifications Clock multiplying within the processor is provided by the internal phase locked loop (PLL) that requires a constant frequency BCLK{0/1}_DP , BCLK{0/1}_DN input, with exceptions for spread spectrum clocking. DC specifications for the BCLK{0/1}_DP , BCLK{0/1}_DN inputs are provided in T able 7-15 . 7.1.5.1 PLL P[...]

Electrical Specifications 54 Datasheet 7.1.8.2 Decoupling Guidelines Due to its large number of transistors and high internal clock speeds, the processor is capable of generating large current swings between low and full power states. This may cause voltages on power planes to sag below their minimum v alues if bulk decoupling is not adequate. Larg[...]

Datasheet 55 Electrical Specifications 7.1.8.3.1 Serial Voltage Identification (SVID) Commands The processor provides the ability to oper ate while transitioning to a new VID setting and its associated processor voltage r ails (V CC, V SA , and V CCD ). This is represented by a DC shift. It should be noted that a low-to-high or high-to-low voltage [...]

Electrical Specifications 56 Datasheet 7.1.8.3.5 SVID Power State Functions – SetPS The processor has three power state functions and these states will be set seamlessly with the SVID bus using the SetPS command. Based on the power state command, the SetPS commands send information to the VR controller to configure the VR to improve efficiency , [...]

Datasheet 57 Electrical Specifications 7.1.8.3.6 SVID Voltage Rail Addressing The processor addresses four different voltage rail control segments within VR12 (V CC , V CCD_01 , V CCD_23 , and V SA ). The SVID data packet contains a 4-bit addressing code. Notes: 1. Check with VR vendors for determining the physical address assignment method for the[...]

Electrical Specifications 58 Datasheet Notes: 1. 00h = Off State 2. VID Range HEX 01-32 are not used by the processor . 3. For VID R anges supported, see T able 7-10 . 4. V CCD is a fixed voltage of 1.35V or 1.5V . 7.1.9 Reserved or Unused Signals All Reserv ed (RSVD) signals must not be connected. Connection of these signals to V CC , V TTA , V TT[...]

Datasheet 59 Electrical Specifications Table 7-5. Signal Groups (Sheet 1 of 3) Differential / Single Ended Buffer Type Signals 1 DDR3 Reference Clocks 2 Differential SSTL Output DDR{0/1/2/3}_CLK_D[N/P][3:0] DDR3 Command Signals 2 Single ended SSTL Output DDR{0/1/2/3}_BA[2:0] DDR{0/1/2/3}_CAS_N DDR{0/1/2/3}_MA[15:00] DDR{0/1/2/3}_MA_PAR DDR{0/1/2/3}[...]

Electrical Specifications 60 Datasheet PCI Express* Miscellaneous Signals Single ended Analog Input PE_RBIAS_SENSE Reference Input/Output PE_RBIAS PE_VREF_CAP DMI2/PCI Express* Signals Differential DMI2 Input DMI_RX_D[N/P][3:0] DMI2 Output DMI_TX_D[N/P][3:0] Platform Environmental Control Interface (PECI) Single ended PECI PECI System Reference Clo[...]

Datasheet 61 Electrical Specifications Notes: 1. Refer to Chapter 6 for signal description details. 2. DDR{0/1/2/3} refers to DDR3 Channel 0, DDR3 Channel 1, DDR3 Channel 2 and DDR3 Channel 3. Notes: 1. Refer to T able 7-17 for details on the R ON (Buffer on Resistance) v alue for this signal. 7.3 Power-On Configuration (POC) Options Sever al confi[...]

Electrical Specifications 62 Datasheet 7.4 Absolute Maximum and Minimum Ratings T able 7-8 specifies absolute maximum and minimum ratings. At conditions outside functional operation condition limits, but within absolute maximum and minimum ratings, neither functionality nor long-term reliability can be expected. If a device is returned to condition[...]

Datasheet 63 Electrical Specifications Notes: 1. Storage conditions are applicable to storage en vironments only . In this scenario, the processor must not receive a clock, and no lands can be connected to a voltage bias. Stor age within these limits will not affect the long-term reliability of the device. For functional oper ation, refer to the pr[...]

Electrical Specifications 64 Datasheet Notes: 1. Unless otherwise noted, all specifications in this table apply to all processors. These specifications are based on pre-silicon characterization. 2. Individual processor VID values may be calibr ated during manufacturing such that two devices at the same speed may have different settings. 3. These vo[...]

Datasheet 65 Electrical Specifications Notes: 1. Unless otherwise noted, all specifications in this table apply to all processors. These specifications are based on final silicon characterization. 2. I CC_TDC (Thermal Design Current) is the sustained (DC equivalent) current that the processor is capable of drawing indefinitely and should be used fo[...]

Electrical Specifications 66 Datasheet 7.5.2 Die Voltage Validation Core voltage (V CC ) overshoot ev ents at the processor must meet the specifications in T able 7-12 when measured across the VCC_SENSE and VSS_VCC_SENSE lands. Overshoot events that are < 10 ns in dur ation may be ignored. These measurements of processor die level overshoot shou[...]

Datasheet 67 Electrical Specifications 7.5.3 Signal DC Specifications DC specifications are defined at the processor pads, unless otherwise noted. DC specifications are only valid while meeting specifications for case temper ature, clock frequency , and input voltages. Care should be taken to read all notes associated with each specification. Table[...]

Electrical Specifications 68 Datasheet Notes: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. The voltage rail V CCD which will be set to 1.50V or 1.35V nominal depending on the voltage of all DIMMs connected to the processor . 3. V IL is the maximum voltage level at a receiving agent that will be [...]

Datasheet 69 Electrical Specifications Notes: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. These specifications are specifi ed at the processor pad. 2. Crossing V oltage is defined as the instantaneous voltage value when the rising edge of BCLK{0/1}_DN is equal to the falling edge of BCLK{0/1}_DP .[...]

Electrical Specifications 70 Datasheet Note: 1. These signals are measured between V IL and V IH . 2. The signal edge rate must be met or the signal must transition monotonically to the asserted state. Notes: 1. V TT refers to instantaneous V TT . 2. Measured at 0.31*V TT 3. Vin between 0V and V TT 4. These are measured between V IL and V IH . 5. T[...]

Datasheet 71 Electrical Specifications Notes: 1. This table applies to the processor sideband and miscellaneous signals specified in T able 7-5 . 2. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 3. These signals are measured between V IL and V IH . Table 7-19. Processor Asynchronous Sideband DC Specifi[...]

Electrical Specifications 72 Datasheet 7.5.3.1 PCI Express* DC Specifications The processor DC specifications for the PCI Express* are available in the PCI Express Base Specification, Revision 3.0. This document will pro vide only the processor exceptions to the PCI Express Base Specification , R evision 3.0. 7.5.3.2 DMI2/PCI Express* DC Specificat[...]

Datasheet 73 Processor Land Listing 8 Processor Land Listing This chapter provides the processor land lists. T able 8-1 is a listing of all processor lands ordered alphabetically by land name. T able 8-2 is a listing of all processor lands ordered by land number .[...]

74 Datasheet Processor Land Listing Table 8-1. Land List by Land Name (Sheet 1 of 42) Land Name Land No. Buffer Type Direction BCLK0_DN CM44 CMOS I BCLK0_DP CN43 CMOS I BCLK1_DN BA45 CMOS I BCLK1_DP AW45 CMOS I BIST_ENABLE A T48 CMOS I BPM_N[0] AR43 ODCMOS I/O BPM_N[1] A T44 ODCMOS I/O BPM_N[2] AU43 ODCMOS I/O BPM_N[3] AV44 ODCMOS I/O BPM_N[4] BB44[...]

Datasheet 75 Processor Land Listing DDR0_DQ[31] CF10 SSTL I/O DDR0_DQ[32] CE31 SSTL I/O DDR0_DQ[33] CC31 SSTL I/O DDR0_DQ[34] CE35 SSTL I/O DDR0_DQ[35] CC35 SSTL I/O DDR0_DQ[36] CD30 SSTL I/O DDR0_DQ[37] CB30 SSTL I/O DDR0_DQ[38] CD34 SSTL I/O DDR0_DQ[39] CB34 SSTL I/O DDR0_DQ[40] CL31 SSTL I/O DDR0_DQ[41] CJ31 SSTL I/O DDR0_DQ[42] CL35 SSTL I/O DD[...]

76 Datasheet Processor Land Listing DDR0_ODT[2] CH28 SSTL O DDR0_ODT[3] CF28 SSTL O DDR0_ODT[4] CB24 SSTL O DDR0_ODT[5] CC27 SSTL O DDR0_PAR_ERR_N CC21 SSTL I DDR0_RAS_N CE29 SSTL O DDR0_WE_N CN29 SSTL O DDR01_RCOMP[0] CA17 Analog I DDR01_RCOMP[1] CC19 Analog I DDR01_RCOMP[2] CB20 Analog I DDR1_BA[0] DB26 SSTL O DDR1_BA[1] DC25 SSTL O DDR1_BA[2] DF[...]

Datasheet 77 Processor Land Listing DDR1_DQ[50] CR41 SSTL I/O DDR1_DQ[51] CU41 SSTL I/O DDR1_DQ[52] CT36 SSTL I/O DDR1_DQ[53] CV36 SSTL I/O DDR1_DQ[54] CT40 SSTL I/O DDR1_DQ[55] CV40 SSTL I/O DDR1_DQ[56] DE37 SSTL I/O DDR1_DQ[57] DF38 SSTL I/O DDR1_DQ[58] DD40 SSTL I/O DDR1_DQ[59] DB40 SSTL I/O DDR1_DQ[60] DA37 SSTL I/O DDR1_DQ[61] DC37 SSTL I/O DD[...]

78 Datasheet Processor Land Listing DDR2_CLK_DN[2] W21 SSTL O DDR2_CLK_DN[3] W23 SSTL O DDR2_CLK_DP[0] AB24 SSTL O DDR2_CLK_DP[1] AB22 SSTL O DDR2_CLK_DP[2] AA21 SSTL O DDR2_CLK_DP[3] AA23 SSTL O DDR2_CS_N[0] AB20 SSTL O DDR2_CS_N[1] AE19 SSTL O DDR2_CS_N[2] AD16 SSTL O DDR2_CS_N[3] AA15 SSTL O DDR2_CS_N[4] AA19 SSTL O DDR2_CS_N[5] P18 SSTL O DDR2_[...]

Datasheet 79 Processor Land Listing DDR2_DQS_DN[08] AB28 SSTL I/O DDR2_DQS_DN[09] W39 SSTL I/O DDR2_DQS_DN[10] AC39 SSTL I/O DDR2_DQS_DN[11] T32 SSTL I/O DDR2_DQS_DN[12] AB34 SSTL I/O DDR2_DQS_DN[13] AD12 S STL I/O DDR2_DQS_DN[14] AA7 SSTL I/O DDR2_DQS_DN[15] V12 SSTL I/O DDR2_DQS_DN[16] AD4 SSTL I/O DDR2_DQS_DN[17] AD28 S STL I/O DDR2_DQS_DP[00] V[...]

80 Datasheet Processor Land Listing DDR3_DQ[03] E37 SSTL I/O DDR3_DQ[04] F40 SSTL I/O DDR3_DQ[05] D40 SSTL I/O DDR3_DQ[06] F38 SSTL I/O DDR3_DQ[07] A37 SSTL I/O DDR3_DQ[08] N39 SSTL I/O DDR3_DQ[09] L39 SSTL I/O DDR3_DQ[10] L35 SSTL I/O DDR3_DQ[11] J35 SSTL I/O DDR3_DQ[12] M40 SSTL I/O DDR3_DQ[13] K40 SSTL I/O DDR3_DQ[14] K36 SSTL I/O DDR3_DQ[15] H3[...]

Datasheet 81 Processor Land Listing DDR3_DQS_DP[09] E39 SSTL I/O DDR3_DQS_DP[10] M38 SSTL I/O DDR3_DQS_DP[11] D34 SSTL I/O DDR3_DQS_DP[12] N31 SSTL I/O DDR3_DQS_DP[13] E11 SSTL I/O DDR3_DQS_DP[14] K12 SSTL I/O DDR3_DQS_DP[15] G7 SSTL I/O DDR3_DQS_DP[16] J3 SSTL I/O DDR3_DQS_DP[17] F28 SSTL I/O DDR3_MA_PAR B18 SSTL O DDR3_MA[00] A19 SSTL O DDR3_MA[0[...]

82 Datasheet Processor Land Listing PE1B_RX_DP[5] K54 PCIEX3 I PE1B_RX_DP[6] J57 PCIEX3 I PE1B_RX_DP[7] K56 PCIEX3 I PE1B_TX_DN[4] K46 PCIEX3 O PE1B_TX_DN[5] L47 PCIEX3 O PE1B_TX_DN[6] K48 PCIEX3 O PE1B_TX_DN[7] L49 PCIEX3 O PE1B_TX_DP[4] H46 PCIEX3 O PE1B_TX_DP[5] J47 PCIEX3 O PE1B_TX_DP[6] H48 PCIEX3 O PE1B_TX_DP[7] J49 PCIEX3 O PE2A_RX_DN[0] N55[...]

Datasheet 83 Processor Land Listing PE3A_TX_DP[1] J51 PCIEX3 O PE3A_TX_DP[2] R47 PCIEX3 O PE3A_TX_DP[3] P48 PCIEX3 O PE3B_RX_DN[4] AB50 PCIEX3 I PE3B_RX_DN[5] AB52 PCIEX3 I PE3B_RX_DN[6] AC53 PCIEX3 I PE3B_RX_DN[7] AC51 PCIEX3 I PE3B_RX_DP[4] Y50 PCIEX3 I PE3B_RX_DP[5] Y52 PCIEX3 I PE3B_RX_DP[6] AA53 PCIEX3 I PE3B_RX_DP[7] AA51 PCIEX3 I PE3B_TX_DN[[...]

84 Datasheet Processor Land Listing RSVD BM44 RSVD BM46 RSVD BN47 RSVD BP44 RSVD BP46 RSVD BR43 RSVD BR47 RSVD BT44 RSVD BU43 RSVD BY46 RSVD C53 RSVD CA45 RSVD CD44 RSVD CE43 RSVD CF44 RSVD CG11 RSVD CP54 RSVD CY46 RSVD CY48 RSVD CY56 RSVD CY58 RSVD D46 RSVD D56 RSVD DA57 RSVD DB56 RSVD DC55 RSVD DD54 RSVD DE55 RSVD E53 RSVD E57 RSVD F46 RSVD F56 R[...]

Datasheet 85 Processor Land Listing VCC AN3 PWR VCC AN5 PWR VCC AN7 PWR VCC AN9 PWR VCC AP10 PWR VCC AP12 PWR VCC AP14 PWR VCC AP16 PWR VCC AP2 PWR VCC AP4 PWR VCC AP6 PWR VCC AP8 PWR VCC AU1 PWR VCC AU11 PWR VCC AU13 PWR VCC AU15 PWR VCC AU17 PWR VCC AU3 PWR VCC AU5 PWR VCC AU7 PWR VCC AU9 PWR VCC A V10 PWR VCC A V12 PWR VCC A V14 PWR VCC A V16 PW[...]

86 Datasheet Processor Land Listing VCC BG9 PWR VCC BH10 PWR VCC BH12 PWR VCC BH14 PWR VCC BH16 PWR VCC BH2 PWR VCC BH4 PWR VCC BH6 PWR VCC BH8 PWR VCC BJ1 PWR VCC BJ11 PWR VCC BJ13 PWR VCC BJ15 PWR VCC BJ17 PWR VCC BJ3 PWR VCC BJ5 PWR VCC BJ7 PWR VCC BJ9 PWR VCC BK10 PWR VCC BK12 PWR VCC BK14 PWR VCC BK16 PWR VCC BK2 PWR VCC BK4 PWR VCC BK6 PWR VC[...]

Datasheet 87 Processor Land Listing VCC_SENSE BW3 O VCCD_01 CD20 PWR VCCD_01 CD22 PWR VCCD_01 CD24 PWR VCCD_01 CD26 PWR VCCD_01 CD28 PWR VCCD_01 CJ19 PWR VCCD_01 CJ21 PWR VCCD_01 CJ23 PWR VCCD_01 CJ25 PWR VCCD_01 CJ27 PWR VCCD_01 CP20 PWR VCCD_01 CP22 PWR VCCD_01 CP24 PWR VCCD_01 CP26 PWR VCCD_01 CP28 PWR VCCD_01 CW19 PWR VCCD_01 CW21 PWR VCCD_01 C[...]

88 Datasheet Processor Land Listing VSS A7 GND VSS AA11 GND VSS AA29 GND VSS AA3 GND VSS AA31 GND VSS AA39 GND VSS AA5 GND VSS AA55 GND VSS AA9 GND VSS AB14 GND VSS AB36 GND VSS AB42 GND VSS AB6 GND VSS AC31 GND VSS AC9 GND VSS AD26 GND VSS AD34 GND VSS AD36 GND VSS AD42 GND VSS AD44 GND VSS AD46 GND VSS AD48 GND VSS AD50 GND VSS AD52 GND VSS AD6 G[...]

Datasheet 89 Processor Land Listing VSS A T12 GND VSS A T14 GND VSS A T16 GND VSS AT2 GND VSS AT4 GND VSS A T46 GND VSS A T52 GND VSS AT6 GND VSS AT8 GND VSS AU45 GND VSS AU47 GND VSS AU49 GND VSS AU51 GND VSS AV42 GND VSS AV54 GND VSS AV56 GND VSS AW55 GND VSS AW57 GND VSS B36 GND VSS B52 GND VSS B6 GND VSS B8 GND VSS BB42 GND VSS BB46 GND VSS BB4[...]

90 Datasheet Processor Land Listing VSS BR57 GND VSS BT46 GND VSS BT48 GND VSS BT50 GND VSS BT52 GND VSS BT54 GND VSS BT56 GND VSS BU45 GND VSS BU51 GND VSS BW1 GND VSS BW11 GND VSS BW13 GND VSS BW15 GND VSS BW17 GND VSS BW5 GND VSS BW7 GND VSS BY24 GND VSS BY4 GND VSS BY42 GND VSS BY58 GND VSS BY8 GND VSS C11 GND VSS C13 GND VSS C3 GND VSS C33 GND[...]

Datasheet 91 Processor Land Listing VSS CH48 GND VSS CH50 GND VSS CH52 GND VSS CH54 GND VSS CH6 GND VSS CJ11 GND VSS CJ17 GND VSS CJ29 GND VSS CJ3 GND VSS CJ43 GND VSS CJ45 GND VSS CJ47 GND VSS CJ51 GND VSS CJ9 GND VSS CK10 GND VSS CK36 GND VSS CK4 GND VSS CK6 GND VSS CL17 GND VSS CL43 GND VSS CL5 GND VSS CM10 GND VSS CM14 GND VSS CM30 GND VSS CM32[...]

92 Datasheet Processor Land Listing VSS CW35 GND VSS CW37 GND VSS CW39 GND VSS CW5 GND VSS CW51 GND VSS CW53 GND VSS CW55 GND VSS CW57 GND VSS CW7 GND VSS CY10 GND VSS CY12 GND VSS CY16 GND VSS CY2 GND VSS CY36 GND VSS CY40 GND VSS CY44 GND VSS CY50 GND VSS CY8 GND VSS D2 GND VSS D26 GND VSS D36 GND VSS D8 GND VSS DA11 GND VSS DA3 GND VSS DA41 GND [...]

Datasheet 93 Processor Land Listing VSS H34 GND VSS H38 GND VSS H40 GND VSS H52 GND VSS H54 GND VSS H8 GND VSS J11 GND VSS J27 GND VSS J31 GND VSS J33 GND VSS J39 GND VSS J41 GND VSS J5 GND VSS J55 GND VSS K2 GND VSS K26 GND VSS K28 GND VSS K30 GND VSS K34 GND VSS K8 GND VSS L25 GND VSS L29 GND VSS L41 GND VSS L5 GND VSS M34 GND VSS M36 GND VSS M42[...]

94 Datasheet Processor Land Listing VSS W51 GND VSS W53 GND VSS W9 GND VSS Y10 GND VSS Y12 GND VSS Y28 GND VSS Y30 GND VSS Y32 GND VSS Y36 GND VSS Y38 GND VSS Y40 GND VSS Y42 GND VSS Y56 GND VSS_VCC_SENSE BY2 O VSS_VSA_SENSE AF14 O VSS_VT TD_SENSE BT42 O VTT A AE45 PWR VTT A AE53 PWR VTT A AM48 PWR VTT A AM54 PWR VTT A AU53 PWR VTT A CA53 PWR VTT A[...]

Datasheet 95 Processor Land Listing Table 8-2. Land List by Land Number (Sheet 1 of 42) Land No. Land Name Buffer Type Direction A11 DDR3_DQ[33] SSTL I/O A13 DDR3_MA[13] SSTL O A15 DDR3_WE_N SSTL O A17 DDR3_BA[0] SSTL O A19 DDR3_MA[00] SSTL O A21 DDR3_MA[05] SSTL O A23 DDR3_MA[11] SSTL O A33 DDR3_DQ[22] SSTL I/O A35 DDR3_DQ[16] SSTL I/O A37 DDR3_DQ[...]

96 Datasheet Processor Land Listing AC41 DDR2_DQ[12] SSTL I/O AC43 PE3D_TX_DP[14] PCIEX3 O AC45 PE3D_TX_DN[12] PCIEX3 O AC47 PE3C_TX_DN[9] PCIEX3 O AC49 PE3A_RX_DN[3] PCIEX3 I AC5 DDR2_DQS_DP[16] SSTL I/O AC51 PE3B_RX_DN[7] PCIEX3 I AC53 PE3B_RX_DN[6] PCIEX3 I AC55 PE2B_RX_DP[6] PCIEX3 I AC7 DDR2_DQS_DP[05] SSTL I/O AC9 VSS GND AD10 DDR2_DQ[39] SST[...]

Datasheet 97 Processor Land Listing AF54 VSS GND AF56 VSS GND AF58 PE2B_RX_DN[7] PCIEX3 I AF6 VSS GND AF8 DDR2_DQ[42] SSTL I/O AG1 VSS GND AG11 DDR2_DQ[34] SSTL I/O AG13 VSA_SENSE O AG15 VSA PWR AG17 VSA PWR AG19 VCC PWR AG21 VTTD PWR AG23 VTTD PWR AG25 VCC PWR AG27 VCC PWR AG29 VCC PWR AG3 VSS GND AG31 VCC PWR AG33 VCC PWR AG35 VCC PWR AG37 VCC PW[...]

98 Datasheet Processor Land Listing AL15 VCC PWR AL17 VCC PWR AL3 VCC PWR AL43 VSS GND AL45 VSS GND AL49 VSS GND AL5 VCC PWR AL51 VSS GND AL53 VSS GND AL55 RSVD AL57 PE2C_RX_DN[10] PCIEX3 I AL7 VCC PWR AL9 VCC PWR AM10 VCC PWR AM12 VCC PWR AM14 VCC PWR AM16 VCC PWR AM2 VCC PWR AM4 VCC PWR AM42 VTTD PWR AM44 RSVD AM46 PE3D_RX_DP[14] PCIEX3 I AM48 VT[...]

Datasheet 99 Processor Land Listing A T44 BPM_N[1] ODCMOS I/O A T46 VSS GND A T48 BIST_ENABLE CMOS I A T52 VSS GND A T54 PE2B_TX_DN[7] PCIEX3 O A T56 PE2D_RX_DN[13] PCIEX3 I A T58 PE2D_RX_DP[12] PCIEX3 I A T6 VSS GND A T8 VSS GND AU1 VCC PWR AU11 VCC PWR AU13 VCC PWR AU15 VCC PWR AU17 VCC PWR AU3 VCC PWR AU43 BPM_N[2] ODCMOS I/O AU45 VSS GND AU47 V[...]

100 Datasheet Processor Land Listing B38 DDR3_DQS_DN[00] SSTL I/O B40 DDR3_DQ[00] SSTL I/O B42 DMI_TX_DP[0] PCIEX O B44 DMI_TX_DP[2] PCIEX O B46 RSVD B48 DMI_RX_DP[1] PCIEX I B50 DMI_RX_DP[3] PCIEX I B52 VSS GND B54 VSA PWR B6 VSS GND B8 VSS GND BA1 VCC PWR BA11 VCC PWR BA13 VCC PWR BA15 VCC PWR BA17 VCC PWR BA3 VCC PWR BA43 BPM_N[6] ODCMOS I/O BA4[...]

Datasheet 101 Processor Land Listing BE51 VSS GND BE7 VCC PWR BE9 VCC PWR BF10 VCC PWR BF12 VCC PWR BF14 VCC PWR BF16 VCC PWR BF2 VCC PWR BF4 VCC PWR BF42 VSS GND BF44 VSS GND BF46 RSVD BF48 PEHPSDA ODCMOS I/O BF6 VCC PWR BF8 VCC PWR BG1 VCC PWR BG11 VCC PWR BG13 VCC PWR BG15 VCC PWR BG17 VCC PWR BG3 VCC PWR BG43 RSVD BG45 RSVD BG47 VSS GND BG5 VCC[...]

102 Datasheet Processor Land Listing BM16 VSS GND BM2 VSS GND BM4 VSS GND BM42 VTTD PWR BM44 RSVD BM46 RSVD BM6 VSS GND BM8 VSS GND BN1 VCC PWR BN11 VCC PWR BN13 VCC PWR BN15 VCC PWR BN17 VCC PWR BN3 VCC PWR BN43 VSS GND BN45 VSS GND BN47 RSVD BN5 VCC PWR BN7 VCC PWR BN9 VCC PWR BP10 VCC PWR BP12 VCC PWR BP14 VCC PWR BP16 VCC PWR BP2 VCC PWR BP4 VC[...]

Datasheet 103 Processor Land Listing BW11 VSS GND BW13 VSS GND BW15 VSS GND BW17 VSS GND BW3 VCC_SENSE O BW43 TDI CMOS I BW5 VSS GND BW7 VSS GND BW9 DDR0_DQ[28] SSTL I/O BY10 DDR0_DQ[24] SSTL I/O BY12 DDR0_DQ[25] SSTL I/O BY14 VCCPLL PWR BY16 DDR_VREFDQRX_C0 1 DC I BY18 VCC PWR BY2 VSS_VCC_SENSE O BY20 VTTD PWR BY22 VTTD PWR BY24 VSS GND BY26 VCC P[...]

104 Datasheet Processor Land Listing CB2 DDR0_DQ[08] SSTL I/O CB20 DDR01_RCOMP[2] Analog I CB22 MEM_HOT_C01_N ODCMOS I/O CB24 DDR0_ODT[4] SSTL O CB26 DDR0_CS_N[6] SSTL O CB28 DDR0_CS_N[3] SSTL O CB30 DDR0_DQ[37] SSTL I/O CB32 DDR0_DQS_DN[13] SSTL I/O CB34 DDR0_DQ[39] SSTL I/O CB36 VSS GND CB38 DDR0_DQ[48] SSTL I/O CB4 DDR0_DQ[09] SSTL I/O CB40 DDR0[...]

Datasheet 105 Processor Land Listing CF12 VSS GND CF14 VSS GND CF16 DDR0_DQS_DN[17] SSTL I/O CF20 DDR0_CKE[4] SSTL O CF22 DDR0_CLK_DN[3] SSTL O CF24 DDR0_CLK_DN[0] SSTL O CF26 DDR0_CS_N[5] SSTL O CF28 DDR0_ODT[3] SSTL O CF30 VSS GND CF32 VSS GND CF34 VSS GND CF36 VSS GND CF38 VSS GND CF4 DDR0_DQS_DP[01] SSTL I/O CF40 VSS GND CF42 VSS GND CF44 RSVD [...]

106 Datasheet Processor Land Listing CJ5 DDR0_DQ[11] SSTL I/O CJ51 VSS GND CJ7 DDR0_DQ[06] SSTL I/O CJ9 VSS GND CK10 VSS GND CK12 DDR0_DQ[16] SSTL I/O CK14 DDR0_DQS_DP[02] SSTL I/O CK16 DDR0_DQ[18] SSTL I/O CK20 DDR0_MA[12] SSTL O CK22 DDR0_MA[08] SSTL O CK24 DDR0_MA[03] SSTL O CK26 DDR0_MA[10] SSTL O CK28 DDR0_CS_N[9] SSTL O CK30 DDR0_DQ[44] SSTL [...]

Datasheet 107 Processor Land Listing CN57 VSS GND CN7 VSS GND CN9 VSS GND CP10 DDR1_DQ[19] SSTL I/O CP12 VSS GND CP14 DDR1_DQS_DN[12] SSTL I/O CP16 VSS GND CP18 DDR0_CKE[3] SSTL O CP2 DDR1_DQ[01] SSTL I/O CP20 VCCD_01 PWR CP22 VCCD_01 PWR CP24 VCCD_01 PWR CP26 VCCD_01 PWR CP28 VCCD_01 PWR CP30 DDR1_DQ[33] SSTL I/O CP32 DDR1_DQS_DP[04] SSTL I/O CP34[...]

108 Datasheet Processor Land Listing CU27 DDR1_ODT[4] SSTL O CU29 DDR1_DQ[36] SSTL I/O CU3 VSS GND CU31 DDR1_DQS_DP[13] SSTL I/O CU33 DDR1_DQ[38] SSTL I/O CU35 VSS GND CU37 DDR1_DQ[49] SSTL I/O CU39 DDR1_DQS_DP[06] SSTL I/O CU41 DDR1_DQ[51] SSTL I/O CU5 VSS GND CU7 DDR1_DQ[17] SSTL I/O CU9 DDR1_DQS_DP[02] SSTL I/O CV10 DDR1_DQ[23] SSTL I/O CV12 DDR[...]

Datasheet 109 Processor Land Listing D10 DDR3_DQS_DP[04] SSTL I/O D12 DDR3_DQ[32] SSTL I/O D14 DDR3_ODT[4] SSTL O D16 DDR3_CS_N[8] SSTL O D18 DDR3_MA[10] SSTL O D2 VSS GND D20 DDR3_MA[04] SSTL O D22 DDR3_MA[08] SSTL O D24 DDR3_MA[14] SSTL O D26 VSS GND D32 DDR3_DQ[18] SSTL I/O D34 DDR3_DQS_DP[11] SSTL I/O D36 VSS GND D38 DDR3_DQS_DP[00] SSTL I/O D4[...]

110 Datasheet Processor Land Listing DC9 DDR1_DQS_DN[01] SSTL I/O DD10 VSS GND DD12 VSS GND DD14 VSS GND DD18 VCCD_01 PWR DD20 VCCD_01 PWR DD22 VCCD_01 PWR DD24 VCCD_01 PWR DD26 VCCD_01 PWR DD32 DDR1_DQ[41] SSTL I/O DD34 VSS GND DD36 VSS GND DD38 VSS GND DD40 DDR1_DQ[58] SSTL I/O DD54 RSVD DD6 VSS GND DD8 DDR1_DQS_DP[10] SSTL I/O DE11 DDR1_DQ[11] S[...]

Datasheet 111 Processor Land Listing F28 DDR3_DQS_DP[17] SSTL I/O F32 DDR3_DQ[19] SSTL I/O F34 DDR3_DQ[17] SSTL I/O F36 VSS GND F38 DDR3_DQ[06] SSTL I/O F4 DDR3_DQ[60] SSTL I/O F40 DDR3_DQ[04] SSTL I/O F42 VSS GND F44 VSS GND F46 RSVD F48 VSS GND F50 VSS GND F52 PE1A_RX_DN[1] PCIEX3 I F54 PE1A_RX_DN[2] PCIEX3 I F56 RSVD F58 RSVD F6 DDR3_DQ[49] SSTL[...]

112 Datasheet Processor Land Listing J37 DDR3_DQS_DP[01] SSTL I/O J39 VSS GND J41 VSS GND J43 PE1A_TX_DP[1] PCIEX3 O J45 PE1A_TX_DP[3] PCIEX3 O J47 PE1B_TX_DP[5] PCIEX3 O J49 PE1B_TX_DP[7] PCIEX3 O J5 VSS GND J51 PE3A_TX_DP[1] PCIEX3 O J53 PE1B_RX_DP[4] PCIEX3 I J55 VSS GND J57 PE1B_RX_DP[6] PCIEX3 I J7 DDR3_DQS_DN[06] SSTL I/O J9 DDR3_DQ[42] SSTL [...]

Datasheet 113 Processor Land Listing M38 DDR3_DQS_DP[10] SSTL I/O M4 DDR3_DQS_DP[07] SSTL I/O M40 DDR3_DQ[12] SSTL I/O M42 VSS GND M44 VSS GND M46 VSS GND M48 RSVD M50 VSS GND M52 VSS GND M54 PE1B_RX_DN[5] PCIEX3 I M56 PE1B_RX_DN[7] PCIEX3 I M6 DDR3_DQ[55] SSTL I/O M8 VSS GND N11 DDR3_DQS_DP[05] SSTL I/O N13 VSS GND N15 VCCD_23 PWR N17 VCCD_23 PWR [...]

114 Datasheet Processor Land Listing R49 PE3B_TX_DP[7] PCIEX3 O R5 VSS GND R51 PE3B_TX_DP[5] PCIEX3 O R53 PRDY_N CMOS O R55 VSS GND R7 VSS GND R9 DDR2_DQ[54] SSTL I/O T10 DDR2_DQ[50] SSTL I/O T12 DDR2_DQS_DP[15] SSTL I/O T14 DDR2_DQ[52] SSTL I/O T16 DDR2_CAS_N SSTL O T18 DDR2_MA[10] SSTL O T20 DDR2_MA[03] SSTL O T22 DDR2_MA[08] SSTL O T24 DDR2_MA[1[...]

Datasheet 115 Processor Land Listing § W11 DDR2_DQS_DP[06] SSTL I/O W13 VSS GND W15 RSVD W17 DDR2_CS_N[8] SSTL O W19 DDR2_ODT[1] SSTL O W21 DDR2_CLK_DN[2] SSTL O W23 DDR2_CLK_DN[3] SSTL O W25 DDR2_MA[14] SSTL O W29 DDR2_DQ[18] SSTL I/O W3 DDR2_DQ[56] SSTL I/O W31 DDR2_DQS_DN[02] SSTL I/O W33 VSS GND W35 DDR2_DQ[29] SSTL I/O W37 VSS GND W39 DDR2_DQ[...]

Package Mechanical Specifications 116 Datasheet 9 Package Mechanical Specifications The processor is in a Flip-Chip Land Grid Array (FCL GA12) package that interfaces with the baseboard using an LGA2011-0 socket. The package consists of a processor mounted on a substrate land-carrier . An integrated heat spreader (IHS) is attached to the package su[...]

Datasheet 117 Boxed Processor Specifications 10 Boxed Processor Specifications 10.1 Introduction Intel boxed processors are intended for system integr ators who build systems from components available through distribution channels. The processors (L GA2011-0) are offered as Intel boxed processors; howev er , the thermal solutions is sold separately[...]