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Intel WiFi Link 5100 manual

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Table of contents for the manual

  • Page 1

    Order N um be r: 31 867 6- 0 03US Intel ® 5100 Memory Controller Hub Chipset for Communica tions, Embedded, and Storage Applications The rma l/ Mec ha n ic al D esi gn Gui de July 2008 Revision 003US[...]

  • Page 2

    Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 2 Order Number: 318676-003US Legal Lines and Disclaim ers INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED , BY EST OPPEL OR OTHERWISE, T O ANY INTELLECTUA L PROPER TY RIGHTS[...]

  • Page 3

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 3 Intel ® 5100 MCH Chipse t Contents 1.0 In tr oduct io n ........... ............ ........... ........... ............ ........... ............ ........... ........... ........ 6 1.1 Design Fl ow . .........[...]

  • Page 4

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 4 Order Number: 318676-003US Figures 1 Thermal Design Process . .... ........... ............ ........... ........... ............ ........... ............ ... ..... 7 2 MCH Package Dime nsions (Top Vie w) ..[...]

  • Page 5

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 5 Intel ® 5100 MCH Chipse t Revision History Date Revisi on Descript ion July 2008 003 Added the Comp actPC I* refere nce solution Added Fi gure 26 , Figure 27 , and Figur e 28 Updated the s upplier infor mat[...]

  • Page 6

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 6 Order Number: 318676-003US 1.0 Introduction As the complexity of computer syste ms increases, so do the power dissipation requiremen ts. Care must be tak en to en sure t hat the ad diti onal po wer i s prop[...]

  • Page 7

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 7 Intel ® 5100 MCH Chipse t 1.2 Definition of Terms Figur e 1. Therm a l De si gn Proce ss Tabl e 1 . Defi nit ion of Ter ms Term Definiti o n FC -BGA Flip Chip Ball Grid Array . A package type de fined by a [...]

  • Page 8

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 8 Order Number: 318676-003US 1.3 Relat ed Documents Intel ® Elec t ronic Des i gn Kit s (EDKs ) prov ide on line , real - ti me co lla ter al updates. The follow ing li n ks tak e you to the EDK serv er and [...]

  • Page 9

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 9 Intel ® 5100 MCH Chipse t 1.4 Ther ma l Sim ula tio n Intel pr o vid es th ermal si mu latio n model s of t he Intel ® 5 100 M CH C hipse t and associated user’s g uides to aid system design ers in simul[...]

  • Page 10

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 10 Order Number: 318676-003US Figu r e 2. M CH Pac k a g e Dime nsions ( Top View ) Figu r e 3. MCH P ackag e Dime nsi ons (S id e Vie w) MCH IHS Handling Excl usio n Are a 42.5 mm . 42.5 mm. 38.5 m m. 38.5 m[...]

  • Page 11

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 11 Intel ® 5100 MCH Chipse t 2.1 Package Mechanical Requirements The Inte l ® 5100 MCH Chipset package has an integrated heat spreader (IHS) that is capable of sustaining a maximum static normal load of 15 l[...]

  • Page 12

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 12 Order Number: 318676-003US Note: Thes e s pe ci ficatio ns appl y to uni form co mp ressive loadin g in a dir e c t ion perpe n d ic ular to the IHS top surfa ce. Note: These specifications are b ased on l[...]

  • Page 13

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 13 Intel ® 5100 MCH Chipse t The case-to-local ambient thermal characterization par ameter ( Ψ CA ) is used as a measure of th e thermal perf orm ance o f the ov erall th ermal so lu tion . It is defi ned by[...]

  • Page 14

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 14 Order Number: 318676-003US 2. Define a target local ambient temper ature, T LA . 3. Use Equa tio n 1 and Equat ion 2 to de termin e the req ui r ed therma l p er fo rmance need ed to coo l th e devic e. Th[...]

  • Page 15

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 15 Intel ® 5100 MCH Chipse t Ta b l e 4 su m m a r i zes th e therma l bud g et requir e d to ad equ ate ly cool th e Inte l ® 5100 MCH C hipset in one config uration usi ng a TD P of 25 W . Furth er cal cul[...]

  • Page 16

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 16 Order Number: 318676-003US 5.1.2 T hermal Calibration an d Controls It is reco mmended that full and routin e cali bration o f tem perature me asurem ent equipm en t be per f orme d bef ore at te mpt in g [...]

  • Page 17

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 17 Intel ® 5100 MCH Chipse t Figure 6. IHS Groo ve Di mens ions[...]

  • Page 18

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 18 Order Number: 318676-003US 5.1.4 T hermocouple Condit ioning and Preparation 1. Use a calib r ated th ermo couple as sp eci fied in Ta b l e 5 . 2. Measure the thermocouple resistance by holding both wires[...]

  • Page 19

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 19 Intel ® 5100 MCH Chipse t 2. P lace the thermoco uple wire i nside t he g roov e le tting the exposed wire an d bead extend about 3.2 mm ( 0 . 12 5") pa s t the end of the gro ove. Secure it w it h K [...]

  • Page 20

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 20 Order Number: 318676-003US Figure 10. Thermoco u pl e Bead Placem en t Fig ur e 11 . Positioni n g B ea d on G r oo ve[...]

  • Page 21

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 21 Intel ® 5100 MCH Chipse t Figure 12. Using 3D Micromani pu lator to Secure Bead Location Figure 1 3. Meas uring R esistance between Thermo couple and IHS[...]

  • Page 22

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 22 Order Number: 318676-003US 5.1.6 C uring Process 1. Let the t hermocouple attach sit in the op en air for at least half an hour . Using any curing accelerator l ike the Locite* 7452 T ak Pak* acceler at or[...]

  • Page 23

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 23 Intel ® 5100 MCH Chipse t 5.1.7 Thermocouple Wire Management Figure 15. Ther mocou ple Wi re Mana geme nt i n Groo ve Figur e 16. Remov in g Excess Adhesi ve from I H S[...]

  • Page 24

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 24 Order Number: 318676-003US Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below t he IHS top surface by running a flat blade on top of the IHS, for example. 5.2 Power Si[...]

  • Page 25

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 25 Intel ® 5100 MCH Chipse t The Intel ® 5100 MCH Chipset has a lower TDP than the Intel ® 5000 S eries Chipset and a similar package size. Due to this, any thermal solutions fo r the Intel ® 5000 Series C[...]

  • Page 26

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 26 Order Number: 318676-003US Whe n using heatsi nks tha t exte nd beyond the MCH c hipse t refere nce hea tsink e nvelope shown in Figure 19 , any motherboard components placed between the heatsink and moth [...]

  • Page 27

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 27 Intel ® 5100 MCH Chipse t Full mechanical drawings of the thermal solution assemb ly and the heatsink clip are provid ed in Appe ndix A . Append ix B conta i ns vend or in format io n for ea c h the rmal s[...]

  • Page 28

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 28 Order Number: 318676-003US 6.1.8.1 Effect o f Pressure on TIM Performan ce As mechanical pressure increases on the TIM, the th ermal resistance of the TIM decreases. This phenomenon is due to the decrease [...]

  • Page 29

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 29 Intel ® 5100 MCH Chipse t 6.2 CompactPCI* Referen ce Heatsink Intel has also developed a reference thermal solution compatible with the CompactPCI* form factor . The reference solution was developed assumi[...]

  • Page 30

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 30 Order Number: 318676-003US 6.2.2 T hermal Solution Pe rforman ce Characteristics Fig ur e 22 shows the per formance of the CompactPCI* reference heatsink. This figure shows the thermal pe rformance of the [...]

  • Page 31

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 31 Intel ® 5100 MCH Chipse t Appendix A Mechanical Drawings Ta b l e 9 li s ts th e mech a n ic al drawings in clude d in th i s ap pe nd i x. Table 9. Mechan ical Drawing List Drawing Description Figure Numb[...]

  • Page 32

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 32 Order Number: 318676-003US Figure 23. A dvancedTCA* He atsink As sembly Drawing[...]

  • Page 33

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 33 Intel ® 5100 MCH Chipse t Figur e 24 . Advan ced TCA* H eatsink Drawin g[...]

  • Page 34

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 34 Order Number: 318676-003US Figure 25. A dvancedTCA* C omponent K eepout Zo ne[...]

  • Page 35

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 35 Intel ® 5100 MCH Chipse t Figure 26. Compac tPCI* He atsin k Ass embly D raw ing[...]

  • Page 36

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 36 Order Number: 318676-003US Figure 27. CompactPCI* Heatsin k Drawi ng[...]

  • Page 37

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 37 Intel ® 5100 MCH Chipse t Figur e 28 . CompactPCI* Comp onent Kee pou t Zone[...]

  • Page 38

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 38 Order Number: 318676-003US Fig ure 29. To rsion al Clip Hea tsink Cl ip Dr awing[...]

  • Page 39

    Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 39 Intel ® 5100 MCH Chipse t Figur e 30 . T I M 2 Draw ing[...]

  • Page 40

    Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 40 Order Number: 318676-003US Appendix B Thermal Solution Compone nt Suppliers Table 10. MC H Torsion al Clip Hea t si nk Therm a l So lutio n Part Intel Part Number Supplie r (Part Number) Con tact Informati[...]