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Philips BGY2016 manual

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Table of contents for the manual

  • Page 1

    DA T A SH EET Product specification Supersedes data of 2000 J an 04 2000 Oct 17 DISCRETE SEMICONDUCT ORS BGY2016 UHF amplifier module h andbook, halfpage M3D167[...]

  • Page 2

    2000 Oct 17 2 Philips Semiconductors Product specification UHF amplifier module BGY2016 FEA TURES • 26 V nominal supply voltage • 16 W output power into a load of 50 Ω with an RF drive power of ≤ 20 mW. APPLICA TIONS • Base station transmitting equipment operating in the 1805 to 1990 MHz frequency band. DESCRIPTION The BGY2016 is a thre[...]

  • Page 3

    2000 Oct 17 3 Philips Semiconductors Product specification UHF amplifier module BGY2016 CHARA CTERISTICS T mb =2 5 ° C; V S1 =5V ; V S2 = 26 V ; P L = 16 W; Z S =Z L =5 0 Ω unless otherwise specified. SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT f frequency 1805 − 1990 MHz I S1 supply current − 80 − mA I S2 supply current P D < [...]

  • Page 4

    2000 Oct 17 4 Philips Semiconductors Product specification UHF amplifier module BGY2016 APPLICA TION INFORMA TION List of components (See Figs 2 and 3) Note 1. The striplines are on a double copper-clad printed-circuit board (RO5880) with ε r = 2.2 and thickness = 0.79 mm. COMPONENT DESCRIPTION V ALUE CA T ALOGUE NO . C1, C2 electrolytic capacit[...]

  • Page 5

    2000 Oct 17 5 Philips Semiconductors Product specification UHF amplifier module BGY2016 handbook, full pagewidth MGM862 90 42 R2 L1 C1 C3 C2 Z 1 Z 2 C4 C7 C8 C6 C5 R1 L2 V S1 V S2 output input Fig.3 Printed-circuit board component layout. Dimensions in mm.[...]

  • Page 6

    2000 Oct 17 6 Philips Semiconductors Product specification UHF amplifier module BGY2016 MOUNTING RECOMMEND A TIONS To ensure a good thermal contact and to prevent mechanical stress when bolted down, the flatness of the mounting base is designed to be typically better than 0.1 mm. The mounting area of the heatsink should be flat and free from burr[...]

  • Page 7

    2000 Oct 17 7 Philips Semiconductors Product specification UHF amplifier module BGY2016 P ACKA GE OUTLINE UNIT Q b p Z c e U 2 U 1 U Fp q REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 99-02-06 IEC JEDEC EIAJ mm 4.0 3.8 0.56 0.46 A 9.5 9.0 0.3 0.2 D 30.1 29.9 E 18.6 18.4 12.8 12.6 4.1 3.9 40.74 40.54 2.54 e 1 17.78 3.25 3.15 L 6.5 6.1 [...]

  • Page 8

    2000 Oct 17 8 Philips Semiconductors Product specification UHF amplifier module BGY2016 D A T A SHEET ST A TUS Note 1. Please consult the most recently issued data sheet before initiating or completing a design. D A T A SHEET ST A TUS PRODUCT ST A TUS DEFINITIONS (1) Objective specification Dev elopment This data sheet contains the design target[...]

  • Page 9

    2000 Oct 17 9 Philips Semiconductors Product specification UHF amplifier module BGY2016 NOTES[...]

  • Page 10

    2000 Oct 17 10 Philips Semiconductors Product specification UHF amplifier module BGY2016 NOTES[...]

  • Page 11

    2000 Oct 17 11 Philips Semiconductors Product specification UHF amplifier module BGY2016 NOTES[...]

  • Page 12

    © Philips Electronics N.V. SCA All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be [...]