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Philips TDA8002C manual

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Table of contents for the manual

  • Page 1

    DA T A SH EET Product specification Supersedes data of 1999 F eb 24 File under Integr ated Circuits, IC02 1999 Oct 12 INTEGRA TED CIRCUITS TDA8002C IC card interface[...]

  • Page 2

    1999 Oct 12 2 Philips Semiconductors Product specification IC car d interface TD A8002C FEA TURES • Single supply voltage interface (3.3 or 5 V environment) • Low-power sleep mode • Three specific protected half-duplex bidirectional buffered I/O lines • V CC regulation 5 V ± 5% or 3 V ± 5%, I CC <5 5m Af o r V DD = 3.0 to 6.5 V, with [...]

  • Page 3

    1999 Oct 12 3 Philips Semiconductors Product specification IC card interf ace TD A8002C QUICK REFERENCE D A T A SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT Supplies V DD supply voltage 3.0 − 6.5 V I DD(lp) supply current low-po wer −− 150 µ A I DD(idle) supply current Idle mode; f CLK OUT = 10 MHz −− 5m A I DD(active) supply curre[...]

  • Page 4

    1999 Oct 12 4 Philips Semiconductors Product specification IC card interf ace TD A8002C BLOCK DIA GRAM Fig.1 Block diagram. handbook, full pagewidth FCE246 100 nF 100 nF 470 nF 470 nF 100 nF 100 nF I/O TRANSCEIVER I/O TRANSCEIVER I/O TRANSCEIVER THERMAL PROTECTION V CC GENERATOR RST BUFFER CLOCK BUFFER SEQUENCER CLOCK CIRCUITRY LATCH OSCILLATOR IN[...]

  • Page 5

    1999 Oct 12 5 Philips Semiconductors Product specification IC card interf ace TD A8002C PINNING SYMBOL PIN I/O DESCRIPTION TYPE CT/A TYPE CT/B TYPE CT/C TYPE CG XT AL1 1 1 1 30 I crystal connection or input for e xternal clock XT AL2 2 2 2 31 O crystal connection I/OUC 3 3 3 32 I/O data I/O line to and from microcontroller A UX1UC 4441 I / O auxil[...]

  • Page 6

    1999 Oct 12 6 Philips Semiconductors Product specification IC card interf ace TD A8002C Note 1. A pull-up resistor of 100 k Ω connected to V DD is integrated. MODE 28 28 28 27 I operating mode selection input (HIGH = normal; LOW = sleep) V DDD −−− 28 supply digital supply v oltage DGND2 −−− 29 supply digital ground 2 SYMBOL PIN I/O D[...]

  • Page 7

    1999 Oct 12 7 Philips Semiconductors Product specification IC card interf ace TD A8002C Fig.4 Pin configuration (TDA8002CT/C). handbook, halfpage XTAL1 XTAL2 I/OUC AUX1UC CS ALARM CLKSEL CLKDIV1 CLKDIV2 STROBE CLKOUT DGND1 AGND S2 MODE RSTIN RST CLK V CC AUX1 I/O VUP S1 V DDA 1 2 3 4 5 6 7 8 9 10 11 12 13 28 27 26 25 24 23 22 21 20 19 18 17 16 15 [...]

  • Page 8

    1999 Oct 12 8 Philips Semiconductors Product specification IC card interf ace TD A8002C FUNCTIONAL DESCRIPTION P ower suppl y The supply pins for the chip are V DDA , V DDD , AGND, DGND1 and DGND2. V DDA and V DDD (i.e. V DD ) should be in the range of 3.0 to 6.5 V. All card contacts remain inactive during power-up or power-down. On power-up, the [...]

  • Page 9

    1999 Oct 12 9 Philips Semiconductors Product specification IC card interf ace TD A8002C Fig.6 ALARM as a function of V DD (t W pulse width minimum of 10 ms). handbook, full pagewidth FCE272 V DD t W t W V th2 + V hys2 V th2 ALARM Fig.7 Chip select. handbook, full pagewidth t DZ t SL CS CS INPUTS FCE245 t SI t IS t DI t ID OFF , I/OUC AUX1UC, AUX2U[...]

  • Page 10

    1999 Oct 12 10 Philips Semiconductors Product specification IC card interf ace TD A8002C T able 1 Clock circuitry definition Notes 1. X = don’t care. 2. In low-power mode. 3. f int = 32 kHz in low-power mode. MODE CLKSEL CLKDIV1 CLKDIV2 FREQUENCY OF CLK FREQUENCY OF CLK OUT HIGH LO W HIGH LO W 1 ⁄ 2 f int 1 ⁄ 2 f int HIGH LO W LO W LO W 1 ?[...]

  • Page 11

    1999 Oct 12 11 Philips Semiconductors Product specification IC card interf ace TD A8002C Logic circuitry After power-up, the circuit has six possible states of operation. Figure 9 shows the state diagram. I DLE MODE After reset, the circuit enters the idle mode. A minimum number of functions in the circuit are active while waiting for the microcon[...]

  • Page 12

    1999 Oct 12 12 Philips Semiconductors Product specification IC card interf ace TD A8002C A CTIV A TION SEQUENCE From Idle mode, the circuit enters the activation mode when the microcontroller sets the CMDVCC line LOW or sets the MODE line HIGH when the CMDVCC line is already LOW. The internal circuitry is then activated, the internal clock is acti[...]

  • Page 13

    1999 Oct 12 13 Philips Semiconductors Product specification IC card interf ace TD A8002C Fig.11 Activation sequence using CMDVCC, CLKDIV1 and CLKDIV2 signals to enable CLK. handbook, full pagewidth FCE274 OSC_INT/64 CMDVCC VUP V CC I/O CLK RSTIN RST LOW t act t 0 t 1 t 2 t 3 CLKDIV1 CLKDIV2 Fig.12 Activation sequence for synchronous application. h[...]

  • Page 14

    1999 Oct 12 14 Philips Semiconductors Product specification IC card interf ace TD A8002C D EACTIV A TION SEQUENCE When a session is completed, the microcontroller sets the CMDVCC line to HIGH state or MODE line to LOW state. The circuit then executes an automatic deactivation sequence by counting the sequencer down and thus end in the Idle mode. F[...]

  • Page 15

    1999 Oct 12 15 Philips Semiconductors Product specification IC card interf ace TD A8002C Fault detection The following fault conditions are monitored by the circuit: • Short-circuit or high current on V CC • Removing card during transaction • V DD dropping • Overheating. When one or more of these faults are detected, the circuit pulls the [...]

  • Page 16

    1999 Oct 12 16 Philips Semiconductors Product specification IC card interf ace TD A8002C LIMITING V ALUES In accordance with the Absolute Maximum Rating System (IEC 134); note 1. Note 1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional operation of the device under this condition is n[...]

  • Page 17

    1999 Oct 12 17 Philips Semiconductors Product specification IC card interf ace TD A8002C CHARA CTERISTICS V DD = 3.3 V ; T amb =2 5 ° C; f xtal = 10 MHz; unless otherwise specified. SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT Supplies V DD supply voltage 3 − 6.5 V I DD(lp) supply current low-po wer mode −− 150 µ A I DD(idle) supply [...]

  • Page 18

    1999 Oct 12 18 Philips Semiconductors Product specification IC card interf ace TD A8002C Data lines G ENERAL t d(edge) dela y between f alling edge of I/O , A UX1, A UX2, I/OUC, A UX1UC and A UX2UC −− 1 µ s t r , t f rise and fall times C i =C o =3 0p F −− 0.5 µ s f I/O(max) maximum frequency on data lines −− 200 kHz D A T A LINES I/[...]

  • Page 19

    1999 Oct 12 19 Philips Semiconductors Product specification IC card interf ace TD A8002C V OL(OFF) LO W -le v el output v oltage on pin OFF I OL(OFF) =2m A −− 0.4 V I OL(ALARM) LO W -le v el output current on pin ALARM V OL(ALARM) =0V −− − 5 µ A V OH(ALARM) HIGH-le vel output v oltage on pin ALARM I OH(ALARM) = − 2m A V DD − 1 −?[...]

  • Page 20

    1999 Oct 12 20 Philips Semiconductors Product specification IC card interf ace TD A8002C L OGIC INPUTS (CV/TV AND CS) (I NTEGRA TED 10 K Ω PULL - UP RESIST OR CONNECTED TO V DD ); note 5 V IL LO W -le v el input v oltage 0 − 0.3V DD V V IH HIGH-le vel input v oltage 0.7V DD − V DD V Logic inputs PRES and PRES; note 5 V IL LO W -le v el input[...]

  • Page 21

    1999 Oct 12 21 Philips Semiconductors Product specification IC card interf ace TD A8002C Notes 1. It may be necessary to connect capacitors from XTAL1 and XTAL2 to ground depending on the choice of crystal or resonator. 2. When the oscillator is stopped in mode 1, XTAL1 is set to HIGH. 3. The transition time and duty cycle definitions are shown in[...]

  • Page 22

    1999 Oct 12 22 Philips Semiconductors Product specification IC card interf ace TD A8002C This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.Th[...]

  • Page 23

    1999 Oct 12 23 Philips Semiconductors Product specification IC card interf ace TD A8002C This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.Th[...]

  • Page 24

    1999 Oct 12 24 Philips Semiconductors Product specification IC card interf ace TD A8002C P A CKA GE OUTLINES UNIT A max. A 1 A 2 A 3 b p cD (1) E (1) (1) eH E LL p Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0[...]

  • Page 25

    1999 Oct 12 25 Philips Semiconductors Product specification IC card interf ace TD A8002C 0.2 UNIT A max. A 1 A 2 A 3 b p cE (1) eH E LL p Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 1.60 0.15 0.05 1.5 1.3 0.25 0.27 0.17 0.18 0.12 5.1 4.9 0.5 7.15 6.85 1.0 0.95 0.55 7 0 o o 0.12 0.1 DIMENSIONS (mm are the [...]

  • Page 26

    1999 Oct 12 26 Philips Semiconductors Product specification IC card interf ace TD A8002C SOLDERING Introduction to soldering surface mount pac kages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number [...]

  • Page 27

    1999 Oct 12 27 Philips Semiconductors Product specification IC card interf ace TD A8002C Suitability of surface mount IC packa ges for wave and reflo w soldering methods Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package[...]

  • Page 28

    © Philips Electronics N.V. SCA All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be [...]