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Samsung NP700G7CS02US manual

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Table of contents for the manual

  • Page 1

    NP700G7C 700G7C SERVICE MANUAL 70G7C Contents 1. Precaution 2. Introduction 3. Desassembly and Reassembly 4. T rouble shooting 5. System Wire Diagram Refer to the service manual in the GSPN (see the rear cover) for more information.[...]

  • Page 2

    Contents Contents 1. Precaution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 − 1 1.1. General After-Sales Service Preca[...]

  • Page 3

    1. Precaution 1. Precaution 1.1. General After-Sales Service Precautions 1) Do not let customers repair the product themselves.. › There is a danger of injury and the product life time may be shortened. 2) Make sure to disconnect the power cord from the wall outlet before repairing the product (especially for after-sales service of electric parts[...]

  • Page 4

    1. Precaution 1.2. Safety Precautions 1) EMI This device has been registered regarding EMI for residential use. It can be used in all areas. 2) Circuit T est (Logic T est) Precautions The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or CMOS. Since these types of devices are highly susceptible to static ele[...]

  • Page 5

    1. Precaution 1.3. Ground The product must be grounded to protect it from static electricity and other dangers. When using a multitap, please use a multi tap with a ground terminal only . If you use a 220V wall outlet with a ground terminal, you do not need to ground it additionally . A void using wall outlets if they are not grounded even if they [...]

  • Page 6

    1. Precaution 1.4. Static Electricity Precautions Many parts of the system are susceptible to static electricity . Using an electrostatic dischar ge (ESD) device is very important for the safety of the user and the user's surroundings. Using an ESD device increases the probability of a successful repair and lowers the expenses for damaged part[...]

  • Page 7

    2. Introduction 2. Introduction 2.1. Product Features Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-1[...]

  • Page 8

    2. Introduction 2-2 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 9

    2. Introduction 2.2. Specication Processor and Motherboard Intel® Core™ i7 Processor 3610QM (2.30 GHz, 6 MB) Intel® Core™ i7 Processor 3720QM (2.60 GHz, 6 MB) CPU*** (Upgrade Not, Use one kind of) Intel® Core™ i7 Processor 3820QM (2.70 GHz, 6 MB) Socket Socket G2(rPGA988B) Manufacturing process 0.022 micron Cache L2 : 6MB i7-3610QM - Ma[...]

  • Page 10

    2. Introduction Max. resolution for VGA Max resolution of 2,048 x 1,536 at 85Hz refresh rate (ext.) (640x480,800x600, 1024x768, 1 152x864, 1280x800,1280x960, 1280x1024, 1400x1050, 1440x900,1600x1024,1600x1200, 1680x1050, 1920x1200, 1920x1440, 2048x1536) [Ext.monitor resolutions Supported by EDID information] Max. resolution for HDMI Support v1.4a c[...]

  • Page 11

    2. Introduction Hard Disk Drive-7200rpm*** 9.5mmH 2.5" SA T A HDD, Removable HDD V endor HGST , Fujitsu, Samsung Storage, T oshiba , WD T ype 9.5 mm Height 2.5" S-A T A Supports SA T A host controller support 48bit LBA (HDD Interface supports SA T A1 - 1st HDD / SA T A2 - 2nd HDD) A verage Access T ime 13m sec. Speed 5400rpm/7200rpm SA T [...]

  • Page 12

    2. Introduction Network T ools LAN*** Integrated 10/100/1000 Mbps Ethernet Chipset R TL81 1 1E Features RJ45 Output Combo module*** Intel Jacksonpeak2 WLAN+BT Combo T ype Intel Jackson Peak2, 802.1 1a/g/n 2x2 W iFi _ Bluetooth(4.0) Combo card (V endor : Intel ) MaxSpeed 300Mbps (Link Speed is only standard value, Actually value will decided by each[...]

  • Page 13

    2. Introduction T ype Li-ion Details of cell 8 cells Battery capacity 5,900 mAh V oltage 15.1 V Battery rating 89Wh Color Black / Y ellow Dimension 140 x 85 x 30.0 mm (W x H x D) W eight Max. 400 g Recharge time Approx. 3.0 hours AC Adapter*** A1 1-200P1A Output Power 200W Dimension 170 X 85 X 35 mm (W x H x D) W eight (AC Adapter) T yp. 750g W orl[...]

  • Page 14

    2. Introduction Accessories Accessories in the box Battery , Adapter , Power Code, Installation Guide(paper), OS CD, S/W Media, TCO Sheet, 3D glasses(option, r echargeable) 2-8 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 15

    2. Introduction 2.3. Comparing product specications 700G7A 700G7C ITEM Ext. Gfx. Ext. Gfx. Processor Huron River i7 Chief River i7 Chipset HM65 HM76 Memory DDR3 4GB~16GB (Max Clock 1333Mhz) DDR3 4GB~16GB (Max Clock 1600Mhz) LCD 17.3” FHD LED (Glare, 400nit) ← Gfx. AMD Radeon HD 6970M nVIDIA Geforce 675M (N13E – GS1) AMD 7970M(TBD) HDD 500G[...]

  • Page 16

    2. Introduction 2.4. Option part List 2-10 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 17

    2. Introduction Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-1 1[...]

  • Page 18

    2. Introduction 2-12 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 19

    2. Introduction KBD Keyboard arrangement and size can differ to by each country Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-13[...]

  • Page 20

    2. Introduction 2.5. Function of Product KBD Backlit Mode Shift 2-14 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 21

    2. Introduction USB3.0 (SuperSpeed USB) USB2.0 Speed (Data rate) 5.0 Gbps Low-speed (1.5 Mbps) Full-speed (12 Mbps) High-Speed (480 Mbps) Data Interface . 4-wire dif ferential signaling separate from USB2.0 signaling . Simultaneous bi-directional data ows . 2-wire dif ferential signaling . Uni-directional data ow with negotiated directional b[...]

  • Page 22

    2. Introduction Jog Dial 2-16 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 23

    2. Introduction Using 3D Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-17[...]

  • Page 24

    2. Introduction 2-18 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 25

    2. Introduction 3D glassed Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-19[...]

  • Page 26

    2. Introduction 2.6. Hardware – New H/W ISSD (Express Cache) 2-20 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 27

    2. Introduction ISSD (Summary) • Advantage : More faster booting speed.(up to 25%) T able With ISSD Without ISSD BIOS Post 4.88 4.87 Boot complete 16.73 30.1 Boot time (BIOS Post + Boot complete) 21.61 34.88 • More faster application speed • –Control & work - Express Cache Driver Control by self, User can only turn on/of f/On Easy Setti[...]

  • Page 28

    2. Introduction NEW H/W Platform 2-22 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 29

    2. Introduction Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-23[...]

  • Page 30

    2. Introduction NEW H/W Graphic H/W WLAN • Jackson Peak 802.1 1abg/n (2x2) Combo Form factor: Mini Card haft size Chipset: Intel Jackson Peak (2X2) N6235 2-24 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 31

    2. Introduction WLAN (Bluetooth) qBT 4.0 • PC Side: BLE Device in connection with the existing BT 3.0 features were added. • Device Side: This model is applied not only BT 3.0 but also BLE(Bluetooth Low Ener gy) only . • Device characteristics of BLE only - The controller is implemented as a simple structure. Chip/Device(Affordable price) - L[...]

  • Page 32

    2. Introduction H/W BT 2-26 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 33

    2. Introduction H/W USB 3.0 Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-27[...]

  • Page 34

    2. Introduction Software: Enhanced functions 2-28 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 35

    2. Introduction 2.7. SW List Driver List V ersion W indows7-Marvell LAN Driver[GbE Fast] 5.60.350.21 Chipset(Huron-River) 5.60.350.21 Intel Rapid Storage T echnology 6.3.0.7000_PSTOBE_MM2007 ASMEDIA USB 3.0 Host Controller Driver 9.2.0.1016 Elan T ouch Pad Driver 2.0.30.0 (U1U2 Disable) Universal Scan Driver 8.17.12.6598 No-WHQL Universal Print Dri[...]

  • Page 36

    2. Introduction Universal Printer/Sacnner Driver 1.0 MultiMedia POP 1.0.2.0 Phone Share 1.0.0.1 1 Smartview (TV share) 20101 1 14 Easy File Share (PC Share) 3.1.5 Easy Migration 2.2.2 Easy Software Manager 5.0.0.8 Software Launcher 1.1.2.1 Cyberlink Media Suite (3D or non 3D) 1.0.0.2 DDD T ridef Shell 3.0.0.17 Cyberlink Y oucam 1.2.0.8 Dolby 3D v .[...]

  • Page 37

    2. Introduction 2.8. System Setup (Bios Setup) SA T A Port 1 => HDD model name is displayed in this item for SA T A Port 1. SA T A Port 2 => Express Cache Memory model name is displayed in this item for SA T A Port 2. SA T A Port 3 => HDD Or ODD model name is displayed in this item for SA T A Port 3. SA T A Port 4 => HDD Or ODD model na[...]

  • Page 38

    2. Introduction => Memory size of the slot 4 ISSD 1.User can not setting. (Sata port2), SMT type 2.ISSD to speed the execution of the basic program will allow CPU Power Saving Mode => 'Enabled' will decrease system power consumption. Hyperthreading => This selects whether Intel® CPU performance will improve. EDB (Execute Disable[...]

  • Page 39

    2. Introduction Battery Life Cycle Extension => ‘Enabled’ means that the system will charge the battery up to 80% for extending the battery life cycle. => ‘Disabled’ means that the system will char ge the battery up to 100% USB Char ge In Sleep Mode => ‘Enabled’ means that the system supports the USB charge feature at the port [...]

  • Page 40

    2. Introduction Set HDD Password => User can set a password of a HDD. Password on Boot => Supervisor Password controls access to system boot. Boot Device Priority => Select system boot options. T ouch Pad Mouse => 'Disabled' prevents installed T ouch Pad mouse from functioning, but frees up IRQ 12. 'Enabled' forces t[...]

  • Page 41

    2. Introduction Exit Saving changes => Exit System Setup and save your changes to CMOS. Exit Discarding Changes =>Exit utility without saving Setup data to CMOS. Load Setup Defaults Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-35[...]

  • Page 42

    2. Introduction => Load default values for all SETUP items. Discard Changes => Load previous values from CMOS for all SETUP items. Save Changes => Save Setup Data to CMOS. Boot Override => Boot with selected device 2-36 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 43

    2. Introduction 2.9. Main Board Information H/W Basic Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-37[...]

  • Page 44

    2. Introduction PIC ITEM CODE Q’ty V er Battery BA43-00319A (5900mAh) 1 BLK Power Code 3903-000452 1 AC Adapter BA44-00280A 200W 1 Installation Guide BA81-08874A 1 MANUAL CDS Sheet BA99-14999A 1 H/W Option Component 700G7C the following optional components to add or r eplace. The type of component can be added later . • 3D glasses(option) • H[...]

  • Page 45

    2. Introduction Copyright© 1995-2012 SAMSUNG. All rights reserved. 2-39[...]

  • Page 46

    3. Desassembly and Reassembly 3. Desassembly and Reassembly 3.1. MainSystem 1. Turn off the power and remove the Battery before disassembling the system. 2. Remove the dummy-SD CARD before disassembling. 3. At the bottom side, Remove 10 Screw to disassemble . 4. Open the HDD door to disassemble. And remove 12 Screw & HDD protect cover . 5. HDD [...]

  • Page 47

    3. Desassembly and Reassembly 6. Disassemble ODD from system. Pull ODD to left. 6–1. Remove the 2 remain screw . 7. Push each point with pinset, and ip the keyboard to disconnect the FFC Cable. 7-1. After Reverse the Keyboard, Disconnect two FFC Cable. This connector is straight type. Before remove FFC Cable, pull the connector . 8. Remove 3 s[...]

  • Page 48

    3. Desassembly and Reassembly 12. Disconnect 3 cable from M/B. 13. After disconnect, you can seprate M/B from Bottom ASSY . And Disconnct Fan Cable and Heat Sin. 3-3 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 49

    3. Desassembly and Reassembly 3.2. LCD Part 1. First remove 2 rubber and remove 2 screw . 2. Pull the LCD bezel from top side, then it can be Separated from LCD Assy . 3. Remove all screw and remove LCD Bracket. And Lift the LCD From LCD BACK ASSY . 4. Disconnect the LCD Cable from LCD. And disassemble LCD Bracket from LCD. 5. T o disassemble the S[...]

  • Page 50

    4. T rouble shooting 4. T rouble shooting 4.1. General spec T ools used for repairing the product. • System Diagnostics Disk • MS-DOS Booting Disk • System Diagnostics Card • Screwdrivers (+, —) • T weezers • Multi-meter • Oscilloscope • Logic Analyzer Replace Units (FRU: Field Replaceable Unit) • DDR3 RAM Module • 2.5" S[...]

  • Page 51

    4. Trouble shooting 4.2. Debugging Flow Chart ※ T raining manual how to use the side of the fault diagnosis please refer . Debugging Flow of our company computer pr oduct does same as between product universally . Refer to attachment Debugging Flowchart mor e content Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-2[...]

  • Page 52

    4. T rouble shooting 4-3 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 53

    4. Trouble shooting Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-4[...]

  • Page 54

    4. T rouble shooting 4.3. System Diagnosis System Diagnostics Card The Diagnostics Card shows the system operations during the POST (Power On Self T est) in a 2 digit hexadecimal number by connecting the cable to the 10 pin connector below the PCMCIA slot after separating the T op part. The card is used to evaluate the reason for the malfunction wi[...]

  • Page 55

    4. Trouble shooting 4.4. Diagnostic Program □ WinDiag4 (lease Refer to the T raining manual chapter4. T rouble Shooting.) 1) W inDiag4 is a Diagnostic tool that tests overall computer’ s H/Ws and functions for W indows 7. 2) Precondition : UAC(User Account Control) should be disabled. 3) Installation : When you double-click SvcDiag.bat le, t[...]

  • Page 56

    4. T rouble shooting □ Pyxis (lease Refer to the T raining manual chapter4. T rouble Shooting.) 1) Pyxis is a software that diagnose computer’ s H/W components in DOS environment. 2) How to use Pyxis • First, make Dos bootable USB memory or CD. • Copy all released les to the Dos bootable device. • After you boot using the Dos bootable [...]

  • Page 57

    4. Trouble shooting 4.5. Hardware T roubleshooting 4.5.1. LCD 1. The screen is dark or the colors of the scr een ar e distorted. 1) Check the connection status • LCD Module LCD Cable • LCD Cable and Main board LCD Connector → Connect Cable and Connector perfectly 2. Replace the LCD cable Defectiveness conrmation 3. Check if there is a part[...]

  • Page 58

    4. T rouble shooting 3. The LCD blinks while the system is in operation. 1. Check if there is a magnetic body near the touch pad button or the system or check if there is an exterior defect to the LCD. 2. Replace the LCD cable Defectiveness conrmation 4-9 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 59

    4. Trouble shooting 4.5.2. Main System 1. The system is not turned on. 1. Check if the AC adapter LED is lit and if the adapter is properly connected to the system. Check the adapter LED. 2. If the AC adapter is not connected, check the charge status of the battery . Even if the battery is char ged, if the remaining battery char ge is too low , the[...]

  • Page 60

    4. T rouble shooting 1. Check if the sound is muted after booting up W indows. → Fn + F6 (Mute cancellation) 2. Control panel conrmation. → Speaker Setting. 3. Check the connection status of the speaker cable and check if the speaker is out of order . 4. Check if there is a magnetic object near the speaker . 5. Replace Main Board. * Check if[...]

  • Page 61

    4. Trouble shooting 4. Check the Headphone jack. 5. Replace Main Board. * Check if it is out of order . 5. external/Internal micr ophone does not work normally . 1. Check the audio driver settings and change them if necessary 2. Check the connection status of the MIC connector and check if the speaker is out of order 3. Check the Mic jack. 4. Repla[...]

  • Page 62

    4. T rouble shooting 2. Check the Display Manager work normally . → Display Manager program Re-install. 3. Check the Control panel. → Check HDMI section enable. Replace Main Board. * Check if it is out of order . 8. T ouch Pad does not work normally . 1. Check the connection status of T ouch Pad FFC. 2. Check the connection status of T ouch Pad[...]

  • Page 63

    4. Trouble shooting 3. Check the connection between Camera cable and Camera module 4. Replace Camera module * Check if it is out of order . 5. Replace Main Board * Check if it is out of order . 10.WLAN does not work normally . 1. Check the damage status of WLAN Cable → Replace WLAN Cable 2. Check the driver status of WLAN → Re-Install WLAN driv[...]

  • Page 64

    4. T rouble shooting 3. Check the connection status of F AN 4. Replace F AN * Check if it is out of order . 5. Replace Main Board. * Check if it is out of order . 3D Function error 3D Function does not work normally . 1. Check the connecting status between cable and 3D BT Module. 2. Check the connection status between cable and Main Board . Change [...]

  • Page 65

    4. Trouble shooting 2. Check the connection status between cable and Main Board 3. Change Module * Check if it is out of order . 4. Check the cable * Check if it is out of order . Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-16[...]

  • Page 66

    4. T rouble shooting 4.6. RTC Battery Reset 4-17 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 67

    4. Trouble shooting 4.7. CPU F AN Control CPU F AN T roubleshooting If F AN doesn’t work well 1) Check thermal Fan locked well 2) Check F AN cable plugged well 3) change F AN. CPU F AN T roubleshooting One can turn the fan on & off and check the fan's operational conditions without system disassembly . • SAFC's default setting is [...]

  • Page 68

    4. T rouble shooting Fan V oltage Measurement - Read Fan RPM indicated in SAFC. Fan V oltage Pass/Fail determination - If Fan RPM satises "rpm spec +/-10%", then Fan test is "P ASS" . CPU F AN T roubleshooting 4-19 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 69

    4. Trouble shooting Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-20[...]

  • Page 70

    4. T rouble shooting 4.8. Battery Use time Battery Use Time Check the following check lists for systems where the battery use time is too short to diagnose problems. Check the battery Check if the battery is out of order referring to the Battery check program distributed to Service 1) Battery Check List 2) Criteria for each of the check lists 4-21 [...]

  • Page 71

    4. Trouble shooting 3) Battery capacity T able. 4) Batterycheck program Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-22[...]

  • Page 72

    4. T rouble shooting Battery T roubleshooting 1) Generally , the battery usage time in advertisements by notebook manufacturers refers to the maximum battery use time. Since the system specications and the usage environment may dif fer , the user's battery usage time may dif fer from the advertisement even if there is no problem with the sy[...]

  • Page 73

    4. Trouble shooting 4.9. Bios Update Set-up Method 1) DOS Mode Update a) Make a Dos booting disk -> Copy Packing le to Disk -> boot from DOS disk -> BIOS update: C:>amiash XXXX.rom /c /x /bbl /force MICOM update : C:>up1 1 1m XXXX.bin Packing e : C:>XXXX.exe /s /c (XXXX.exe is the packing le merging BIOS and MICOM -[...]

  • Page 74

    4. T rouble shooting 4.10. H/W Upgrade HDD 4-25 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 75

    4. Trouble shooting Memory Copyright© 1995-2012 SAMSUNG. All rights reserved. 4-26[...]

  • Page 76

    5. System Wire Diagram 5. System Wire Diagram 5.1. System Layout 5-1 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 77

    5. System Wire Diagram Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-2[...]

  • Page 78

    5. System Wire Diagram 5-3 Copyright© 1995-2012 SAMSUNG. All rights reserved.[...]

  • Page 79

    5. System Wire Diagram 5.2. Board Component Board Component- Bottom 1.WLAN Conn. 2.USB3.0 Conn. 3.SoDIMMConn. 4.DC Conn 5.LCD Conn 6.MXM Conn 7.KBD Conn. 8.KBD Backlit Conn 9.Speaker Conn(Left). 10.Speaker Conn(Right) 1 1.7-in-1 slot 12.Human I/F Connector 13.T ouch Pad Sub B’D 14.Display Port Conn 15.USB 2.0 Sub B’D Conn 16.3D Dongle Connector[...]

  • Page 80

    5. System Wire Diagram Board Component- T op 1.R TC BA TTER Y Conn 2.PCH Chipset 3.Micom 4.CPU Socket 5.SodimmSocket 6.HDD Connector(1 st ) 7.HDD Connector(2 nd ) 8.CPU Fan Conn 9.Debug Conn Board Component- Sub board 1.Human I/F Sub B’D 2.T ouch Pad Sub B’D 3.Jog Dial Sub B’D(including USB 2.0 X 1 Port) 4.Logo Sub Board 5-5 Copyright© 1995-[...]

  • Page 81

    5. System Wire Diagram KBD Keyboard layout and size can vary by each country . Copyright© 1995-2012 SAMSUNG. All rights reserved. 5-6[...]

  • Page 82

    GSPN (GLOBAL SERVICE P ARTNER NETWORK) Area Web Site Europe, MENA, CIS, Africa https://gspn1.samsungcsportal.com E.Asia, W .Asia, China, Japan https://gspn2.samsungcsportal.com N.America, S.America https://gspn3.samsungcsportal.com This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under[...]