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Texas Instruments TS3USB221 manual

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Table of contents for the manual

  • Page 1

    User's Guide SCDU001A – July 2009 – Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Contents 1 Preface ....................................................................................................................... 2 2 Introduction .............................[...]

  • Page 2

    A TTENTION HANDLE ONL Y A T ST A TIC SAFE WORK ST A TIONS ST A TIC SENSITIVE DEVICES Preface www.ti.com 1 Preface 1.1 About This Manual This user’s guide describes the TS3USB221/A/E Evaluation Module (EVM). This guide contains the EVM schematics, bill of materials, assembly drawings, and top and bottom board layouts. 1.2 How to Use This Manual Th[...]

  • Page 3

    TS3USB221/A/E EVM TS3USB221/A/E www.ti.com Introduction 2 Introduction The TS3USB221/A/E EVM is an evaluation module for the Texas Instruments (TI) 1:2 multiplexer/demultiplexer high-bandwidth USB switches. It is specially designed for high-speed USB 2.0 signals, supports bidirectional signaling, and offers high-bandwidth (1.1 GHz). When interfacin[...]

  • Page 4

    TS3USB221/A/E EVM TS3USB221/A/E Introduction www.ti.com 2.2 Quick Start Figure 2. Quick Start Evaluation 1. Connect the PC to the USB connector J3 through a USB cable. 2. Make sure the 3.3-V LDO output is enabled by opening J8 without a jumper. 3. Make sure the TS3USB221/A/E IC is enabled by shunting J7 with a jumper. 4. Connect two USB downstream [...]

  • Page 5

    TS3USB221/A/E Output Select or Ouput Enable 3.3-V LDO Ouput Enable 10 k W 10 k W www.ti.com EVM Configuration and Description 3 EVM Configuration and Description 3.1 EVM Description To conform to the USB 2.0 specification, the differential traces D+ and D- lines on the board are impedance matched to 90- Ω differential. The trace length of the thr[...]

  • Page 6

    EVM Configuration and Description www.ti.com 3.3 Board Stack-Up Table 3 shows the board stack-up. Table 3. Board Stack-Up Subclass Thickness Dielectric Loss Width Impedance Coupling Spacing Diff Z o Type Shield Name (mils) Constant Tangent (mils) ( Ω ) Type (mils) ( Ω ) 1 SURFACE 2 TOP CONDUCTOR 2.4 1 0 7.5 47.72 EDGE 7.5 85.004 3 DIELECTRIC 4 [...]

  • Page 7

    www.ti.com EVM Configuration and Description 3.4 Schematics Figure 4. EVM Schematic 7 SCDU001A – July 2009 – Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated[...]

  • Page 8

    EVM Configuration and Description www.ti.com 3.5 PCB Layout Figure 5. Top Silkscreen/Assembly 8 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A – July 2009 – Revised October 2009 Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated[...]

  • Page 9

    www.ti.com EVM Configuration and Description Figure 6. Top Metal (High-Speed Differential) 9 SCDU001A – July 2009 – Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated[...]

  • Page 10

    EVM Configuration and Description www.ti.com Figure 7. Internal Ground Plane 10 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A – July 2009 – Revised October 2009 Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated[...]

  • Page 11

    www.ti.com EVM Configuration and Description Figure 8. Internal Power Plane 11 SCDU001A – July 2009 – Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated[...]

  • Page 12

    EVM Configuration and Description www.ti.com Figure 9. Bottom Metal (Low-Speed Single-Ended) 12 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer SCDU001A – July 2009 – Revised October 2009 Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated[...]

  • Page 13

    www.ti.com EVM Configuration and Description Figure 10. Bottom Silkscreen/Assembly 13 SCDU001A – July 2009 – Revised October 2009 TS3USB221/A/E High Speed USB 2.0 (480 Mbps) 1:2 Multiplexer/Demultiplexer Switch Evaluation Module Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated[...]

  • Page 14

    Related Documentation www.ti.com 3.6 Bill of Materials Table 4. Bill of Materials Count RefDes Value Description Size Part Number Manufacturer 2 J1, J3 – USB Connector Type A – AU-Y1005 Assmann Electronics Inc Molex / Waldom 3 J2, J4, J5 – USB Connector Type B – 67068-9000 Electronics 100 mil x Sullins Connector 3 J6, J7, J8 – Header, 2x1[...]

  • Page 15

    IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders[...]