Ampro Corporation COM 830 manual

COM 830 (Computer-On-Module) Reference Manual P/N 5001829A Revision A[...]

Notice Page NOTICE No part of this document may be reproduced, transm itte d , transcribed, stored in a retrie val system, or translated into any language or co mputer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual, or otherwise, without the prior written permission of Ampro Computers, Incorporate[...]

COM 830 Reference Manual iii Content s Chapter 1 About This Manual ............... .................... ................ ................... ................... ........... 1 Symbols ............... ................. ................ ................ ................ ................ .................... ....................... 1 Warning ......... [...]

Contents iv Reference Manual COM 830 Secondary Connector Rows C and D ....................... .................... ................ ................... ........ 15 PCI Express Graphics (PEG) ....................... .................... ................ ................ ................... ..... 15 SDVO ........... ................ ................ [...]

Contents COM 830 Reference Manual v Chapter 4 BIOS Setup Descrip tion .............. ................ ................ ................... ................ .........53 Entering the BIOS Setup Program. ....... ................ ................... .................... ................ ................. .53 Boot Selection Popup ............ ... .... .[...]

Contents vi Reference Manual COM 830 List of Tables Table 1-1. Definitions of Terms ......... ... ... ... ... .... ... ... ................ .... ... ... ... ... .... ... ................ ... ... .... 1 Table 1-2. COM Express Pinout Types ......... .... ... ... ... .... ... ... ... .... ... ... ... ... .... ... ... ... .... ... ... ... ... .... 2 Ta[...]

COM 830 Reference Manual 1 Chapter 1 About This Manual This manual provides inform at ion about the comp onents, features, connectors and BI OS Setup menus available on the COM 830. Symbols The following symbols are used in this man ual: Wa r n i n g W arnings indicate conditions that, if not observed, can cause personal injury . Caution Cautions w[...]

Chapter 1 About This Manual 2 Reference Manual COM 830 Beginning on the date of shipm e nt to its direct customer and continuing for the publi s hed warrant y period, Ampro represents that the products are new and warran ts that each product failing to function properly under normal use, due to a defect in materials or workmans hip or due to non co[...]

Chapter 1 About This Manual COM 830 Reference Manual 3 Carrier board designers can utilize as little or as ma ny of the I/O interfaces as necessary . The carrier board can therefore provide all the interf ace connectors required to attach the system to the a pplication specific peripherals. This versatility allows the designer to cr eate a dense an[...]

Chapter 1 About This Manual 4 Reference Manual COM 830[...]

COM 830 Reference Manual 5 Chapter 2 S pecifications Feature List T a ble 2-1. Feat ure Summary Form Factor Based on COM Express™ standard pinout T ype 2 (Basic size 95 x 125mm) Processor Intel® Core™ Duo U2500 UL V 1.2GHz , with 2-MByte L2 cache UL V (Ultra Low V oltage) Intel® Celeron M 423 UL V 1.07GHz, with 1-MByte L2 cache (Ultra Low V o[...]

Chapter 2 Specifications 6 Reference Manual COM 830 Usable Memory Although the Intel ® 82945GM Grap hics and Mem ory Controller Hub (GMHC) supports up to 4GB of physical memory , not all of the available memory is usab le for applications. This is due to the fact that some of the physical memo ry will always be allocated to the following: Legacy M[...]

Chapter 2 Specifications COM 830 Reference Manual 7 Electrost atic Sensitive Device All COM 830 variants are electrostatic sensitiv e devices . Do not handle the COM 830, or processor, except at an electrostatic-free work station. Failure to do so m ay cause damage to t he module and/or processor and void the manufacturer ’ s warranty . Supply V [...]

Chapter 2 Specifications 8 Reference Manual COM 830 W indo ws XP Professional Standby Mode (requires setup node “Suspend Mode” in the BIOS to be configured to S1 POS [Power On Suspend]) Suspend to RAM (requires setup node “Suspend Mod e” in BIOS to be configu red to S3 STR [suspend to RAM]) Processor Information In the following power table[...]

Chapter 2 Specifications COM 830 Reference Manual 9 Environment al Specifications T emperature Operation: 0° to 60°C Storage: -20° to +80°C Humidity O per at ion: 10% to 90% S torage: 5% to 95% Ampro strongly recommends that you use the appropriate module heatspreader as a thermal interface between the module and your applicat ion ’ s cooling[...]

Chapter 2 Specifications 10 Reference Manual COM 830 Block Diagram A-B GMCH Intel 82945GM DDR2-SODIMM Socket (top) DDR2-SODIMM Socket (bottom) 8x USB 2.0 CRT LCD I/F (L VDS) AC’97 Digital Audio / HDA Interface 2x SA T A GPIs/GPOs SPI LPC Bus PCI Bus I2C Fan Control Power Management and Control Signals Gbit Ethernet SM Bus 1x IDE (Primary) System [...]

Chapter 2 Specifications COM 830 Reference Manual 11 Heat spreader An important factor for e ach system integration is the thermal de sign. The heatspreader acts as a thermal coupling device to the module. It is a 3mm thick aluminum plat e. The heatspreader is thermally couple d to the CPU via a thermal gap filler and on some modules it may also be[...]

Chapter 2 Specifications 12 Reference Manual COM 830 Heat spreader Dimensions Heatspreader is available for all variants of COM 830. NOTE All measurements are in millim eters. T orque specification for heatspreader screws is 0.5 Nm.[...]

Chapter 2 Specifications COM 830 Reference Manual 13 Connector Subsystems Rows A, B, C, D The COM 830 is connected to the carrier board via tw o 220-pin connectors (COM Express T yp e 2 pinout) for a total of 440 pins connectivity . These connector s are b roken down into four rows. The prim ary connector consists of ro ws A and B while the seconda[...]

Chapter 2 Specifications 14 Reference Manual COM 830 PCI Express™ The COM 830 offers 6x x1 PCI Express lanes vi a the Intel 82801GHM (ICH7M-DH), which can be configured to support PCI Express edge cards or Ex pressCards. One of the six x1 PCI Express lane is utilized by the onboard Ethernet controller therefore there are only 5x x1 PCI Express la[...]

Chapter 2 Specifications COM 830 Reference Manual 15 Power Supply Implement ation Guidelines 12 volt input power is the sole operational po we r source for the COM 830. The remaining necessary voltages are internally generated on the module usin g onbo ard vo ltage regulators. A baseboard designer should be aware of the following importan t inform [...]

Chapter 2 Specifications 16 Reference Manual COM 830 Onboard Microcontroller The COM 830 is equipped with an A TMEL At mega168 microcontroller . This onboard microcontroller plays an important role for most of the BIOS features. It fully isolates some of the embedded features such as system monitoring or the I²C bus from the x86 core ar chitecture[...]

Chapter 2 Specifications COM 830 Reference Manual 17 Simplified Overview of BIOS Setup Dat a Backup The above diagram provides an overview of how the BIOS Setup Data is backed up on modules. OEM default values mentioned above refer to customer speci fic CMOS settings created using the System Uti lity tool. Once the BIOS Setup Program has been enter[...]

Chapter 2 Specifications 18 Reference Manual COM 830 Security Features The COM 830 can be equipped optionall y with a “T ru st ed Platform Module” (TPM 1.2). This TPM 1.2 includes co-processors to calculate efficient hash and RSA algorithms with key lengths up to 2,048 bits as well as a real random nu mber generator . Security sensitive applica[...]

Chapter 2 Specifications COM 830 Reference Manual 19 Native vs. Comp atible IDE mode Comp atible Mode When operating in compat ible mode, the SA T A and P A T A (Parallel A T A) con troller together need two legacy IRQs (14 and 15) and are unable to share these IR Qs with other devices. This is a result of the fact that the SA T A and P A T A contr[...]

Chapter 2 Specifications 20 Reference Manual COM 830 any damage to the processor as a result of overhea ting. The THERMTRIP# signal activation is completely independent from processor activity and therefore does not produce any bus cycles. Processor Perfor mance Control Intel ® Core™ 2 Duo and C ore™ Duo processors run at different voltage/fre[...]

Chapter 2 Specifications COM 830 Reference Manual 21 3. 64-bit Mode: 64-bit operating system an d 64-bit applications. This usage requires 64-bit dev ice drivers. It also requires ap pl ications to be modif ied for 64-bit oper ation and then recompiled and validated . Intel 64 provides support for: 64-bit flat virt ual address space 64-bit pointers[...]

Chapter 2 Specifications 22 Reference Manual COM 830 Active Cooling During this cooling policy the operating system is turning the fan on/off. Although active cool ing devices consume power and produce noise, they also have the ab il ity to cool the thermal zone without havin g to reduce the overall system performance. Use the “active c ooling tr[...]

Chapter 2 Specifications COM 830 Reference Manual 23 GPI2# Set GPE2 Function node to Sleep Button in the ACPI set up m enu or set Resume On Ring to E nabled in th e Power setup menu . Onboard LAN Event Device driver must be configured fo r W ake On LAN support. SMBALER T# W akes unconditionally from S1 -S5. PCI Express W AKE# W a kes unco nditional[...]

Chapter 2 Specifications 24 Reference Manual COM 830 USB 2.0 EHCI Host Controller Support The 8 USB ports are shared between an EHCI host controller and the 4 UHCI host controllers. W ithin the EHC functionality there is a port-routing logic that execut es the mixing between the two different types of host controllers (EHC I and UHCI). This means t[...]

COM 830 Reference Manual 25 Chapter 3 Signals and Pinout T ables The following section describes th e signals fou nd on COM Express™ T ype II connectors used fo r Am pro modules. The table below describes the terminology used in this section for the Signal Description tables. The PU/PD column indicates if a COM Express in ternal pull-up or pu ll-[...]

Chapter 3 Signals and Pinout Tables 26 Reference Manual COM 830 A-B Connector Signal Descriptions T a ble 3-2. AC'97/Intel ® Hi gh Definition Audio Link Signals Description s Signal Description I/O PU/PD Comment AC_RST# AC ’97/Intel High Definition Audi o Reset: This signal is the master hardware reset to external codec(s). O 3. 3V AC_SYN C[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 27 AC_SYNC and AC_SDOUT can be used to switch PCI Express channels 1-4 between x1 and x4 mode. If both signals are each pulled-up (using 1k resis tors) to 3.3V at the risi ng edge of PWROK then x4 mode is enabled. x1 mode is used by default if these resistors are not populated. T a ble 3[...]

Chapter 3 Signals and Pinout Tables 28 Reference Manual COM 830 SA T A2_RX+ SA T A2_RX- Serial A T A channel 2, Receive Input differential pair . I SA T A Not suppo rt ed SA T A2_TX+ SA T A2_TX- Serial A T A channel 2, T ransmit Output differential pair . O SA T A Not support ed SA T A3_RX+ SA T A3_RX- Serial A T A channel 3, Receive Input differen[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 29 PCIE3_TX+ PCIE3_TX- PCI Express channel 4, T r ansm it Out put differential pair O PCIE Supports PCI Express Base Specification, Revision 1.0a PCIE4_RX+ PCIE4_RX- PCI Express channel 5, Receive Input differential pair I PCIE Supports PCI Express Base Specification, Revision 1.0a PCIE4[...]

Chapter 3 Signals and Pinout Tables 30 Reference Manual COM 830 T a ble 3-8. USB Signal Description s Signal Description I/O PU/PD Comment USB0+ USB Port 0, data + or D+ I/O USB 2.0 compliant and backwards compatible to USB 1.1 USB0- USB Port 0, data - o r D- I/O USB 2.0 compliant and backwards compatible to USB 1.1 USB1+ USB Port 1, data + or D+ I[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 31 USB7- USB Port 7, data - o r D- I/O USB 2.0 compliant and backwards compatible to USB 1.1 USB_0_1_OC# USB over-current sense, USB ports 0 and 1. A pul l- up for this line shall be present on the module. An open drain driver from a USB current monitor on the carrier board may drive thi[...]

Chapter 3 Signals and Pinout Tables 32 Reference Manual COM 830 VGA_BLU Blue for monitor . Analog DAC ou tpu t, designed to drive a 37.5-Ohm equivalent load. O Analog PD 150R Analog output VGA_HSYN C Horizontal sync ou tput to VGA monitor O 3.3V VGA_VSYN C V ertical sync output to VGA mo nitor O 3.3V VGA_I2C_C K DDC clock line (I²C port dedicated [...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 33 TV_DAC_B TVDAC Channel B Output suppo rts the following: Composite video : not used Component video: Lum inance (Y) analog signal. S-V ideo: Luminance analog signal. O Analog PD 150R Analog output TV_DAC_C TVDAC Channel C Output suppo rts the following: Composite video : not used Comp[...]

Chapter 3 Signals and Pinout Tables 34 Reference Manual COM 830 T able 3-13. General Purpose I/O Signal Descriptions Signal Description I/O PU/PD Commen t GPO[0] General pu rpose out put pins . Upon a hardware reset, these outputs should be low . O 3.3VSB PU 10 k 3.3VSB GPO[1] General pu rpose out put pins . Upon a hardware reset, these outputs sho[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 35 SUS_S3# Indicates syst em is in Suspend to RAM state. Active low output. Also known as "PS_ON" and can be used to control an A TX power supply . O 3.3VSB PU 10k 3.3VSB SUS_S4# Indicates syst em is in Suspend to Disk state. Active low output. O 3.3VSB PU 10k 3.3VSB Not suppor[...]

Chapter 3 Signals and Pinout Tables 36 Reference Manual COM 830 A-B Connector Pinout VCC_R TC Real-time clock circuit-power input. N ominally +3.0V . P GND Ground - DC power and signal and AC signal return path. All available GND connector pins shall be used and tied to Carrier Board GND plane. P T a ble 3-16. Conn ecto r A-B Pinout Pin Row A Pin R[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 37 A2 0 SA T A0_RX- B20 SA T A1_RX- A75 L VDS_A2+ B75 L VDS_B2+ A2 1 GND (FIXED) B21 GND (FIXED) A76 L V DS_ A2- B76 L VDS_B2- A2 2 SA T A2_TX+ (*) B22 SA T A3_TX+ (*) A77 L V DS_ VDD _ EN B77 L VDS_B3+ A2 3 SA T A2_TX- (*) B23 SA T A3_TX- (*) A 78 L VDS_A3+ B78 L VDS_B3- A2 4 SUS_S5# B2[...]

Chapter 3 Signals and Pinout Tables 38 Reference Manual COM 830 C-D Connector Signal Descriptions A4 3 USB2+ B43 USB3+ A98 VCC_12V B98 TV_DAC_ B A4 4 USB_2_3_OC# B44 USB_0_1_OC# A99 VCC_12V B99 TV_DAC_ C A4 5 USB0- B45 USB1- A10 0 GND (FIXED) B10 0 GND (FIXED) A4 6 USB0+ B46 USB1+ A10 1 VCC_12V B10 1 VCC_12V A4 7 VCC_R TC B47 EXCD1_PERST# A10 2 VCC[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 39 PCI_TRDY# PCI bus T arget Ready control line, active low I/O 3.3V PU 8k2 3.3V PCI_STOP# PCI bus ST OP control line, active low , driven by cycle init iator I/O 3.3V PU 8k2 3.3V PCI_P AR PCI bus parity I/O 3.3V PCI_PERR# Parit y Er ro r: An external PCI device drives PERR# when it rece[...]

Chapter 3 Signals and Pinout Tables 40 Reference Manual COM 830 IDE_IOR# I/O read li ne to IDE device. O 3.3V IDE_REQ IDE Device DMA Request . It is asserted by the IDE device to request a data transfe r . I 3.3V IDE_ACK# IDE Device DMA Acknowled ge. O 3.3V IDE_CS1# ID E Dev ice Chip Select for 1F0h to 1FFh range. O 3.3V IDE_CS3# ID E Dev ice Chip [...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 41 T a ble 3-20. SDVO Signal Descr ip tions Signal Description I/O PU/PD Comment SDVOB_RED+ SDVOB_RED- Serial Digital V ideo B red output dif ferential pair Mu ltiplexed with PEG_TX[0]+ and PEG_TX[0]- pair O PCIE SDVOB_GRN+ SDVOB_GRN- Serial Digital V ideo B green ou tpu t dif ferential [...]

Chapter 3 Signals and Pinout Tables 42 Reference Manual COM 830 NOTE Some signals have special functio nality during the reset process. They may bootstrap some basic important functions of the module. T a ble 3-21. Module T ype De finition Sign al Description Signal Description I/O Comment TYPE[ 0:2]# The TYPE pins indicate to the Carrie r Board th[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 43 C-D Connector Pinout T a ble 3-23. Conn ecto r C-D Pinout Pin Row C Pin Row D Pin Row C Pin Row D C1 GND (FIXED) D1 GND (FIXED) C56 PEG _RX1- D56 P EG _TX1- C2 IDE_D7 D2 IDE_D5 C57 TYPE1# D57 TYPE2 # C3 IDE_D6 D3 IDE_D10 C58 PEG_RX2+ D58 PEG_TX2+ C4 IDE_D3 D4 IDE_D1 1 C59 PEG_RX2- D59[...]

Chapter 3 Signals and Pinout Tables 44 Reference Manual COM 830 C36 PCI_DEVSEL# D36 PCI_FRAME# C91 PEG_RX12+ D91 PEG_TX12+ C37 PCI_IRDY# D37 PCI_AD16 C92 PEG_RX12- D92 PEG _TX12- C38 PCI_C/BE2# D3 8 PCI_AD18 C93 GND D93 GND C39 PCI_AD17 D39 PCI_AD20 C94 PEG_RX13 + D94 PEG_TX13+ C40 PCI_AD19 D40 PCI_AD22 C95 PEG_RX13 - D95 PEG_TX13- C41 GND (FIXED) [...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 45 Boot S trap Signals T a ble 3-24. Boot Strap Signal Descriptions Signal Description of Boot S trap Signal I/O PU /PD Comment AC_SYNC AC ’97/Intel ® H igh Defi nition Audio Sync: This signal is a 48 kHz fixed rate s ample sync to the codec(s). It is also used to encode the stream nu[...]

Chapter 3 Signals and Pinout Tables 46 Reference Manual COM 830 System Resources System Memory Map I/O Address Assignment The I/O address assignment of the COM 830 module is functionally identical with a st andard PC/ A T . The most important addresses and the ones that dif fer fr om the standard PC/A T co nfiguration are listed i n the table below[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 47 LPC Bus On the COM 830 the PCI Bus acts as the subtractive decoding agent. All I/O cycles that are not positively decoded are forwarded to the PCI Bus not the LPC Bus. Only specified I/O ranges are forwarded to the LPC Bus. In the BIOS the following I/O ad dress ranges are sent to the[...]

Chapter 3 Signals and Pinout Tables 48 Reference Manual COM 830 Interrupt Request (IRQ) Lines In PIC mode, the PCI bus interrupt lines can be routed to any free IRQ. T a ble 3-27. IRQ Lines in PIC mode IRQ# A vailable T ypical Interrupt Source Connected to Pin 0 No Counter 0 Not applicable 1 No Keyboard Not ap plicable 2 No Cascade Interrupt from S[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 49 In APIC mode, the PCI bus interrupt lines are connected with IRQ 20, 21, 22 and 23. PCI Configuration Sp ace Map 9 Note 2 Generic IRQ9 via SERIRQ, option for SCI 10 Y es IRQ10 via SERIRQ 1 1 Y es IRQ1 1 via SERIRQ 12 Y es IRQ12 via SERIRQ 13 No Math process or Not applicable 14 Note 1[...]

Chapter 3 Signals and Pinout Tables 50 Reference Manual COM 830 00h 02h 01h N.A. VGA Graph ics 00h 1Bh 00h Internal In tel Hig h Definition Audio Cont roller (Azalia) 00h (see Note) 1Ch 00h Internal PC I Express Root Port 0 00h (see Note) 1Ch 01h Internal PC I Express Root Port 1 00h (see Note) 1Ch 02h Internal PC I Express Root Port 2 00h (see Not[...]

Chapter 3 Signals and Pinout Table s COM 830 Reference Manual 51 PCI Interrupt Routing Map 04h (see Note) 00h xxh Internal PCI Express Port 3 05h (see Note) 00h Xxh Intern al PCI Express Po rt 4 06h (see Note) 00h 00h Internal Onboard Gigabit LAN Controller 07h (see Note) 04h xxh INT A-INTD PCI Bus Slot 1 07h (see Note) 05h xxh INT A-INTD PCI Bus S[...]

Chapter 3 Signals and Pinout Tables 52 Reference Manual COM 830 PCI Bus Masters The COM 830 supports 4 ex ternal PCI Bus Masters. Ther e are no limitations in conn ecting bus master PCI devices. I²C Bus There are no onboard resources connect ed to the I²C bus. Address 16h is reserv ed for Batter y Management solutions. SM Bus System Management (S[...]

COM 830 Reference Manual 53 Chapter 4 BIOS Setup Description The following section d escribes the BIOS setup program. The BIOS setup program can be used to view and change the BIOS settings for the module. Only experi enced users shoul d ch ange the default BIOS settings. Entering the BIOS Setup Program. The BIOS setup program can be accessed by pr[...]

Chapter 4 BIOS Setup Description 54 Reference Manual COM 830 Main Setup Screen When you first enter the BIOS setup, you will enter the Main setup screen. Y ou can alw ays return to the Main setup screen by selecting the Main tab. The Main screen reports BIOS, processor , memory and board in formation and is for configuring the system date and time.[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 55 Advanced Setup Select the Advanced tab from the setup menu to enter the Advanced BIOS Setup sc reen. The menu is used for setting adva nced features: Main Advanced Boot Security Power Exit ACPI Configuration PCI Configuration Graphics Configuration CPU Configuration Chipset Configuration [...]

Chapter 4 BIOS Setup Description 56 Reference Manual COM 830 ACPI Configuration Submenu Feature Options Description ACPI A ware O/S No Ye s Set this value to allow the system to utilize the Intel ACPI (Advanced Configuration and Power Interface). Set to NO for non ACPI aware operating system like DOS and W i ndows NT . Set to YES if your OS complie[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 57 Win XP W atchdog ACPI Event rest art configuration PCI Configuration Submenu NOTE In ACPI m ode it is not possible f or a “W atchdog ACPI Event” handler to directly restart or shutdown the OS. For this reason the BIOS will do one of the following: For Shutdown: An over tem perature no[...]

Chapter 4 BIOS Setup Description 58 Reference Manual COM 830 PCI IRQ Resource Ex clusion Submenu PCI Interrupt Routing Submenu Graphics Configuration Submenu Feature Options Description IRQ xx A vailable Reserved Allow or restrict the BIOS fro m giving IRQ resource to PCI/PNP devices. Feature Options Description PIRQ xx (devices) Auto, 3, 4, .., 14[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 59 DVMT/FIXED Memory 64MB 128MB Maximum DVMT Amount of DRAM the DVMT graphics driver can or will allocate (depends on DVMT mode selected). Boot Display Dev ice Auto CR T only SDVO only CR T + SDVO LFP only CR T + LFP Select the display device(s) used for boot up. LFP = Local Flat Panel (L VD[...]

Chapter 4 BIOS Setup Description 60 Reference Manual COM 830 SDVO Port B Device None DVI TV CR T L VDS Select the SDVO device connected to this port. SDVO Port C Device None DVI TV CR T L VDS Select the SDVO device connected to this port. TV Standard VBIOS-Default NTSC PA L SECAM SMP TE240M ITU-R television SMP TE295M SMP TE296M EIA-770.2 EIA-770.3[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 61 CPU Configuration Submenu Feature Options Description Processor Info Block No optio n Displays the processor man ufacturer , brand, frequ ency , an d cache sizes. MPS Revision 1.1 1.4 Select the revision of the mu lti processor support interface that should be offered by the BIOS. Set bac[...]

Chapter 4 BIOS Setup Description 62 Reference Manual COM 830 C1 Enable Standard Enhanced Enable standard or enhanced C1 support. C2 Enable Disabled Standard Enhanced Disable or enable C2 support in standard or enhanced mode. C3 Enable Disabled Standard Enhanced Disable or enable C3 support in standard or enhanced mode. C4 Enable Disabled Standard E[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 63 Chip set Configuration Submenu Feature Options Desc ription Memory Hole Disabled 15MB-16MB Enable or disable the memory hole between 15MB and 16MB. If enabled, accesses to this range are forwarded to the LPC / PCI bus . Chipset Thermal Throttling Disabled Enabled This enables or disables [...]

Chapter 4 BIOS Setup Description 64 Reference Manual COM 830 I/O Interface Configuration Submenu PCIE Port 1IOxAPIC Enable Disabled Enabled Enable su ppo rt for IOAPIC behind PCI Express port. PCIE Port 2 IOxAP IC Enable Disabled Enabled Enable su ppo rt for IOAPIC behind PCI Express port. PCIE Port 3 IOxAP IC Enable Disabled Enabled Enable su ppo [...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 65 SIO Winbond W8362 7 Configuration Feature Options Description Floppy Controller Disabled Enabled Enable / Disable the W83627 floppy control ler . Floppy A Disabled 360 KB 5 ¼” 1.2 MB 5¼” 720 KB 3 ½” 1.44 MB 3 ½” 2.88 MB 3 ½” Select the floppy drive A type. Serial Port 1/2 C[...]

Chapter 4 BIOS Setup Description 66 Reference Manual COM 830 Clock Configuration IDE Configuration Submenu Feature Options Description Spread Spectrum Disabled Enabled Enable spread spectrum clock modulatio n to red uce EMI. Feature Options Description A T A/IDE Config uration Disabl ed Compatible Enhanced Configure the integrated parallel and seri[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 67 IDE Detect T ime Out (s) 0, 5, 10, ... 30, 35 Set this option to stop the BIOS from searching for IDE devices within the specified number of seconds. Basically , this allows you to fine-tune the setti ngs to allow for faster boot tim es. Adjust this sett ing until a suitable timing can be[...]

Chapter 4 BIOS Setup Description 68 Reference Manual COM 830 Primary/Secondary IDE M aster/Slave Submen u Feature Options Description Device Hard Disk A T API CDROM Displ ays the type of drive d etected. The 'grayed-out' items below are the IDE disk drive parameters taken from the firmware of the IDE disk. V endor no option Manufacturer o[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 69 DMA Mode Auto SWDMA0, 1, 2 MWDMA0, 1, 2 UDMA0, 1, 2, 3, 4, 5, 6 Set to AUTO to let the BIOS auto detect the supported DMA mode. SWDMA = Sing le W ord DMA MWDMA = Multi W ord DMA UDMA = Ultra DMA S.M.A.R.T Auto Disabled Enabled Set to AUTO to let the BIOS auto detect hard disk drive suppor[...]

Chapter 4 BIOS Setup Description 70 Reference Manual COM 830 USB Configuration Submenu Feature Opt ions Description USB Functions Disabled 2 USB Ports 4 USB Ports 6 USB Ports 8 USB Ports Disable ICH7M-DH USB host controllers. Enable UHCI host controller 0. Enable UHCI host controller 0 + 1. Enable UHCI host controller 0 + 1 + 2. Enable UHCI host co[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 71 USB Mass S torage Device Configuration Submenu Keyboard/Mouse Configuration Submenu USB Mass Storage Reset Delay 10 Sec 20 Sec 30 Sec 40 Sec Number of seconds the legacy USB supp ort BIOS routine waits for the USB mass storage device after the start unit command. USB Mass Storage Device C[...]

Chapter 4 BIOS Setup Description 72 Reference Manual COM 830 Remote Access Configuration Submenu Feature Options Description Remote Access Disabled Enabled Enable/Disable the BIOS remote access feature. Note: If the systems serial ports ar e disabled in the 'I/ O Interface Configuration ' submenu, then Seria l Redir ection is disabled and[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 73 Hardware Monitoring Submenu NOTE This setup node is only applicable if an external Super I/O has been implemented on the carrier board. Feature Options Desc ription H/W Health Function Disabled Enabled Enable hardware health monitori ng device and display the readings. Board T emperature [...]

Chapter 4 BIOS Setup Description 74 Reference Manual COM 830 W atchdog Configur ation Submenu Feature Options Description POST W a tchdo g Disabled 30sec 1min 2min 5min 10min 30min Select the timeout value for the POST watchd og. The watchdog i s only active during the power-on- self-test of the system an d provides a facility to prevent errors dur[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 75 Boot Setup Select the Boot tab from the setup me nu to enter the Boot setup screen. In the upper part of the screen the Boot setup allows you to prioritize the available boot devices. The lower part of this setup screen show s options related to the BIOS boot. T imeout 1 0.5sec 1sec 2sec [...]

Chapter 4 BIOS Setup Description 76 Reference Manual COM 830 Boot Device Priority Feature Options Description Boot Priority Selection Device Based Ty p e B a s e d Select between device and type based boot priority lists. The “Device Based” bo ot priority list allo ws you to select from a list of currently detected devices only . The “T ype B[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 77 Boot Settings Configuration Feature Op tions Description Quick Boot Disabled Enabled If Enabled , some POST tasks will be skipped to speed-up the BIOS boot process. Quiet Boot Disabled Enabled Disabled displays normal POST diagnostic mes sages. Enabled displays OEM logo instead of POST me[...]

Chapter 4 BIOS Setup Description 78 Reference Manual COM 830 Security Setup Select the Security tab from the setup menu to enter the Security setup screen. NOTE The term 'AC power loss' stands for the state when the module loses the standby voltage on the 5 V_SB pins. On modules, t he standby voltage is con tinuously monitored after the s[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 79 Security S ettings Hard Disk Security This feature enables the users to set, reset or disable passwords for each hard drive in Setup without rebooting. If the user enables password support, a powe r cycle must occur for the hard drive to lock using the new password. Both user and master p[...]

Chapter 4 BIOS Setup Description 80 Reference Manual COM 830 Hard Disk Security Us er Password Hard Disk Security Us er Password Power Setup Select the Power tab from the setup menu to enter th e Power Mana gem e nt setup screen . Feature Options Description Primary/Secondary Master/Slave HDD User Password enter password Set or clear the user passw[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 81 Exit Menu Select the Exit tab from the setup menu to enter the Exit set up screen. Y ou can displ ay an Exit screen opt ion by highlighting it using the <Arrow> keys. Additional BIOS Features The COM 830 uses a /AMIBIOS that is stored in an onb oard Flash Rom ch ip and can be update[...]

Chapter 4 BIOS Setup Description 82 Reference Manual COM 830 Serial Port and Console Redirection Serial Redirection allows video and keyboard re direction via a standard RS -232 serial port . BIOS Security Features The BIOS provides both a supervisor and us er pa ssword. If you use both pa sswords, the supervisor password must be set first. The sys[...]

Chapter 4 BIOS Setup Description COM 830 Reference Manual 83 Industry Sp ecifications The list below provides links to ind ustry sp ecifications that apply to Ampro mod ules. Specification Link Audio Codec ‘97 Component Specification, V ersi on 2.3 (AC ’97) http://www .intel.com/desig n/chipsets/ audio/ Low Pin Count Interface Specification, Re[...]

Chapter 4 BIOS Setup Description 84 Reference Manual COM 830[...]

COM 830 Reference Manual 85 Appendix A T echnical Support Ampro Computers, Inc. provid es a number of methods fo r contacting T echnical Supp ort listed in the Ta b l e A - 1 below . Request s for support through the Ask an Expert are given th e highest priority , and usually will be addressed within one working day . • Ampro Ask an Expe rt – T[...]

Appendix A Technical Support 86 Reference Manual COM 830[...]