HP (Hewlett-Packard) 646676001 manual

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Índice do manual

  • Página 1

    HP Pr oL ian t ML3 5 0p Gen8 S er v er Maint enance and S er v i ce Guide Abstract This document is for the person who installs, administers, and tr oubleshoots servers and stor age systems. This document is in tended for experienced IT professionals or end - users with no or prior hardware setup experience. HP ass umes you are qualified in the ser[...]

  • Página 2

    © Copyright 2012, 2013 He wlett- Packard Development Company, L.P. The information contained herei n is subject to change without notice. The only warranties for HP products and service s are set forth in the expres s warranty statements accompanyin g such products and services. Nothin g herein should be co nstrued as consti tuting an addi tional [...]

  • Página 3

    Contents 3 Con tents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog .........[...]

  • Página 4

    Contents 4 System battery ........................................................................................................................................ 70 HP Trusted Platform Module ...................................................................................................................... 71 Troubleshooting ...................[...]

  • Página 5

    Customer self repair 5 C u st omer s elf r epair HP products are desig ned with many Customer Se lf Repair (CSR) parts t o minimize repair time and allow for greater flexibi lity in performing def ective parts replace ment. If during the diagno sis period HP (or HP ser vice providers or service partners) identifies that the repair c an be accomplis[...]

  • Página 6

    Customer self repair 6 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer c es pièces, les c oûts de déplacemen t et main d'œuvre d u service vous ser ont facturés. Facultatif - Piè ces pour lesquell es la réparati on par le client est facultative. Ces pièces sont[...]

  • Página 7

    Customer self repair 7 In base alla dispo nib ilità e alla località g eografica, le parti CSR v engono spedite con cons egna entro il giorno lavorat ivo seguente. La conse gna nel giorno stesso o entro quattro ore è o fferta con un sup plemento di costo solo in a lcune zone. In caso di necessità si può richie dere l'a ssistenza telefo nic[...]

  • Página 8

    Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihnen das Er s atzteil in Rechnung stel len. Im Falle von Custome r Self Repair ko mmt HP für alle Kost en für die Liefer ung und Rücksend ung auf und best immt den Kurier- /Frachtdienst. Weitere Inf ormationen üb er das HP Custom er Self Repair Prog ramm erhalten Sie von Ihrem [...]

  • Página 9

    Customer self repair 9 enviara el componente defe ctuoso requerido, HP p odrá cobrarle por el de sustit ución. En el caso de todas sustitucion es que lleve a ca bo el cliente, H P se hará cargo de todos l os gastos de env ío y devolución d e componentes y esco gerá la empresa de transpo rte que se utilice par a dich o servicio. Para obtener m[...]

  • Página 10

    Customer self repair 10 Neem contact op met e en Service Partne r voor meer informatie over het Customer Se lf Repair programma van HP. Informatie o ver Service Partners vindt u op de HP website ( http://www.hp.com/go/self repair ). Gar antie s erv ice "P arts Onl y" Het is mogelijk dat de HP gar antie alleen de garantieservice "Part[...]

  • Página 11

    Customer self repair 11 No caso desse se rviço, a substituição de pe ças CSR é obrig atória. Se desejar qu e a HP substitua es sas peças, serão cobradas as despesas de transport e e mão - de - obra do serviç o.[...]

  • Página 12

    Customer self repair 12[...]

  • Página 13

    Customer self repair 13[...]

  • Página 14

    Customer self repair 14[...]

  • Página 15

    Illustrated parts catalog 15 I llus tr ated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5 ) 1 Front bezel 667267 - 001 Mandatory 1 2 Second optical drive cage 67061 2 - 001 Optiona l 2 3 Fan cage 667255 - 001 Optional 2 4 Fan blank 667262 - 001 Mandatory 1 5 Fan louver 667258 - 001 Optiona l [...]

  • Página 16

    Illustrated parts catalog 16 Item Description Spare part number Customer self repair (on page 5 ) c) T - 10 screws (4)* — — d) T - 15 screws ( 4)* — — e) Discovery se rvice cable* — — f) Server baseblank covers (2)* — — 9 Tower feet 667264 - 001 Mandatory 1 10 LFF drive bl ank 667279 - 001 Mandatory 1 11 SFF drive blank 667276 - 0 0[...]

  • Página 17

    Illustrated parts catalog 17 sustitución, pue de o no conlle var costes ad icionales, de pendiendo del t ipo de servicio de garantía correspondiente al producto. 3 No: No — Algunos componentes no están dise ñados para que puedan ser repar ados por el usuario. Para que el usua rio haga valer su garantía, HP p one como cond ición que u n prov[...]

  • Página 18

    Illustrated parts catalog 18 S ystem components Item Description Spare part number Customer self repair (on page 5 ) 13 Power supplies — — a) HP 460W C S Gold (92% e fficiency ) 511777 - 001 Mandatory 1 b) HP 460 W CS Platinu m Plus (94% efficiency) * 660184 - 001 Mandatory 1 c) HP 750 W CS Gold (92% efficiency )* 511778 - 0 01 Mandatory 1 d) H[...]

  • Página 19

    Illustrated parts catalog 19 Item Description Spare part number Customer self repair (on page 5 ) g) 2.3GHz Intel Xeon E5 - 2630 processor, 6C, 95W* 670528 - 001 Optional 2 h) 2.5 GHz Intel Xeon E5 - 2640 processor, 6C, 95W* 670527 - 001 Optional 2 i) 2.9 GHz Intel Xeon E5 - 2667 processor, 6C, 130W* 670537 - 001 Optional 2 j) 1.8 GHz Intel Xeon E5[...]

  • Página 20

    Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5 ) 24 Power cable * 667259 - 001 Optional 2 25 SATA cable* 667265 - 001 Mandatory 1 26 SFF drive backpl ane with expander * 693610 - 001 Op tional 2 27 LFF drive backp lane with expan der* 693611 - 001 Optional 2 28 Fan module* 66725 4 - 001 Mandatory 1 2[...]

  • Página 21

    Illustrated parts catalog 21 2 Optional: Optiona l — Teile, für die das Customer Self Repair - Verfahren optional ist. Diese Teile si nd auch für Customer Self Repair ausgelegt. Wenn Sie j edoch den Austausch dieser Teile von HP vornehmen lassen möc hten, können bei diesem Service je nach den für Ihr Produkt vo rgesehenen Garantiebedingungen[...]

  • Página 22

    Illustrated parts catalog 22[...]

  • Página 23

    Removal an d replacement procedures 23 R emo v al and r eplacemen t pr ocedur es Required tools You need the following it ems for some procedur es: • T- 10 Torx screwdriver • T- 15 Torx screwdriver • HP Insight Diagnosti cs software (" HP Insight Diagnostics " on page 73 ) S afety consider ations Before performin g service procedure[...]

  • Página 24

    Removal an d replacement procedures 24 This symbol on an R J- 45 receptacle indicates a network i nterface connection. WARNING: To reduce the ri sk of electric shock, fire, or dama ge to the equipment, do not plug telephone or telecommunicatio ns connectors into this receptacle. This symbol in dicates the pr esence of a hot surfa ce or hot compon e[...]

  • Página 25

    Removal an d replacemen t procedures 25 • Power down the serv er (on page 25 ). If you must remove a server from a rack or a no n - hot - plug component from a serv er, power d own the server. • Remove the to wer bezel (on page 26 ). • Remove the r ack bezel. • Extend the server from the rack (o n page 27 ). If you are performing service p [...]

  • Página 26

    Removal an d replacement procedures 26 R emove the security bezel Unlock the security bezel, press the latch on the security bezel, and then remove the security bez el. R emove the tower bezel This server ha s a removable bezel that must be unlocke d and opened before acc essing the hard driv es. The bezel must be kept closed during normal server o[...]

  • Página 27

    Removal an d replacement procedures 27 3. Remove all power: a. Disconnect each power co rd from the power sourc e. b. Disconne ct each power cor d from the server. 4. Extend the server from the rack (on pag e 27 ). 5. Remove the a ccess panel (" Access panel " on page 28 ). 6. Loosen the ra ck bezel thum bscrews located inside the chas si[...]

  • Página 28

    Removal an d replacement procedures 28 3. After performing the installation or maintenanc e procedure, slide the server back i nto the rack, and then press the serv er firmly into th e rack to secure it in place. WARNING: To reduce the risk of p ersonal injury, be careful when pres sing the server rail - release latches and sliding t he server into[...]

  • Página 29

    Removal an d replacement procedures 29 To replace the compon ent, reverse the removal procedure. A ir baffle To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ). o For rack models, if in stalled, remove t he security beze l (on page 26 ). 2. Power d[...]

  • Página 30

    Removal an d replacement procedures 30 3. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each powe r cord from the ser ver. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, level surface with t he access panel facing up. o For rack models, ex tend the server from the rack (on pa[...]

  • Página 31

    Removal an d replacement procedures 31 6. Remove the fan blank. To replace th e component, rev erse the remova l procedure. F an To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ). o For rack models, if in stalled, remove t he security beze l (on p[...]

  • Página 32

    Removal an d replacement pr oc edures 32 6. Remove the fa n. To replace th e component, rev erse the remova l procedure. F an cage IMPORTANT: When installing or replacin g server components, one or more fans might need to be removed. To pr event an orderly or i mmediate server shutdo wn, HP highly recommends powering down the server during these pr[...]

  • Página 33

    Removal an d replacement procedures 33 7. Remove the fa n cage. To replace th e component, rev erse the remova l procedure. T ower feet NOTE: This p rocedure applies t o tower server s only. To remove the component: 1. Open and remove the be zel (" Remove the to wer bezel " on page 26 ). 2. Power down the serv er (on page 25 ). 3. Remove [...]

  • Página 34

    Removal an d replacement procedures 34 4. Place the serv er on the side . 5. Remove the t ower feet. To replace th e component, rev erse the remova l procedure. C omponent bo x blank To remove the component: 1. For tower mod els, open and remove t he bezel (" Remov e the tower bezel " on page 26 ). 2. For rack models, do the following: a.[...]

  • Página 35

    Removal an d replacement procedures 35 ii. Disconnect each power cord from the server d. Remove the a ccess panel (" Acce ss panel " on page 28 ). e. Remove the ra ck bezel. 3. Remove the component box blank. To replace th e component, rev erse the remova l procedure. D rive blank To remove the component: 1. Do one of the foll owing: o Fo[...]

  • Página 36

    Removal an d replacement procedures 36 WARNING: To reduce the risk o f injury from el ectric shock, d o not remove more th an one drive carrier at a time. To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ). o For rack models, if in stalled, remove [...]

  • Página 37

    Removal an d replacement procedures 37 9. Using the T - 15 screwdriver, loosen T - 15 screws securing t he optical drive cage. 10. Remove the optical dri ve cage. To replace th e component, rev erse the remova l procedure. O ptical drive To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Rem[...]

  • Página 38

    Removal an d replacement procedures 38 b. Disconne ct each power cor d from the server. 4. For tower mod els, do the following: a. Place the ser ver on a flat, l evel surface with the access panel f acing up. b. Remove the a ccess panel (" Acce ss panel " on page 28 ). 5. For rack m odels, do the foll owing: a. Extend the server from the [...]

  • Página 39

    Removal an d replacement proced ures 39 b. Remove the a ccess panel (" Acce ss panel " on page 28 ). 5. For rack models, do the following: a. Extend the server from the rack (on page 27 ). b. Remove the a ccess panel (" Acce ss panel " on page 28 ). c. Release thum bscrews and remove the rac k bezel. 6. Remove the a ir baffle (&[...]

  • Página 40

    Removal an d replacement procedures 40 Power supply module CAUTION: To preve nt improper cooling and thermal damage , do not operate the server unles s all bays are popul ated with either a co mponent or a blank. To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel &quo[...]

  • Página 41

    Removal an d replacement procedures 41 2. Power down the serv er (on page 25 ). 3. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each power cor d from the server. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, lev el surface with the access panel fa cing up. o For rack models[...]

  • Página 42

    Removal an d replacement procedures 42 o Four - bay power supp ly configuration 8. Loosen the two thumbsc rews, and remove the powe r supply backplane from t he cage: o Two - bay power supply backpl ane board[...]

  • Página 43

    Removal an d replacement procedures 43 o Four - bay power supply backplane bo ard To replace th e component, reve rse the removal procedur e. E xpansio n board 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ). o For rack models, if in stalled, remove t he security beze l[...]

  • Página 44

    Removal an d replacement procedures 44 7. Open the PCI retainer latch. 8. Remove the expansion bo ard. NOTE: If removing a n expansion board from slots 3, 6 or 8, first release the retai ning lever on the system b oard and then remov e the card from t he system. To replace the compon ent, reverse the removal procedure. G raphic ca rd adapter To rem[...]

  • Página 45

    Removal an d replacement procedures 45 2. Power down the serv er (on page 25 ). 3. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each powe r cord from the ser ver. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, level surface with t he access panel facing up. o For rack models[...]

  • Página 46

    Removal an d replacement procedures 46 9. Disconnect the cables f rom the graphic card. 10. Remove the graphic c ard. To replace th e component, rev erse the remova l procedure. C ache module CAUTION: In systems that u se external data storage, be sure that the se rver is the first unit to be powered down and the last to be powered back up. Taking [...]

  • Página 47

    Removal an d replacement procedures 47 2. Power down the serv er (on page 25 ). 3. Remove all power: a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each powe r cord from the ser ver. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, level surface with t he access panel facing up. o For rack models[...]

  • Página 48

    Removal an d replacement procedures 48 CAUTION: To preve nt a server malf unction or damage t o the equipment, do n ot add or remove the battery pack while an array capacity expansio n, RAID level migration, or st ripe size migration is in progress. CAUTION: After the server is powered down, w ait for 30 seconds and t hen check the amber LED before[...]

  • Página 49

    Removal an d replacement procedures 49 SFF drive ba ckplane To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ). o For rack models, if in stalled, remove t he security bezel (on page 26 ). 2. Power down the serv er (on page 25 ). 3. Remove all power[...]

  • Página 50

    Removal an d replacement procedures 50 8. Remove the SFF drive cage. 9. Remove all drives f rom the drive cage (" Drive " on page 35 ). 10. Loosen the thumbscrew on the drive backplane and re move it from the cag e. To replace th e component, rev erse the remova l proced ure. LFF drive backplane To remove the component: 1. Do one of the f[...]

  • Página 51

    Removal an d replacement procedures 51 a. Disconnect ea ch power cord from the power sour ce. b. Disconne ct each powe r cord from the ser ver. 4. For tower mod els, do the following: a. Place the ser ver on a flat, l evel surface with the access panel f acing up. b. Remove the a ccess panel (" Acce ss panel " on page 28 ). 5. For rack mo[...]

  • Página 52

    Removal an d replacement procedures 52 9. Remove all drives f rom the drive cage (" Drive " on page 35 ). 10. Loosen the thumbscrew on the drive backplane and re move it from the cag e. To replace th e component, rev erse the remova l procedure. S ystems Insight Disp lay assembly CAUTION: When routing cables, always be sure that the c abl[...]

  • Página 53

    Removal an d replacement procedures 53 8. Remove the S ystems Insight Display assem bly. To replace th e component, rev erse the remova l procedure. H eatsink To remove the component: 1. Do one of the followin g: o For tower models, open and remove th e bezel (" Remov e the tower bezel " on page 26 ). o For rack models, if in stalled, rem[...]

  • Página 54

    Re moval and replac ement procedures 54 7. Open the heatsink retaining levers. 8. Remove the h eatsink. To replace th e heatsink: 1. Use the alcoh ol swab to remove all th e existing therma l grease from the pro cessor. Allow the alco hol to evaporate before con tinuing.[...]

  • Página 55

    Removal an d replacement procedures 55 2. Remove the h eatsink prote ctive cover. 3. Install the heatsink, and then close the heatsink retaining levers. 4. Install the air b affle. 5. Install the access panel. 6. Do one of the followin g: o For tower models, return the server to an upright position, and then i nstall the bezel. o For rack models, s[...]

  • Página 56

    Removal an d replacement procedures 56 P rocessor WARNING: To reduce the risk o f personal inj ury from hot surfa ces, allow the d rives and the internal system components to cool before touchi ng them. CAUTION: To p revent possi ble ser ver malfunction and damage to the e quipment, multiprocessor configurations must contain processors with the sam[...]

  • Página 57

    Removal an d replacement procedures 57 7. Open the heatsink retaining levers. 8. Remove the h eatsink.[...]

  • Página 58

    Removal an d replacement procedures 58 9. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. 10. Remove the p rocess or from th e processor retaining bra cket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area.[...]

  • Página 59

    Removal an d replacement procedures 59 To install a proces sor: 1. Install the processor. Verify that the processor is fully seated in the proc essor retaining bracket by visually inspecting t he processor installat ion guides on either side o f the processor. THE PINS ON THE SYSTEM BOARD AR E VERY FRAGILE AND E ASILY DAMAGED . CAUTION: THE PINS ON[...]

  • Página 60

    Removal an d replacement procedures 60 3. Press and hold th e processor retaining bracket in place, and then close each p rocessor locking lev er. Press only in the area indicated on the processor re taining bracket. 4. Use the alcohol swa b to remove all the ex isting thermal grease fr om the heatsink. Allow th e alcohol to evaporate before con ti[...]

  • Página 61

    Removal an d replacement procedures 61 6. Install the heatsink, and then close the heatsink retaining levers. 7. Install the air b affle. 8. Install the access panel. 9. Do one of the followin g: o For tower models, return the server to an upright position. o For rack models, sl ide the server ba ck into the rack. 10. Connect ea ch power cord to th[...]

  • Página 62

    Removal an d replacement procedures 62 b. Disconne ct each power cor d from the server. 4. Do one of the followin g: o For tower mo dels, place th e server on a flat, level surfa ce with the access panel facing up. o For rack models, ex tend the server from the rack (on page 27 ). 5. Remove the a ccess panel (" Acce ss panel " on page 28 [...]

  • Página 63

    Removal an d replacement procedures 63 6. Remove the a ir baffle (" Air baffle " on page 29 ). 7. Remove the fa n cage (" Fan cage " on page 32 ). 8. Remove all DIMMs (" DIMMs " on page 61 ). 9. Remove any installe d PCI cards. 10. Remove the PCI card suppo rt bracket on both si des. 11. Disconnect all cables connected[...]

  • Página 64

    Removal an d replacement procedures 64 13. Remove the h eatsink. 14. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.[...]

  • Página 65

    Removal an d replacement procedures 65 15. Remove the p rocessor from the processor retaining brack et. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area. CAUTION: To avoid dama ge to the s ystem board: • Do not touch the processor socket contacts. • Always insta ll the processo r [...]

  • Página 66

    Removal an d replacement procedures 66 To replace th e system board: 1. Install th e spare system bo ard. 2. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.[...]

  • Página 67

    Removal an d replacement procedures 67 3. Remove the cl ear processor socket cover. Reta in the processor socket cover for future use. 4. Install the processor. Verify that the processor is fully seated in the proc essor retaining bracket by visually inspecting t he processor installat ion guides on either side o f the processor. THE PINS ON THE SY[...]

  • Página 68

    Remo val and replacemen t procedures 68 CAUTION: Do not press down on the pr ocessor. Pressing down on the processor may caus e damage to the processor socket and the system board. Press onl y in the area indicated on the processor retain ing bracket. 6. Press and hold th e processor retaining bracket in place, and then close each p rocessor lockin[...]

  • Página 69

    Removal an d replacement procedures 69 10. Install the heatsink, and then close the heatsink retaining levers. 11. Install th e processor sock et cover onto th e processor socket o f the failed syst em board. IMPORTANT: Install all components with the s ame configuration that was used on the fail ed system board. 12. Install all component s removed[...]

  • Página 70

    Removal an d replacement procedures 70 Warning: The serial number should ONLY be modified by qualified personnel. This value should always match the serial number located on the chassis. 5. Press the Enter key to clear the warning. 6. Enter the serial number and press the Enter key. 7. Select Product ID . The following warning appears: Warning: The[...]

  • Página 71

    Removal an d replacement procedures 71 7. Remove the battery. IMPORTANT: Replacing the syst em board batter y resets the system RO M to its default configuration. After replacing the battery, reconfigure the sys tem through RBSU. For more information about battery replace ment or proper dis posal, contact an autho rized reseller or an authorized se[...]

  • Página 72

    Troubleshootin g 72 T r ouble shootin g T roubleshooting resources The H P ProLiant Gen8 Tr oubleshooting Guide, V olume I: Trouble shooting pr ovides procedur es for resolving common problems and c omprehensive courses of action for fault isola tion and identification, issue resolution, and software maintenance o n ProLiant serv ers and server bla[...]

  • Página 73

    Diagnostic tool s 73 D i agno sti c tools H P Insight D iagnostics HP Insight Diagnostic s is a proactive server management tool, available in both offline and online version s, that provides diag nostics and troublesh ooting capabilities to assist IT administrat ors who verify server installations, tro ubleshoot problems, and pe rform repair valid[...]

  • Página 74

    Diagnostic tool s 74 • From within the iLO 4 user interface • From within HP Insight Diagnostics (on page 73 ) For more information, see the Management CD or DVD in the HP Ins ight Foundation suite for ProLiant. HP Insight Remote Suppo rt software HP strongly recommends that you install HP Insight Remote Su pport software to complete the instal[...]

  • Página 75

    Component ident ification 75 C om ponen t i dentif i cati on F ront panel comp onents • SFF Item Description 1 Media/Dri ve cage bay 2 SAS/SATA drives (8) 3 Serial number/iLO i nformation p ull tab* 4 Optical drive 5 USB connect ors (4) *The serial nu mber/iLO informa tion pull tab is double - sided. The top side shows the server serial number, a[...]

  • Página 76

    Component ident ification 76 • LFF Item Description 1 Media/Dri ve cage bay 2 SAS/SATA drive (6) 3 Serial number/iLO i nformation p ull tab* 4 Optical drive 5 USB connect ors (4) *The serial nu mber/iLO informa tion pull tab is double - sided. The top side shows the server serial number, and the r everse side shows the d efault iLO accou nt infor[...]

  • Página 77

    Component i dentificati on 77 Item Description Status 1 Power On/Standb y button and system power LED Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby Off = No power p resent* 2 NIC status LED Solid green = L ink to network Flashing green (1 Hz/cycle per sec) = Network active[...]

  • Página 78

    Component ident ification 78 Item Description Status 3 DIMM LEDs Amb er = DIMM error Off = Normal All other LEDs A mber = Failure Off = Normal IMPORTANT: If more than one DIMM slot LED is illumin ated, further troubleshooting is required. Test each bank of DIM Ms by removing all other DIM Ms. Isolate the failed DIM M by replacing each DIMM in a ba [...]

  • Página 79

    Component ident ification 79 Systems Insi ght Display LED and color H ealth LED System power LED Status Power cap (gree n) — Flashing green Waiting for pow er Power cap (flashing amber) — Am ber Power cap has been exceeded Power cap (gree n) — Green Power is avail able IMPORTANT: If more than one DIMM slot LED is illumin ated, further trouble[...]

  • Página 80

    Component ident ification 80 Item Description 16 NIC connector 1 17 USB connect ors (4) 18 Video connect or 19 PCIe slot 5 (Processor 2) 20 PCIe slot 6 (Processor 2) 21 PCIe slot 7 (Processor 2) 22 PCIe slot 8 (Processor 2) 23 PCIe slot 9 (Processor 2) R ear panel LEDs Item Description Status 1 NIC activity LE D Green = Linked to network Off = No n[...]

  • Página 81

    Component ident ification 81 S ystem board c omponents Item Description 1 Slot 1 PCIe 3 x16 (8, 4, 1) 2 Slot 2 PCIe 3 x8 (4, 1) 3 Slot 3 PCIe 3 x16 (16, 8, 4, 1 ) 4 Slot 4 PCIe 3 x8 (4, 1) 5 Processor 1 D IMM slots 6 Smart Array P4 20i memory cache mod ule 7 Mini - SAS connectors (2) 8 Processor 2 D IMM slots 9 Processor socket 2 10 SD card sl ot 1[...]

  • Página 82

    Component ident ification 82 Item Description 27 Processor socket 1 (populated) S ystem maintena nce switch Position Def ault Function S1 Off Off = iLO 4 securit y is enabled. On = iLO 4 securit y is disable d. S2 Off Off = System configu ration can b e changed. On = System configu ration is lock ed. S3 Off Reserved S4 Off Reserved S5 Off Off = Pow[...]

  • Página 83

    Component ident ification 83 S AS and SA TA device numbers With optional dr ive cages installed, the ser ver supports up to 24 SFF drives or up to 18 LFF drives. The serv er does not support m ixing SFF and LFF drives. HP recommends that you populate drive bays s tarting with the lowest SA S or SATA devic e number. Dri ves are numbered from left to[...]

  • Página 84

    Component ident ification 84 D rive LED defini tions Item LED Status Definition 1 Locate Solid blu e The drive is being identified by a h ost application . Flashing blue The drive carrie r firmware is b eing update d or requires an update. 2 Activity ring Rotat ing green Drive a ctivity Off No drive activit y 3 Do not remove S olid white Do not re [...]

  • Página 85

    Component ident ification 85 Item Description Configuration 1 Fan 1 Redundant (pri mary fan when processor 2 is installed) 2 Fan 2 Primary 3 Fan 3 Primary 4 Fan 4 Primary FBWC module LEDs (P 222, P420, P420i, P421, P822) The FBWC module has three single - color LEDs (one a mber and two gree n). The LEDs on the ca che module installed on a storage c[...]

  • Página 86

    Component ident ification 86 1 - Amber 2 - Green 3 - G reen Interpre tation Off Flashing 0.5 Hz Flashing 0.5 H z The cache micr ocontroller is e xecuting from within its boot loader and receiving new flash code from the host controller. Off Flashing 1 Hz Flashing 1 Hz The cache module i s powering up, and th e capacitor pack is char ging. Off Off F[...]

  • Página 87

    Compone nt ident ification 87 Item Connector Description 2 J9 Drive backplan e bay 1/optic al drive power co nnector 3 J5 Drive backplan e bay 2 power co nnector 4 J6 Drive backplan e bay 3 power co nnector 5 J8 Graphic card p ower connector[...]

  • Página 88

    Cabling 88 C abling S erver data cabling Item Description 1 Optical drive conn ector 2 Drive cage 1, S AS connect or 2 3 Drive cage 1, SAS conne ctor 1 4 SATA connector 5 SAS connector 6 SAS connector[...]

  • Página 89

    Cabling 89 M edia device data cabling Item Description 1 Optical drive conn ector 2 Optical drive conn ector 3 Optical drive conn ector 4 SATA connector 5 SATA connector 6 SATA connector O ptical driv e cabling[...]

  • Página 90

    Specifications 90 S pec if icati ons E nvironmental spec ifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Nonoperating - 30 ° C to 60 ° C ( - 22 ° F to 14 0 ° F) Relative humidity (noncondensing) Operating, maximum wet bul b temperature of 28°C (82.4°F) 10% to 90% Nonoperating, maximum wet bu[...]

  • Página 91

    Specifications 91 • HP 460 W Gold Power S upply (92% efficiency) • HP 460 W Platinum Plu s Power Supply (94% effi ciency) • HP 750 W Gold Power S upply (92% efficiency) • HP 750 W Platinum Plu s Power Supply (94% effi ciency) • HP 12 00 W Platinum Plus P ower Supply (94% efficien cy) H P 460 W Gold Power Supply (92% eff iciency) Specifica[...]

  • Página 92

    Specifications 92 H P 750 W Gold Power Supply (92% eff iciency) Specification Value Input requirements — Rated input voltage 100 to 120 VA C, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input cu rrent 8.9 A at 100 VAC 4.3 A at 200 VAC Rated input po wer 857 W at 100 V AC input 824 W at 200V AC input Btus per hour 2925 at 100V AC inp[...]

  • Página 93

    Specifications 93 Rated input cu rrent 10 A at 100 V AC 6.7 A at 200 VAC Rated input po wer 990 W at 115V AC input 1315 W at 23 0V AC input Btus per hour 3060 at 100V AC input 3380 at 115V AC inpu t 4503 at 200V AC inpu t 4485 at 230V AC inpu t Power supply output — Rated steady - state power 800 W at 100V AC in put 900 W at 120V AC input 1200 W [...]

  • Página 94

    Acronyms and abbreviation s 94 A c r on y ms and abbr e v iati on s AMP Advanced Memory Protec tion CS HE HP Common Slot H igh - Efficiency (power su pply) CSR Customer Self Re pair FBWC flash - backed write cache iLO Integrated Lights - Out IML Integrated Management Log LFF large form factor LRDIMM load reduced dual in - l ine memory module NMI no[...]

  • Página 95

    Acronyms and abbreviation s 95 POST Power - On Self Test PSP HP ProLiant Support Pack RBSU ROM - Based Setup Utility RPS redundant power supply SAS serial attached SCSI SATA serial ATA SFF small form fact or SID Systems Insight Dis play SIM Systems In sight Manager TPM Trusted Platform Modu le UID unit identification USB universal serial bus[...]

  • Página 96

    Documentation feedback 96 Doc ument ati on f eedbac k HP is committed to pro viding documentation that mee ts your needs. To help us improve the documentation, send any erro rs, s uggestions, or comm ents to Documentation Fee dback ( mailto:docsfee dback@hp.com ). Include the document title and part number, version number, or the URL when submittin[...]

  • Página 97

    Index 97 A access panel 28 air baffle 29 B battery 70 buttons 75 C cables 88 cabling 88, 89 cache module 46 components 15, 75 conne cto rs 75 crash dump analysis 82 D data cabling 88 device bay blank 34 device numbers 83 diagnosing problem s 72 diagnostic tools 73 diagnostics utility 73 DIMMs 61 drive LEDs 84 drives, removing 35 E electrostatic dis[...]

  • Página 98

    Index 98 power supply specific ations 90, 91, 92 powering down 25 powering up 25 problem diagnosis 72 processo rs 56 R rack bezel 25, 26 rear panel compone nts 79 rear panel LEDs 80 S safety considerations 23 safety information 23 SATA connectors 81 security bez el 26 server specifica tions 90 specificati ons, server 90 static electricity 23 symbol[...]