Panasonic DMC-XS1GN manual

© Panasonic Corporation 2013 Unauthorized copy- ing and distribution is a violation of law . ORDER NO. DSC1302004CE B26 Digit al Camera Model No. DMC-XS1P DMC-XS1PC DMC-XS1PU DMC-XS1EB DMC-XS1EE DMC-XS1EF DMC-XS1EG DMC-XS1EP DMC-XS1GA DMC-XS1GC DMC-XS1GF DMC-XS1GK DMC-XS1GN DMC-XS1G T Colour (W)..........White T ype (K)...........Black T ype (R)..[...]

2 T ABLE OF CONTENTS PA G E PA G E 1 Safety Precautions --------------------------- -------------------- 3 1.1. General Guidelines ------------------------------------- --- 3 1.2. Leakage Current Cold Check --------------------------- 3 1.3. Leakage Current Hot Ch eck (See Figure. 1) -------- 3 1.4. How to Discharge the E.C apacitor on Flash T op P[...]

3 1 Safety Precautions 1.1. General Guidelines 1. IMPORT ANT SAFETY NOTICE There are special compo nents used in this equipment which are important for safety . These parts are marked by in the Schematic Diagrams, Circuit Board Layout, Exploded Views and Replacement Parts List. It is essen- tial that these critical parts should be repl aced with ma[...]

4 1.4. How to Discharge the E.Ca p acitor on Flash T op P .C.B. CAUTION: • Be sure to discharge the E.Capacitor on Flash T op P . C.B. before disassembling. • Be careful of the high volt age circuit on Flash T op P .C.B. when servicin g. [Discharging Proce dure] 1. Put the insulati on tube on the le ad part of resistor (ERG5SJ102:1k Ω /5W). (A[...]

5 2W a r n i n g 2.1. Prevention of Electrost atic Di scharge (ESD) to Electrost atically Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged easi ly by static electricity . Such components commonly are called Elec- trostatically Sensitive (ES) Devices. The following technique s should be used to help reduce th e in ciden[...]

6 3 Service Navigation 3.1. Introduction This service manual contains technical information, which a llow se rvice personnel’s to understand and se rvice this model. Please place orders using the parts list and not the drawing reference numb ers. If the circuit is cha nged or modified, the information wil l be foll owed by service manual to be co[...]

7 3.3. General Description Abou t Lead Free Solder (PbF) The lead free sold er has been used in the mounting process of all electrical components on the printed circuit board s used for this equipment in considering th e globally environmen tal conservation. The normal solder is the alloy of tin (Sn) and lead (Pb). On the other ha nd, the lead free[...]

8 3.4. How to Define the Model Suffix (NTSC or P A L model) There are seven kinds of DMC- XS1, regardless of the colours. • a) DMC-XS1 (Japan domestic model) • b) DMC-XS1P/PC • c) DMC-XS1EB/EF/EG/EP • d) DMC-XS1EE • e) DMC-XS1G T • f) DMC-XS1GN • g) DMC-XS1PU/GA/GC/GF/GK What is the difference is that the “INITIAL SETTINGS” data w[...]

9 3.4.2. INITIAL SETTINGS: After replacing the Main P .C.B., make sure to perform the in itial settings after achieving the adj ustment by ordering the follo wing procedure in accordance with model suffix of the unit. 1. IMPORT ANT NOTICE: Before proceeding Initial settings, make sure to read the following CAUTIONS. 2. PROCEDURES: • Precautions: [...]

10 • Step 4. Display the INITIAL SETTING: While pressing [ MENU/SET ] button and “[ RIGHT ] of Cursor button” simu ltaneously , turn the Power off. The “INITIAL SETTINGS” menu is displayed . There are two kinds of “INITIAL SETTINGS” menu form as follows: [CASE 1. After replacing Main P .C.B.] When Main P . C.B. has just been replaced,[...]

11 • Step 6. Set the model suffi x in “INITIAL SETTINGS”: Press the “[ RIGHT ] of Cursor buttons”. The only set area is displayed, and then press the “[ RIGHT ] of Cursor buttons” after confirmation. (The unit is powered off automatica lly .) • Step 7. CONFIRMA TION: Confirm the display of “PLEASE SET THE CLOCK” in concerned lan[...]

12 4 S pecifications The following specification is for DMC-XS1P/DMC-FH10P . Some specifications may differ depending on model suffix.[...]

13 5 Location of Controls and Component s The following descri ption is for DMC-XS1P . Some descriptions ma y differ depending on model suffix.[...]

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15 6 Service Mode 6.1. Error Code Memory Function 1. General description This unit is equipped with h istory of error code memory func tion, and can be memorized 16 error cod es in sequence from the latest. When the error is occurred more than 16, the oldest error is overwritten in sequence. The error code is not memorized when the power su pply is[...]

16 Error Code List The error code co nsists of 8 bits data and it shows the following information.[...]

17 Important notice about “Error Code L ist” 1) About “*” indication: The third digit from the left is dif ferent as follows. - In case of 0 (example: 18 0 01000) When the third digit from the left shows “0”, thi s erro r occurred under the condition of INIT IAL SETTINGS has been completed. It means that this error is occurre d basicall[...]

18 7 Service Fixture & T ools 7.1. Service Fixture and T ools The following Service Fixture and tools are us ed for checking and servicing this uni t. 7.2. When Replacing the Main P .C.B. After replacing the Main P .C.B., be sure to achieve adjustment. The service software is available at “TSN Website”.[...]

19 7.3. Service Position Check the Flash T op P .C.B., when servic ing this DSC.(Refer to the following.) CAUTION. (When servicing Flash T op P .C.B.) 1. Be sure to discharge th e E.Capacitor on Flas h T op P .C.B.. Refer to “How to Discharge the E.Capacitor on Flash T op P .C.B.”. The E.Capacitor voltage is not lowered soon even if the AC Cord[...]

20 8 Disassembly and Assembly Instructions 8.1. Disassembly Flow Chart This is a disassembling chart. When assembling, perform this chart conve rsely . 8.2. P .C.B. Location[...]

21 8.3. Disassembly Procedure 8.3.1. Removal of the Rear Case Unit (Fig. D1) No. Item Fig Removal 1 Rear Case Unit (Fig. D1) Memory Card Batter y 2 Screws (A) 3 Screws (B) (Fig. D2) Rear Case U nit 2 Rear Op Plate Unit (Fig. D3) 1 Scr ew (C) 1 Locking tab 2 Hooking parts Connector (A) Rear Op Plate Unit 3 Front Case Unit (Fig. D4) 1 Locking tab Fro[...]

22 (Fig. D2) 8.3.2. Removal of the Rear Op Plate Unit (Fig. D3)[...]

23 8.3.3. Removal of th e Front Case Unit (Fig. D4) 8.3.4. Removal of the LCD Unit (Fig. D5)[...]

24 8.3.5. Removal of the Frame Plate (Fig. D6) 8.3.6. Removal of the T op Case Unit (Fig. D7) (Fig. D8)[...]

25 8.3.7. Removal of the Flash T op P .C.B. (Fig. D9) 8.3.8. Removal of th e Lens Unit (W/C CD) (Fig. D10) 8.3.9. Removal of the Main P .C.B. and Speaker (Fig. D1 1)[...]

26 (Fig. D12) [ When Inst alling ] CA TION: Before soldering the T erminal A (Connecting p art of Main P .C.B. and Frame Unit). Before soldering the T erminal A, make sure to tighten the “Screw (F)” first in o rder to eliminate the gap between Main P .C.B. and Frame Uni t. Other wise, soldered terminal A part may be damaged after assembling.[...]

27 8.3.10. Removal of th e Battery Door Unit (Fig. D13) NOTE: (When Installing) Make sure to confirm the following points when installing: • The Screw is tigh tened enoug h. • Installing conditions are fine. (No distortion , no abnormal- space.) • No dust and/or dirt on Le ns surfaces. • LCD image is fine. (No dust and di rt on it, and no g[...]

28 8.4. Removal of the CCD FPC Un it When remove the CCD FPC Unit once (the screw (G) is loos- ened even a little), the optical tilt adjustment is required. When loosen the screw (G), neces sa ry the optical tilt ad just- ment at the end of assembling. (Refer to item “9.3.2.”) T o prevent the C CD FPC Unit from catchin g the dust and dirt, do n[...]

29 9 Measurement s and Adjustments 9.1. Introduction When servicing this unit, make sure to perform the adjustments necessary based on the part(s) replaced. Before disassembling the unit, it is recomme nded to back up the camera data stored in Flash -ROM as a data file. IMPORT ANT NOTI CE (After replacing the Mai n P .C.B.) After replacing the Main[...]

30 9.2.2. Flash-ROM Data Backup Number of necessary adjustment items decreas es by copying the backup d ata to new Main P . C.B. when adjustment data in old Main P . C.B. is usually read by ROM_BACKUP “DSC → SD”. It is recommended to backup the Flash-R OM data as the way of return when trouble occurs before disassembling the uni t depend- ing[...]

31 9.3. Det ails of Electrical Adjustment 9.3.1. How to execute the Electrical Adjustment It is not necessary to connect the camera to a PC to perfor m adjustments. “Flag reset operation” and “Initial setting operation” are requ ired when carrying out the alignm ent, fo llow the procedure below . 9.3.1.1. St artup Electrical Adjustment mode[...]

32 9.3.1.3. Execute Adjustment (In case of “OIS Adjustment”) 1. Perform step “9.3.1.1.” to “9 .3.1.2.”, to re set the OIS flag status “F” (Set) to “0” (Reset) 2. Press “[ W ] side of the Zoom button” after Flag reset. OIS Adjustment screen is displayed on the LCD panel. (Refer to F ig.3-3) 3. Press the [ Shutter ] button. Th[...]

33 9.3.2. Adjustment Specifications The following matrix table shows the relation between the rep laced part and the N ecessary Adjustment. When a part is replaced, make sure to perform t he necessary a djustment(s) in the order indi cated. The table below shows all the information nece ssary to perform each adjustment.[...]

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35 9.4. Af ter Adjustment 9.4.1. Initial Setting Since the initial setting h as been released to execute the built-i n adjustment so ftware, it should be set up ag ain before shipp ing th e camera to the customer . Refer to the procedure described in “3.4 .2. INIT IAL SETTINGS” for details. [ IMPORT ANT ] 1. The initial settin g should be done [...]

36 10 Maintenance 10.1. Cleaning Lens and LCD Panel Do not touch the surface of l ens and L CD Panel wi th your h and. When cleaning the lens, use air-Blower to blow off the dust. When cleaning the LCD Panel , dampen the lens cleanin g pape r with lens clean er , and the gently wipe the its surface. Note: The Lens Cleaning KIT ; VFK1900BK (Only sup[...]

37 1 1 Block Diagram 1 1.1. Overall Block Diagram CCD SIGNAL PROCESSOR FOCUS IRIS SDRAM/1G-bit NAND FLASH ROM/1G-bit MEMORY CARD REAR OPERA TION UNIT OVERALL BLOCK DIAGRAM OIS UNIT VENUS ENGINE CAMERA PROCESS J-PEG COMP/EX P ANDS MEDIA I/F USB I/F MAIN MICROPROCESSOR FLASH TOP OPERA TION UNIT SHUTTER ZOOM OIS CONTROL LENS DRIVE LCD DRIVE MICROPHONE[...]

38 1 1.2. Flash / T op Block Diagram 1 1.3. Sub Operation Block Diagram DMC-XS1 FLASH TOP BLOCK DIAGRAM FLASH TOP BLOCK DIAGRAM F8001 3 5 2 1 T8001 CL8004 C8003 (For Flash Charge) FLASH UNIT FLASH TOP P .C.B. CL8008 (FLASH TRG) TL8003 IC8001 (IGBT DRIVER) GND DRV OUT VDD DRVIN CHARGE 10 9 8 7 6 SW TEST CS FB STAT 1 2 3 4 5 CL8006 CL8003 CL8005 CL50[...]

39 12 Wiring Connection Diagram 12.1. Interconnection Diagram DMC-XS1 INTERCONNECTION DIAGRAM INTERCONNECTION DIAGRAM MAIN P.C.B. (COMPONENT SIDE) : (FOIL SIDE) FLASH TOP P.C.B. (COMPONENT SIDE) : (FOIL SIDE) LCD UNIT CCD FPC UNIT LENS UNIT BA TTERY SPEAKER SUB OPERATION FPC RL6501 RL6502 TL9002 TL9003 TL9001 FLASH UNIT M5001 MICROPHONE TL8001 TL80[...]