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AMD 1207 инструкция обслуживания

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Похожие руководства по эксплуатации

Хорошее руководство по эксплуатации

Законодательство обязывает продавца передать покупателю, вместе с товаром, руководство по эксплуатации AMD 1207. Отсутствие инструкции либо неправильная информация, переданная потребителю, составляют основание для рекламации в связи с несоответствием устройства с договором. В законодательстве допускается предоставлении руководства в другой, чем бумажная форме, что, в последнее время, часто используется, предоставляя графическую или электронную форму инструкции AMD 1207 или обучающее видео для пользователей. Условием остается четкая и понятная форма.

Что такое руководство?

Слово происходит от латинского "instructio", тоесть привести в порядок. Следовательно в инструкции AMD 1207 можно найти описание этапов поведения. Цель инструкции заключается в облегчении запуска, использования оборудования либо выполнения определенной деятельности. Инструкция является набором информации о предмете/услуге, подсказкой.

К сожалению немного пользователей находит время для чтения инструкций AMD 1207, и хорошая инструкция позволяет не только узнать ряд дополнительных функций приобретенного устройства, но и позволяет избежать возникновения большинства поломок.

Из чего должно состоять идеальное руководство по эксплуатации?

Прежде всего в инструкции AMD 1207 должна находится:
- информация относительно технических данных устройства AMD 1207
- название производителя и год производства оборудования AMD 1207
- правила обслуживания, настройки и ухода за оборудованием AMD 1207
- знаки безопасности и сертификаты, подтверждающие соответствие стандартам

Почему мы не читаем инструкций?

Как правило из-за нехватки времени и уверенности в отдельных функциональностях приобретенных устройств. К сожалению само подсоединение и запуск AMD 1207 это слишком мало. Инструкция заключает ряд отдельных указаний, касающихся функциональности, принципов безопасности, способов ухода (даже то, какие средства стоит использовать), возможных поломок AMD 1207 и способов решения проблем, возникающих во время использования. И наконец то, в инструкции можно найти адресные данные сайта AMD, в случае отсутствия эффективности предлагаемых решений. Сейчас очень большой популярностью пользуются инструкции в форме интересных анимаций или видео материалов, которое лучше, чем брошюра воспринимаются пользователем. Такой вид инструкции позволяет пользователю просмотреть весь фильм, не пропуская спецификацию и сложные технические описания AMD 1207, как это часто бывает в случае бумажной версии.

Почему стоит читать инструкции?

Прежде всего здесь мы найдем ответы касательно конструкции, возможностей устройства AMD 1207, использования отдельных аксессуаров и ряд информации, позволяющей вполне использовать все функции и упрощения.

После удачной покупки оборудования/устройства стоит посвятить несколько минут для ознакомления с каждой частью инструкции AMD 1207. Сейчас их старательно готовят или переводят, чтобы они были не только понятными для пользователя, но и чтобы выполняли свою основную информационно-поддерживающую функцию.

Содержание руководства

  • Страница 1

    Advanced Micro Devices Thermal Design Guide for Socket F (1207) Processors 32800 Publicat ion # 3.00 Revision: August 200 6 Issue Date:[...]

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    © 2005 Advanced Micr o Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no represen tations or warranties with respect to the accuracy or completeness of the contents of th is publication and reserves the right to make changes to specificat[...]

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    Contents 3 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Chapter 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [...]

  • Страница 4

    4 Content s 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors 5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.3.5 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 5.3.[...]

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    List of Figures 5 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 List of Figur es Figure 1. The 1207-Pin Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB Thermal Solut[...]

  • Страница 6

    6 List of Figures 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 26. Socket F (1207) 2U-4P Socket Outline and So cket Window . . . . . . . . . . . . . . . . . . . . . 56 Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restri ction Zone . . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F (1207[...]

  • Страница 7

    List of T ables 7 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 List of T ables Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors . . . . . . . . . . . . 13 Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors . . . . . . . . . . . . . . . . .[...]

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    8 List of T ables 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Страница 9

    Revision History 9 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Revision History Date Revision Descript ion July 2006 3.00 Initial Public release.[...]

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    10 Revision History 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Страница 11

    Chapter 1 Introduction 1 1 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 1 Intr oduction This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, uti lizing AMD 64-bit technology . Detailed drawings, descriptions, and design targets[...]

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    12 Introduction Chapter 1 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

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    Chapter 2 Processor Thermal Solutions 13 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 2 Pr ocessor Thermal Solutions This chapter describes the thermal solutions fo r systems based on socket F (1207) processors. 2.1 Pr ocessor Specifications The objective of thermal solutions is to maintain the proc essor[...]

  • Страница 14

    14 Processor Thermal Solutions Chapter 2 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors 2.2 Socket Description Figure 1 shows a three-dimensional view of th e 1207-pin socket used with socket F (1207) processors. This socket is base d on LGA (land-grid array) technology . The LGA socket has 35 pads x 35 pads on a 1[...]

  • Страница 15

    Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 15 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 3 Thermal Design of Platforms Using the AMD Pr ocessor -In-a-Box (PIB) Thermal Solution This chapter describes the motherboard component height restrictions, ther[...]

  • Страница 16

    16 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 2 on pa ge 15. This space perm[...]

  • Страница 17

    Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 17 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 T a ble 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for socket F (1207) processors. Figure 3 on page 18 shows an exploded view[...]

  • Страница 18

    18 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 3. Exploded V iew of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors 3.3.1 Backplate Assembly The backplate is mounted on the ba ckside of th[...]

  • Страница 19

    Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 19 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Note: Do not cut entir ely thr ough the center rib. Doin g so will compr omise the stiffness of the backplate. The plate uses two PennEngineering (PEM) sta ndof fs that s[...]

  • Страница 20

    20 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

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    Chapter 4 Thermal Design of Custom 1U-2P Systems 21 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Chapter 4 Thermal Design of Custom 1U-2P Systems This chapter describes the motherboard compone nt-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 1[...]

  • Страница 22

    22 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 4 on pa ge 21. This space permits heat sink designs with better thermal perf[...]

  • Страница 23

    Chapter 4 Thermal Design of Custom 1U-2P Systems 23 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Figure 5 on page 24 shows an explode d view of the components used in the thermal reference design solution for custom 1U-2P systems ba sed on socket F (1207) processors. T able 5. Components for the Pr ocessor T[...]

  • Страница 24

    24 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 5. Exploded V iew of Thermal Solution for Custom 1U-2P Systems The following sections describe the mechanical requirements of the components shown in Figure 5. 4.3.1 Backplate Assembly For details on the backpl[...]

  • Страница 25

    Chapter 4 Thermal Design of Custom 1U-2P Systems 25 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Lifting the heat sink away from the processor can re sult in damage to the processor contact pads, the socket contacts, or the socket solder-ball joints . Ma intaining the spring force is important for the life o[...]

  • Страница 26

    26 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Other fan and heat sink co mbinations may yield adequate ther mal performance. The system designer must ensure that the thermal solution provides requ ired cooling for the proce ssor for the given system layout and fl[...]

  • Страница 27

    Chapter 4 Thermal Design of Custom 1U-2P Systems 27 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 4.3.5 Thermal Interface Material The heat sink contacts the top surface of the processor package and utilizes the thermal interface material between the processor lid and the heat sink. AMD recommends us ing a hi[...]

  • Страница 28

    28 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Страница 29

    Chapter 5 Thermal Design of Custom 2U-4P Systems 29 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Chapter 5 Thermal Design of Custom 2U-4P Systems This chapter describes the motherboard compone nt-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 2U-4P [...]

  • Страница 30

    30 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 8 on pa ge 29. This space permits heat sink designs with better thermal perf[...]

  • Страница 31

    Chapter 5 Thermal Design of Custom 2U-4P Systems 31 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Figure 9 on page 32 shows an explode d view of the components used in the thermal reference design solution for custom 2U-4P systems ba sed on socket F (1207) processors. T able 8. Components for the Pr ocessor Therma[...]

  • Страница 32

    32 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 9. Exploded V iew of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors The following sections describe the mechanical requirements of the components shown in Figure 9. 5.3.1 Backplate[...]

  • Страница 33

    Chapter 5 Thermal Design of Custom 2U-4P Systems 33 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 5.3.2 Spring Clip The spring clip is designed to apply 75 lbs of for ce to the center of the heat sink. This force is necessary to help prevent the heat sink from lifting of f of the package during shock or vibration-[...]

  • Страница 34

    34 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors the center to 2.5 mm at the edges. The heat sink al so has three heat pipes soldered to the base and connected to the top of the fin stack to improve fin ef ficiency . This design provides optimum heat spreading perfo[...]

  • Страница 35

    Chapter 5 Thermal Design of Custom 2U-4P Systems 35 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 on flow simulations of an AMD reference 2U system, the flow-through of the heat sink is approximately 18 CFM. Figure 1 1 sh ows that this flow rate corres ponds to a case-to-ambient thermal resistance of 0.22°C/W . T[...]

  • Страница 36

    36 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Страница 37

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 37 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Pr ocessors Appendix A contains detaile d recommended keep-out dra[...]

  • Страница 38

    38 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 12. Socket F (1207) PIB Boar d Component Height Restrictions 7 3 . 8 1 1 9 . 9 1 D C B A A B C D 1 2 3 4 5 6 7 8 8 7 5 6 4 3 2 1 S E C I V E D O R C I M D[...]

  • Страница 39

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 39 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 13. Socket F (1207) PIB Mounting Ho les, Contact Pads, and No-Routing Zone x 2 0 5 4 . 0 0. 000 0. 00 x 2 2 3 . 5 2 2 4 . 1 1 1. 441 36. 59 0. 787 0. 39 [...]

  • Страница 40

    40 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 14. Socket F (1207) PIB So cket Outline and Socket Window 0.000 0.00 0.724 18. 3 9 2.189 55. 6 1 0 0 0 . 0 0 0 . 0 19. 9 1 0. 784 8 5 4 . 0 3 6 . 1 1 6 3 [...]

  • Страница 41

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 41 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone x 2 4 1 . 0 5 4 7 9 . 1 0. 000 0.00 1. 44 1 2 x 36. 59 1. 26 5 2 x 32. 13 1. 08 6 2 x 27. 59 2.[...]

  • Страница 42

    42 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out 7 9 4 . 0 3 6 . 2 1 0. 000 0. 00 1. 318 33. 47 2. 885 73. 29 0 0 0 . 0 0 0 . 0 4 4 9 . 1 7 3 . 9 4 [...]

  • Страница 43

    Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 43 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out x 2 0 7 5 . 1 0. 000 0. 39 7 2 x 0. 966 24. 54 10. 09 0. 00 1. 318 33. 47 0. 233 1. 33 5 2 x 33. 91 1.[...]

  • Страница 44

    44 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Страница 45

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 45 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Appendix B Keep-Out Drawings for Custom 1U- 2P Systems Based on the Socket F (1207) Pr ocessor Appendix B contains detailed recommended keep-out drawings for processo r hea[...]

  • Страница 46

    46 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 18. Socket F (1207) 1U-2P B oard Component Height Restrictions 0 0 . 3 4 . d n u o r g o t e i T ; t h g i e h t n e n o p m o c x a M ] ' ' 0 0 0 . 0 [ 0 0[...]

  • Страница 47

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 47 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 19. Socket F (1207) 1U-2P Mounting Ho les, Contact Pads, and No-Routing Zone x 2 2 3 . 5 2 7 9 9 . 0 0. 000 0. 00 0. 96 6 2 x 24. 54 2. 53 4 2 x 0 0 0 . 0 7 3 . 6 4 [...]

  • Страница 48

    48 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 20. Socket F (1207) 1U-2P So cket Outline and Socket Window 19.9 1 0.784 0 0 0 . 0 0 0 . 0 8 5 4 . 0 3 6 . 1 1 0.000 0.00 1 8 9 . 1 3 3 . 0 5 0.724 18. 39 2.189 55. 6[...]

  • Страница 49

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 49 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 21. Socket F (1207) 1U-2P He at Sink Height Restriction Zone 7 2 8 . 0 0 0 . 1 2 0.000 0. 00 2. 83 4 2 x 0 0 0 . 0 0 0 . 0 71. 98 1. 26 6 2 x 1.681 42. 71 3.249 82. [...]

  • Страница 50

    50 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out 6 7 5 . 0 3 6 . 4 1 0. 000 0. 00 1. 598 40 .59 3. 166 80 .41 0 0 0 . 0 0 0 . 0 2 2 0 . 2 7 3 . 1 5 . s t n e [...]

  • Страница 51

    Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 51 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 23. Socket F (1207) 1U -2P Backplate Contact Zone 5. 9 1 2 x 0. 233 0. 000 0. 00 1. 598 40.59 3. 166 80.41 1. 266 32.16 2. 834 71.98 0 0 0 . 0 0 0 . 0 6 7 5 . 0 3 6 [...]

  • Страница 52

    52 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Страница 53

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 53 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Appendix C Keep-Out Drawings for Custom 2U- 4P Systems Based on the Socket F (1207) Pr ocessor Appendix C contains detailed recomm ended keep out drawings for pr ocessor he[...]

  • Страница 54

    54 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 24. Socket F (1207) 2U-4P B oard Component Height Restrictions 0 0 . 3 4 4 2 . 5 1 D C B A A B C D 1 2 3 4 5 6 7 8 8 7 5 6 4 3 2 1 S E C I V E D O R C I M D E C N A V[...]

  • Страница 55

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 55 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 25. Socket F (1207) 2U-4P Mounting Ho les, Contact Pads, and No-Routing Zone 3 2 .1 6 1 .2 6 6 0. 000 0. 00 0. 96 6 2 x 1. 866 47.40 24. 54 2. 53 4 2 x 64. 36 x 2 0 [...]

  • Страница 56

    56 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 26. Socket F (1207) 2U-4P So cket Outline and Socket Window 1 9 .9 1 0 .7 8 4 0. 000 0.00 0. 724 18. 39 1. 520 38. 61 2. 189 55. 61 0 0 0 . 0 0 0 . 0 8 5 4 . 0 3 6 . [...]

  • Страница 57

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 57 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 27. Socket F (1207) 2U-4P He at Sink Height Restriction Zone 1.266 0. 000 0. 00 2.83 4 2 x 2.260 57.4 1 0. 693 17.59 0 0 0 . 0 0 0 . 0 7 2 6 . 0 2 9 . 5 1 71.98 2 x [...]

  • Страница 58

    58 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out 7 9 4 . 0 3 6 . 2 1 0. 000 0.00 1. 598 40.59 3. 166 80.41 0 0 0 . 0 0 0 . 0 4 4 9 . 1 7 3 . 9 4 D C B A A B C[...]

  • Страница 59

    Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 59 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 29. Socket F (1207) 2U -4P Backplate Contact Zone 3 2 1 . 0 0.000 0.00 1.598 40. 59 x 2 3.166 80. 41 0 0 0 . 0 0 0 . 0 6 6 5 . 0 7 3 . 4 1 7 9 4 . 0 3 6 . 2 1 1 8 8 [...]

  • Страница 60

    60 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors[...]

  • Страница 61

    Appendix D Flow Simulation Result s for Custom 2U-4P Systems Based on Socket F (1207) Processors 61 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Pr ocessors Appendix D describes the flow simulation result s for 2U-4P systems base[...]

  • Страница 62

    62 Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors Appendix D 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 31. S treamline Plot of AM D Refer ence Custom 2U-4P System Thermal simulation of the 2U-4P system shown in Figure 30 on page 61 with the heat sink and fan describ[...]