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Intel E8501 инструкция обслуживания

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Похожие руководства по эксплуатации

Хорошее руководство по эксплуатации

Законодательство обязывает продавца передать покупателю, вместе с товаром, руководство по эксплуатации Intel E8501. Отсутствие инструкции либо неправильная информация, переданная потребителю, составляют основание для рекламации в связи с несоответствием устройства с договором. В законодательстве допускается предоставлении руководства в другой, чем бумажная форме, что, в последнее время, часто используется, предоставляя графическую или электронную форму инструкции Intel E8501 или обучающее видео для пользователей. Условием остается четкая и понятная форма.

Что такое руководство?

Слово происходит от латинского "instructio", тоесть привести в порядок. Следовательно в инструкции Intel E8501 можно найти описание этапов поведения. Цель инструкции заключается в облегчении запуска, использования оборудования либо выполнения определенной деятельности. Инструкция является набором информации о предмете/услуге, подсказкой.

К сожалению немного пользователей находит время для чтения инструкций Intel E8501, и хорошая инструкция позволяет не только узнать ряд дополнительных функций приобретенного устройства, но и позволяет избежать возникновения большинства поломок.

Из чего должно состоять идеальное руководство по эксплуатации?

Прежде всего в инструкции Intel E8501 должна находится:
- информация относительно технических данных устройства Intel E8501
- название производителя и год производства оборудования Intel E8501
- правила обслуживания, настройки и ухода за оборудованием Intel E8501
- знаки безопасности и сертификаты, подтверждающие соответствие стандартам

Почему мы не читаем инструкций?

Как правило из-за нехватки времени и уверенности в отдельных функциональностях приобретенных устройств. К сожалению само подсоединение и запуск Intel E8501 это слишком мало. Инструкция заключает ряд отдельных указаний, касающихся функциональности, принципов безопасности, способов ухода (даже то, какие средства стоит использовать), возможных поломок Intel E8501 и способов решения проблем, возникающих во время использования. И наконец то, в инструкции можно найти адресные данные сайта Intel, в случае отсутствия эффективности предлагаемых решений. Сейчас очень большой популярностью пользуются инструкции в форме интересных анимаций или видео материалов, которое лучше, чем брошюра воспринимаются пользователем. Такой вид инструкции позволяет пользователю просмотреть весь фильм, не пропуская спецификацию и сложные технические описания Intel E8501, как это часто бывает в случае бумажной версии.

Почему стоит читать инструкции?

Прежде всего здесь мы найдем ответы касательно конструкции, возможностей устройства Intel E8501, использования отдельных аксессуаров и ряд информации, позволяющей вполне использовать все функции и упрощения.

После удачной покупки оборудования/устройства стоит посвятить несколько минут для ознакомления с каждой частью инструкции Intel E8501. Сейчас их старательно готовят или переводят, чтобы они были не только понятными для пользователя, но и чтобы выполняли свою основную информационно-поддерживающую функцию.

Содержание руководства

  • Страница 1

    Intel ® E8500/E8501 Chip set North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Guide May 2006 Document Number 306749-002[...]

  • Страница 2

    2 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER WISE, T O ANY INTELLECTUAL PROPERTY RI GH TS IS GRANTED BY THIS DOCUMENT . EXCEPT AS P ROVIDED IN INTEL[...]

  • Страница 3

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 3 Bridge (XMB) Thermal/Mechani cal Desig n Guide Contents 1 Introduction... ................ ................ ............. ................ ................ ................. ................ ........ 7 1.1 Design Flow ............ ... .............. .............. ..............[...]

  • Страница 4

    4 Intel ® E8500/8501 Chipset North Bridge (NB) and eXtern al Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5 XMB Heatsink Thermal Solution Assembly ....... ......... .............. .............. .............. ............. 38 8.5.1 Heatsink Orientation ............. .............. ................. .............. .............. ........[...]

  • Страница 5

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 5 Bridge (XMB) Thermal/Mechani cal Desig n Guide Tables 3-1 Intel ® E8500 Chipset NB Thermal Specifications ... ...................... .............. .............. .........15 3-2 Intel ® E8501 Chipset NB Thermal Specifications ... ...................... .............. ........[...]

  • Страница 6

    6 Intel ® E8500/8501 Chipset North Bridge (NB) and eXtern al Memory Bridge (XMB) Thermal/Me chanical Design Guide Revision History § Document Number Revision Number Description Date 306749 001 • Initial release of this document March 2005 306749 002 • Added Intel® E8501 chipset specific information and re-titled document • Added updated In[...]

  • Страница 7

    Intel ® E8500 /E8501Chipset North Bridg e (NB) an d eXternal Memory 7 Bridge (XMB) Thermal/Mechani cal Desig n Guide 1 Introduction As the complexity of computer systems increases, so do the power dissi patio n requirements. Care must be taken to ensure that the additional power is properl y dissipat ed. T ypical methods to improve heat dissipatio[...]

  • Страница 8

    Introduction 8 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001239 1.2 Definition of T erms BGA Ball grid array . A package type, defined by a resin-fiber substrate, onto which a die is mounted, bonded and encapsulated in m old ing com pound. The primary electrical interface is an [...]

  • Страница 9

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 9 Bridge (XMB) Thermal/Mechani cal Desig n Guide Introduction XMB Intel ® E8500/E8501 chipset eXternal Mem ory Bridge Component. The chipset component that bridges th e IMI and DDR interfaces. 1.3 Reference Document s The reader of this specification sh ould also be fami liar wit[...]

  • Страница 10

    Introduction 10 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Страница 11

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 11 Bridge (XMB) Thermal/Mechani cal Desig n Guide 2 Packaging T echnology The E8500/E8501 chi psets consist of four i ndi vidual components: the NB, the XMB, the Intel ® 6700PXH 64-bit PCI Hub and the I/O control l er hu b (ICH5R). The E8500/E8501 chipset NB component use a 42.5 [...]

  • Страница 12

    Packaging T e chnology 12 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTES: 1. All dimensions are in millimeter s. 2. All dimensions and tolerances confor m to ANSI Y14.5M-1994. Figure 2-3. NB Package Dimensions (Botto m View) 42.5 + 0.05 11 25 23 21 19 17 15 13 9 7 5 3 12 7 2 9 [...]

  • Страница 13

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 13 Bridge (XMB) Thermal/Mechani cal Desig n Guide Packaging T e ch no lo gy Figure 2-4. XMB Package Dimensions (T op View) Figure 2- 5. XMB Package Dimensions ( Side View) XMB Die Die Keepout Area Handling Exclusion Area 37.50mm . 27.50mm. 23.50mm. 37.50mm . 27.50mm . 23.50mm . 14[...]

  • Страница 14

    Packaging T e chnology 14 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 2.1 Package Mechanical Requirement s The E8500/E8501c chipset NB package has an IHS and the XMB package has an exposed bare die which is capable of sustaining a maximum static no rm al load of 15-lbf. The packag[...]

  • Страница 15

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 15 Bridge (XMB) Thermal/Mechani cal Desig n Guide 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely t o cause the E8500/E8501 ch ipset NB/XMB components to co nsume maximum power dissipation for sustained time periods. T[...]

  • Страница 16

    Thermal Specifications 16 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTE: 1. These specifications are based on si lico n characterization, however, they may be updated as further data becomes available. § T able 3-2. Intel ® E8501 Chip set NB Thermal S pecifications Parameter [...]

  • Страница 17

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 17 Bridge (XMB) Thermal/Mechani cal Desig n Guide 4 Thermal Simulation Intel provides thermal simulatio n mod els of the E8500/E8501 chipset NB/XM B compo nents and associated user's guides to aid system designers in simulating, analyzing, and optim izi ng their thermal solut[...]

  • Страница 18

    Thermal Simulation 18 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Страница 19

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 19 Bridge (XMB) Thermal/Mechani cal Desig n Guide 5 Thermal Metrology The system designer must make temperature measurements to accura tely determine the thermal performance of the system. Intel has established gu idelines for proper tech niques to measure the NB/XMB die temperatu[...]

  • Страница 20

    Thermal Metrolo gy 20 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001240 NOTE: Not to scale. 001321 NOTE: Not to scale. Figure 5-1. Thermal Solution De cision Flowchart Figure 5-2. Zero Degree Angle Att ach Heatsink Modifications Figure 5-3. Zero Degree Angle Att ach Methodology ([...]

  • Страница 21

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 21 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Metrology 5.2 Power Simulation Sof tware The power simulation software is a utility designed to dissipate the thermal design power on an E8500/E8501 chipset NB compon ent or XMB comp onent when used in conjunction with the [...]

  • Страница 22

    Thermal Metrolo gy 22 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Страница 23

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 23 Bridge (XMB) Thermal/Mechani cal Desig n Guide 6 NB Reference Thermal Solution #1 Intel has developed two different reference thermal solu tions designed to meet th e cooling needs of the E8500/E8501 chipset NB com ponent under oper ating environmen ts and specifications define[...]

  • Страница 24

    NB Reference Thermal Solution #1 24 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on t[...]

  • Страница 25

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 25 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.4 Board-Level Component s Keepout Dimensions The location of hole pattern and keepout zones fo r the reference thermal solution are shown in Figure 6-3 . Figure 6-2. First NB Reference Heat sink V[...]

  • Страница 26

    NB Reference Thermal Solution #1 26 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.5 First NB Heat sink Thermal Solution Assembly The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interface. It is attached to the bo ard by using[...]

  • Страница 27

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 27 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.5.1 Heat s ink Orientation Since this solution is based on a unidirectional heatsin k, mean airflo w direction must be aligned with the direction of the heatsink fins. 6.5.2 Extruded Heat sink Pro[...]

  • Страница 28

    NB Reference Thermal Solution #1 28 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide the thermal resistance of the Chomeric s THERMFLOW T710 TIM is shown in Ta b l e 6 - 1 The heatsink clip provides enough pressu re for the TIM to achieve a thermal conductivity of 0.17 ° Ci n c h 2 /W[...]

  • Страница 29

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 29 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.6 Reliability Guidelines Each motherboard, heatsink a nd attach combination may vary the mechanical loading of the component. Based on the end user envi ronment, the user should define th e approp[...]

  • Страница 30

    NB Reference Thermal Solution #1 30 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Страница 31

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 31 Bridge (XMB) Thermal/Mechani cal Desig n Guide 7 NB Reference Thermal Solution #2 Intel has developed two different reference thermal solu tions designed to meet th e cooling needs of the E8500/E8501 chipset NB com ponent under oper ating environmen ts and specifications define[...]

  • Страница 32

    NB Reference Thermal Solution #2 32 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on t[...]

  • Страница 33

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 33 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.4 Board-Level Component s Keepout Dimensions Please refer to Section 6.4 for detail. 7.5 Second NB Heat sink Thermal Solution Assembly The reference thermal solution for the chipset NB component i[...]

  • Страница 34

    NB Reference Thermal Solution #2 34 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.5.1 Heat sink Orient ation Since this solution is based on a unidirectional heatsink , mean airflow direction must be align ed with the direction of the heatsink fins. 7.5.2 Extruded Heat sink Profil[...]

  • Страница 35

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 35 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.6 Reliability Guidelines Please refer to Section 6.6 for detail. §[...]

  • Страница 36

    NB Reference Thermal Solution #2 36 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Страница 37

    Intel ® E8500 /E8501 Chipset North Bridge (NB) and eXternal Memo ry 37 Bridge (XMB) Thermal/Mechani cal Desig n Guide 8 XMB Reference Thermal Solution Intel has developed one different reference thermal solution designed to meet the cooling needs of the E8500/E8501 chipset XMB component under operating environments and specifi cations defined in t[...]

  • Страница 38

    XMB Reference Thermal Solution 38 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.3 Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width and depth constr aints typically placed on the[...]

  • Страница 39

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 39 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution Full mechanical drawings of the therm al soluti on assembly and the heatsink are provided in Appendix B . Appendix A contains vendor information fo r each thermal solution component. 8.5.1 Heat s ink [...]

  • Страница 40

    XMB Reference Thermal Solution 40 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5.2 Extruded Heat sink Profiles The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB. Figure 8-5 shows the heatsink profile. Appendix A lists a sup plier for this ex[...]

  • Страница 41

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 41 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution 8.6 Reliability Guidelines Please refer to Section 6.6 for details. § Figure 8-5. XMB Heat sink Extrusion Profile[...]

  • Страница 42

    XMB Reference Thermal Solution 42 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Страница 43

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 43 Bridge (XMB) Thermal/Mechani cal Desig n Guide A Thermal Solution Component Suppliers T able A-1. NB Heat sink Thermal Solution #1 Part Intel Part Number Sup plier (Part Numb er) Contact Information Heatsink Assembly includes: • Unidirectional Fin Heatsink • Thermal Interfa[...]

  • Страница 44

    Thermal Solution Compone nt Suppliers 44 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide T able A-2. NB Heat sink Thermal Solution #2 Part Intel Part Number Supplier (Part Number) Contact Information Heatsink Assembly includes: • Unidirectional Fin Heatsink • Thermal Interface Mat[...]

  • Страница 45

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 45 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Solution Component Suppliers NOTE: The enabled components may not be currently available from all suppl iers. Contact the supplier directly to verify time of component availability . § T able A-3. XMB Heat sink Thermal Sol[...]

  • Страница 46

    Thermal Solution Compone nt Suppliers 46 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide[...]

  • Страница 47

    Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 47 Bridge (XMB) Thermal/Mechani cal Desig n Guide B Mechanical Drawings T able B-1. Mechanic al Drawing List Drawing Description Figure Number NB Heatsink #1 Assembly Drawing Figure B-1 NB Heatsink #1 Drawing Figure B-2 NB Heatsink #2 Assembly Drawing Figure B-3 NB Heatsink #2 Dra[...]

  • Страница 48

    Mechanical Drawings 48 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-1. NB Heatsink #1 Assembl y Drawing[...]

  • Страница 49

    Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 49 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-2. NB Heat sink #1 Drawing[...]

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    Mechanical Drawings 50 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-3. NB Heatsink #2 Assembl y Drawing[...]

  • Страница 51

    Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 51 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-4. NB Heat sink #2 Drawing[...]

  • Страница 52

    Mechanical Drawings 52 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-5. XMB Heatsink Assembly Drawing[...]

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    Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 53 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-6. XMB Heat sink Drawing[...]

  • Страница 54

    Mechanical Drawings 54 Intel ® E8500/E8501 Chi pset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mech anical Design Guide §[...]