HP (Hewlett-Packard) 643064-001 manual
- Consulta online o descarga el manual de instrucciones
- 97 páginas
- 3.69 mb
Ir a la página of
manuales de instrucciones parecidos
-
Server
HP (Hewlett-Packard) ML310
32 páginas 0.75 mb -
Server
HP (Hewlett-Packard) 9000 V2600 SCA
206 páginas 3.79 mb -
Server
HP (Hewlett-Packard) 8200zl/5400zl/3500yl Series
12 páginas 0.23 mb -
Server
HP (Hewlett-Packard) 670856-S01
134 páginas 5.91 mb -
Server
HP (Hewlett-Packard) DL585 G5
19 páginas 0.62 mb -
Server
HP (Hewlett-Packard) F200
10 páginas 0.19 mb -
Server
HP (Hewlett-Packard) DL740
36 páginas 0.39 mb -
Server
HP (Hewlett-Packard) PC2-6400
38 páginas 0.84 mb
Buen manual de instrucciones
Las leyes obligan al vendedor a entregarle al comprador, junto con el producto, el manual de instrucciones HP (Hewlett-Packard) 643064-001. La falta del manual o facilitar información incorrecta al consumidor constituyen una base de reclamación por no estar de acuerdo el producto con el contrato. Según la ley, está permitido adjuntar un manual de otra forma que no sea en papel, lo cual últimamente es bastante común y los fabricantes nos facilitan un manual gráfico, su versión electrónica HP (Hewlett-Packard) 643064-001 o vídeos de instrucciones para usuarios. La condición es que tenga una forma legible y entendible.
¿Qué es un manual de instrucciones?
El nombre proviene de la palabra latina “instructio”, es decir, ordenar. Por lo tanto, en un manual HP (Hewlett-Packard) 643064-001 se puede encontrar la descripción de las etapas de actuación. El propósito de un manual es enseñar, facilitar el encendido o el uso de un dispositivo o la realización de acciones concretas. Un manual de instrucciones también es una fuente de información acerca de un objeto o un servicio, es una pista.
Desafortunadamente pocos usuarios destinan su tiempo a leer manuales HP (Hewlett-Packard) 643064-001, sin embargo, un buen manual nos permite, no solo conocer una cantidad de funcionalidades adicionales del dispositivo comprado, sino también evitar la mayoría de fallos.
Entonces, ¿qué debe contener el manual de instrucciones perfecto?
Sobre todo, un manual de instrucciones HP (Hewlett-Packard) 643064-001 debe contener:
- información acerca de las especificaciones técnicas del dispositivo HP (Hewlett-Packard) 643064-001
- nombre de fabricante y año de fabricación del dispositivo HP (Hewlett-Packard) 643064-001
- condiciones de uso, configuración y mantenimiento del dispositivo HP (Hewlett-Packard) 643064-001
- marcas de seguridad y certificados que confirmen su concordancia con determinadas normativas
¿Por qué no leemos los manuales de instrucciones?
Normalmente es por la falta de tiempo y seguridad acerca de las funcionalidades determinadas de los dispositivos comprados. Desafortunadamente la conexión y el encendido de HP (Hewlett-Packard) 643064-001 no es suficiente. El manual de instrucciones siempre contiene una serie de indicaciones acerca de determinadas funcionalidades, normas de seguridad, consejos de mantenimiento (incluso qué productos usar), fallos eventuales de HP (Hewlett-Packard) 643064-001 y maneras de solucionar los problemas que puedan ocurrir durante su uso. Al final, en un manual se pueden encontrar los detalles de servicio técnico HP (Hewlett-Packard) en caso de que las soluciones propuestas no hayan funcionado. Actualmente gozan de éxito manuales de instrucciones en forma de animaciones interesantes o vídeo manuales que llegan al usuario mucho mejor que en forma de un folleto. Este tipo de manual ayuda a que el usuario vea el vídeo entero sin saltarse las especificaciones y las descripciones técnicas complicadas de HP (Hewlett-Packard) 643064-001, como se suele hacer teniendo una versión en papel.
¿Por qué vale la pena leer los manuales de instrucciones?
Sobre todo es en ellos donde encontraremos las respuestas acerca de la construcción, las posibilidades del dispositivo HP (Hewlett-Packard) 643064-001, el uso de determinados accesorios y una serie de informaciones que permiten aprovechar completamente sus funciones y comodidades.
Tras una compra exitosa de un equipo o un dispositivo, vale la pena dedicar un momento para familiarizarse con cada parte del manual HP (Hewlett-Packard) 643064-001. Actualmente se preparan y traducen con dedicación, para que no solo sean comprensibles para los usuarios, sino que también cumplan su función básica de información y ayuda.
Índice de manuales de instrucciones
-
Página 1
HP Pr oL ian t DL5 8 0 G7 Serv er Maint enance and S er v i ce Guide Abstract This document describes service pr ocedures for the HP ProLiant DL58 0 G7 Server. This document is inten ded for experienced ser vice technicians. H P assumes that you ar e qualified in the servicing of computer equip ment, are trained in re cognizing hazards in produ cts[...]
-
Página 2
© Copyright 2010, 2012 Hewlett- Packard Development Company, L.P. The information contained herei n is subject to change without notice. The only wa rranties for HP products and services are set for th in the express warranty statements accompanyin g such products and services. Nothi ng herein should be constr ued as constitutin g an additional wa[...]
-
Página 3
Contents 3 Con tents Customer self repair ...................................................................................................................... 5 Parts only warranty service ......................................................................................................................... 5 Illustrated parts catalog .........[...]
-
Página 4
Contents 4 Diagnostic tools .......................................................................................................................... 67 Troubleshooting resource s ........................................................................................................................ 67 SmartStart software .........................[...]
-
Página 5
Customer self repair 5 C u st omer s elf r epair HP products are desig ned with many Customer Se lf Repair (CSR) parts to mi nimize repair time and allow f or greater flex ibility in per forming def ective parts rep lacement. If during the diagno sis period HP (or HP service providers or service partners) identifies th at the repair can be accompli[...]
-
Página 6
Customer self repair 6 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer c es pièces, les c oûts de déplacemen t et main d'œuv re du service vo us seront facturé s. Facultatif - Piè ces pour lesquell es la réparation par le client est facultative. Ces pièces sont[...]
-
Página 7
Customer self repair 7 In base alla disponibi lità e alla località geograf ica, le parti CSR vengono sp edite con consegna entro il giorno lavorat ivo seguente. La conse gna nel giorno stesso o entro quattro ore è o fferta con un sup plemento di costo solo in a lcune zone. In caso di necessità si può richiedere l' assistenza telefonica d [...]
-
Página 8
Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihnen das Er satzteil in Rechnung stellen. Im Falle von Customer Self Repair ko mmt HP für alle Kost en für die Liefer ung un d Rücksendung auf u nd bestimmt den Kurier- /Frachtdienst. Weitere Informatione n über das HP Customer Sel f Repair Programm erhalten Si e von Ihrem Serv[...]
-
Página 9
Customer self repai r 9 enviara el componente defectuo so requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustitucion es que lleve a ca bo el cliente, H P se hará cargo de todos l os gastos de env ío y devolución d e componentes y esco gerá la empresa de transpor te que se utilice para dic ho se rvicio. Para obtener m?[...]
-
Página 10
Customer self repair 10 Neem contact op met e en Service Partner voo r meer informatie o ver het Customer Self Re pair programma van HP. Informatie o ver Service Partners vindt u op de HP website ( http://www. hp.com/go/selfrepair ). G ar anti es e r v ice "P arts Onl y" Het is mogelijk dat de HP garan tie alleen de g arantieservice "[...]
-
Página 11
Customer self repair 11 No caso desse se rviço, a substituição de peç as CSR é obrigatória. S e desejar que a HP su bstitua essas peças, serão cobradas as despesas de transporte e mão - de - obra do serviço.[...]
-
Página 12
Customer self repair 12[...]
-
Página 13
Customer self repair 13[...]
-
Página 14
Customer self repair 14[...]
-
Página 15
Customer self repair 15[...]
-
Página 16
Illustrated parts catalog 16 I llus tr ated part s catalog M echanical co mponents Item Description Spare part number Customer self repair (on page 5 ) 1 Plastics ki t 591209 - 001 — a) Bezel — Mandatory 1 b) PCI card re tainer* — Mandatory 1 c) Bezel assembly, power and Systems Insight Display — Man datory 1 d) Fan louver* — Mandatory 1[...]
-
Página 17
Illustrated parts catalog 17 Item Description Spare part number Customer sel f repair (on page 5 ) e) Blank, power supply — Mandatory 1 2 Access panel 591206 - 001 Mandatory 1 3 Processor memory drawer 591197 - 0 01 Mandatory 1 4 Blank, hard dr ive 392613 - 001 Mandatory 1 5 Tool, T - 15 Torx * 199630 - 001 Mandatory 1 *Not shown 1 Mandatory — [...]
-
Página 18
Illustrated parts catalog 18 sustitución, pue de o no conllev ar costes adici onales, depe ndiendo del tipo de servicio de ga rantía corresp ondiente al producto. 3 No: No — Algunos componentes no están dise ñados para que puedan ser reparados por el usua rio. Para que el usu ario haga valer su garantía, HP p one como condic ión que un prov[...]
-
Página 19
Illustrated parts catalog 19 S ystem components Item Description Spare part number Customer self repair (on page 5 ) 6 Power supplies — — a) 1200 W, 9 0% 498152 - 001 Mandatory 1 b) 1200 W, 9 4%* 579229 - 0 01 Mandatory 1 7 Fan, 92 - mm, hot -plug 591208 - 001 Mandatory 1 8 Processor — — a) Intel Xeon X7560 processor kit ** 594893 - 001 Opt[...]
-
Página 20
Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5 ) e) Intel Xeon L7555 processor kit* ** 594900 - 0 01 Optional 2 f) Intel Xeon X7542 processor kit* ** 594895 - 001 Optional 2 g) Intel Xeon E7520 processor kit* ** 597821 - 001 Optional 2 h) Intel Xeon Processor E7 - 4870 processor k it* ** 653050 - 001[...]
-
Página 21
Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 5 ) d) 8 - GB PC3 1060 0R, dual ran k* 501536 - 001 Mandatory 1 e) 8 - GB PC3L 1060 0R, dual ran k* 606427 - 001 Mandatory 1 f) 16 - GB PC3 8500R, quad r ank* 501538 - 001 Mandatory 1 g) 16 - GB PC3 10600R , dual ran k* 632204 - 001 Mandatory 1 h) 32 - GB [...]
-
Página 22
Illustrated parts catalog 22 Item Description Spare part number Customer self repair (on page 5 ) f) BBWC cache module, 512 - MB* 462 975 - 001 Option al 2 g) BBWC batte ry pack* 462976 - 001 Optiona l 2 25 Trusted Platform Module* 450168 - 001 No 3 Cables — — 26 Cable kit* 594765 - 001 Mandatory 1 a) Cable assembly, power, Systems Insight Disp[...]
-
Página 23
Illustrated parts catalog 23 2 Optional: Opziona li — Parti la cui riparazione da parte d el cliente è fac oltativa. Si tr atta comunque di co mponenti progett ati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP , potrebbe dover sostenere spese addizionali a seconda del tipo d i garanzia previs to per il pro dotto. 3 N[...]
-
Página 24
Illustrated parts catalog 24[...]
-
Página 25
Removal an d replacement procedures 25 R emo v al and r eplacemen t pr ocedur es R equired tools You need the following items for som e procedures: • Torx T - 15 screwdriver (pr ovided with the server) • Phillips screwdriver • Flathead screwdrive r • Diagnostics Utilit y S afety consider ations Before perfo rming service p rocedures, review[...]
-
Página 26
Removal an d replacement procedures 26 • Remove the s erver from the r ack (on page 27 ). If the rack environment, cabling configuration, or the server location in the rac k creates awkward conditions, remove the server from the rack. • Remove the acc ess panel (on page 28 ). If you are ser vicing internal components, rem ove the access p anel.[...]
-
Página 27
Removal an d replacement procedures 27 2. Extend the server on the r ack rails until the server rail - r elease latches en gage. 3. After performing the installation or maintenance procedure, slide the server into the r ack by pressing the server rail - release la tches. R emove the server f rom the rack WARNING: The server weighs approxi mately 36[...]
-
Página 28
Removal an d replacement pro cedures 28 2. Remove the fo llowing comp onents to reduce the w eight of the ser ver: o Processor memory drawer (" Remove the processor memory drawer " on page 29 ) o Hard drives (" SAS/SATA har d drive " on page 30 ) o Power supplies (" Hot - plug power supply " on page 47 ) 3. Disconne ct[...]
-
Página 29
Removal an d replacement procedures 29 R emove the processor memory drawer To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove the p rocessor memor y drawer shippi ng screws, if in stalled. Retain the screws for futur e use (" Processor memory drawer shipping screw locat ions " on page 28 ). 3. Release th e latches[...]
-
Página 30
Removal an d replacement procedures 30 To replace th e component, reve rse the removal procedure . R emove the SPI boar d To remove the component: 1. Power off th e server. 2. Extend the server from the rack (on pag e 26 ). 3. Remove the a ccess panel (on page 28 ). 4. Disconnect all cables from the SPI board. IMPORTANT: If replacing the SPI board [...]
-
Página 31
Removal an d replacement procedures 31 3. Remove the hard drive. To replace th e component, rev erse the remova l procedure. H eatsink To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove the p rocessor memor y drawer shippi ng screws, if in stalled. Retain the screws for futur e use (" Processor memory drawer shipping s[...]
-
Página 32
Removal an d replacement procedures 32 5. Open the processor retaining br acket. 6. Remove the h eatsink. To replace the compon ent: 1. Clean the old thermal grease from the top of the processor with th e alcohol swab. Allow the alcohol to evaporate before con tinuing.[...]
-
Página 33
Removal an d replacement procedures 33 2. Remove the h eatsink prote ctive cover. 3. Inst all the heatsink. 4. Close and lock the pr ocessor retaining bra cket. 5. Install the proce ssor memory drawer cover. 6. Install the processor me mory drawer. 7. Power up the server. P rocessor[...]
-
Página 34
Removal an d replacement procedures 34 WARNING: U se caution when installing t he processor memory mod ule or removing the processor memory modu le. The processor memor y module is very heavy whe n fully populated. CAUTION: To p revent possi ble server malfunction and damage to the equipme nt, multiprocessor configurations must contain processors w[...]
-
Página 35
Removal an d replacement procedures 35 5. Open the processor retaining bracket. 6. Remove the h eatsink.[...]
-
Página 36
Removal an d replacement procedures 36 7. Open the pro cessor lockin g lever and the p rocessor socket reta ining bracket. 8. Using the pro cessor tool, re move the proce ssor from the syst em board: a. Line up the proces sor tool, ensuring the locking l ever graphic on the tool is or iented correctly. b. Press in on the plastic tabs, and then plac[...]
-
Página 37
Removal an d replacement procedures 37 9. Carefully rotate the tool, and then push in and releas e the tabs to secure the processor in the tool. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area. To replace the compon ent: 1. Carefully inse rt the processor into the proce ssor installa[...]
-
Página 38
Removal an d replacement procedures 38 2. Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install the processo r. THE PINS ON THE SYST EM BOARD ARE VERY F RAGILE AND EASILY DAMAG ED . CAUTION: THE PINS ON THE SYSTEM B OARD ARE VERY FRAGIL E AND EASILY DAMAGED. To avoid damage to the s ystem bo[...]
-
Página 39
Removal an d replacement procedures 39 3. Press and hold the tabs on the processor instal lation tool to separate it from the processor, and then remove the tool. 4. Close the processor socket retaining bracket and th e processor locking lever. CAUTION: Be sure to clos e the processor so cket retaining b racket before closi ng the processor locking[...]
-
Página 40
Removal an d replacement procedures 40 6. Apply all the grease to the top of the processor in the follo wing pattern to ensure even distribution. 7. Install the heatsink. 8. Close and lock the pr ocessor retaining bra cket. 9. Install the proce ssor memory drawer cover. 10. Install the processor me mory drawer. 11. Power up the server. Memory cartr[...]
-
Página 41
Removal an d replacement procedures 41 IMPORTANT: Be sure you are usin g the correct spare p art number when repla cing the memory cartridge. The server ships with one of two differe nt memory cartridges, which are not interchangeable. 1. Power down the serv er (on page 26 ). 2. Remove the p rocessor memor y drawer shippi ng screws, if in stalled. [...]
-
Página 42
Remo val and replacemen t procedures 42 6. Open the memory cartri dge cover. 7. Remove the D IMMs from the fa iled memory cart ridge: a. Open the DI MM slot latches. b. Remove the D IMM. To replace the compon ent: 1. Install the DIMMs in the replacement memory cartridge: a. Open the DI MM slot latches.[...]
-
Página 43
Removal an d replacement procedures 43 b. Install the DIMM. 2. Close the memory car tridge cover. 3. Install the memory cartridge. 4. Install the proce ssor memory drawer cover. 5. Install the processor me mory drawer. 6. Power up the server. D IMMs To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove the p rocessor memor y d[...]
-
Página 44
Removal an d replacement procedures 44 CAUTION: To preve nt damage to the processo r memory drawer c over, be sure the ha ndle of the processor memory drawer is fully open befor e removing the cover. 4. Be sure the handle on the processor memory drawer is completely open, and then remove the processor memory drawer cover. 5. Remove the m emory cart[...]
-
Página 45
Removal an d replacement procedures 45 6. Open the memory cartri dge cover. 7. Remove the fa iled DIMM fro m the memory cart ridge: a. Open the DI MM slot latches. b. Remove the D IMM. To replace the compon ent: 1. Install the replacement DIMM in the memory cartridge: a. Open the DI MM slot latches.[...]
-
Página 46
Removal an d replacement procedures 46 b. Install the DIMM. 2. Close the memory car tridge cover. 3. Install the memory cartridge. 4. Install the proce ssor memory drawer cover. 5. Install the processor me mory drawer. 6. Power up the server.[...]
-
Página 47
Removal an d replacement procedures 47 P ower su pply blank Remove the component as indic ated. To replace th e component, rev erse the remova l procedure. H ot - plug power supply The server sup ports up to four hot - plug power supplies. Install all power suppl ies to provide full redundanc y. HP recommends ins tall ing redundant hot - plug power[...]
-
Página 48
Removal an d replacement procedures 48 2. Remove the failed power supply. To replace th e component, rev erse the remova l procedure. S ystems Insight Disp lay assembly CAUTION: When routing cables, always be sure that the c ables are not in a position where they can be pinched or c rimped. To remove the component: 1. Power down the serv er (on pag[...]
-
Página 49
Removal and replacement procedures 49 To replace th e component, rev erse the remova l procedure. F an To remove the component: 1. Extend the server from the rack (on pag e 26 ). 2. Remove the a ccess panel (on page 28 ). 3. Remove the fa iled fan. To replace th e component, rev erse the remova l procedure. F an louver To remove the component: 1. P[...]
-
Página 50
Removal an d replacement procedures 50 5. Remove the fa n louver. CAUTION: Do not operat e the server unle ss a fan louver is installed nex t to fans 1 and 4. If t hese louvers are n ot installed, th e server overheat s. To replace th e component, rev erse the remova l procedure. I /O expansion board CAUTION: To preve nt improper cooling and therma[...]
-
Página 51
Removal an d replacement procedures 51 4. Release th e latches on the rel ease lever. 5. Lower the ha ndle, and th en extend the proce ssor memory dra wer from the serv er until the relea se latches catch. 6. Remove the a ccess pan el (on page 28 ). 7. Remove any expansion boards f rom the failed I/O expansi on board (" Non - hot - plug expans[...]
-
Página 52
Removal an d replacement procedures 52 o PCI- X/PCIe Express I/O expansion board o PCIe Express I/O expansion board To replace th e component, rev erse the remova l procedure. DVD- ROM drive To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from the rack (on pag e 26 ).[...]
-
Página 53
Removal an d replacement procedures 53 3. Remove the a ccess panel (on page 28 ). 4. Disconnect the cable from the rear of the DVD - ROM drive . 5. Remove the DVD - ROM driv e. To replace th e component, rev erse the remova l procedure. S olid state drive To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from th[...]
-
Página 54
Removal an d replacement procedures 54 To replace th e component, rev erse the remova l procedure. E xpansion slot cover CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all expansion slo ts have either an expansion s lot cover or an expansion boar d installed. 1. Power down the serv er (on page 26 ). 2. Ex[...]
-
Página 55
Removal an d replacement procedures 55 N on - hot - plug expan sion board CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all expansion slo ts have either an expansion s lot cover or an expansion boar d installed. To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from t[...]
-
Página 56
Removal an d repla cement procedures 56 7. Remove the expansion bo ard. To replace th e component, rev erse the removal procedure. Battery- backed wr ite cache proce dures Two types of proced ures are provided for the BBW C option: • Removal and re placement of failed compo nents: o Removing the cache modu le (" Removing the BBW C cache modu[...]
-
Página 57
Removal an d replacement procedures 57 4. If the existi ng cache is conn ected to a battery , observe the BBWC Status LED (" Battery pack LEDs " on page 85 ). o If the LED is fl ashing every 2 secon ds, data is still tr apped in the cach e. Restore syst em power, and then repeat th e previous ste ps. o If the LED is not illumi nated, disc[...]
-
Página 58
Removal an d replacement procedures 58 o If the LED is not illuminated, disconnect the battery c able from the cache. 5. Disconnect the cable. 6. Remove the battery pac k. The SPI board is re moved for clarity. To replace th e component, rev erse the remova l procedure. R ecovering data from the battery - backed write cache If the server fails, use[...]
-
Página 59
Removal an d replacement procedures 59 o If the server h as failed, remove t he controller, cache module (" Removing the BBWC cache modu le " on page 56 ), and battery p ack (" Removing the BB WC battery pack " on page 57 ) from the failed server, an d install the cont roller, cache m odule, and bat tery pack in the recov ery se[...]
-
Página 60
Removal an d replacement procedures 60 5. Disconnect the cable. 6. Remove the SPI board (o n page 30 ). 7. Open the cache slot latches. 8. Remove the c ache module. To replace th e component, rev erse the remova l procedure. R emoving the FBWC capacito r pack CAUTION: After the server is p owered down, wa it 15 seconds and then check the am ber LED[...]
-
Página 61
Removal an d replacement procedures 61 To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from the rack (on pag e 26 ). 3. Remove the a ccess panel (on page 28 ). 4. If the exist ing cache is conn ected to a bat tery, observe t he FBWC Status L ED (" FBWC mod ule LEDs " on page 87 ). o If the LED is fl [...]
-
Página 62
Removal an d replacement procedures 62 Battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides powe r to the real - time c lock. WARNING: The compu ter contains an internal li thium manganese dioxide , a vanadiu m pentoxide, or an alkaline battery pack. A risk of fire and b[...]
-
Página 63
Removal an d repl acement procedure s 63 WARNING: The server weighs approxi mately 36.3 kg – 49.9 kg (80. 0 lb – 110.0 lb). To reduce the risk of inj ury, remove the fo llowing comp onents before rem oving the serve r from the rack: • Processor memory drawer (" Remove the processor memory drawer " on page 29 ) • Hard drives ("[...]
-
Página 64
Removal an d replacement procedures 64 1. Install th e spare system bo ard. 2. Install al l components rem oved from the ser ver. 3. Install the access panel. 4. Slide the server bac k into the rack. 5. Power up the server. After you repl ace the system b oard, you must re - enter the server serial number and the product ID. 1. During the ser ver s[...]
-
Página 65
Removal an d replacement procedures 65 S AS backpl ane To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from the rack (on pag e 26 ). 3. Remove the a ccess panel (on page 28 ). 4. Remove all hard drives (" SAS/SATA hard drive " on pag e 30 ). 5. Disconnect all cables from the SAS backplane. 6. Release[...]
-
Página 66
Removal an d replacement procedures 66 8. Remove the backpl ane. To replace th e component, rev erse the removal procedure. H P Truste d Platform Mo dule The TPM is no t a customer - removable part. CAUTION: Any attempt to remove an installed T PM from the system board bre aks or disfigures the TPM security r ivet. Upon locating a broken or d isfig[...]
-
Página 67
Diagnostic tool s 67 D i agno sti c tools T roubleshooting resources The HP ProLiant Serv ers Troubleshooting Guid e provides procedure s for resolving common prob lems and comprehensiv e courses of action for fault isola tion and identificati on, error message interpr etation, issue resolution, and software m aintenance on ProLiant serv ers and se[...]
-
Página 68
Diagnostic tool s 68 support ProLiant BL, ML, DL, and S L servers. The toolkit i ncludes a mod ular set of utiliti es and importan t documentation that describes how to apply these tools to buil d an automated server de ployment process. The Scriptin g Toolkit provides a flexible way to crea te standard server configuration scripts. These scripts a[...]
-
Página 69
Diagnostic tool s 69 For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant Servers User Guid e o n the HP website ( http://www.hp.com/support/SAC_UG_ProL iantServers_en ). To configure ar rays, see the Conf iguring Arrays on HP Sm art Array Controllers Re ference Guide on the HP website ( htt[...]
-
Página 70
Diagnostic tool s 70 For more information, see the Management CD or DVD in the HP Ins ight Foundation suite for ProLiant. I nsight Lights -Out 3 techno logy The iLO 3 sub system is a stan dard component of selected ProLian t servers that p rovides server h ealth and remote server man ageability. The iLO 3 subsyst em includes an intelligen t micropr[...]
-
Página 71
Diagnostic tool s 71 HP Insight Diagnosti cs Online Edition is a w eb - based applic ation that captures system configuration and other related data needed for eff ective serv er management. Available in Microsoft® Windows® and Linu x versions, the utility helps to ensure proper syste m operation. For more informa tion or to download the utility,[...]
-
Página 72
Component ident ification 72 C om ponen t i dentif i cati on F ront panel comp onents Item Description 1 Ser ial and PID tag 2 Optical drive 3 Systems Insight Display 4 USB connect ors (2) 5 Video connecto r 6 Processor memory drawer[...]
-
Página 73
Component id ent ification 73 F ront panel LEDs and b uttons Item Description Sta tus 1 UID button and LED Blue — Act ivated Blue (flashing) — Server being managed remotely Off — Deactiva ted 2 Health LED Green — Normal (system on) Amber (flashing) — Internal system health degraded Red (flashing) — Internal system health critical Off ?[...]
-
Página 74
Component ident ification 74 S ystems Insight Disp lay The Systems Insight Display LEDs represent the se rver and component layou t. LED Description AMP status Off — No protection Green — Protection enabled Amber — Memory failure occur red Amber (flashing) — Memory co nfiguration erro r Health Green — Normal (system on) Amber (flashing) ?[...]
-
Página 75
Component ident ification 75 R ear panel comp onents Item Description Item Description 1 Power supply ba y 4 (optional) 15 Expansion slot 2 (op tional) 2 Power supply ba y 3 (optional) 16 Expansion slot 3 (op tional) 3 Power supply bay 2 17 Expansion slot 4 ( optional) 4 Power supply bay 1 18 Exp ansion slot 5 (optiona l) 5 Mouse conne ctor 19 Ex p[...]
-
Página 76
Component ident ification 76 R ear panel LEDs and b uttons Item Description LED color Status 1 iLO 3 NIC Activity LED Green On or flashing — Network acti vity Off — No network a ctivity 2 iLO 3 NIC Link LE D Green On — Linked to network Off — Not linked to network 3 NIC 2 Activity LED Green On or flashing — Network a ctivity Off — No ne[...]
-
Página 77
Component ident ification 77 P ower su pply LED Power LED St atus Off No AC power to p ower supply units Green AC is present. Standby output i s on, output is disabled. Green AC is present. Standby output i s on, power supply DC output is on and OK. Off Power supply failure (includes over voltage and overtemperature)[...]
-
Página 78
Component ident ification 78 S ystem board c omponents Item Description 1 Optional I/O ex pansion board connectors: • PCI - X/PCI Express I/ O expansion bo ard • PCI Express I/O expansion board 2 Slot 7 PCIe 2 x8 (4, 2, 1) 3 Slot 8 PCIe 2 x8 (4, 2, 1) 4 Slot 9 PCIe 2 x16 (8, 4, 2, 1) 5 Slot 10 PCI e2 x8 (4, 2, 1) 6 Slot 11 PCI e2 x8 (8, 4, 2, 1[...]
-
Página 79
Component ident ification 79 S ystem maintena nce switch The system maintenance switch (SW1) is an eight - position switch that is u sed for system configuration. The default position for a ll eight positions is Off. Position Descript ion Function S1 iLO 3 security Off = iLO 3 se curity is enabled. On = iLO 3 securit y is disabled . S2 Configuratio[...]
-
Página 80
Component ident ification 80 S PI board compo nents Item Description 1 Mini - SAS connectors (2) 2 SAS cache connector 3 TPM connector 4 Fan data con nector 5 RMII connecto r 6 SD card slot 7 Battery 8 10Gb NIC conn ector* 9 NIC cache con nector* 10 NIC 3 conne ctor 11 NIC 1 conne ctor 12 Video connect or 13 Keyboard con nector 14 USB connect ors ([...]
-
Página 81
Component ident ification 81 I /O expansion board components • PCI- X/PCI Express I/O expansion board Item Description 1 Slot 6 PCIe 2 x16 (16, 8, 4, 2, 1) 2 Slot 4 PCIe 2 x8 (4, 2, 1)* 3 Slot 3 PCIe 2 x16 (16, 8, 4, 2, 1) 4 Slot 2 PCI -X 5 Slot 1 PCI -X *Slot 4 is physically a x8 slot but operates electrically as a x4 slot. • PCI Express I/O e[...]
-
Página 82
Component ident ification 82 **Slots 2, 3, 5 and 6 are physically x16 slots but operate el ectrically as x8 slots. P rocessors and memory cartridges The processor memory dr awer contains 4 proces sor sockets and 8 memory c artridges. For DIMM numbering an d installation guideline s, see the server user guide.[...]
-
Página 83
Component ident ification 83 D IMM slot location s Each memory module contains 8 DIMM slots . The paired banks are identi fied by the letters A through D. D evice numbers[...]
-
Página 84
Component ident ification 84 H ard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) H ard drive LED combina tions Online/activity LED (green) Fault/UID LED (amber/blue) Interpretat ion On, off, or flashing Alternatin g amber and blue The drive has failed, or a predictiv e failure alert has been received for this drive; [...]
-
Página 85
Component ident ification 85 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretat ion Off Steadily amber A critical faul t condition has been identified for this drive, a nd the controller has p laced it offline. Replace the drive as soon as possible. Off Amber, flashing regularly (1 Hz) A predictive failu re alert has been received f[...]
-
Página 86
Component ident ification 86 LED3 pattern LED4 pat tern Interpretation Off Flashing (2 Hz) The system is powered down, and the cac he contains data that has not yet been written to the drives. Restore system po wer as soon as possible to prevent data loss. Data preserv ation time is ex tended any time that 3.3 V auxiliary power is av ailable, as in[...]
-
Página 87
Component ident ification 87 FBWC module LEDs The FBWC module has two single - color LEDs (green and amber) . The LEDs are du plicated on the reverse side of the cache module to fa cilitate status viewin g. 1 Green LED 2 Amber LED Interpretation Off On A backup is in progress. Flashing (1 Hz) On A restore is in progress. Flashing (1 Hz) Off The cap[...]
-
Página 88
Component ident ification 88 F an locations P ower su pply backplan e components[...]
-
Página 89
Component ident ification 89 Item Description 1 Graphics c ard power connector 2 Graphics card p ower connector 3 Graphics card p ower connector 4 SAS backplane power conn ector 5 Fan power conne ctor[...]
-
Página 90
Cabling 90 C abling DVD- ROM drive cabling[...]
-
Página 91
Specifications 91 S pec if icati ons E nvironmental spec ifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping - 40 ° C to 70 ° C ( - 40 ° F to 158 ° F) Maximum wet bulb tempera ture 28 ° C (82.4 ° F) Relative humidity (noncondensing)** Operating 10% to 90% Nonoperating 5% to 95% * All te[...]
-
Página 92
Acronyms and abbreviation s 92 A c r on y ms and abbr e v iati on s ABEND abnormal end ASR Automatic Server R ecovery BBWC battery - backed write c ache FBWC flash - backed write cache iLO 3 Integrated Lights - Out 3 IML Integrated Management Log NVRAM nonvolatile memory ORCA Option ROM Conf iguration for Arrays PCIe peripheral component interconne[...]
-
Página 93
Acronyms and abbrevia tions 93 RBSU ROM - Based Setup Utility SAS serial attached SCSI SD Secure Digital SIM Systems In sight Manager SPI system perip heral interfa ce TPM Trusted Platform Modu le UID unit identification USB universal serial bus[...]
-
Página 94
Documentation feedback 94 Doc ument ati on f eedbac k HP is committed to pro viding documentation that mee ts your needs. To help us improve the docume ntation, send any erro rs, suggestion s, or comments to Documentation Feedback ( mailto:docsf eedback@hp.com ). Include the document title and part number, vers ion number, or the URL when submittin[...]
-
Página 95
Index 95 A access panel 28 ASR (Automatic Se rver Recovery) 70 Automatic Server R ecovery (ASR) 70 B backplane, hard drive 65 backplane, powe r 65 backplane, SAS 65 battery 19, 62, 80 battery pack LEDs 85 battery - backed write c ache (BBWC) 19, 56, 57, 58, 80, 85 battery - backed write c ache battery pack 19, 56, 57 BBWC (battery - backed write ca[...]
-
Página 96
Index 96 I I/O expansion board compo nents 81 I/O expansion boards, remo ving 50 illustrated parts catalog 16 iLO (Integrated Ligh ts - Ou t) 70 IML (Integrate d Management Log) 69 Insight Diagnosti cs 70, 71 Integ rated Lights - Out (iLO) 70 Integrated Management Log (IML) 69 internal health LED 73 K keyboard connector 75, 80 L LED, external healt[...]
-
Página 97
Index 97 status lights, battery pack 85 support packs 67 switch, system maintenance 78 system battery 80 system board 19, 62, 65 system boar d components 78, 79 system boar d switches 79 system components 19, 72 system maintenance switch 78, 79 system power LED 73, 85 Systems Insight Dis play assembly 19, 48 T telco racks 26, 27 three slot option c[...]